# Pressure Sensor, 1.1 bar, I2C Digital, SPI, Absolute, 3 V, 12.5 µA

![Product image](https://novapart.co/image/farnell:3397822/)

**URL**: https://novapart.co/products/MS561101BA03-50/pressure-sensor-11-bar-i2c-digital-spi-absolute-3
**SKU**: MS561101BA03-50
**Manufacturer**: TE CONNECTIVITY
**Category**: Sensors & Transducers || Sensors || Pressure Sensors, Transducers || Pressure Transducers
**Price**: €5.0300
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Sensor Output | I2C Digital, SPI |
| Supply Current | 12.5µA |
| Voltage Rating | 3V |
| Operating Pressure Max | 1.1bar |
| Pressure Measurement Type | Absolute |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3397822/)

## MS5611-01BA03 

Barometric Pressure Sensor, with stainless steel cap 

## SPECIFICATIONS 

- **High resolution module, 10 cm** 

- **Fast conversion down to 1 ms** 

- **Low power, 1 µA (standby < 0.15 µA)** 

- **QFN package 5.0 x 3.0 x 1.0 mm[3]** 

- **Supply voltage 1.8 to 3.6 V** 

- **Integrated digital pressure sensor (24 bit ΔΣ ADC)** 

- **Operating range: 10 to 1200 mbar, -40 to +85 °C** 

- **I[2] C and SPI interface up to 20 MHz** 

- **No external components (Internal oscillator)** 

- **Excellent long-term stability** 

The MS5611-01BA is a new generation of high resolution altimeter sensors from MEAS Switzerland with SPI and I[2] C bus interface. This barometric pressure sensor is optimized for altimeters and variometers with an altitude resolution of 10 cm. The sensor module includes a high linearity pressure sensor and an ultra-low power 24 bit ΔΣ ADC with internal factory calibrated coefficients. It provides a precise digital 24 Bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation of an altimeter/thermometer function without any additional sensor. The MS5611-01BA can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. Small dimensions of only 5.0 mm x 3.0 mm and a height of only 1.0 mm allow for integration in mobile devices. This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland proven experience and knowhow in high volume manufacturing of altimeter modules, which have been widely used for over a decade. The sensing principle employed leads to very low hysteresis and high stability of both pressure and temperature signal. 

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## FEATURES 

## **FIELD OF APPLICATION** 

- Mobile altimeter / barometer systems 

- Bike computers 

- Variometers 

- Height sensing for medical alarms 

- Indoor navigation 

## **TECHNICAL DATA** 

|**Sensor Performances (VDD = 3 V)**|**Sensor Performances (VDD = 3 V)**|**Sensor Performances (VDD = 3 V)**|**Sensor Performances (VDD = 3 V)**|**Sensor Performances (VDD = 3 V)**|
|---|---|---|---|---|
|**Pressure**|**Min**|**Typ**|**Max**|**Unit**|
|Range|10||1200|mbar|
|ADC|24|||bit|
|Resolution (1)|0.065 / 0.042 / 0.027<br>/ 0.018 / 0.012|||mbar|
|Accuracy25°C, 750 mbar|-1.5||+1.5|mbar|
|Error band, -20°C to +85°C,<br>450 to 1100 mbar (2)|<br>-2.5||+2.5|mbar|
|Response time (1)|0.5 / 1.1 / 2.1 / 4.1 /<br>8.22|||ms|
|Long term stability||±1||mbar/yr|
|**Temperature**|**Min**|**Typ**|**Max**|**Unit**|
|Range|-40||+85|°C|
|Resolution||<0.01||°C|
|Accuracy|-0.8||+0.8|°C|
|Notes: (1) Oversampling Ratio: 256 / 512 / 1024 / 2048 / 4096<br> (2)Withautozero at one pressure point|||||



## **FUNCTIONAL BLOCK DIAGRAM** 

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**----- Start of picture text -----**<br>
VDD<br>PS<br>Meas. MUX<br>CSB<br>SENSOR +IN InterfaceDigital SDI/SDA<br>-IN PGA ADC Filterdig. SDOSCLK<br>Sensor Memory<br>Interface IC (PROM)<br>128 bits<br>SGND<br>GND<br>**----- End of picture text -----**<br>


