# Bipolar (BJT) Single Transistor, PNP, 40 V, 200 mA, 200 mW, SOT-416, Surface Mount

![Product image](https://novapart.co/image/farnell:2533330/)

**URL**: https://novapart.co/products/MMBT3906TT1G/bipolar-bjt-single-transistor-pnp-40-v-200-ma-mw
**SKU**: MMBT3906TT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0270
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:-40V; Transition Frequency ft:250MHz; Power Dissipation Pd:200mW; DC Collector Current:-200mA; DC Current Gain hFE:30hFE; Transist

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Power Dissipation | 200mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 250MHz |
| Transistor Case Style | SOT-416 |
| Dc Current Gain Hfe Min | 30hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 200mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2533330/)

MMBT3906TT1 

## General Purpose Transistors 

## **PNP Silicon** 

This transistor is designed for general purpose amplifier applications. It is housed in the SOT−416/SC−75 package which is designed for low power surface mount applications. 

## **www.onsemi.com** 

|**GENERAL PURPOSE**|
|---|
|**AMPLIFIER TRANSISTORS**|
|**SURFACE MOUNT**|
|COLLECTOR<br>3|
|**CASE 463**<br>**SOT−416/SC−75**<br>**STYLE 1**<br>3<br>2<br>1<br>BASE<br>2<br>EMITTER<br>~~&~~<br>~~i.~~|
|1|
|**MARKING DIAGRAM**|
||
||
||
|2A M|
||
|2A<br>= Device Code<br>M<br>= Date Code*<br>= Pb−Free Package<br>1<br>*Date Code orientation may vary depending up-<br>on manufacturing location.<br>(Note: Microdot may be in either location)|
|**ORDERING INFORMATION**|
|**Device**<br>**Package**<br>**Shipping**†|
|MMBT3906TT1<br>SOT−416<br>3000 / Tape &|
|Reel<br>MMBT3906TT1G<br>SOT−416|
|(Pb−Free)|
|NSVMMBT3906TT1G<br>SOT−416<br>3000 / Tape &|
|(Pb−Free)<br>Reel|



## **Features** 

- Pb−Free Package is Available 

- NSVM Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

||**MAXIMUM RATINGS**(TA= 25°C)|||||||
|---|---|---|---|---|---|---|---|
|**Rating**<br>**Symbol**<br>**Value**<br>**Unit**<br>Collector−Emitter Voltage<br>VCEO<br>−40<br>Vdc<br>Collector−Base Voltage<br>VCBO<br>−40<br>Vdc<br>Emitter−Base Voltage<br>VEBO<br>−5.0<br>Vdc<br>Collector Current − Continuous<br>IC<br>−200<br>mAdc<br>3<br>~~i.~~||||||||
||**THERMAL CHARACTERISTICS**||||||1|
||**Characteristic**||**Symbol**|**Max**|**Unit**||**MARKING DIAGRAM**|
||Total Device Dissipation,||PD|||||
||FR−4 Board (Note 1) @TA= 25°C|||200|mW|||
||Derated above 25°C|||1.6|mW/°C|||
||Thermal Resistance, Junction−to−Ambient||R JA|600|°C/W|||
||(Note 1)|||||||
||Total Device Dissipation,<br>FR−4 Board (Note 2) @TA= 25°C<br>Derated above 25°C<br>PD<br>300<br>2.4<br>mW<br>mW/°C<br>Thermal Resistance, Junction−to−Ambient<br>(Note 2)<br>R JA<br>400<br>°C/W<br>Junction and Storage Temperature Range<br>TJ, Tstg<br>−55 to +150<br>°C<br>~~eH~~||||||2A<br>M<br>*Date Code orientation may vary depending up-<br>on manufacturing location.<br>(Note: Microdot may be in either location)|
|Stresses exceeding those listed in the Maximum Ratings table may damage the||||||||
|device. If any of these limits are exceeded, device functionality should not be||device. If any of these limits are exceeded, device functionality should not be|device. If any of these limits are exceeded, device functionality should not be||||**ORDERING INFORMATION**|
|assumed, damage may occur and reliability may be affected.||assumed, damage may occur and reliability may be affected.||||||
|1. FR−4 @ Minimum Pad|||||||**Device**|



