# Bipolar (BJT) Single Transistor, PNP, 40 V, 600 mA, 640 mW, SOT-723, Surface Mount

![Product image](https://novapart.co/image/farnell:3368640/)

**URL**: https://novapart.co/products/MMBT4403M3T5G/bipolar-bjt-single-transistor-pnp-40-v-600-ma-640
**SKU**: MMBT4403M3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0500
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 640mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 200MHz |
| Transistor Case Style | SOT-723 |
| Dc Current Gain Hfe Min | 20hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 600mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3368640/)

MMBT4403M3T5G 

## PNP Switching Transistor 

The MMBT4403M3T5G device is a spin−off of our popular SOT−23 three−leaded device. It is designed for general purpose switching applications and is housed in the SOT−723 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. 

## **http://onsemi.com** 

## **Features** 

- Reduces Board Space 

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COLLECTOR<br>3<br>1<br>BASE<br>2<br>EMITTER<br>**----- End of picture text -----**<br>


- This is a Halide−Free Device 

- This is a Pb−Free Device 

**MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Collector−Emitter Voltage VCEO −40 Vdc Collector−Base Voltage VCBO −40 Vdc Emitter−Base Voltage VEBO −5.0 Vdc Collector Current − Continuous IC −600 mAdc ~~===~~ 

**MARKING THERMAL CHARACTERISTICS DIAGRAM** 3 **Characteristic Symbol Max Unit SOT−723** Total Device Dissipation PD mW **CASE 631AA** AG M FR−5 Board (Note 1) 265 2 **STYLE 1** TA = 25 ° C mW/ ° C 1 Derate above 25 ° C 2.1 ~~LM~~ AG = Specific Device Code Thermal Resistance, R JA 470 ° C/W M = Date Code Junction−to−Ambient ~~te~~ Total Device Dissipation PD 640 mW Alumina Substrate, (Note 2) TA = 25 ° C Derate above 25 ° C 5.1 mW/ ° C **ORDERING INFORMATION** Thermal Resistance, R JA 195 ° C/W Junction−to−Ambient **Device Package Shipping**[†] ~~pt~~ Junction and Storage Temperature TJ, Tstg −55 to ° C MMBT4403M3T5G SOT−723 8000/Tape & Reel +150 (Pb−Free) ~~es ee ee a~~ Stresses exceeding Maximum Ratings may damage the device. Maximum †For information on tape and reel specifications, Ratings are stress ratings only. Functional operation above the Recommended including part orientation and tape sizes, please Operating Conditions is not implied. Extended exposure to stresses above the refer to our Tape and Reel Packaging Specifications Recommended Operating Conditions may affect device reliability. Brochure, BRD8011/D. 

1. FR−5 = 1.0 0.75 0.062 in. 

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 

Publication Order Number: **MMBT4403M3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2009 **January, 2009 − Rev. 0** 

**MMBT4403M3T5G** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**Characteristic**|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|---|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (Note 3)<br>(IC= −1.0 mAdc, IB= 0)||V(BR)CEO|−40|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −0.1 mAdc, IE= 0)||V(BR)CBO|−40|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −0.1 mAdc, IC= 0)||V(BR)EBO|−5.0|−|Vdc|
|Base Cutoff Current<br>(VCE= −35 Vdc, VEB= −0.4 Vdc)||IBEV|−|−0.1|�Adc|
|Collector Cutoff Current<br>(VCE= −35 Vdc, VEB= −0.4 Vdc)||ICEX|−|−0.1|�Adc|
|**ON CHARACTERISTICS**||||||
|DC Current Gain<br>(IC= −0.1 mAdc, VCE= −1.0 Vdc)<br>(IC= −1.0 mAdc, VCE= −1.0 Vdc)<br>(IC= −10 mAdc, VCE= −1.0 Vdc)<br>(Note 3)<br>(IC= −150 mAdc, VCE= −2.0 Vdc)<br>(Note 3)<br>(IC= −500 mAdc, VCE= −2.0 Vdc)||hFE|30<br>60<br>100<br>100<br>20|−<br>−<br>−<br>300<br>−|−|
|Collector−Emitter Saturation Voltage (Note 3)<br>(IC= −150 mAdc, IB= −15 mAdc)<br>(IC= −500 mAdc, IB= −50 mAdc)||VCE(sat)|−<br>−|−0.4<br>−0.75|Vdc|
|Base−Emitter Saturation Voltage (Note 3)<br>(IC= −150 mAdc, IB= −15 mAdc)<br>(IC= −500 mAdc, IB= −50 mAdc)||VBE(sat)|−0.75<br>−|−0.95<br>−1.3|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= −20 mAdc, VCE= −10 Vdc, f = 100 MHz)||fT|200|−|MHz|
|Collector−Base Capacitance<br>(VCB= −10 Vdc, IE= 0, f = 1.0 MHz)||Ccb|−|8.5|pF|
|Emitter−Base Capacitance<br>(VBE= −0.5 Vdc, IC= 0, f = 1.0 MHz)||Ceb|−|30|pF|
|Input Impedance<br>(IC|= −1.0 mAdc, VCE= −10 Vdc, f = 1.0 kHz)|hie|1.5|15|k�|
|Voltage Feedback Ratio<br>(IC|= −1.0 mAdc, VCE= −10 Vdc, f = 1.0 kHz)|hre|0.1|8.0|X 10−4|
|Small−Signal Current Gain<br>(IC|= −1.0 mAdc, VCE= −10 Vdc, f = 1.0 kHz)|hfe|60|500|−|
|Output Admittance<br>(IC|= −1.0 mAdc, VCE= −10 Vdc, f = 1.0 kHz)|hoe|1.0|100|�Mhos|
|**SWITCHING CHARACTERISTICS**||||||
|Delay Time|(VCC= −30 Vdc, VEB= −2.0 Vdc,<br>IC= −150 mAdc, IB1= −15 mAdc)|td|−|15|ns|
|Rise Time||tr|−|20||
|Storage Time|(VCC= −30 Vdc, IC= −150 mAdc,<br>IB1= IB2= −15 mAdc)|ts|−|225|ns|
|Fall Time||tf|−|30||