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## PERFORMANCE SPECIFICATIONS 

## **ABSOLUTE MAXIMUM RATINGS** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Supplyvoltage|VDD||-0.3||+4.0|V|
|Storage temperature|TS||-40||+125|°C|
|Overpressure|Pmax||||6|bar|
|Maximum Soldering<br>Temperature|Tmax|40 sec max|||250|°C|
|ESD rating||Human Body<br>Model|-4||+4|kV|
|Latch up||JEDEC standard<br>No 78|-100||+100|mA|



## **ELECTRICAL CHARACTERISTICS** 

|**Parameter **|**Symbol **|**Conditions**|**Min.**|**Typ. **|**Max **|**Unit**|
|---|---|---|---|---|---|---|
|OperatingSupplyvoltage|VDD||1.8|3.0|3.6|V|
|OperatingTemperature|T||-40|+25|+85|°C|
|Supply current<br>(1 sample per sec.)|IDD|OSR<br>4096<br>2048<br>1024<br>512<br>256||12.5<br>6.3<br>3.2<br>1.7<br>0.9||µA|
|Peak supplycurrent||duringconversion||1.4||mA|
|Standbysupplycurrent||at 25°C||0.02|0.14|µA|
|VDD Capacitor||From VDD to GND|100|||nF|



## **ANALOG DIGITAL CONVERTER (ADC)** 

|**Parameter **|**Symbol **|**Conditions**|**Min.**|**Typ. **|**Max **|**Unit**|
|---|---|---|---|---|---|---|
|Output Word||||24||bit|
|Conversion time|tc|OSR<br>4096<br>2048<br>1024<br>512<br>256|<br>7.40<br>3.72<br>1.88<br>0.95<br>0.48|8.22<br>4.13<br>2.08<br>1.06<br>0.54|9.04<br>4.54<br>2.28<br>1.17<br>0.60|ms|



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## PERFORMANCE SPECIFICATIONS (CONTINUED) 

## **PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)** 

|**Parameter**|**Conditions**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|OperatingPressure Range|Prange|Full Accuracy|450||1100|mbar|
|Extended Pressure Range|Pext|Linear Range of<br>ADC|10||1200|mbar|
|Total Error Band, no autozero|at 25°C, 700..1100 mbar<br>at 0..50°C, 450..1100 mbar<br>at -20..85°C, 450..1100 mbar<br>at -40..85°C,450..1100 mbar||-1.5<br>-2.0<br>-3.5<br>-6.0||+1.5<br>+2.0<br>+3.5<br>+6.0|mbar|
|Total Error Band, autozero at<br>one pressure point|at 25°C, 700..1100 mbar<br>at 10..50°C, 450..1100 mbar<br>at -20..85°C, 450..1100 mbar<br>at -40..85°C,450..1100 mbar||-0.5<br>-1.0<br>-2.5<br>-5.0||+0.5<br>+1.0<br>+2.5<br>+5.0|mbar|
|Maximum error with supply<br>voltage|VDD= 1.8 V … 3.6 V|||±2.5||mbar|
|Long-term stability||||±1||mbar/yr|
|Recoveringtime after reflow(1)||||7||days|
|Resolution RMS|OSR                                 4096<br>2048<br>1024<br>512<br>256|||0.012<br>0.018<br>0.027<br>0.042<br>0.065||mbar|



(1) Time to recovering at least 66% of the reflow impact 

## **TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)** 

|**Parameter **|**Conditions**|**Min.**|**Typ. **|**Max **|**Unit**|
|---|---|---|---|---|---|
|Absolute Accuracy|at 25°C<br>-20..85°C<br>-40..85°C|-0.8<br>-2.0<br>-4.0||+0.8<br>+2.0<br>+4.0|°C|
|Maximum error with supply<br>voltage|VDD= 1.8 V … 3.6 V||±0.5||°C|
|Resolution RMS|OSR                                 4096<br>2048<br>1024<br>512<br>256||0.002<br>0.003<br>0.005<br>0.008<br>0.012||°C|



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## PERFORMANCE SPECIFICATIONS (CONTINUED) 

