# Bipolar (BJT) Single Transistor, General Purpose, NPN, 40 V, 200 mA, 225 mW, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:1459100/)

**URL**: https://novapart.co/products/MMBT3904LT1G/bipolar-bjt-single-transistor-general-purpose-npn
**SKU**: MMBT3904LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0250
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:40V; Transition Frequency ft:300MHz; Power Dissipation Pd:225mW; DC Collector Current:200mA; DC Current Gain hFE:300hFE; Transisto

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | MMBTxxxx |
| Qualification | AEC-Q101 |
| Power Dissipation | 225mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | 300MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 300hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 200mA |
| Collector Emitter Voltage Max | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1459100/)

## MMBT3904L, SMMBT3904L 

## General Purpose Transistor **NPN Silicon** 

## **Features** 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **www.onsemi.com** 

• S Prefix for Automotive and Other Applications Requiring Unique COLLECTOR Site and Control Change Requirements; AEC−Q101 Qualified and 3 PPAP Capable 1 **MAXIMUM RATINGS** BASE **Rating Symbol Value Unit** 2 Collector−Emitter Voltage VCEO 40 Vdc EMITTER Collector−Base Voltage VCBO 60 Vdc Emitter−Base Voltage VEBO 6.0 Vdc 3 Collector Current − Continuous IC 200 mAdc **SOT−23 (TO−236) CASE 318** Collector Current − Peak (Note 3) ICM 900 mAdc 1 **STYLE 6** ~~=o&~~ **THERMAL CHARACTERISTICS** 2 **Characteristic Symbol Max Unit** Total Device Dissipation FR−5 Board (Note 1) @TA = 25 ° C PD 225 mW **MARKING DIAGRAM** Derate above 25 ° C 1.8 mW/ ° C Thermal Resistance, Junction−to−Ambient R JA 556 ° C/W 1AM M Total Device Dissipation Alumina PD ~~pe~~ Substrate, (Note 2) 1 @TA = 25 ° C 300 mW Derate above 25 ° C 2.4 mW/ ° C 1AM = Specific Device Code Thermal Resistance, Junction−to−Ambient R JA 417 ° C/W M = Date Code* ~~pt~~ = Pb−Free Package Junction and Storage Temperature TJ, TstgJ, Tstg, Tstgstg −55 to +150 ° C (Note: Microdot may be in either location) Stresses exceeding those listed in the Maximum Ratings table may damage the *Date Code orientation and/or overbar may device. If any of these limits are exceeded, device functionality should not be vary depending upon manufacturing location. 

Junction and Storage Temperature TJ, TstgJ, Tstg, Tstgstg −55 to +150 ° C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 0.75 0.062 in. 

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. 

3. Reference SOA curve. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MMBT3904LT1G<br>SMMBT3904LT1G|SOT−23<br>(Pb−Free)|3000 / Tape &<br>Reel|
|MMBT3904LT3G<br>SMMBT3904LT3G|SOT−23<br>(Pb−Free)|10,000 / Tape &<br>Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MMBT3904LT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 1994 **October, 2016 − Rev. 13** 

## **MMBT3904L, SMMBT3904L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Collector−Emitter Breakdown Voltage (IC= 1.0 mAdc, IB= 0)||V(BR)CEO|40|−|Vdc|
|Collector−Base Breakdown Voltage (IC= 10�Adc, IE= 0)||V(BR)CBO|60|−|Vdc|
|Emitter−Base Breakdown Voltage (IE= 10�Adc, IC= 0)||V(BR)EBO|6.0|−|Vdc|
|Base Cutoff Current (VCE= 30 Vdc, VEB= 3.0 Vdc)||IBL|−|50|nAdc|
|Collector Cutoff Current (VCE= 30 Vdc, VEB= 3.0 Vdc)||ICEX|−|50|nAdc|
|**ON CHARACTERISTICS**(Note 4)||||||
|DC Current Gain<br>(IC= 0.1 mAdc, VCE= 1.0 Vdc)<br>(IC= 1.0 mAdc, VCE= 1.0 Vdc)<br>(IC= 10 mAdc, VCE= 1.0 Vdc)<br>(IC= 50 mAdc, VCE= 1.0 Vdc)<br>(IC= 100 mAdc, VCE= 1.0 Vdc)||HFE|40<br>70<br>100<br>60<br>30|−<br>−<br>300<br>−<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= 10 mAdc, IB= 1.0 mAdc)<br>(IC= 50 mAdc, IB= 5.0 mAdc)||VCE(sat)|−<br>−|0.2<br>0.3|Vdc|
|Base−Emitter Saturation Voltage<br>(IC= 10 mAdc, IB= 1.0 mAdc)<br>(IC= 50 mAdc, IB= 5.0 mAdc)||VBE(sat)|0.65<br>−|0.85<br>0.95|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**||||||
|Current−Gain − Bandwidth Product (IC= 10 mAdc, VCE= 20 Vdc, f = 100 MHz)||fT|300|−|MHz|
|Output Capacitance (VCB= 5.0 Vdc, IE= 0, f = 1.0 MHz)||Cobo|−|4.0|pF|
|Input Capacitance (VEB= 0.5 Vdc, IC= 0, f = 1.0 MHz)||Cibo|−|8.0|pF|
|Input Impedance (VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)||hie|1.0|10|k�|
|Voltage Feedback Ratio (VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)||hre|0.5|8.0|X 10−4|
|Small−Signal Current Gain (VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)||hfe|100|400|−|
|Output Admittance (VCE= 10 Vdc, IC= 1.0 mAdc, f = 1.0 kHz)||hoe|1.0|40|�mhos|
|Noise Figure (VCE= 5.0 Vdc, IC= 100�Adc, RS= 1.0 k ohms, f = 1.0 kHz)||NF|−|5.0|dB|
|**SWITCHING CHARACTERISTICS**||||||
|Delay Time|(VCC= 3.0 Vdc, VBE= −0.5 Vdc,<br>IC= 10 mAdc, IB1= 1.0 mAdc)|td|−|35|ns|
|Rise Time||tr|−|35||
|Storage Time|(VCC= 3.0 Vdc,<br>IC= 10 mAdc, IB1= IB2= 1.0 mAdc)|ts|−|200|ns|
|Fall Time||tf|−|50||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

