# Bipolar (BJT) Single Transistor, NPN, 60 V, 100 mA, 300 mW, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2464062/)

**URL**: https://novapart.co/products/MMBT2484LT1G/bipolar-bjt-single-transistor-npn-60-v-100-ma-300
**SKU**: MMBT2484LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0390
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:60V; Transition Frequency ft:-; Power Dissipation Pd:225mW; DC Collector Current:100mA; DC Current Gain hFE:250hFE; Transis

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | MMBTxxxx |
| Qualification | AEC-Q101 |
| Power Dissipation | 300mW |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | NPN |
| Transition Frequency | - |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 250hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 100mA |
| Collector Emitter Voltage Max | 60V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2464062/)

MMBT2484LT1G 

## Low Noise Transistor 

## **NPN Silicon** 

## **Features** 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **http://onsemi.com** 

COLLECTOR 3 **MAXIMUM RATINGS Rating Symbol Value Unit** 1 BASE Collector−Emitter Voltage VCEO 60 Vdc Collector−Base Voltage VCBO 60 Vdc 2 Emitter−Base Voltage VEBO 6.0 Vdc EMITTER Collector Current − Continuous IC 100 mAdc ~~EES~~ **THERMAL CHARACTERISTICS** 3 **Characteristic Symbol Max Unit** 1 Total Device Dissipation FR−5 Board,(Note 1) TA = 25 ° C PD 225 mW 2 Derate above 25 ° C 1.8 mW/ ° C **SOT−23 (TO−236)** Thermal Resistance, Junction−to−Ambient R JA 556 ° C/W **CASE 318 STYLE 6** Total Device Dissipation Alumina PD Substrate, (Note 2) TA = 25 ° C 300 mW Derate above 25 ° C 2.4 mW/ ° C **MARKING DIAGRAM** Thermal Resistance, Junction−to−Ambient R JA 417 ° C/W ~~re —SS~~ Junction and Storage Temperature TJ, Tstg −55 to +150 ° C 1U M 

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3<br>1<br>2<br>SOT−23 (TO−236)<br>CASE 318<br>STYLE 6<br>MARKING DIAGRAM<br>1U M<br>1<br>1U = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date Code orientation and/or overbar may<br>vary depending upon manufacturing location.<br>**----- End of picture text -----**<br>


Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. FR−5 = 1.0 x 0.75 x 0.062 in. 

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina. 

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ORDERING INFORMATION<br>Device Package Shipping [†]<br>MMBT2484LT1G SOT−23 3,000 / Tape & Reel<br>(Pb−Free)<br>——<br>†For information on tape and reel specifications,<br>including part orientation and tape sizes, please<br>refer to our Tape and Reel Packaging Specifications<br>Brochure, BRD8011/D.<br>**----- End of picture text -----**<br>


Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2009 **August, 2009 − Rev. 4** 

**MMBT2484LT1/D** 

**MMBT2484LT1G** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Breakdown Voltage<br>(IC= 10 mAdc, IB= 0)|V(BR)CEO|60|−|Vdc|
|Collector−Base Breakdown Voltage<br>(IC= 10�Adc, IE= 0)|V(BR)CBO|60|−|Vdc|
|Emitter−Base Breakdown Voltage<br>(IE= 10�Adc, IC= 0)|V(BR)EBO|5.0|−|Vdc|
|Collector Cutoff Current<br>(VCB= 45 Vdc, IE= 0)<br>(VCB= 45 Vdc, IE= 0, TA= 150°C)|ICBO|−<br>−|10<br>10|nAdc<br>�Adc|
|Emitter Cutoff Current<br>(VEB= 5.0 Vdc, IC= 0)|IEBO|−|10|nAdc|
|**ON CHARACTERISTICS**|||||
|DC Current Gain<br>(IC= 1.0 mAdc, VCE= 5.0 Vdc)<br>(IC= 10 mAdc, VCE= 5.0 Vdc)|hFE|250<br>−|−<br>800|−|
|Collector−Emitter Saturation Voltage<br>(IC= 1.0 mAdc, IB= 0.1 mAdc)|VCE(sat)|−|0.35|Vdc|
|Base−Emitter On Voltage<br>(IC= 1.0 mAdc, VCE= 5.0 Vdc)|VBE(on)|−|0.95|Vdc|
|**SMALL−SIGNAL CHARACTERISTICS**|||||
|Output Capacitance<br>(VCB= 5.0 Vdc, IE= 0, f = 1.0 MHz)|Cobo|−|6.0|pF|
|Input Capacitance<br>(VEB= 0.5 Vdc, IC= 0, f = 1.0 MHz)|Cibo|−|6.0|pF|
|Noise Figure<br>(IC= 10�Adc, VCE= 5.0 Vdc, RS= 10 k�, f = 1.0 kHz, BW = 200 Hz)|NF|−|3.0|dB|