## **DIGITAL INPUTS (CSB, I[2] C, DIN, SCLK)** 

|**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ. **|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Serial data clock|SCLK|SPIprotocol|||20|MHz|
|Input high voltage|VIH|Pins CSB|80% VDD||100% VDD|V|
|Input low voltage|VIL||0% VDD||20% VDD|V|
|Input leakage current|Ileak25°C<br>Ileak85°C|at 25°C|||0.15|µA|



## **PRESSURE OUTPUTS (I[2] C, DOUT)** 

|**Parameter **|**Symbol **|**Conditions**|**Min.**|**Typ. **|**Max **|**Unit**|
|---|---|---|---|---|---|---|
|Output high voltage|VOH|Isource= 1.0 mA|80% VDD||100% VDD|V|
|Output low voltage|VOL|Isink= 1.0 mA|0% VDD||20% VDD|V|
|Load capacitance|CLOAD||||16|pF|



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## FUNCTIONAL DESCRIPTION 

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**----- Start of picture text -----**<br>
VDD<br>PS<br>Meas. MUX<br>CSB<br>SENSOR +IN Digital<br>Interface SDI/SDA<br>PGA ADC dig. SDO<br>-IN Filter SCLK<br>Sensor Memory<br>Interface IC (PROM)<br>128 bits<br>SGND<br>GND<br>**----- End of picture text -----**<br>


Figure 1: Block diagram of MS5611-01BA 

## **GENERAL** 

The MS5611-01BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS561101BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor to a 24bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. 

## **FACTORY CALIBRATION** 

Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 128bit PROM of each module. These bits (partitioned into 6 coefficients) must be read by the microcontroller software and used in the program converting D1 and D2 into compensated pressure and temperature values. 

## **SERIAL INTERFACE** 

The MS5611-01BA has built in two types of serial interfaces: SPI and I[2] C. Pulling the Protocol Select pin PS to low selects the SPI protocol, pulling PS to high activates the I[2] C bus protocol. 

|**Pin PS**|**Mode**|**Pins used**|
|---|---|---|
|High|I2C|SDA|
|Low|SPI|SDI,SDO,CSB|



## **SPI MODE** 

The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be pulled high after the command is sent or after the end of the command execution (for example end of conversion). The best noise performance from the module is obtained when the SPI bus is idle and without communication to other devices during the ADC conversion. 

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## **I[2] C MODE** 

The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDA (Serial DAta). The sensor responds on the same pin SDA which is bidirectional for the I[2] C bus interface. So this interface type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board space.  In I[2] C-Mode the complement of the pin CSB (Chip Select) represents the LSB of the I[2] C address. It is possible to use two sensors with two different addresses on the I[2] C bus. The pin CSB shall be connected to VDD or GND (do not leave unconnected!). 

## **COMMANDS** 

The MS5611-01BA has only five basic commands: 

1. Reset 

2. Read PROM (128 bit of calibration words) 

3. D1 conversion 

4. D2 conversion 

5. Read ADC result (24 bit pressure / temperature) 

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## **PRESSURE AND TEMPERATURE CALCULATION** 