2. FR−4 @ 1.0 × 1.0 Inch Pad 

- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2006 **May, 2017 − Rev. 2** 

**MMBT3906TT1/D** 

## **MMBT3906TT1** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (Note 3)<br>(IC= −1.0 mAdc, IB= 0)||V(BR)CEO|−40|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= −10�Adc, IE= 0)||V(BR)CBO|−40|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= −10�Adc, IC= 0)||V(BR)EBO|−5.0|−|Vdc|
|Base Cutoff Current<br>(VCE= −30 Vdc, VEB= −3.0 Vdc)||IBL|−|−50|nAdc|
|Collector Cutoff Current<br>(VCE= −30 Vdc, VEB= −3.0 Vdc)||ICEX|−|−50|nAdc|
|**ON CHARACTERISTICS**(Note 3)||||||
|DC Current Gain<br>(IC= −0.1 mAdc, VCE= −1.0 Vdc)<br>(IC= −1.0 mAdc, VCE= −1.0 Vdc)<br>(IC= −10 mAdc, VCE= −1.0 Vdc)<br>(IC= −50 mAdc, VCE= −1.0 Vdc)<br>(IC= −100 mAdc, VCE= −1.0 Vdc)||hFE|60<br>80<br>100<br>60<br>30|−<br>−<br>300<br>−<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −1.0 mAdc)<br>(IC= −50 mAdc, IB= −5.0 mAdc)||VCE(sat)|−<br>−|−0.25<br>−0.4|Vdc|
|Base−Emitter Saturation Voltage<br>(IC= −10 mAdc, IB= −1.0 mAdc)<br>(IC= −50 mAdc, IB= −5.0 mAdc)||VBE(sat)|−0.65<br>−|−0.85<br>−0.95|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product<br>(IC= −10 mAdc, VCE= −20 Vdc, f = 100 MHz)||fT|250|−|MHz|
|Output Capacitance<br>(VCB= −5.0 Vdc, IE= 0, f = 1.0 MHz)||Cobo|−|4.5|pF|
|Input Capacitance1<br>(VEB= −0.5 Vdc, IC= 0, f = 1.0 MHz)||Cibo|−|10.0|pF|
|Input Impedance<br>(VCE= −10 Vdc, IC= −1.0 mAdc, f = 1.0 kHz)||hie|2.0|12|k�|
|Voltage Feedback Ratio<br>(VCE= −10 Vdc, IC= −1.0 mAdc, f = 1.0 kHz)||hre|0.1|10|X 10−4|
|Small−Signal Current Gain<br>(VCE= −10 Vdc, IC= −1.0 mAdc, f = 1.0 kHz)||hfe|100|400|−|
|Output Admittance<br>(VCE= −10 Vdc, IC= −1.0 mAdc, f = 1.0 kHz)||hoe|3.0|60|�mhos|
|Noise Figure<br>(VCE= −5.0 Vdc, IC= −100�Adc, RS= 1.0 k�, f = 1.0 kHz)||NF|−|4.0|dB|
|**SWITCHING CHARACTERISTICS**||||||
|Delay Time|(VCC= −3.0 Vdc, VBE= 0.5 Vdc)|td|−|35|ns|
|Rise Time|(IC= −10 mAdc, IB1= −1.0 mAdc)|tr|−|35||
|Storage Time|(VCC= −3.0 Vdc, IC= −10 mAdc)|ts|−|225|ns|
|Fall Time|(IB1= IB2= −1.0 mAdc)|tf|−|75||



3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

**www.onsemi.com** 

**2** 

**MMBT3906TT1** 

**==> picture [488 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.0<br>D = 0.5<br>0.2<br>0.1<br>0.1<br>0.05<br>0.02<br>0.01 0.01<br>SINGLE PULSE<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>r(t), NORMALIZED TRANSIENT THERMAL RESISTANCE t, TIME (s)<br>**----- End of picture text -----**<br>