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RS<br>in<br>en<br>IDEAL<br>TRANSISTOR<br>**----- End of picture text -----**<br>


**Figure 1. Transistor Noise Model** 

**http://onsemi.com** 

**2** 

**MMBT2484LT1G** 

## **NOISE CHARACTERISTICS** 

(VCE = 5.0 Vdc, TA = 25 ° C) 

## **NOISE VOLTAGE** 

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30 30<br>BANDWIDTH = 1.0 Hz BANDWIDTH = 1.0 Hz<br>20 20<br>IC = 10 mA RS ≈ 0 RS ≈ 0<br>3.0 mA f = 10 Hz<br>10 10<br>100 Hz<br>1.0 mA<br>7.0 7.0<br>10 kHz<br>1.0 kHz<br>5.0 5.0<br>300 �A 100 kHz<br>3.0 3.0<br>10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10<br>f, FREQUENCY (Hz) IC, COLLECTOR CURRENT (mA)<br>Figure 2. Effects of Frequency Figure 3. Effects of Collector Current<br>10 20<br>BANDWIDTH = 1.0 Hz<br>7.0<br>5.0<br>IC = 10 mA 16<br>3.0 BANDWIDTH = 10 Hz to 15.7 kHz<br>2.0 3.0 mA<br>12<br>1.0 mA<br>1.0<br>IC = 1.0 mA<br>0.7 300 �A 8.0 500 �A<br>0.5<br>100 �A<br>0.3 100 �A<br>4.0 10 �A<br>0.2<br>10 �A 30 �A<br>RS ≈ 0<br>0.1 0<br>10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k 10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k<br>f, FREQUENCY (Hz) RS, SOURCE RESISTANCE (OHMS)<br>Figure 4. Noise Current Figure 5. Wideband Noise Figure<br>100 Hz NOISE DATA<br>300 20<br>200 BANDWIDTH = 1.0 Hz I C  = 10 mA<br>100 100 �A 16 IC = 10 mA 3.0 mA<br>70 3.0 mA 1.0 mA<br>50 12<br>1.0 mA<br>30 300 �A 300 �A<br>20 30 �A 8.0<br>100 �A<br>10<br>7.0 10 �A 4.0 30 �A<br>10 �A<br>5.0<br>BANDWIDTH = 1.0 Hz<br>3.0 0<br>10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k 10 20 50 100 200 500 1�k 2�k 5�k 10�k 20�k 50�k 100�k<br>RS, SOURCE RESISTANCE (OHMS) RS, SOURCE RESISTANCE (OHMS)<br>en, NOISE VOLTAGE (nV) en, NOISE VOLTAGE (nV)<br>In, NOISE CURRENT (pA) NF, NOISE FIGURE (dB)<br>NF, NOISE FIGURE (dB)<br>VT, TOTAL NOISE VOLTAGE (nV)<br>**----- End of picture text -----**<br>


