# Bipolar (BJT) Single Transistor, Darlington, NPN, 30 V, 300 mA, 225 mW, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2464055/)

**URL**: https://novapart.co/products/MMBTA13LT1G/bipolar-bjt-single-transistor-darlington-npn-30-v
**SKU**: MMBTA13LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0660
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Qualification | AEC-Q101 |
| Power Dissipation | 225mW |
| Dc Current Gain Hfe | 10000hFE |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 125MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 10000hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 300mA |
| Collector Emitter Voltage Max | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2464055/)

## MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L 

## Darlington Amplifier Transistors 

## **NPN Silicon** 

## **http://onsemi.com** 

## **Features** 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* 

**SOT−23 (TO−236) CASE 318 STYLE 6** 

COLLECTOR 3 **MAXIMUM RATINGS Rating Symbol Value Unit** BASE 1 Collector−Emitter Voltage VCES 30 Vdc Collector−Base Voltage VCBO 30 Vdc Emitter−Base Voltage VEBO 10 Vdc EMITTER 2 Collector Current − Continuous IC 300 mAdc ~~ee~~ **MARKING DIAGRAM** ~~*~~ **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** 1x M Total Device Dissipation FR−5 Board PD (Note 1) TDerate above 25A = 25 °° CC 2251.8 mW/mW ° C 1 Thermal Resistance, Junction−to−Ambient R JA 556 ° C/W 1x = Device Code x = M for MMBTA13LT1G, Total Device Dissipation Alumina PD SMMBTA13LT1G Derate above 25Substrate, (Note 2) T ° C A = 25 ° C 3002.4 mW/mW ° C x = N for MMBTA14LT1G, SMMBTA14LT1G, T3G Thermal Resistance, Junction−to−Ambient R JA 417 ° C/W M = Date Code* = Pb−Free Package ~~=ae~~ Junction and Storage Temperature TJ, Tstg −55 to +150 ~~=~~ ° C (Note: Microdot may be in either location) Stresses exceeding Maximum Ratings may damage the device. Maximum *Date Code orientation and/or overbar may Ratings are stress ratings only. Functional operation above the Recommended vary depending upon manufacturing location. Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−5 = 1.0 0.75 0.062 in. **ORDERING INFORMATION** 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. **Device Package Shipping**[†] MMBTA13LT1G, SOT−23 3,000 / Tape & Reel SMMBTA13LT1G (Pb−Free) MMBTA14LT1G, SOT−23 3,000 / Tape & Reel SMMBTA14LT1G (Pb−Free) SMMBTA14LT3G SOT−23 10,000 / Tape & (Pb−Free) Reel E ~~EE~~ †For information on tape and reel specifications, *For additional information on our Pb−Free strategy and soldering details, please including part orientation and tape sizes, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2012 **November, 2012 − Rev. 5** 

**MMBTA13LT1/D** 

## **MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Breakdown Voltage<br>(IC= 100�Adc, VBE= 0)|V(BR)CES|30|−|Vdc|
|Collector Cutoff Current<br>(VCB= 30 Vdc, IE= 0)|ICBO|−|100|nAdc|
|Emitter Cutoff Current<br>(VEB= 10 Vdc, IC= 0)|IEBO|−|100|nAdc|
|**ON CHARACTERISTICS**(Note 3)|||||
|DC Current Gain<br>(IC= 10 mAdc, VCE= 5.0 Vdc)<br>MMBTA13, SMMBTA13<br>MMBTA14, SMMBTA14<br>(IC= 100 mAdc, VCE= 5.0 Vdc)<br>MMBTA13, SMMBTA13<br>MMBTA14, SMMBTA14|hFE|5000<br>10,000<br>10,000<br>20,000|−<br>−<br>−<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= 100 mAdc, IB= 0.1 mAdc)|VCE(sat)|−|1.5|Vdc|
|Base−Emitter On Voltage<br>(IC= 100 mAdc, VCE= 5.0 Vdc)|VBE|−|2.0|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**|||||
|Current−Gain − Bandwidth Product (Note 4)<br>(IC= 10 mAdc, VCE= 5.0 Vdc, f = 100 MHz)|fT|125|−|MHz|



3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

4. fT = |hfe| • ftest. 