**Start** Maximum values for calculation results: PMIN = 10mbar   PMAX = 1200mbar TMIN = -40°C TMAX = 85°C TREF = 20°C 

**==> picture [497 x 442] intentionally omitted <==**

**----- Start of picture text -----**<br>
Convert calibration data into coefficients (see bit pattern of W1 to W4)Read calibration data (factory calibrated) from PROM<br>Variable Description | Equation Recommended Size [ [1]] Value Example /<br>variable type [bit] min max Typical<br>C1 Pressure sensitivity | SENST1 unsigned int 16 16 0 65535 40127<br>C2 Pressure offset | OFFT1 unsigned int 16 16 0 65535 36924<br>C3 Temperature coefficient of pressure sensitivity | TCS unsigned int 16 16 0 65535 23317<br>C4 Temperature coefficient of pressure offset | TCO unsigned int 16 16 0 65535 23282<br>C5 Reference temperature | TREF unsigned int 16 16 0 65535 33464<br>C6 Temperature coefficient of the temperature | TEMPSENS unsigned int 16 16 0 65535 28312<br>Read dig tal pressureRead digital pressure and temperature datad temperature data<br>D1 Digital pressure value unsigned int 32 24 0 16777216 9085466<br>D2 Digital temperature value unsigned int 32 24 0 16777216 8569150<br>Calculate temperature<br>Difference between actual and reference temperature  [[2]]<br>dT signed int 32 25 -16776960 16777216 2366<br>dT   = D2 - TREF =  D2   -  C5 * 2 [8]<br>Actual temperature (-40…85°C with 0.01°C resolution) 2007<br>TEMP TEMP = 20°C + dT * TEMPSENS = 2000 + dT * C6 / 2 [23] signed int 32 41 -4000 8500 = 20.07 °C<br>Calculate temperatureCalculate temperature compensated pressurepensated pressure<br>OFF Offset at actual temperature  OFF = OFFT1 + TCO * dT = C2 [[3]] * 2 [16] + (C4 * dT  ) / 2 [7] signed int 64 41 -8589672450 12884705280 2420281617<br>SENS Sensitivity at actual temperature  SENS = SENST1 + TCS * dT = C1 * 2 [[4]] [15] + ( C3 * dT  ) / 2 [8] signed int 64 41 -4294836225 6442352640 1315097036<br>Temperature compensated pressure (10…1200mbar with  100009<br>P 0.01mbar resolution) signed int 32 58 1000 120000<br>P   = D1 * SENS - OFF =  (D1 * SENS / 2 [21]  - OFF) / 2 [15] = 1000.09 mbar<br>Display pressure and temperature value<br>**----- End of picture text -----**<br>


Notes 

[1] Maximal size of intermediate result during evaluation of variable [2] min and max have to be defined [3] min and max have to be defined [4] min and max have to be defined 

Figure 2: Flow chart for pressure and temperature reading and software compensation. 

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## **SECOND ORDER TEMPERATURE COMPENSATION** 

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**----- Start of picture text -----**<br>
Yes No<br>TEMP<20°C<br>Low temperature Low temperature High temperature<br>T2 = dT2 / 231 T2 = 0<br>OFF2 = 5  (TEMP – 2000)2 / 21 OFF2 = 0<br>SENS2 = 5  (TEMP – 2000)2/ 22 SENS2 = 0<br>Yes No<br>TEMP<-15°C<br>Very low temperature Low temperature<br>OFF2 = OFF2 + 7  (TEMP + 1500)2<br>SENS2 = SENS2 + 11  (TEMP + 1500)2/ 21<br>Calculate pressure and temperature<br>TEMP = TEMP - T2<br>OFF = OFF - OFF2<br>SENS = SENS - SENS2<br>**----- End of picture text -----**<br>


Figure 3: Flow chart for pressure and temperature to the optimum accuracy. 

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## SPI INTERFACE 

## **COMMANDS** 

Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the PROM read command using the a2, a1 and a0 bits. 

||**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**Command byte**|**hex value**|
|---|---|---|---|---|---|---|---|---|---|
|Bit number|0|1|2|3|4|5|6|7||
|Bit name|PR<br>M|COV -|COV -|Typ|Ad2/<br>Os2|Ad1/<br>Os1|Ad0/<br>Os0|Stop||
|Command||||||||||
|Reset|0|0|0|1|1|1|1|0|0x1E|
|Convert D1(OSR=256)|0|1|0|0|0|0|0|0|0x40|
|Convert D1(OSR=512)|0|1|0|0|0|0|1|0|0x42|
|Convert D1(OSR=1024)|0|1|0|0|0|1|0|0|0x44|
|Convert D1(OSR=2048)|0|1|0|0|0|1|1|0|0x46|
|Convert D1(OSR=4096)|0|1|0|0|1|0|0|0|0x48|
|Convert D2(OSR=256)|0|1|0|1|0|0|0|0|0x50|
|Convert D2(OSR=512)|0|1|0|1|0|0|1|0|0x52|
|Convert D2(OSR=1024)|0|1|0|1|0|1|0|0|0x54|
|Convert D2(OSR=2048)|0|1|0|1|0|1|1|0|0x56|
|Convert D2(OSR=4096)|0|1|0|1|1|0|0|0|0x58|
|ADC Read|0|0|0|0|0|0|0|0|0x00|
|PROM Read|1|0|1|0|Ad2|Ad1|Ad0|0|0xA0 to<br>0xAE|



