# Bipolar (BJT) Single Transistor, PNP, 80 V, 500 mA, 150 mW, SOT-323, Surface Mount

![Product image](https://novapart.co/image/farnell:2533334/)

**URL**: https://novapart.co/products/MMBTA56WT1G/bipolar-bjt-single-transistor-pnp-80-v-500-ma-150
**SKU**: MMBTA56WT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0290
**Stock**: 10+
**Lead Time**: 131 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-80V; Transition Frequency ft:50MHz; Power Dissipation Pd:150mW; DC Collector Current:-500mA; DC Current Gain hFE:100hFE; Transist

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 150mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 50MHz |
| Transistor Case Style | SOT-323 |
| Dc Current Gain Hfe Min | 100hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 500mA |
| Collector Emitter Voltage Max | 80V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2533334/)

## MMBTA56W, SMMBTA56W 

## Driver Transistor 

## **PNP Silicon** 

## **Features** 

- Moisture Sensitivity Level: 1 

**www.onsemi.com** 

- ESD Rating: 

   - ♦ Human Body Model − 4 kV 

   - ♦ Machine Model − 400 V 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Collector−Emitter Voltage|VCEO|−80|Vdc|
|Collector−Base Voltage|VCBO|−80|Vdc|
|Emitter−Base Voltage|VEBO|−4.0|Vdc|
|Collector Current − Continuous|IC|−500|mAdc|
|**THERMAL CHARACTERISTICS**||||
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Total Device Dissipation FR−5 Board|PD||mW|
|TA= 25°C||460||
|Thermal Resistance, Junction to Ambient|R JA|272|°C/W|
|(Note 1)||||
|Junction and Storage Temperature|TJ, Tstg|−55 to +150|°C|



## **THERMAL CHARACTERISTICS** 

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 Board, 1 oz. Cu, 100 mm[2] . 

**SC−70 (SOT−323) CASE 419 STYLE 3** 

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COLLECTOR<br>3<br>1<br>BASE<br>:<br>2<br>EMITTER<br>**----- End of picture text -----**<br>


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MARKING DIAGRAM<br>**----- End of picture text -----**<br>


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FM M<br>1 -<br>FM = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

*Date Code orientation may vary depending upon manufacturing location. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MMBTA56WT1G<br>(Pb−Free)|SC−70<br>(Pb−Free)|3,000 /<br>Tape & Reel|
|SMMBTA56WT1G<br>(Pb−Free)|SC−70<br>(Pb−Free)|3,000 /<br>Tape & Reel|
|SMMBTA56WT3G<br>(Pb−Free)|SC−70<br>(Pb−Free)|10,000 /<br>Tape & Reel|



- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2012 **September, 2018 − Rev. 5** 

**MMBTA56WT1/D** 

## **MMBTA56W, SMMBTA56W** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Breakdown Voltage (Note 1)<br>(IC= −1.0 mAdc, IB= 0)|V(BR)CEO|−80|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −100�Adc, IC= 0)|V(BR)EBO|−4.0|−|Vdc|
|Collector Cutoff Current<br>(VCE= −60 Vdc, IB= 0)|ICES|−|−0.1|�Adc|
|Collector Cutoff Current<br>(VCB= −60 Vdc, IE= 0)<br>(VCB= −80 Vdc, IE= 0)|ICBO|−<br>−|−<br>−0.1|�Adc|
|**ON CHARACTERISTICS**|||||
|DC Current Gain<br>(IC= −10 mAdc, VCE= −1.0 Vdc)<br>(IC= −100 mAdc, VCE= −1.0 Vdc)|hFE|100<br>100|−<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= −100 mAdc, IB= −10 mAdc)|VCE(sat)|−|−0.25|Vdc|
|Base−Emitter On Voltage<br>(IC= −100 mAdc, VCE= −1.0 Vdc)|VBE(on)|−|−1.2|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**|||||
|Current−Gain − Bandwidth Product (Note 2)<br>(IC= −100 mAdc, VCE= −1.0 Vdc, f = 100 MHz)|fT|50|−|MHz|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2.0%. 

2. fT is defined as the frequency at which |hfe| extrapolates to unity. 

