# Bipolar (BJT) Single Transistor, NPN, 40 V, 600 mA, 265 mW, SOT-723, Surface Mount

![Product image](https://novapart.co/image/farnell:2724360/)

**URL**: https://novapart.co/products/MMBT4401M3T5G/bipolar-bjt-single-transistor-npn-40-v-600-ma-265
**SKU**: MMBT4401M3T5G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0490
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:40V; Transition Frequency ft:250MHz; Power Dissipation Pd:2; Available until stocks are exhausted Alternative available

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 265mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 250MHz |
| Transistor Case Style | SOT-723 |
| Dc Current Gain Hfe Min | 20hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 600mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2724360/)

MMBT4401M3T5G 

## NPN Switching Transistor 

The MMBT4401M3T5G device is a spin−off of our popular SOT−23 three−leaded device. It is designed for general purpose switching applications and is housed in the SOT−723 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. 

## **http://onsemi.com** 

## **Features** 

- Reduces Board Space 

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 

Compliant **MAXIMUM RATINGS Rating Symbol Value Unit** Collector−Emitter Voltage VCEO 40 Vdc Collector−Base Voltage VCBO 60 Vdc Emitter−Base Voltage VEBO 6.0 Vdc Collector Current − Continuous IC 600 mAdc ~~==~~ **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** Total Device Dissipation PD mW FR−5 Board (Note 1) 265 TA = 25 ° C mW/ ° C Derate above 25 ° C 2.1 ~~ae~~ Thermal Resistance, R JA 470 ° C/W Junction−to−Ambient Total Device Dissipation PD 640 mW Alumina Substrate, (Note 2) TDerate above 25 ° C A = 25 ° C 5.1 mW/ ° C ~~Fr~~ Thermal Resistance, R JA 195 ° C/W Junction−to−Ambient Junction and Storage Temperature TJ, Tstg −55 to ° C +150 ~~PE~~ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

**==> picture [167 x 213] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR<br>3<br>1<br>BASE<br>2<br>EMITTER<br>MARKING<br>* DIAGRAM<br>3<br>SOT−723<br>AF M<br>CASE 631AA<br>2 STYLE 1<br>1<br>AF = Specific Device Code<br>M = Date Code<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MMBT4401M3T5G|SOT−723<br>(Pb−Free)|8000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

1. FR−5 = 1.0 0.75 0.062 in. 

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 

Publication Order Number: **MMBT4401M3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2012 **August, 2012 − Rev. 1** 

