# Power MOSFET, N Channel, 20 V, 300 mA, 1 ohm, SOT-323, Surface Mount

![Product image](https://novapart.co/image/farnell:1453615RL/)

**URL**: https://novapart.co/products/MMBF2201NT1G/power-mosfet-n-channel-20-v-300-ma-1-ohm-sot-323
**SKU**: MMBF2201NT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.1090
**Stock**: 1000+
**Lead Time**: 141 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:300mA; Drain Source Voltage Vds:20V; On Resistance Rds(on):1ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.7V; Power Dissipa

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 150mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-323 |
| Drain Source Voltage Vds | 20V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 300mA |
| Drain Source On State Resistance | 1ohm |
| Gate Source Threshold Voltage Max | 1.7V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1453615RL/)

MMBF2201N, NVF2201N 

## Power MOSFET 300 mAmps, 20 Volts 

## **N−Channel SC−70/SOT−323** 

These miniature surface mount MOSFETs low RDS(on) assure minimal power loss and conserve energy, making these devices ideal for use in small power management circuitry. Typical applications are dc−dc converters, power management in portable and battery−powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. 

## **Features** 

- Low RDS(on) Provides Higher Efficiency and Extends Battery Life 

- Miniature SC−70/SOT−323 Surface Mount Package Saves Board Space 

- NVF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* 

- These Devices are Pb−Free and are RoHS Compliant 

**MAXIMUM RATINGS** (TJ = 25 ° C unless otherwise noted) 

|**MAXIMUM RATINGS**(TJ = 25J = 25= 25°C unless otherwise noted)|C unless otherwise noted)|C unless otherwise noted)||
|---|---|---|---|
|**Rating**<br>~~oe~~|**Symbol**<br>~~oe~~|**Value**<br>~~oe~~|**Unit**<br>~~oe~~|
|Drain−to−Source Voltage<br>~~oe~~|VDSS<br>~~oe~~|20<br>~~oe~~|Vdc<br>~~oe~~|
|Gate−to−Source Voltage − Continuous<br>~~oe~~<br>~~ee~~|VGS<br>~~oe~~<br>|±20<br>~~oe~~<br>~~ee~~|Vdc<br>~~oe~~<br>~~ee~~|
|Drain Current<br>− Continuous @ TA= 25°C<br>− Continuous @ TA= 70°C<br>− Pulsed Drain Current (tp ≤10 s)<br>~~ee~~<br>~~pt~~|ID<br>ID<br>IDM<br><br>~~pttt~~|300<br>240<br>750<br>~~ee~~<br>~~tt~~|mAdc<br>~~ee~~<br>~~tt~~|
|Total Power Dissipation @ TA= 25°C<br>(Note 1)<br>Derate above 25°C<br>~~ee ~~<br>~~pt~~|PD<br> <br>~~pttt~~|150<br>1.2<br> ~~ee~~<br>~~tt~~|mW<br>mW/°C<br>~~ee~~<br>~~tt~~|
|Operating and Storage Temperature Range<br>~~pt~~|TJ, Tstg<br>~~pttt~~|−55 to 150<br>~~tt~~|°C<br>~~tt~~|
|Thermal Resistance, Junction−to−Ambient<br>~~pt~~|R JA<br>~~pt tt~~|833<br>~~tt~~|°C/W<br>~~tt~~|
|Maximum Lead Temperature for Soldering<br>Purposes, for 10 seconds|TL|260|°C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. Mounted on G10/FR4 glass epoxy board using minimum recommended footprint. 

## **http://onsemi.com** 

## **300 mAMPS, 20 VOLTS** 

## **R = 1 DS(on)** 

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N−Channel<br>3<br>1<br>2<br>**----- End of picture text -----**<br>


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MARKING DIAGRAM<br>AND PIN ASSIGNMENT<br>3<br>3<br>Drain<br>1<br>2 SC−70/SOT−323<br>CASE 419 N1 M<br>STYLE 8<br>=<br>1 2<br>Gate Source<br>N1 = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


*Date Code orientation may vary depending upon manufacturing location. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MMBF2201NT1G|SOT−323<br>(Pb−Free)|3000 / Tape &<br>Reel|
|NVF2201NT1G*|SOT−323<br>(Pb−Free)|3000 / Tape &<br>Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MMBF2201NT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **August, 2013 − Rev. 7** 

