# Bipolar (BJT) Single Transistor, PNP, 45 V, 500 mA, 350 mW, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:2825119/)

**URL**: https://novapart.co/products/MMBT200./bipolar-bjt-single-transistor-pnp-45-v-500-ma-350
**SKU**: MMBT200.
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.0160
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Power Dissipation | 350mW |
| Dc Current Gain Hfe | 100hFE |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 250MHz |
| Transistor Case Style | SOT-23 |
| Dc Current Gain Hfe Min | 100hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 500mA |
| Collector Emitter Voltage Max | 45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2825119/)

## **PN200A / MMBT200 PNP General-Purpose Amplifier** 

## **Description** 

This device is designed for general-purpose amplifier applications at collector currents to 300 mA. Sourced from Process 68. 

**==> picture [313 x 63] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>E<br>TO-92<br>B<br>E B C SOT-23<br>**----- End of picture text -----**<br>


**Figure 1. PN200A Device Package** 

**Figure 2. MMBT200 Device Package** 

**Ordering Information Part Number Marking Package Packing Method** PN200A PN200A TO-92 3L Bulk MMBT200 N2 SOT-23 3L Tape and Reel ~~——<£_~~ 

## **Absolute Maximum Ratings**[(1),(2)] 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VCEO|Collector-Emitter Voltage|-45|V|
|VCBO|Collector-Base Voltage|-60|V|
|VEBO|Emitter-Base Voltage|-6|V|
|IC|Collector Current - Continuous|-500|mA|
|TJ, TSTG|Operating and Storage Junction Temperature Range|-55 to +150|°C|



## **Notes:** 

1. These ratings are based on a maximum junction temperature of 150 ° C. 

2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or lowduty cycle operations. 

Publication Order Number: PN200A/D 

© 1997 Semiconductor Components Industries, LLC. October-2017, Rev. 2 

## **Thermal Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|Values are at|TA= 25°C unless otherwise noted.||||
|---|---|---|---|---|
|**Symbol**|**Parameter**|**Max.**<br>**PN200A**(3)<br>**MMBT200**(4)||**Unit**|
||||**MMBT200**(4)||
|P|Total Device Dissipation|625|350|mW|
|D|Derate Above 25°C|5.0|2.8|mW/°C|
|RθJC|Thermal Resistance, Junction to Case|83.3||°C/W|
|RθJA|Thermal Resistance, Junction to Ambient|200|357|°C/W|



## **Notes:** 

3. PCB size: FR-4  76 x 114 x 1.57 mm[3] (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size. 

4. Device mounted on FR-4 PCB 1.6 inch X 1.6 inch X 0.06 inch. 

## **Electrical Characteristics** 

Values are at TA = 25°C unless otherwise noted. 

|Values are at|TA= 25°C unless otherwise noted.||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**||**Min.**|**Max.**|**Unit**|
|**Off Characteristics**|||||||
|BVCBO|Collector-Base Breakdown Voltage|IC= -10μA, IB= 0||-60||V|
|BVCEO|Collector-Emitter Breakdown<br>Voltage(5)|IC= -1.0 mA, IE= 0||-45||V|
|BVEBO|Emitter-Base Breakdown Voltage|IE= -10μA, IC= 0||-6.0||V|
|ICBO|Collector Cut-Off Current|VCB= -50 V, IE= 0|||-50|nA|
|ICES|Collector Cut-Off Current|VCE= -40 V, IE= 0|||-50|nA|
|IEBO|Emitter Cut-Off Current|VEB= -4.0 V, IC= 0|||-50|nA|
|**On Characteristics**|||||||
|hFE|DC Current Gain|IC= -100μA,<br>VCE= -1.0 V|MMBT200|80|||
||||PN200A|240|||
|||IC= -10 mA,<br>VCE= -1.0 V|MMBT200|100|450||
||||PN200A|300|600||
|||IC= -100 mA,<br>VCE= -1.0 V(5)|PN200A|100|||
|||IC= -150 mA,<br>VCE= -5.0 V(5)|MMBT200|100|350||
||||PN200A|100|||
|VCE(sat)|Collector-Emitter Saturation<br>Voltage|IC= -10 mA, IB= -1.0 mA|||-0.2|V|
|||IC= -200 mA, IB= -20 mA(5)|||-0.4||
|VBE(sat)|Base-Emitter Saturation<br>Voltage|IC= -10 mA, IB= -1.0 mA|||-0.85|V|
|||IC= -200 mA, IB= -20 mA(5)|||-1.00||
|**Small Signal Characteristics**|||||||
|f|Current Gain - Bandwidth Product|V= -20 V I= -20 mA||250||MHz|
|T||CE,C,|||||
|Cob|Output Capacitance|VCB= -10 V, f = -1.0 MHz|||6.0|pF|
|NF|Noise Figure|IC= -100μA, VCE= -5.0 V,<br>RG= 2.0 kΩ, f = 1.0 kHz|||4.0|dB|