**==> picture [181 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
RS<br>in<br>en<br>IDEAL<br>TRANSISTOR<br>**----- End of picture text -----**<br>


**Figure 1. Transistor Noise Model** 

**http://onsemi.com** 

**2** 

**MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L** 

## **NOISE CHARACTERISTICS** 

(VCE = 5.0 Vdc, TA = 25 ° C) 

**==> picture [485 x 383] intentionally omitted <==**

**----- Start of picture text -----**<br>
500 2.0<br>BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz<br>RS ≈ 0 1.0<br>200<br>0.7<br>0.5<br>100 IC = 1.0 mA<br>10 �A 0.3<br>50 0.2<br>100 �A 0.1 100 �A<br>20<br>0.07<br>I C  = 1.0 mA 0.05 10 �A<br>10<br>0.03<br>5.0 0.02<br>10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k 10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k<br>f, FREQUENCY (Hz) f, FREQUENCY (Hz)<br>Figure 2. Noise Voltage Figure 3. Noise Current<br>200 14<br>BANDWIDTH = 10 Hz TO 15.7 kHz<br>12<br>BANDWIDTH = 10 Hz TO 15.7 kHz<br>100<br>10<br>70 IC = 10 �A 10 �A<br>8.0<br>50<br>100 �A<br>6.0<br>30 100 �A<br>4.0 IC = 1.0 mA<br>20<br>1.0 mA<br>2.0<br>10 0<br>1.0 2.0 5.0 10 20 50 100 200 500 1000 1.0 2.0 5.0 10 20 50 100 200 500 1000<br>RS, SOURCE RESISTANCE (k�) RS, SOURCE RESISTANCE (k�)<br>en, NOISE VOLTAGE (nV) in, NOISE CURRENT (pA)<br>NF, NOISE FIGURE (dB)<br>VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)<br>**----- End of picture text -----**<br>


**Figure 4. Total Wideband Noise Voltage** 

**Figure 5. Wideband Noise Figure** 

**http://onsemi.com** 

**3** 

**MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L** 

**==> picture [177 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
SMALL−SIGNAL CHARACTERISTICS<br>**----- End of picture text -----**<br>


**==> picture [487 x 594] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 4.0<br>V CE  = 5.0 V<br>10 TJ = 25°C 2.0 f = 100 MHz TJ = 25 ° C<br>7.0 Cibo<br>1.0<br>5.0 Cobo 0.8<br>0.6<br>3.0 0.4<br>2.0 0.2<br>0.04 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 0.5 1.0 2.0 0.5 10 20 50 100 200 500<br>VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)<br>Figure 6. Capacitance Figure 7. High Frequency Current Gain<br>200�k 3.0<br>TJ = 125 ° C TJ = 25°C<br>100�k<br>2.5<br>70�k50�k 25°C IC = 10 mA 50 mA 250 mA 500 mA<br>30�k 2.0<br>20�k<br>1.5<br>10�k<br>7.0�k -�55°C<br>5.0�k 1.0<br>V CE  = 5.0 V<br>3.0�k<br>2.0�k 0.5<br>5.0 7.0 10 20 30 50 70 100 200 300 500 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000<br>IC, COLLECTOR CURRENT (mA) IB, BASE CURRENT (�A)<br>Figure 8. DC Current Gain Figure 9. Collector Saturation Region<br>1.6 -�1.0<br>TJ = 25°C *APPLIES FOR IC/IB ≤ hFE/3.0 25°C TO 125°C<br>1.4 -�2.0 *R�VC FOR VCE(sat)<br>VBE(sat) @ IC/IB = 1000 -�55°C TO 25°C<br>1.2 -�3.0<br>VBE(on) @ VCE = 5.0 V 25°C TO 125°C<br>1.0 -�4.0<br>�VB FOR VBE<br>0.8 -�5.0 -�55°C TO 25°C<br>VCE(sat) @ IC/IB = 1000<br>0.6 -�6.0<br>5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>C, CAPACITANCE (pF)<br>|hfe|, SMALL-SIGNAL CURRENT GAIN<br>hFE, DC CURRENT GAIN<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>C)°<br>V, VOLTAGE (VOLTS)<br>V, TEMPERATURE COEFFICIENTS (mV/<br>θ<br>R<br>**----- End of picture text -----**<br>