**==> picture [491 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
+3 V +3 V<br>DUTY CYCLE = 2% 10 < t1 < 500 �s t1<br>+10.9 V<br>300 ns +10.9 V 275 DUTY CYCLE = 2% 275<br>10 k 10 k<br>0<br>-�0.5 V<br>< 1 ns CS < 4 pF* 1N916 CS < 4 pF*<br>-�9.1 V′<br>< 1 ns<br>**----- End of picture text -----**<br>


* Total shunt capacitance of test jig and connectors 

**Figure 1. Delay and Rise Time Equivalent Test Circuit** 

**Figure 2. Storage and Fall Time Equivalent Test Circuit** 

**www.onsemi.com** 

**2** 

**MMBT3904L, SMMBT3904L** 

## **TYPICAL TRANSIENT CHARACTERISTICS** 

**==> picture [487 x 596] intentionally omitted <==**

**----- Start of picture text -----**<br>
TJ = 25°C<br>TJ = 125°C<br>10 5000<br>3000 VCC = 40 V<br>7.0 IC/IB = 10<br>2000<br>5.0<br>1000<br>700<br>Cibo<br>500<br>3.0<br>300 QT<br>2.0 Cobo 200<br>QA<br>100<br>70<br>1.0 50<br>0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 40 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>REVERSE BIAS VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)<br>Figure 3. Capacitance Figure 4. Charge Data<br>500 500<br>300 IC/IB = 10 300 VCC = 40 V<br>IC/IB = 10<br>200 200<br>100 100<br>70 tr @ VCC = 3.0 V 70<br>50 50<br>30 30<br>40 V<br>20 20<br>15 V<br>10 10<br>2.0 V<br>7 td @ VOB = 0 V 7<br>5 5<br>1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 5. Turn−On Time Figure 6. Rise Time<br>500 500<br>′<br>300200 IC/IB = 20 IC/IB = 10 tIB1 s = t= IsB2 -  [1] /8 tf 300200 VIB1CC = I = 40 VB2<br>IC/IB = 20<br>100 100<br>70 70<br>50 IC/IB = 20 50<br>30 IC/IB = 10 30 IC/IB = 10<br>20 20<br>10 10<br>7 7<br>5 5<br>1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Q, CHARGE (pC)<br>CAPACITANCE (pF)<br>TIME (ns)<br>r<br>t  , RISE TIME (ns)<br>f<br>t  , FALL TIME (ns)<br>t  , STORAGE TIME (ns)′s<br>**----- End of picture text -----**<br>


**Figure 7. Storage Time** 

**Figure 8. Fall Time** 

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**3** 

**MMBT3904L, SMMBT3904L** 

## **TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS NOISE FIGURE VARIATIONS** 

(VCE = 5.0 Vdc, TA = 25 ° C, Bandwidth = 1.0 Hz) 