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TURN-ON TIME TURN-OFF TIME<br>-1.0 V VCC +VBB VCC<br>+40 V +40 V<br>5.0 �s 100 RL 100 RL<br>+10 V OUTPUT OUTPUT<br>Vin RB Vin RB<br>0<br>tr = 3.0 ns 5.0 �F * CS � 6.0 pF 5.0 �F * CS � 6.0 pF<br>100 100<br>5.0 �s<br>tr = 3.0 ns<br>**----- End of picture text -----**<br>


- *Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage Polarities 

**Figure 1. Switching Time Test Circuits** 

**www.onsemi.com** 

**2** 

**MMBTA56W, SMMBTA56W** 

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**----- Start of picture text -----**<br>
200 100<br>VTJCE = 25 = -2.0 V°C 70 TJ = 25°C<br>50 Cibo<br>100<br>30<br>70<br>20<br>50<br>10 Cobo<br>30<br>7.0<br>20 5.0<br>-2.0 -3.0 -5.0 -7.0 -10 -20 -30 -50 -70 -100 -200 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100<br>IC, COLLECTOR CURRENT (mA) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 2. Current−Gain — Bandwidth Product Figure 3. Capacitance<br>1.0 k -1.0 k<br>700 -700 100 �s<br>500 -500 1.0 ms<br>ts<br>300 -300 1.0 s<br>200 -200 TC = 25°C<br>TA = 25°C<br>100 -100<br>70 tf -70<br>50 -50 CURRENT LIMIT<br>VCC = -40 V THERMAL LIMIT<br>30 IC/IB = 10 -30 SECOND BREAKDOWN LIMIT<br>20 IB1 = IB2 -20<br>TJ = 25°C td @ VBE(off) = -0.5 V tr<br>10 -10<br>-5.0 -7.0 -10 -20 -30 -50 -70 -100 -200 -300 -500 -1.0 -2.0 -3.0 -5.0 -7.0 -10 -20 -30 -50 -70 -100<br>IC, COLLECTOR CURRENT (mA) VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>Figure 4. Switching Time<br>Figure 5. Active−Region Safe Operating Area<br>400 -1.0<br>TJ = 25°C<br>T J  = 125°C<br>VCE = -1.0 V -0.8 VBE(sat) @ IC/IB = 10<br>200<br>25°C<br>-0.6<br>VBE(on) @ VCE = -1.0 V<br>-55°C<br>100 -0.4<br>80<br>-0.2<br>60<br>VCE(sat) @ IC/IB = 10<br>40 0<br>-0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>C, CAPACITANCE (pF)<br>f T, CURRENT-GAIN - BANDWIDTH PRODUCT (MHz)<br>t, TIME (ns)<br>IC , COLLECTOR CURRENT (mA)<br>, DC CURRENT GAIN V, VOLTAGE (VOLTS)<br>hFE<br>**----- End of picture text -----**<br>


**Figure 6. DC Current Gain** 

**Figure 7. “ON” Voltages** 

**www.onsemi.com** 

**3** 

## **MMBTA56W, SMMBTA56W** 

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**----- Start of picture text -----**<br>
-1.0 -0.8<br>TJ = 25°C<br>-0.8 -1.2<br>IC = IC = IC = IC =<br>-50 mA -100 mA -250 mA -500 mA<br>-0.6 -1.6<br>-0.4 -2.0 R�VB for VBE<br>IC =<br>-0.2 -10 mA -2.4<br>0 -2.8<br>-0.05 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -500<br>IB, BASE CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>°<br>, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>VB, TEMPERATURE COEFFICIENT (mV/  C)<br>�<br>VCE R<br>**----- End of picture text -----**<br>


**Figure 8. Collector Saturation Region** 

**Figure 9. Base−Emitter Temperature Coefficient** 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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**SC−70 (SOT−323)** CASE 419 ISSUE P 

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DATE 07 OCT 2021<br>**----- End of picture text -----**<br>


**SCALE 4:1** 

## **GENERIC MARKING DIAGRAM** 

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XX M �<br>�<br>1<br>XX = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

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STYLE 1: STYLE 2: STYLE 3:<br>CANCELLED PIN 1. ANODE PIN 1. BASE<br>2. N.C. 2. EMITTER<br>3. CATHODE 3. COLLECTOR<br>STYLE 6: STYLE 7: STYLE 8:<br>PIN 1. EMITTER PIN 1. BASE PIN 1. GATE<br> 2. BASE  2. EMITTER  2. SOURCE<br> 3. COLLECTOR  3. COLLECTOR  3. DRAIN<br>**----- End of picture text -----**<br>


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STYLE 4: STYLE 5:<br>PIN 1. CATHODE PIN 1. ANODE<br>2. CATHODE  2. ANODE<br>3. ANODE  3. CATHODE<br>STYLE 9: STYLE 10: STYLE 11:<br>PIN 1. ANODE PIN 1. CATHODE PIN 1. CATHODE<br> 2. CATHODE  2. ANODE 2. CATHODE<br> 3. CATHODE-ANODE  3. ANODE-CATHODE 3. CATHODE<br>**----- End of picture text -----**<br>


## **DOCUMENT NUMBER: 98ASB42819B** 

**DESCRIPTION: SC−70 (SOT−323)** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

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## **PUBLICATION ORDERING INFORMATION** 

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◊ 

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