## **Note:** 

5. Pulse test: pulse width ≤ 300 μ s, duty cycle ≤ 2.0%. 

www.onsemi.com 

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## **Typical Performance Characteristics** 

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500<br>V       = 5V CE<br>400 125 °C<br>CHT THag<br>SS ee eet me<br>300 PUTTIN TEI TTT PST TTT<br>a a<br>Pl 25 °C CECT NTT<br>200 PTT I TTT.UTTIN NT<br>ST |<br>100 - 40 °C<br>STG ann GENNMGLITL INBEV’| TIN<br>0 LTTUM1FTTH TUTTI|TTLNS<br>0.01 0.1 1 10 100<br>I   - COLLECTOR CURRENT  (mA)C<br>FE<br>h    - TYPICAL PULSED CURRENT GAIN<br>**----- End of picture text -----**<br>


**Figure 3. Typical Pulsed Current Gain vs. Collector Current** 

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1.2 β = 10 Mmooo<br>1 PH thn Ft<br>0.8 Cn - 40  ° C con ae<br>EI aaa<br>0.6 25 °C 125 °C<br>Cn eer<br>ee<br>0.4 Tit o_o<br>0.2<br>PCIon o_o<br>0 PCI Ce<br>0.1 1 10 100 300<br>I   - COLLECTOR CURRENT  (mA)C<br>Figure 5. Base-Emitter Saturation Voltage<br>vs. Collector Current<br>100<br>Ff} V     = 50VCB<br>10 [ToT yt [| [ {| [| 7<br>SSS SSS SSS SS<br>——<br>1 re ee eee<br>ee Ss<br>SS<br>0.1 SSS<br>0.01 es es ee<br>25 50 75 100 125<br>T  - AMBIENT TEMPERATURE (  C)A °<br>BESAT<br>CBO<br>V        - BASE EMITTER VOLTAGE (V)<br>I      - COLLECTOR CURRENT (nA)<br>**----- End of picture text -----**<br>


**Figure 7. Collector Cut-Off Current vs. Ambient Temperature** 

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0.3<br>0.25 β = 10<br>CoAe<br>0.2 ri ci oT<br>a<br>0.15 esPEE rT 25 °C AY<br>0.1 jE<br>SL<br>0.05 Coi 125  oot °C 2ai - 40  ° C<br>0 eattt Tt | eeCI<br>0.1 1 10 100 300<br>I   - COLLECTOR CURRENT  (mA)C<br>CESAT<br>- COLLECTOR EMITTER VOLTAGE (V)<br>V<br>**----- End of picture text -----**<br>


**Figure 4. Collector-Emitter Saturation Voltage vs. Collector Current** 

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**----- Start of picture text -----**<br>
0.81 a - 40°C aeS<br>ee 25 °C<br>0.6 ara I Le 125  at °C<br>0.4 CO er<br>0.2 — V     = 5VCE<br>Sa| TT P|<br>0 re CIP<br>0.1 1 10 100 200<br>I   - COLLECTOR CURRENT  (mA)C<br>BEON<br>V      - BASE EMITTER ON VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 6. Base-Emitter On Voltage vs. Collector Current** 

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95 a LO oot coo<br>90 EN ll<br>LL TNE EIT TTT<br>85 aRE ll<br>80<br>Dh<br>m0<br>75<br>CT oe<br>70 L TTI ETETETTT<br>0.1 1 10 100 1000<br>RESISTANCE (k   ) Ω<br>CER<br>BV       - BREAKDOWN VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 8. Collector-Emitter Breakdown Voltage with Resistance Between Emitter-Base** 

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## **Typical Performance Characteristics** (Continued) 