**MMBT4401M3T5G** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**Characteristic**|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|---|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (Note 3)<br>(IC= 1.0 mAdc, IB= 0)||V(BR)CEO|40|−|Vdc|
|Collector−Base Breakdown Voltage|(IC= 0.1 mAdc, IE= 0)|V(BR)CBO|60|−|Vdc|
|Emitter−Base Breakdown Voltage|(IE= 0.1 mAdc, IC= 0)|V(BR)EBO|6.0|−|Vdc|
|Base Cutoff Current|(VCE= 35 Vdc, VEB= 0.4 Vdc)|IBEV|−|0.1|�Adc|
|Collector Cutoff Current|(VCE= 35 Vdc, VEB= 0.4 Vdc)|ICEX|−|0.1|�Adc|
|**ON CHARACTERISTICS**(Note 3)||||||
|DC Current Gain|(IC= 0.1 mAdc, VCE= 1.0 Vdc)<br>(IC= 1.0 mAdc, VCE= 1.0 Vdc)<br>(IC= 10 mAdc, VCE= 1.0 Vdc)<br>(IC= 150 mAdc, VCE= 1.0 Vdc)<br>(IC= 500 mAdc, VCE= 2.0 Vdc)|hFE|20<br>40<br>80<br>100<br>40|−<br>−<br>−<br>300<br>−|−|
|Collector−Emitter Saturation Voltage|(IC= 150 mAdc, IB= 15 mAdc)<br>(IC= 500 mAdc, IB= 50 mAdc)|VCE(sat)|−<br>−|0.4<br>0.75|Vdc|
|Base−Emitter Saturation Voltage|(IC= 150 mAdc, IB= 15 mAdc)<br>(IC= 500 mAdc, IB= 50 mAdc)|VBE(sat)|0.75<br>−|0.95<br>1.2|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC=|20 mAdc, VCE= 10 Vdc, f = 100 MHz)|fT|250|−|MHz|
|Collector−Base Capacitance|(VCB= 5.0 Vdc, IE= 0, f = 1.0 MHz)|Ccb|−|6.5|pF|
|Emitter−Base Capacitance|(VEB= 0.5 Vdc, IC= 0, f = 1.0 MHz)|Ceb|−|30|pF|
|Input Impedance<br>(IC|= 1.0 mAdc, VCE= 10 Vdc, f = 1.0 kHz)|hie|1.0|15|k�|
|Voltage Feedback Ratio<br>(IC|= 1.0 mAdc, VCE= 10 Vdc, f = 1.0 kHz)|hre|0.1|8.0|X 10−4|
|Small−Signal Current Gain<br>(IC|= 1.0 mAdc, VCE= 10 Vdc, f = 1.0 kHz)|hfe|40|500|−|
|Output Admittance<br>(IC|= 1.0 mAdc, VCE= 10 Vdc, f = 1.0 kHz)|hoe|1.0|30|�mhos|
|**SWITCHING CHARACTERISTICS**||||||
|Delay Time|(VCC= 30 Vdc, VEB= 2.0 Vdc,<br>IC= 150 mAdc, IB1= 15 mAdc)|td|−|15|ns|
|Rise Time||tr|−|20||
|Storage Time|(VCC= 30 Vdc, IC= 150 mAdc,<br>IB1= IB2= 15 mAdc)|ts|−|225|ns|
|Fall Time||tf|−|30||



3. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2.0%. 

## **SWITCHING TIME EQUIVALENT TEST CIRCUITS** 

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**----- Start of picture text -----**<br>
+�30 V +�30 V<br>1.0 to 100 �s, 200 � 1.0 to 100 �s, 200 �<br>+16 V DUTY CYCLE ≈ 2.0% +16 V DUTY CYCLE ≈ 2.0%<br>0<br>0<br>-�2.0 V < 2.0 ns 1.0 k� CS* < 10 pF -14 V < 20 ns 1.0 k� CS* < 10 pF<br>Scope rise time < 4.0 ns -�4.0 V<br>*Total shunt capacitance of test jig connectors, and oscilloscope<br>**----- End of picture text -----**<br>


**Figure 1. Turn−On Time** 

**Figure 2. Turn−Off Time** 

**http://onsemi.com** 

**2** 

**MMBT4401M3T5G** 

**==> picture [487 x 624] intentionally omitted <==**

**----- Start of picture text -----**<br>
500<br>450 TJ = 150°C V V CE CE  = 5.0 V  = 2.0 V<br>400<br>VCE = 1.0 V<br>350<br>25°C<br>300<br>250<br>200 -�55°C<br>150<br>100<br>50<br>0<br>0.01 0.1 1<br>IC, COLLECTOR CURRENT (A)<br>Figure 3. DC Current Gain<br>1.2<br>1.0<br>0.8<br>IC = 1.0 mA 10 mA 100 mA 300 mA 500 mA<br>0.6<br>0.4<br>0.2<br>0<br>0.001 0.01 0.1 1 10 100<br>IB, BASE CURRENT (mA)<br>Figure 4. Collector Saturation Region<br>0.35 +�0.5<br>IC/IB = 10<br>0.30 0 �VC for VCE(sat)<br>0.25<br>150°C -�0.5<br>0.20<br>-�1.0<br>0.15 25°C<br>-�1.5<br>0.10<br>-55°C<br>0.05 -�2.0 �VB for VBE<br>0 -�2.5<br>0.0001 0.001 0.01 0.1 1 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (mA)<br>Figure 5. Collector−Emitter Saturation Voltage Figure 6. Temperature Coefficients<br>vs. Collector Current<br>FE<br>h     , DC CURRENT GAIN<br>CE<br>V     , COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>C)°<br>COEFFICIENT (mV/<br>VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE (V)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**3** 