Figure 4: Command structure 

## **RESET SEQUENCE** 

The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device ROM from an unknown condition 

**==> picture [419 x 105] intentionally omitted <==**

**----- Start of picture text -----**<br>
0 1 2 3 4 5 6 7<br>SCLK<br>__ F444 44444<br>CSB<br>PU ETT<br>SDI<br>ee] 2.8ms RELOAD<br>SDO<br>STP<br>PS<br>BQ<br>**----- End of picture text -----**<br>


Figure 5: Reset command sequence SPI mode 0 

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0 1 2 3 4 5 6 7 SCLK ~~— GREE QQ~~ CSB ~~HQT~~ SDI ~~ERS (~~ **2.8ms RELOAD** SDO ~~HP~~ PS ~~BE~~ 

Figure 6: Reset command sequence SPI mode 3 

## **CONVERSION SEQUENCE** 

The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. The chip select can be disabled during this time to communicate with other devices. 

After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. 

**==> picture [420 x 243] intentionally omitted <==**

**----- Start of picture text -----**<br>
0 1 2 3 4 5 6 7<br>SCLK<br>—FHL<br>CSB<br>HQT<br>SDI e ee | (<br>8.22ms ADC CONVERSION<br>SDO<br>STye<br>PS<br>RE QE<br>Figure 7: Conversion out sequence, Typ=d1, OSR = 4096<br>0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 27 28 29 30 31<br>SCLK<br>CSB<br>TL GT<br>SDI 0 ee 0) READING 24BIT ADC RESULT MSB FIRST<br>SDO<br>ST<br>PS<br>**----- End of picture text -----**<br>


Figure 8: ADC Read sequence 

## **PROM READ SEQUENCE** 

The read command for PROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. 

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**==> picture [416 x 105] intentionally omitted <==**

**----- Start of picture text -----**<br>
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23<br>SCLK<br>FFE EGE EL<br>CSB PP<br>SDI<br>BS READING 16BIT PROM VALUE MSB FIRST<br>SDO S|<br>PS BI<br>**----- End of picture text -----**<br>


Figure 9: PROM Read sequence, address = 011 (Coefficient 3). 

## I[2] C INTERFACE 

## **COMMANDS** 

Each I[2] C communication message starts with the start condition and it is ended with the stop condition. The MS5611-01BA address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does not have a microcontroller inside, the commands for I[2] C and SPI are quite similar. 

## **RESET SEQUENCE** 

The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5611-01BA to function is to send several SCLKs followed by a reset sequence or to repeat power on reset. 

**==> picture [286 x 51] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 0 0 0 1 1 1 1 0 0<br>Device Address command<br>e S Device Address W A s cmd byte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>dd From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 10: I[2] C Reset Command 

## **PROM READ SEQUENCE** 

The PROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. 

**==> picture [304 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0<br>Device Address command<br>a S Device Address W A cmd byte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>UI From Slave P = Stop Condition R = Read N = Not Acknowledge<br>Figure 11: I [2] C Command to read memory address= 011 (Coefficient 3)<br>1 1 1 0 1 1 CSB 1 0 1 1 0 0 X X X X 0 X X X X X X X X 0<br>Device Address data data<br>a S Device Address R A Memory bit 15 - 8 A Memory bit 7 - 0 N P<br>Ss nS<br>From Master S = Start Condition W = Write A = Acknowledge<br>UW From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 12: I[2] C answer from MS5611-01BA 

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## **CONVERSION SEQUENCE** 

A conversion can be started by sending the command to MS5611-01BA. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when an acknowledge appears from the MS5611-01BA, 24 SCLK cycles may be sent to receive all result bits. Every 8 bit the system waits for an acknowledge signal. 