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**----- Start of picture text -----**<br>
100<br>4 “OL CO Ta = 25°C a f = 1.0 MHz<br>a | | PE tt<br>3 FCI CO Con Po SHH<br>na er<br>SUI<br>10 a<br>2 Ic = een 100 uA 50 mA 300 mA PTTEL LTT|<br>Cib<br>AH SESS SSH<br>EEE TEI ET ESS St Cob<br>1<br>| \ a a<br>0 CENAETTNCCT RIC 0.1 1 10 100<br>100 300 700 2000 4000 V     - COLLECTOR VOLTAGE (V)CE<br>I   - BASE CURRENT  (uA)B<br>Figure 9. Collector Saturation Region Figure 10. Input and Output Capacitance vs.<br>Reverse Voltage<br>40 300<br>V      ce = 5V TL 270 —— t s<br>240<br>30 FHP Ee<br>210<br>180 IB1 = IB2 = Ic / 10<br>20 150 V      = 10 Vcc<br>YT CI 120 ———=<br>10 d 90 Sa ee t f  Os t r<br>7 LCI 60 —_— =<br>PPTL 30 ———— t d<br>0 1 CCI 10 20 Co 50 100 150 010 SS 20 30 50 100 200 300<br>I   - COLLECTOR CURRENT (mA)C I   - COLLECTOR CURRENT  (mA)C<br>CAPACITANCE (pF)<br>CE<br>V     - COLLECTOR-EMITTER VOLTAGE (V)<br>TIME (nS)<br>T<br>f   - GAIN BANDWIDTH PRODUCT (MHz)<br>**----- End of picture text -----**<br>


**Figure 11. Gain Bandwidth Product vs. Collector Current** 

**Figure 12. Switching Times vs. Collector Current** 

**==> picture [194 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
700 YT | [| [| — [| — J TT JT TT Tf<br>600 eeP|esTNCO ft tf ft | ft | fT fT<br>500 TO-92<br>YrHt+tin| | [| Ndft tttYF | [| J |<br>400 SOT-23<br>a<br>300 Pet ft TP AAR TE IN<br>200 Yree| [| ee| [ ee[| [wTee NeRITeee<br>100 ;PF || || [|[| f| [f [[| [|Jf “7AJT [IASAANNK Tf<br>0 Yr [| | [| | [ [— [— JT [ 7 SSS)<br>0 25 50 75 100 125 150<br>TEMPERATURE  (  C)°<br>D<br>P   - POWER DISSIPATION (mW)<br>**----- End of picture text -----**<br>


**Figure 13. Power Dissipation vs. Ambient Temperature** 

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## **Physical Dimensions** 

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**----- Start of picture text -----**<br>
TO-92<br>   D<br>**----- End of picture text -----**<br>


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## **Figure 14. 3-LEAD, TO-92, MOLDED, STD STRAGHIT LEAD (NO EOL CODE) (ACTIVE)** 

_Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor's worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products._ 

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**==> picture [398 x 497] intentionally omitted <==**

**----- Start of picture text -----**<br>
Physical Dimensions  (Continued)<br>SOT-23<br>0.95<br>2.92±0.20<br>3<br>1.40<br>1.30 [+0.20] 2.20<br>-0.15<br>1 2<br>(0.29) 0.60<br>0.37<br>0.95<br>0.20 A B 1.00<br>1.90 1.90<br>LAND PATTERN<br>RECOMMENDATION<br>1.20 MAX SEE DETAIL A<br>(0.93) 0.10<br>0.00<br>0.10 C<br>C<br>2.40±0.30<br>NOTES: UNLESS OTHERWISE SPECIFIED<br>GAGE PLANE<br>A) REFERENCE JEDEC REGISTRATION<br>TO-236, VARIATION AB, ISSUE H.<br>0.23 B) ALL DIMENSIONS ARE IN MILLIMETERS.<br>0.08 C) DIMENSIONS ARE INCLUSIVE OF BURRS,<br>0.25   MOLD FLASH AND TIE BAR EXTRUSIONS.<br>D) DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M - 1994.<br>0.20 MIN SEATING    E) DRAWING FILE NAME: MA03DREV10<br>(0.55) PLANE<br>SCALE: 2X<br>**----- End of picture text -----**<br>


## **Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE (ACTIVE)** 

_Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a ON Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms and conditions, specifically the warranty therein, which covers ON Semiconductor products._ 

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6 

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