# Bipolar (BJT) Single Transistor, NPN, 80 V, 500 mA, 625 mW, TO-226AA, Through Hole

![Product image](https://novapart.co/image/farnell:2454055/)

**URL**: https://novapart.co/products/MPSA06RA/bipolar-bjt-single-transistor-npn-80-v-500-ma-625
**SKU**: MPSA06RA
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0720
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:80V; Transition Frequency ft:100MHz; Power Dissipation Pd:625mW; DC Collector Current:500mA; DC Current Gain hFE:100hFE

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 625mW |
| Transistor Mounting | Through Hole |
| Transistor Polarity | NPN |
| Transition Frequency | 100MHz |
| Transistor Case Style | TO-226AA |
| Dc Current Gain Hfe Min | 100hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 500mA |
| Collector Emitter Voltage Max | 80V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2454055/)

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September 2014<br>**----- End of picture text -----**<br>


## **MPSA06 / MMBTA06 / PZTA06 NPN General-Purpose Amplifier** 

## **Features** 

- This device is designed for general-purpose amplifier 

- applications at collector currents to 300 mA. 

- Sourced from process 12. 

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**----- Start of picture text -----**<br>
MPSA06                            MMBTA06                            PZTA06<br>C<br>C<br>E E<br>C<br>TO-92 B SOT-23 B<br>SOT-223<br>E  B  C Mark: 1G<br>**----- End of picture text -----**<br>


## **Ordering Information** 

|**Part Number**|**Top Mark**|**Package**|**Packing Method**|
|---|---|---|---|
|MPSA06|MPSA06|TO-92 3L|Bulk|
|MMBTA06|1G|SOT-23 3L|Tape and Reel|
|PZTA06|A06|SOT-223 4L|Tape and Reel|



## **Absolute Maximum Ratings**[(1), (2)] 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCEO|Collector-Emitter Voltage|80|V|
|VCBO|Collector-Base Voltage|80|V|
|VEBO|Emitter-Base Voltage|4.0|V|
|IC|Collector Current - Continuous|500|mA|
|TJ, TSTG|Operating and Storage Junction Temperature Range|-55 to +150|°C|



## **Notes:** 

1. These ratings are based on a maximum junction temperature of 150 ° C. 

2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or low-duty-cycle operations. 

© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

## **Thermal Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|Values are at TA = 25°C unless otherwise noted.|Values are at TA = 25°C unless otherwise noted.A = 25°C unless otherwise noted.= 25°C unless otherwise noted.|||||
|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Max.**|||**Unit**|
|||**MPSA06**|**MMBTA06**(3)|**PZTA06**(4)||
|PD|Total Device Dissipation|625|350|1000|mW|
||Derate Above 25°C|5.0|2.8|8.0|mW/°C|
|RθJC|Thermal Resistance, Junction-to-Case|83.3|||°C/W|
|RθJA|Thermal Resistance, Junction-to-Ambient|200|357|125|°C/W|



## **Notes:** 

3. Device is mounted on FR-4 PCB 1.6 inch x 1.6 inch x 0.06 inch. 

4. Device is mounted on FR-4 PCB 36 mm x 18 mm x 1.5 mm, mounting pad for the collector lead minimum 6 cm[2] . 

## **Electrical Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|**Off Characteristics**||||||
|V(BR)CEO|Collector-Emitter Breakdown Voltage(5)|IC= 1.0 mA, IB= 0|80||V|
|V(BR)EBO|Emitter-Base Breakdown Voltage|IE= 100μA, IC= 0|4.0||V|
|ICEO|Collector Cut-Off Current|VCE= 60 V, IB= 0||0.1|μA|
|ICBO|Collector Cut-Off Current|VCB= 80 V, IE= 0||0.1|μA|
|**On Characteristics**||||||
|hFE|DC Current Gain|IC= 10 mA, VCE= 1.0 V|100|||
|||IC= 100 mA, VCE= 1.0 V|100|||
|VCE(sat)|Collector-Emitter Saturation Voltage|IC= 100 mA, IB= 10 mA||0.25|V|
|VBE(on)|Base-Emitter On Voltage|IC= 100 mA, VCE= 1.0 V||1.2|V|
|**Small Signal Characteristics**||||||
|fT|Current Gain - Bandwidth Product|IC= 10 mA, VCE= 2.0 V,<br>f = 100 MHz|100||MHz|