**Figure 6. Total Noise Voltage** 

**Figure 7. Noise Figure** 

**http://onsemi.com** 

**3** 

**MMBT2484LT1G** 

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4.0<br>3.0<br>VCE = 5.0 V<br>2.0 TA = 125°C<br>25°C<br>1.0<br>-�55°C<br>0.7<br>0.5<br>0.4<br>0.3<br>0.2<br>0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10<br>IC, COLLECTOR CURRENT (mA)<br>Figure 8. DC Current Gain<br>1.0 -�0.4<br>TJ = 25°C<br>0.8 -�0.8<br>0.6 VBE @ VCE = 5.0 V -�1.2<br>0.4 -�1.6 TJ = 25°C to 125°C<br>0.2 -�2.0<br>-�55°C to 25°C<br>VCE(sat) @ IC/IB = 10<br>0 -�2.4<br>0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100<br>IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)<br>Figure 9. “On” Voltages Figure 10. Temperature Coefficients<br>8.0 500<br>6.0 TJ = 25°C<br>300<br>4.0 Cob Ceb Cib<br>200<br>3.0<br>Ccb<br>2.0<br>100<br>1.0 70 VTJCE = 25 = 5.0 V°C<br>0.8 50<br>0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100<br>VR, REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)<br>FE<br>h     , DC CURRENT GAIN (NORMALIZED)<br>C)°<br>VBE, BASE-EMITTER<br>V, VOLTAGE (VOLTS) Rθ<br>TEMPERATURE COEFFICIENT (mV/<br>C, CAPACITANCE (pF)<br>fT, CURRENT-GAIN — BANDWIDTH PRODUCT (MHz)<br>**----- End of picture text -----**<br>


**Figure 11. Capacitance** 

**Figure 12. Current−Gain — Bandwidth Product** 

**http://onsemi.com** 

**4** 

**MMBT2484LT1G** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AN 

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D NOTES:1. DIMENSIONING AND TOLERANCING PER<br>SEE VIEW C ANSI Y14.5M, 1982.<br>3 2. CONTROLLING DIMENSION: INCH.<br>— = 3. MAXIMUM LEAD THICKNESS INCLUDES<br>LEAD FINISH THICKNESS. MINIMUM LEAD<br>THICKNESS IS THE MINIMUM THICKNESS OF<br>E HE BASE MATERIAL.<br>4. 318−01 THRU −07 AND −09 OBSOLETE,<br>NEW STANDARD 318−08.<br>c<br>1 2 MILLIMETERS<br>b DIM MIN NOM MAX MIN<br>e 0.25 A 0.89 1.00 1.11 0.035<br>A1 0.01 0.06 0.10 0.001<br>b 0.37 0.44 0.50 0.015<br>c 0.09 0.13 0.18 0.003<br>D 2.80 2.90 3.04 0.110<br>A E 1.20 1.30 1.40 0.047<br>e 1.78 1.90 2.04 0.070<br>L L 0.10 0.20 0.30 0.004<br>as A1 L1 0.35 0.54 0.69 0.014<br>L1 H E 2.10 2.40 2.64 0.083<br>VIEW C STYLE 6:<br>**----- End of picture text -----**<br>


|**DIM**|**MILLIMETERS**|**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|
||**MIN**|**NOM**|**MAX**|**MIN**|**NOM**|**MAX**|
|**A**|0.89|1.00|1.11|0.035|0.040|0.044|
|**A1**|0.01|0.06|0.10|0.001|0.002|0.004|
|**b**|0.37|0.44|0.50|0.015|0.018|0.020|
|**c**|0.09|0.13|0.18|0.003|0.005|0.007|
|**D**|2.80|2.90|3.04|0.110|0.114|0.120|
|**E**<br>**e**|1.20<br>1.78|1.30<br>1.90|1.40<br>2.04|0.047<br>0.070|0.051<br>0.075|0.055<br>0.081|
|**L**|0.10|0.20|0.30|0.004|0.008|0.012|
|**L1**|0.35|0.54|0.69|0.014|0.021|0.029|
|**HE**|2.10|2.40|2.64|0.083|0.094|0.104|



## **SOLDERING FOOTPRINT*** 

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0.95<br>0.037<br>0.95<br>0.037<br>2.0<br>0.079<br>0.9<br>0.035<br>SCALE 10:1 mm<br>= oa inches<br>0.8<br>0.031 ="<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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**MMBT2484LT1/D** 

**5** 



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