**Figure 1. Normalized Thermal Response** 

**==> picture [483 x 106] intentionally omitted <==**

**----- Start of picture text -----**<br>
3 V 3 V<br>< 1 ns<br>+�9.1 V<br>275 275<br>< 1 ns<br>10 k 10 k<br>0<br>CS < 4 pF* 1N916 CS < 4 pF*<br>+10.6 V<br>300 ns 10 < t1 < 500 �s<br>DUTY CYCLE = 2% t1 10.9 V<br>DUTY CYCLE = 2%<br>**----- End of picture text -----**<br>


- Total shunt capacitance of test jig and connectors 

**Figure 2. Delay and Rise Time Equivalent Test Circuit** 

**Figure 3. Storage and Fall Time Equivalent Test Circuit** 

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**3** 

**MMBT3906TT1** 

## **TYPICAL TRANSIENT CHARACTERISTICS** 

**==> picture [488 x 197] intentionally omitted <==**

**----- Start of picture text -----**<br>
TJ = 25°C<br>TJ = 125°C<br>10 5000<br>7.0 3000 VCC = 40 V<br>2000 IC/IB = 10<br>5.0 Cobo 1000 QT<br>700<br>Cibo<br>3.0 500<br>300<br>2.0 200<br>QA<br>100<br>70<br>1.0 50<br>0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)<br>Q, CHARGE (pC)<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 4. Capacitance** 

**Figure 5. Charge Data** 

**==> picture [235 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
500<br>300 IC/IB = 10<br>200<br>100<br>70<br>50 tr @ VCC = 3.0 V<br>30 15 V<br>20<br>40 V<br>10 2.0 V<br>7<br>td @ VOB = 0 V<br>5<br>1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (mA)<br>TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 6. Turn−On Time** 

**==> picture [243 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
500<br>300 VCC = 40 V<br>200 IB1 = IB2<br>IC/IB = 20<br>100<br>70<br>50<br>30 IC/IB = 10<br>20<br>10<br>7<br>5<br>1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (mA)<br>f<br>t  , FALL TIME (ns)<br>**----- End of picture text -----**<br>


**Figure 7. Fall Time** 

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**4** 

**MMBT3906TT1** 

## **TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS NOISE FIGURE VARIATIONS** 

(VCE = −5.0 Vdc, TA = 25 ° C, Bandwidth = 1.0 Hz) 

**==> picture [489 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.0 12<br>SOURCE RESISTANCE = 200 � f = 1.0 kHz IC = 1.0 mA<br>IC = 1.0 mA 10<br>4.0<br>SOURCE RESISTANCE = 200 � IC = 0.5 mA<br>IC = 0.5 mA 8.0<br>3.0<br>SOURCE RESISTANCE = 2.0 k<br>6.0<br>IC = 50 �A<br>2.0<br>4.0<br>IC = 50 �A<br>1.0 SOURCE RESISTANCE = 2.0 k 2.0 IC = 100 �A<br>IC = 100 �A<br>0 0<br>0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100<br>f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (k�)<br>NF, NOISE FIGURE (dB) NF, NOISE FIGURE (dB)<br>**----- End of picture text -----**<br>


**Figure 8.** 

**Figure 9.** 

## **h PARAMETERS** 

(VCE = −10 Vdc, f = 1.0 kHz, TA = 25 ° C) 

**==> picture [488 x 370] intentionally omitted <==**

**----- Start of picture text -----**<br>
300 100<br>70<br>50<br>200<br>30<br>100 20<br>70<br>10<br>50<br>7.0<br>30 5.0<br>0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 10. Current Gain Figure 11. Output Admittance<br>20 10<br>7.0<br>10<br>7.0 5.0<br>5.0<br>3.0<br>3.0<br>2.0<br>2.0<br>1.0<br>0.7<br>1.0<br>0.5<br>0.7<br>0.3<br>0.2 0.5<br>0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>�<br>hfe, CURRENT GAIN<br>oe<br>h    , OUTPUT ADMITTANCE (   mhos)<br>-4<br>)Ω<br>ie<br>h    , INPUT IMPEDANCE (k<br>re<br>h    , VOLTAGE FEEDBACK RATIO (X 10    )<br>**----- End of picture text -----**<br>