## **Notes:** 

5. Pulse test: pulse width ≤ 300 μ s, duty cycle ≤ 2%. 

© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

2 

## **Typical Performance Characteristics** 

**==> picture [441 x 557] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 0.5<br>V    = 1V CE  β = 10<br>To 125 °C 0.4<br>150  TN il Co CnC<br>tT 7 Aoe<br>_—|  25 °C ONT 0.3 Con CoC 125 °C Co<br>100<br>Uf<br>SSS 0.2 «(SESS  25 °C<br>SSS - 40 °C TTT 0ek<br>50<br>oeNN 0.1 SE | S/TA<br>- 40 °C<br>aPETeeASST 0 SaPm ttt till lll<br>0.001 0.01 0.1 0.1 1 10 100 1000<br>I    - COLLECTOR CURRENT  (A)C I   - COLLECTOR CURRENT  (mA)C<br>Figure 2. Collector-Emitter Saturation Voltage vs.<br>Figure 1. Typical Pulsed Current Gain vs.<br>Collector Current<br>Collector Current<br>1 β = 10 1<br>- 40 °C<br>ae SE 0 ST<br>ee 0.8 Ty<br>- 40 °C<br>0.8 PTT,  25 °C rl 0.6 =  25 °C = aT<br>Et eT il aa ee eee<br>Fee 125 °C Pe 125 °C<br>0.6 ne 0.4<br>LTT ee eS ant | V     = 5VCE<br>0.2<br>| TTT | EE T E T L I [ET ET T 2SeeeHHT<br>0.4 TAUee [ae] LEHI | LUTTE EE 0 aCoCTT<br>0.1 1 10 100 1000 1 10 100 1000<br>I   - COLLECTOR CURRENT  (mA)C I   - COLLECTOR CURRENT  (mA)C<br>Figure 3. Base-Emitter Saturation Voltage vs.  Figure 4. Base-Emitter On Voltage vs.<br>Collector Current Collector Current<br>10 2.0<br>V     = 80 VCB 1.8<br>—_—____-SS ee 1.6 SSeSP| Ti I C =10mA SSaEeeREE<br>1 I C =50mA<br>a 1.4 ee<br>——————— 1.2 eee eee I C =100mA cite<br>0.1 ee 1.0 Es een ee IC=250mA I C =500mA<br>0.8<br>SS ee ee eee pope pap<br>0.6<br>0.01 a a SeeECee th ee een<br>SS SS 0.4 ee Ie<br>——————a 0.2 EHNAES<br>0.00125 50 75 100 125 0.00.01 Ps 0.1 1 Sse 10<br>°<br>T  - AMBIENT TEMPERATURE (  C)A IB - Base Current (mA)<br>FE CESAT<br>BESAT<br>BEON<br>CBO<br>h    - TYPICAL PULSED CURRENT GAIN<br>V         - COLLECTOR EMITTER VOLTAGE (V)<br>V         - BASE EMITTER VOLTAGE (V)<br>V        - BASE EMITTER ON VOLTAGE (V)<br>, Collector Emitter Voltage (V)<br>I      - COLLECTOR CURRENT (nA) CE(SAT)<br>V<br>**----- End of picture text -----**<br>