## **MMBT4401M3T5G** 

**==> picture [490 x 401] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.1 1.0<br>IC/IB = 10 VCE = 2.0 V<br>1.0 0.9<br>0.9 −55 ° C<br>0.8<br>−55 ° C<br>0.8<br>0.7<br>0.7 25 ° C<br>25 ° C 0.6<br>0.6<br>0.5<br>0.5<br>0.4 150 ° C 0.4 150 ° C<br>0.3 0.3<br>0.0001 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 7. Base−Emitter Saturation Voltage vs. Figure 8. Base−Emitter Turn On Voltage vs.<br>Collector Current Collector Current<br>21 8.5<br>7.5<br>19<br>6.5<br>17<br>5.5<br>15<br>4.5<br>13<br>3.5<br>11<br>2.5<br>9 1.5<br>0 1 2 3 4 5 6 0 5 10 15 20 25 30 35 40 45 50<br>Veb, EMITTER BASE VOLTAGE (V) Vcb, COLLECTOR BASE VOLTAGE (V)<br>, BASE−EMITTER<br>VOLTAGE (V)<br>BE(sat) , BASE−EMITTER TURN ON<br>V<br>SATURATION VOLTAGE (V)<br>BE(on)<br>V<br>, INPUT CAPACITANCE (pF)<br>, OUTPUT CAPACITANCE (pF)<br>ibo<br>C obo<br>C<br>**----- End of picture text -----**<br>


**Figure 9. Input Capacitance vs. Emitter Base Voltage** 

**Figure 10. Output Capacitance vs. Collector Base Voltage** 

**==> picture [241 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>1 s 100 ms 10 ms 1 ms 0.1 ms<br>100<br>10<br>Single Pulse Test<br>at TA = 25°C<br>1.0<br>1.0 10 100<br>VCE, COLLECTOR EMITTER VOLTAGE (V)<br>, COLLECTOR CURRENT (mA)<br>IC<br>**----- End of picture text -----**<br>


**Figure 11. Safe Operating Area** 

**http://onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOT−723** CASE 631AA−01 ISSUE D 

DATE 10 AUG 2009 

**SCALE 4:1** 

**==> picture [451 x 252] intentionally omitted <==**

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−X− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME<br>D Y14.5M, 1994.<br>b1 A 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3 −Y− 3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>THICKNESS OF BASE MATERIAL.<br>E H E 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS OR GATE BURRS.<br>1 2<br>Go 2X b tf MILLIMETERS<br>C DIM MIN NOM MAX<br>2X e 0.08 X Y A 0.45 0.50 0.55<br>SIDE VIEW b 0.15 0.21 0.27<br>TOP VIEW b1 0.25 0.31 0.37<br>C 0.07 0.12 0.17<br>3X L D 1.15 1.20 1.25<br>1 E 0.75 0.80 0.85<br>e 0.40 BSC<br>H E 1.15 1.20 1.25<br>L 0.29 REF<br>L2 0.15 0.20 0.25<br>3X L2 |CU E GENERIC<br>BOTTOM VIEW MARKING DIAGRAM*<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. ANODE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE XX M<br> 2. EMITTER  2. N/C  2. ANODE  2. CATHODE  2. SOURCE<br> 3. COLLECTOR  3. CATHODE  3. CATHODE  3. ANODE  3. DRAIN<br>=<br>1<br>XX = Specific Device Code<br>RECOMMENDED<br>M = Date Code<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

3. MAXIMUM LEAD THICKNESS INCLUDES LEADFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUMFINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 

**==> picture [177 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
RECOMMENDED<br>SOLDERING FOOTPRINT*<br>2X<br>0.40<br>2X 0.27<br>“Ar<br>PACKAGE<br>OUTLINE<br>SAE]<br>1.50<br>3X 0.52 aoe 0.36<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON12989D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SOT−723 PAGE 1 OF 1** ~~SE~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

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