3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

## **SWITCHING TIME EQUIVALENT TEST CIRCUIT** 

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-�30 V -�30 V<br>200 � 200 �<br>< 2 ns < 20 ns<br>+2 V +14 V<br>0 0<br>1.0 k� CS* < 10 pF 1.0 k� CS* < 10 p<br>-16 V<br>-�16 V<br>10 to 100 �s, 1.0 to 100 �s,<br>DUTY CYCLE = 2% Scope rise time < 4.0 ns DUTY CYCLE = 2% +�4.0 V<br>*Total shunt capacitance of test jig connectors, and oscilloscope<br>**----- End of picture text -----**<br>


**Figure 1. Turn−On Time** 

**Figure 2. Turn−Off Time** 

**http://onsemi.com** 

**2** 

**MMBT4403M3T5G** 

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STATIC CHARACTERISTICS<br>**----- End of picture text -----**<br>


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450<br>VCE = 5.0 V<br>400<br>VCE = 2.0 V<br>350 T J  = 150°C V CE = 1.0 V<br>300<br>250<br>25°C<br>200<br>150<br>-�55°C<br>100<br>50<br>0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A)<br>Figure 3. DC Current Gain<br>1.2<br>IC = 1.0 mA 10 mA 100 mA 500 mA<br>1.0<br>0.8<br>0.6<br>0.4<br>0.2<br>0<br>0.001 0.01 0.1 1 10 100<br>Ib, BASE CURRENT (mA)<br>Figure 4. Collector Saturation Region<br>0.35 0.5<br>IC/IB = 10<br>0.30 0<br>�VC for VCE(sat)<br>0.25<br>150°C 0.5<br>0.20<br>1.0<br>0.15 25°C<br>1.5<br>0.10<br>-55°C<br>0.05 2.0 �VS for VBE<br>0 2.5<br>0.0001 0.001 0.01 0.1 1 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (mA)<br>Figure 5. Collector−Emitter Saturation Voltage Figure 6. Temperature Coefficients<br>vs. Collector Current<br>FE<br>h      , DC CURRENT GAIN<br>CE<br>V     , COLLECTOR-EMITTER VOLTAGE (V)<br>C)°<br>COEFFICIENT (mV/<br>VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE (V)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**3** 

**MMBT4403M3T5G** 

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1.1 1.0<br>IC/IB = 10 VCE = 2.0 V<br>1.0 0.9<br>0.9 0.8 −55 ° C<br>−55 ° C<br>0.8 0.7<br>0.7 0.6 25 ° C<br>25 ° C<br>0.6 0.5<br>0.5 0.4<br>150 ° C<br>0.4 150 ° C 0.3<br>0.3 0.2<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 7. Base−Emitter Saturation Voltage vs. Figure 8. Base−Emitter Turn On Voltage vs.<br>Collector Current Collector Current<br>40 15<br>35 13<br>30 11<br>25 9<br>20 7<br>15 5<br>10 3<br>0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40<br>Veb, EMITTER BASE VOLTAGE (V) Vcb, COLLECTOR BASE VOLTAGE (V)<br>, BASE−EMITTER<br>VOLTAGE (V)<br>BE(sat) , BASE−EMITTER TURN ON<br>V<br>SATURATION VOLTAGE (V)<br>BE(on)<br>V<br>, INPUT CAPACITANCE (pF)<br>, OUTPUT CAPACITANCE (pF)<br>ibo<br>C obo<br>C<br>**----- End of picture text -----**<br>


**Figure 9. Input Capacitance vs. Emitter Base Voltage** 

**Figure 10. Output Capacitance vs. Collector Base Voltage** 

**http://onsemi.com** 

**4** 

**MMBT4403M3T5G** 

## **PACKAGE DIMENSIONS** 

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SOT−723<br>CASE 631AA−01<br>ISSUE C<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>**----- End of picture text -----**<br>


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−X−<br>D<br>b1 A<br>flo −Y− cu<br>3<br>E L H E<br>1 2<br>ce b 2X C<br>e<br>0.08 (0.0032) X Y<br>**----- End of picture text -----**<br>


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2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br>4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.45 0.50 0.55 0.018 0.020 0.022<br>e b 0.15 0.21 e 0.27 0.0059 e 0.0083 0.0106<br>b1 0.25 0.31 0.37 0.010 0.012 0.015<br>C 0.07 0.12 0.17 0.0028 0.0047 0.0067<br>D 1.15 1.20 1.25 0.045 0.047 0.049<br>E 0.75 0.80 0.85 0.03 0.032 0.034<br>STYLE 1:<br>PIN 1. BASE e 0.40 BSC 0.016 BSC<br> 2. EMITTER H E 1.15 1.20 1.25 0.045 0.047 0.049<br> 3. COLLECTOR L 0.15 0.20 0.25 0.0059 0.0079 0.0098<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

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0.40<br>0.0157<br>to<br>0.40<br>0.0157<br>2<br>1.0<br>0.039<br>0.40<br>0.0157<br>ea<br>0.40 0.40<br>Ll<br>0.0157 0.0157<br>SCALE 20:1 mm<br>(—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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**MMBT4403M3/D** 

**5** 



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