## **MMBF2201N, NVF2201N** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)||||||
|---|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||||
|Drain−to−Source Breakdown Voltage<br>(VGS= 0 Vdc, ID= 10�A)||V(BR)DSS|20|−|−|Vdc|
|Zero Gate Voltage Drain Current<br>(VDS= 16 Vdc, VGS= 0 Vdc)<br>(VDS= 16 Vdc, VGS= 0 Vdc, TJ= 125°C)||IDSS|−<br>−|−<br>−|1.0<br>10|�Adc|
|Gate−Body Leakage Current (VGS=±20 Vdc, VDS= 0)||IGSS|−|−|±100|nAdc|
|**ON CHARACTERISTICS**(Note 2)|||||||
|Gate Threshold Voltage<br>(VDS= VGS, ID= 250�Adc)||VGS(th)|1.0|1.7|2.4|Vdc|
|Static Drain−to−Source On−Resistance<br>(VGS= 10 Vdc, ID= 300 mAdc)<br>(VGS= 4.5 Vdc, ID= 100 mAdc)||rDS(on)|−<br>−|0.75<br>1.0|1.0<br>1.4|�|
|Forward Transconductance (VDS= 10 Vdc, ID= 200 mAdc)||gFS|−|450|−|mMhos|
|**DYNAMIC CHARACTERISTICS**|||||||
|Input Capacitance|(VDS= 5.0 V)|Ciss|−|45|−|pF|
|Output Capacitance|(VDS= 5.0 V)|Coss|−|25|−||
|Transfer Capacitance|(VDG= 5.0 V)|Crss|−|5.0|−||
|**SWITCHING CHARACTERISTICS**(Note 3)|||||||
|Turn−On Delay Time|(VDD= 15 Vdc, ID= 300 mAdc,<br>RL= 50�)|td(on)|−|2.5|−|ns|
|Rise Time||tr|−|2.5|−||
|Turn−Off Delay Time||td(off)|−|15|−||
|Fall Time||tf|−|0.8|−||
|Gate Charge (See Figure 5)||QT|−|1400|−|pC|
|**SOURCE−DRAIN DIODE CHARACTERISTICS**|||||||
|Continuous Current||IS|−|−|0.3|A|
|Pulsed Current||ISM|−|−|0.75||
|Forward Voltage (Note 3)||VSD|−|0.85|−|V|



2. Pulse Test: Pulse Width ≤ 300 � s, Duty Cycle ≤ 2%. 

3. Switching characteristics are independent of operating junction temperature. 

## **TYPICAL CHARACTERISTICS** 

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1.0 1.6<br>0.9<br>1.4<br>0.8 V GS  = 4 V<br>1.2<br>0.7 VGS = 4.5 V<br>1.0<br>0.6<br>VGS = 3.5 V ID = 100 mA<br>0.5 0.8 V GS  = 10 V<br>0.4<br>0.6 I D  = 300 mA<br>0.3 V GS  = 3 V<br>0.4<br>0.2<br>0.1 VGS = 2.5 V 0.2<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 -�60 -�40 -�20 0 20 40 60 80 100 120 140 160<br>VDS, DRAIN�-�SOURCE VOLTAGE (VOLTS) TEMPERATURE (°C)<br>ID, DRAIN CURRENT (AMPS) RDS, ON RESISTANCE (OHMS)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Drain Characteristics** 

**Figure 2. On Resistance versus Temperature** 

**http://onsemi.com** 

**2** 

**MMBF2201N, NVF2201N** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10 1.2<br>8 I D  = 300 mA 1.0 V GS  = 4.5 V<br>0.8<br>6<br>0.6<br>VGS = 10 V<br>4<br>0.4<br>2<br>0.2<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>GATE�-�SOURCE VOLTAGE (VOLTS) ID, DRAIN CURRENT (AMPS)<br>RDS, ON RESISTANCE (OHMS) RDS, ON RESISTANCE (OHMS)<br>**----- End of picture text -----**<br>


**Figure 3. On Resistance versus Gate−Source Voltage** 

**Figure 4. On Resistance versus Drain Current** 

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**----- Start of picture text -----**<br>
1.0 45<br>40 V GS = 0 V<br>F = 1 mHz<br>35<br>0.1 30<br>25<br>20<br>Ciss<br>0.01 15<br>Coss<br>10<br>5 C rss<br>0.001 0<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 2 4 6 8 10 12 14 16 18 20<br>VSD, SOURCE�-�DRAIN FORWARD VOLTAGE (VOLTS) VDS, DRAIN�-�SOURCE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>IS, SOURCE CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 5. Source−Drain Forward Voltage** 

**Figure 6. Capacitance Variation** 

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1.0<br>0.9<br>0.8 25<br>-�55<br>0.7<br>150<br>0.6<br>0.5<br>0.4<br>0.3<br>0.2<br>0.1<br>0<br>0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5<br>VGS, GATE�-�SOURCE VOLTAGE (VOLTS)<br>ID, DRAIN CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 7. Transfer Characteristics** 

**http://onsemi.com** 

**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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**SC−70 (SOT−323)** CASE 419 ISSUE P 

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**----- Start of picture text -----**<br>
DATE 07 OCT 2021<br>**----- End of picture text -----**<br>


**SCALE 4:1** 

## **GENERIC MARKING DIAGRAM** 

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XX M �<br>�<br>1<br>XX = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

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STYLE 1: STYLE 2: STYLE 3:<br>CANCELLED PIN 1. ANODE PIN 1. BASE<br>2. N.C. 2. EMITTER<br>3. CATHODE 3. COLLECTOR<br>STYLE 6: STYLE 7: STYLE 8:<br>PIN 1. EMITTER PIN 1. BASE PIN 1. GATE<br> 2. BASE  2. EMITTER  2. SOURCE<br> 3. COLLECTOR  3. COLLECTOR  3. DRAIN<br>**----- End of picture text -----**<br>


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STYLE 4: STYLE 5:<br>PIN 1. CATHODE PIN 1. ANODE<br>2. CATHODE  2. ANODE<br>3. ANODE  3. CATHODE<br>STYLE 9: STYLE 10: STYLE 11:<br>PIN 1. ANODE PIN 1. CATHODE PIN 1. CATHODE<br> 2. CATHODE  2. ANODE 2. CATHODE<br> 3. CATHODE-ANODE  3. ANODE-CATHODE 3. CATHODE<br>**----- End of picture text -----**<br>


## **DOCUMENT NUMBER: 98ASB42819B** 

**DESCRIPTION: SC−70 (SOT−323)** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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