**Figure 12. Input Impedance** 

**Figure 13. Voltage Feedback Ratio** 

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**5** 

**MMBT3906TT1** 

## **STATIC CHARACTERISTICS** 

**==> picture [489 x 626] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0<br>TJ = +125°C VCE = 1.0 V<br>1.0 +25°C<br>0.7<br>-�55°C<br>0.5<br>0.3<br>0.2<br>0.1<br>0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (mA)<br>Figure 14. DC Current Gain<br>1.0<br>T J  = 25°C<br>0.8<br>IC = 1.0 mA 10 mA 30 mA 100 mA<br>0.6<br>0.4<br>0.2<br>0<br>0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10<br>IB, BASE CURRENT (mA)<br>Figure 15. Collector Saturation Region<br>1.0 1.0<br>TJ = 25°C VBE(sat) @ IC/IB = 10<br>0.5<br>0.8 VBE @ VCE = 1.0 V �VC FOR VCE(sat) +25°C TO +125°C<br>0 -�55°C TO +25°C<br>0.6<br>-0.5<br>0.4 +25°C TO +125°C<br>-1.0<br>�VS FOR VBE(sat) -�55°C TO +25°C<br>0.2 VCE(sat) @ IC/IB = 10 -1.5<br>0 -2.0<br>1.0 2.0 5.0 10 20 50 100 200 0 20 40 60 80 100 120 140 160 180 200<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>FE<br>h     , DC CURRENT GAIN (NORMALIZED)<br>CE<br>V     , COLLECTOR EMITTER VOLTAGE (VOLTS)<br>C)°<br>V, VOLTAGE (VOLTS)<br>V, TEMPERATURE COEFFICIENTS (mV/<br>θ<br>**----- End of picture text -----**<br>


**Figure 16. “ON” Voltages** 

**Figure 17. Temperature Coefficients** 

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**6** 

**MMBT3906TT1** 

## **PACKAGE DIMENSIONS** 

**==> picture [70 x 29] intentionally omitted <==**

**----- Start of picture text -----**<br>
SC−75/SOT−416<br>CASE 463−01<br>ISSUE G<br>**----- End of picture text -----**<br>


**==> picture [424 x 348] intentionally omitted <==**

**----- Start of picture text -----**<br>
−E− NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>TT Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>2<br>MILLIMETERS INCHES<br>3 DIM MIN NOM MAX MIN NOM MAX<br>e −D− A 0.70 0.80 0.90 0.027 0.031 0.035<br>1 A1 0.00 0.05 0.10 0.000 0.002 0.004<br>b 3 PL b 0.15 0.20 0.30 0.006 0.008 0.012<br>0.20 (0.008) M D HE 0.20 (0.008) E CDE 0.101.550.70 0.151.600.80 0.251.650.90 0.0040.0610.027 0.0060.0630.031 0.0100.0650.035<br>e 1.00 BSC 0.04 BSC<br>7 0 —eeSeeS L 0.10 0.15 0.20 0.004 0.006 0.008<br>a. He HE 1.50 1.60 1.70 0.060 0.063 0.067<br>STYLE 1:<br>C PIN 1. BASE<br>A  2. EMITTER<br> 3. COLLECTOR<br>L A1<br>SOLDERING FOOTPRINT*<br>0.356<br>0.014<br>aT<br>1.803 0.787<br>0.071 0.031<br>7 at _<br>_ 0.508 a<br>0.020 1.000<br>0.039<br>SCALE 10:1 mm<br>(— inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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**MMBT3906TT1/D** 

**7** 



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