**==> picture [287 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0<br>Device Address command<br>S Device Address W A cmd byte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>From Slave P = Stop Condition R = Read N = Not Acknowledge<br>Figure 13: I [[2]] C Command to initiate a pressure conversion (OSR=4096, typ=D1)<br>1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0<br>Device Address command<br>S Device Address W A cmd byte A P<br>From Master S = Start Condition W = Write A = Acknowledge<br>From Slave P = Stop Condition R = Read N = Not Acknowledge<br>**----- End of picture text -----**<br>


Figure 13: I[[2]] C Command to initiate a pressure conversion (OSR=4096, typ=D1) 

Figure 14: I[2] C ADC read sequence 

|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|1<br>1<br>1<br>0<br>1<br>1 CSB 1<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>X<br>0<br>data<br>data<br>data<br>Device Address|
|---|---|---|---|---|---|---|---|---|---|---|
|S|Device Address|R|A|Data 23-16|A|Data 8 - 15|A|Data 7 - 0|N|P|
|From Master<br>S = Start Condition<br>W = Write<br>A = Acknowledge<br>From Slave<br>P = Stop Condition<br>R = Read<br>N = Not Acknowledge|||||||||||
||||||||||||
||||||||||||



Figure 15: I[2] C answer from MS5611-01BA 

## **CYCLIC REDUNDANCY CHECK (CRC)** 

MS5611-01BA contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data validity in memory. The application note AN520 describes in detail CRC-4 code used. 

**==> picture [230 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
A  D D D D D D D D D D D D D D D D<br>B B B B B B<br>d  B B B B B B B B B B<br>1 1 1 1 1 1<br>d  5 4 3 2 1 0 9 8 7 6 5 4 3 2 1 0<br>0  16 bit reserved for manufacturer<br>1  Coefficient 1 (16 bit unsigned)<br>2  Coefficient 2 (16 bit unsigned)<br>3  Coefficient 3 (16 bit unsigned)<br>4  Coefficient 4 (16 bit unsigned)<br>5  Coefficient 5 (16 bit unsigned)<br>6  Coefficient 6 (16 bit unsigned)<br>7  CRC<br>**----- End of picture text -----**<br>


Figure 16: Memory PROM mapping 

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MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap 

## APPLICATION CIRCUIT 

The MS5611-01BA is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. It is designed for low-voltage systems with a supply voltage of 3 V. 

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**----- Start of picture text -----**<br>
MS5611-01BA<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
MS5611-01BA<br>**----- End of picture text -----**<br>


Figure 17: Typical application circuit with SPI / I[2] C protocol communication 

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MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap 

## PIN CONFIGURATION 

|**Pin**|**Name**|**Type **|**Function**|
|---|---|---|---|
|1|VDD|P|Positive supplyvoltage|
|2|PS|I|Protocol select<br>PS high (VDD)I2C<br>PS low(GND) SPI|
|3|GND|G|Ground|
|4|CSB|I|Chip select (active low),<br>internal connection|
|5||||
|6|SDO|O|Serial data output|
|7|SDI /<br>SDA|I / IO|Serial data input /<br>I2C data IO|
|8|SCLK|I|Serial data clock|



## DEVICE PACKAGE OUTLINE 

Figure 18: MS5611-01BA03 package outline 

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MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap 

## RECOMMENDED PAD LAYOUT 

Pad layout for bottom side of the MS5611-01BA soldered onto printed circuit board. 

Reserved area: Please do not route tracks between pads 

## SHIPPING PACKAGE 

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MS5611-01BA03 Barometric Pressure Sensor, with stainless steel cap 

## MOUNTING AND ASSEMBLY CONSIDERATIONS 

## **SOLDERING** 

Please refer to the application note AN808 available on our website for all soldering issues. 

## **MOUNTING** 

The MS5611-01BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. 

## **CONNECTION TO PCB** 

The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for applications in watches and other special devices. 

## **CLEANING** 

The MS5611-01BA has been manufactured under cleanroom conditions. It is therefore recommended to assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean” shall be used. Cleaning might damage the sensor! 

## **ESD PRECAUTIONS** 

The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore essential to ground machines and personnel properly during assembly and handling of the device. The MS5611-01BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. 

## **DECOUPLING CAPACITOR** 

Particular care must be taken when connecting the device to the power supply. A 100 nF ceramic capacitor must be placed as close as possible to the MS5611-01BA VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. 