**Figure 10. “On” Voltages** 

**Figure 11. Temperature Coefficients** 

**http://onsemi.com** 

**4** 

**MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L** 

**==> picture [487 x 597] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>0.7<br>D = 0.5<br>0.5<br>0.2<br>0.3<br>0.2<br>0.05 SINGLE PULSE<br>0.1<br>0.1<br>0.07 SINGLE PULSE<br>0.05<br>0.03 Z�JC(t) = r(t)  •  R�JC�TJ(pk) - TC = P(pk) Z�JC(t)<br>0.02 Z� JA(t)  = r(t) • R� JA �T J(pk)  - T A  = P (pk)  Z� JA(t)<br>0.01<br>0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0�k 2.0�k 5.0�k 10�k<br>t, TIME (ms)<br>Figure 12. Thermal Response<br>1.0�k<br>700 1.0 ms<br>500<br>300 TA = 25°C TC = 25°C 100 �s<br>200 1.0 s<br>100<br>70<br>50<br>30<br>CURRENT LIMIT<br>20 THERMAL LIMIT<br>SECOND BREAKDOWN LIMIT<br>10<br>0.4 0.6 1.0 2.0 4.0 6.0 10 20 40<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>Figure 13. Active Region Safe Operating Area<br>FIGURE A<br>t P<br>PP PP<br>t1<br>1/f<br>DUTY�CYCLE � t1�f � [t][1]<br>tP<br>PEAK PULSE POWER = PP<br>r(t), TRANSIENT THERMAL<br>RESISTANCE (NORMALIZED)<br>IC, COLLECTOR CURRENT (mA)<br>**----- End of picture text -----**<br>


**Design Note: Use of Transient Thermal Resistance Data** 

**http://onsemi.com** 

**5** 

**MMBTA13L, SMMBTA13L, MMBTA14L, SMMBTA14L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AP 

**==> picture [461 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|NOTES:|
|1.|DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.|
|D|2.|CONTROLLING DIMENSION: INCH.|
|3.|MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH|
|SEE VIEW C|THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM|
|3|THICKNESS OF BASE MATERIAL.|
|4.|DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,|
|PROTRUSIONS, OR GATE BURRS.|
|E|HE|MILLIMETERS|INCHES|
|DIM|MIN|NOM|MAX|MIN|NOM|MAX|
|A|0.89|1.00|1.11|0.035|0.040|0.044|
|c|
|A1|0.01|0.06|0.10|0.001|0.002|0.004|
|1|2|
|b|0.37|0.44|0.50|0.015|0.018|0.020|
|b|c|0.09|0.13|0.18|0.003|0.005|0.007|
|e|0.25|D|2.80|2.90|3.04|0.110|0.114|0.120|
|E|1.20|1.30|1.40|0.047|0.051|0.055|
|e|1.78|1.90|2.04|0.070|0.075|0.081|
|L|0.10|0.20|0.30|0.004|0.008|0.012|
|L1|0.35|0.54|0.69|0.014|0.021|0.029|
|A|H|E|2.10|2.40|2.64|0.083|0.094|0.104|
|0|°|−−−|10|°|0|°|−−−|10|°|
|L|
|A1|STYLE 6:|
|L1|PIN 1.|BASE|
|2.|EMITTER|
|VIEW C|3.|COLLECTOR|

**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [158 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.95<br>0.037<br>0.95<br>0.037<br>2.0<br>0.079<br>0.9<br>0.035<br>SCALE 10:1 mm<br>= (— inches )<br>0.8<br>0.031 be<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**MMBTA13LT1/D** 

**6** 



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