**==> picture [490 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
12 14<br>SOURCE RESISTANCE = 200 � f = 1.0 kHz<br>IC = 1.0 mA<br>10 IC = 1.0 mA 12<br>SOURCE RESISTANCE = 200 � 10 IC = 0.5 mA<br>8<br>IC = 0.5 mA IC = 50 �A<br>8<br>6 SOURCE RESISTANCE = 1.0 k IC = 100 �A<br>IC = 50 �A 6<br>4<br>4<br>2 SOURCE RESISTANCE = 500 � 2<br>IC = 100 �A<br>0 0<br>0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100 0.1 0.2 0.4 1.0 2.0 4.0 10 20 40 100<br>f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (k OHMS)<br>Figure 9.  Figure 10.<br>h PARAMETERS<br>(VCE = 10 Vdc, f = 1.0 kHz, TA = 25 ° C)<br>300 100<br>50<br>200<br>20<br>10<br>100<br>70 5<br>50<br>2<br>30 1<br>0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 11. Current Gain Figure 12. Output Admittance<br>20 10<br>7.0<br>10<br>5.0<br>5.0<br>3.0<br>2.0<br>2.0<br>1.0<br>1.0<br>0.5<br>0.7<br>0.2 0.5<br>0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>NF, NOISE FIGURE (dB) NF, NOISE FIGURE (dB)<br>�<br>fe<br>h    , CURRENT GAIN<br>oe<br>h    , OUTPUT ADMITTANCE (   mhos)<br>-4<br>ie<br>h    , INPUT IMPEDANCE (k OHMS)<br>re<br>h    , VOLTAGE FEEDBACK RATIO (X 10    )<br>**----- End of picture text -----**<br>


**Figure 13. Input Impedance** 

**Figure 14. Voltage Feedback Ratio** 

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**4** 

**MMBT3904L, SMMBT3904L** 

## **TYPICAL STATIC CHARACTERISTICS** 

**==> picture [487 x 372] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>TJ = +150°C VCE = 1.0 V<br>+25°C<br>100 -�55°C<br>10<br>1<br>0.1 1.0 10 100 1000<br>IC, COLLECTOR CURRENT (mA)<br>Figure 15. DC Current Gain<br>1.0<br>T J  = 25°C<br>0.8<br>IC = 1.0 mA 10 mA 30 mA 100 mA<br>0.6<br>0.4<br>0.2<br>0<br>0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10<br>IB, BASE CURRENT (mA)<br>FE<br>h     , DC CURRENT GAIN<br>CE<br>V     , COLLECTOR EMITTER VOLTAGE (VOLTS)<br>**----- End of picture text -----**<br>


**Figure 16. Collector Saturation Region** 

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**5** 

## **MMBT3904L, SMMBT3904L** 

**==> picture [492 x 591] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.8 1.4<br>IC/IB = 10<br>0.7 IC/IB = 10<br>° 1.2<br>150 C<br>0.6<br>25 ° C<br>1.0<br>0.5<br>−55 ° C −55 ° C<br>0.4 0.8<br>25 ° C<br>0.3<br>0.6<br>0.2<br>150 ° C<br>0.4<br>0.1<br>0 0.2<br>0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 17. Collector Emitter Saturation Voltage Figure 18. Base Emitter Saturation Voltage vs.<br>vs. Collector Current Collector Current<br>1.4 1.0<br>1.2 VCE = 1 V 0.5 +25°C TO +125°C<br>�VC FOR VCE(sat)<br>1.0 0 -�55°C TO +25°C<br>−55 ° C<br>0.8 -�0.5<br>25 ° C -�55°C TO +25°C<br>0.6 -�1.0<br>+25°C TO +125°C<br>0.4 150 ° C -�1.5 �VB FOR VBE(sat)<br>0.2 -�2.0<br>0.0001 0.001 0.01 0.1 1 0 20 40 60 80 100 120 140 160 180 200<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (mA)<br>Figure 19. Base Emitter Voltage vs. Collector Figure 20. Temperature Coefficients<br>Current<br>1000 1<br>1 ms<br>1 s<br>VCE = 1 V 10 ms<br>TA = 25 ° C 100 ms<br>Thermal Limit<br>0.1<br>100<br>0.01<br>Single Pulse Test<br>@ TA = 25 ° C<br>10 0.001<br>0.1 1 10 100 1000 0.01 0.1 1 10 100<br>IC, COLLECTOR CURRENT (mA) VCE (Vdc)<br>, BASE−EMITTER<br>, COLLECTOR−EMITTER<br>BE(sat)<br>V<br>SATURATION VOLTAGE (V) SATURATION VOLTAGE (V)<br>CE(sat)<br>V<br>°<br>COEFFICIENT (mV/  C)<br>, BASE−EMITTER VOLTAGE (V)<br>BE(on)<br>V<br>IC (A)<br>PRODUCT (MHz)<br>, CURRENT−GAIN−BANDWIDTH<br>fT<br>**----- End of picture text -----**<br>


**Figure 21. Current Gain Bandwidth vs. Collector Current** 

**Figure 22. Safe Operating Area** 

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**6** 

**MMBT3904L, SMMBT3904L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

**==> picture [462 x 328] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>a 3 = THE BASE MATERIAL.<br>| E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 ° −−− 10 ° 0 ° −−− 10 °<br>A1 SIDE VIEW SEE VIEW C c STYLE 6:<br>END VIEW PIN 1. BASE<br>2. EMITTER<br>3. COLLECTOR<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 _ 0.90<br>Lo | cr<br>3X 0.80 | LL L 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**7** 



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