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## TYPICAL PERFORMANCE CHARACTERISTICS 

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**----- Start of picture text -----**<br>
ADC-value D1 vs Pressure (typical)<br>10000000<br>9000000<br>8000000<br>7000000 -40°C<br>20°C<br>85°C<br>6000000<br>5000000<br>4000000<br>3000000<br>0 100 200 300 400 500 600 700 800 900 1000 1100<br>Pressure (mbar)<br>ADC-value D2 vs Temperature (typical)<br>12000000<br>11000000<br>10000000<br>9000000<br>8000000<br>7000000<br>6000000<br>5000000<br>4000000<br>-40 -20 0 20 40 60 80 100 120<br>Temperature (°C)<br>ADC-value D2 (LSB)<br>ADC-value D1 (LSB)<br>**----- End of picture text -----**<br>


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## TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) 

**==> picture [355 x 195] intentionally omitted <==**

**----- Start of picture text -----**<br>
Absolute Pressure Accuracy after Calibration, 2nd order compensation<br>2<br>1.5<br>85°C<br>60°C<br>1 20°C<br>0°C<br>-40°C<br>0.5 Poly. (85°C)<br>Poly. (60°C)<br>Poly. (20°C)<br>0 Poly. (0°C)<br>300 400 500 600 700 800 900 1000 1100 Poly. (-40°C)<br>-0.5<br>-1<br>-1.5<br>-2<br>Pressure (mbar)<br>Pressure error (mbar)<br>**----- End of picture text -----**<br>


**==> picture [347 x 214] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pressure Error Accuracy vs temperature (typical)<br>28<br>26<br>24<br>22<br>20<br>18<br>16<br>Perror(1000,1st order)<br>14 Perror(1000,2nd order)<br>12 Perror(800,1st order)<br>10 Perror(800,2nd order)<br>Perror(450,1st order)<br>8<br>Perror(450,2nd order)<br>6<br>4<br>2<br>0<br>-2<br>-4<br>-40 -20 0 20 40 60 80<br>Temperature (°C)<br>Pressure error (mbar)<br>**----- End of picture text -----**<br>


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Barometric Pressure Sensor, with stainless steel cap 

**==> picture [352 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
Temperature Error Accuracy vs temperature (typical)<br>15<br>10<br>Temperature error (standard<br>calculation)<br>5 Temperature error (with 2ndorder calculation)<br>0<br>-5<br>-40 -20 0 20 40 60 80 100 120<br>Temperature (°C)<br>Temperature error (°C)<br>**----- End of picture text -----**<br>


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## TYPICAL PERFORMANCE CHARACTERISTICS (CONTINUED) 

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## ORDERING INFORMATION 

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**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|PART NUMBER|Delivery|
|DESCRIPTION|Art. No|
|Form|
|MS5611-01BA03|Barometric Pressure Sensor with Thin Metal Cap|MS561101BA03-50|Tape and Reel|

**----- End of picture text -----**<br>


**PRODUCT DESCRIPTION MS5611__BA__** 

## **Pressure Range** 

**==> picture [59 x 63] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||
|---|---|
|01|1 bar|
|Version|
|03|Cap|

**----- End of picture text -----**<br>


## **ASIA** 

**NORTH AMERICA EUROPE ASIA** Measurement Specialties, Inc., Measurement Specialties (Europe), Ltd., Measurement Specialties (China) Ltd., a TE Connectivity company a TE Connectivity Company a TE Connectivity company Tel:  +1 800-522-6752 Tel:  +31 73 624 6999 Tel:  +86 0400-820-6015 Email: customercare.frmt@te.com Email: customercare.bevx@te.com Email: customercare.shzn@te.com 

## **TE.com/sensorsolutions** 

## Measurement Specialties, Inc., a TE Connectivity company. 

Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. 

The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. 

© 2015 TE Connectivity Ltd. family of companies All Rights Reserved. 

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Page 22 



## Links

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- [Supplier page](https://es.farnell.com/en-ES/te-connectivity/ms561101ba03-50/barometer-press-sensor-absolute/dp/3397822)
---

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