**Figure 5. Collector Cut-Off Current vs. Ambient Temperature** 

**Figure 6. Collector Saturation Region** 

© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

3 

## **Typical Performance Characteristics** (Continued) 

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**----- Start of picture text -----**<br>
100<br>117116 Eo Err En SS C ib f = 1.0 MHz<br>CoS 10 itTTT<br>115<br>114 a 0 ee ees eeet<br>C ob<br>113 C nToI SCTNST 1 tt,|ee TH|<br>112 Cnn h N attee<br>1110.1 Con 1 oon 10 100 1000 0.1 eea OO TT<br>0.1 1 10 100<br>RESISTANCE (k   ) Ω<br>V      - COLLECTOR VOLTAGE (V)CE<br>Figure 7. Collector-Emitter Breakdown Voltage         Figure 8. Input and Output Capacitance vs.<br>with Resistance Between Emitter-Base Reverse Current<br>400<br>V     = 5VCE CT 1<br>350<br>Poe pT ING TET ETT<br>a 0.75 INO] SOT-223 PT Tf<br>TO-92<br>300<br>a ee ee rN TTT<br>2 ee — IN<br>250 vr ih 0.5 PT RAAT NT<br>SOT-23<br>40 TSN<br>200<br>PZ ==ECC SNOT<br>0.25<br>150 ZC HEPES<br>100 ee| 0 essPS<br>1 10 20 50 100 0 25 50 75 100 125 150<br>I    - COLLECTOR CURRENT (mA)C TEMPERATURE  (  C)o<br>Figure 9. Gain Bandwidth Product vs.                   Figure 10. Power Dissipation vs.<br>Collector Current Ambient Temperature<br>D<br>CAPACITANCE (pF)<br>CER<br>BV       - BREAKDOWN VOLTAGE (V)<br>P   - POWER DISSIPATION (W)<br>T<br>f   - GAIN BANDWIDTH PRODUCT (MHz)<br>**----- End of picture text -----**<br>


© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

4 

## **Physical Dimensions** 

**==> picture [15 x 4] intentionally omitted <==**

**----- Start of picture text -----**<br>
        D<br>**----- End of picture text -----**<br>


**Figure 11. 3-LEAD, TO-92, MOLDED, STD STRAIGHT LEAD (NO EOL CODE)** 

© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

5 

**Physical Dimensions** (Continued) 

**==> picture [337 x 461] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.95<br>2.92±0.20<br>3<br>1.40<br>1.30 [+0.20] 2.20<br>ne -0.15 IE<br>1 2<br>(0.29) 0.60<br>0.37<br>0.95<br>0.20 A B 1.00<br>ea 1.90 1.90 ff<br>LAND PATTERN<br>RECOMMENDATION<br>1.20 MAX SEE DETAIL A<br>(0.93) 0.10<br>0.00<br>0.10 C<br>C<br>2.40±0.30<br>NOTES: UNLESS OTHERWISE SPECIFIED<br>GAGE PLANE<br>   A)  REFERENCE JEDEC REGISTRATION<br>TO-236, VARIATION AB, ISSUE H.<br>0.23    B)  ALL DIMENSIONS ARE IN MILLIMETERS.<br>0.08    C)  DIMENSIONS ARE INCLUSIVE OF BURRS,<br>0.25        MOLD FLASH AND TIE BAR EXTRUSIONS.<br>   D)  DIMENSIONING AND TOLERANCING PER<br>       ASME Y14.5M - 1994.<br>0.20 MIN SEATING    E)  DRAWING FILE NAME: MA03DREV10<br>fi (0.55) ts PLANE<br>SCALE: 2X<br>Figure 12. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE<br>**----- End of picture text -----**<br>


© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

6 

## **Physical Dimensions** (Continued) 

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**----- Start of picture text -----**<br>
Figure 13. MOLDED PACKAGING, SOT-223, 4-LEAD<br>**----- End of picture text -----**<br>


© 1997 Fairchild Semiconductor Corporation MPSA06 / MMBTA06 / PZTA06 Rev. 1.1.0 

www.fairchildsemi.com 

7 

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## **PRODUCT STATUS DEFINITIONS** 

|**Definition of Terms**|||
|---|---|---|
|**Datasheet Identification**|**Product Status**|**Definition**|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications may change<br>in anymanner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild<br>Semiconductor reserves the right to make changes at anytime without notice to improve design.|
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|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.<br>The datasheet is for reference information only.|



Rev. I71 www.fairchildsemi.com 

© Fairchild Semiconductor Corporation 



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