# Power MOSFET, N Channel, 60 V, 500 mA, 5 ohm, SOT-23, Surface Mount

![Product image](https://novapart.co/image/farnell:1431321/)

**URL**: https://novapart.co/products/MMBF170LT1G/power-mosfet-n-channel-60-v-500-ma-5-ohm-sot-23
**SKU**: MMBF170LT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.0550
**Stock**: 1000+
**Lead Time**: 148 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:500mA; Drain Source Voltage Vds:60V; On Resistance Rds(on):5ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:3V; Power Dissipatio

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 225mW |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | SOT-23 |
| Drain Source Voltage Vds | 60V |
| Operating Temperature Max | 150°C |
| Continuous Drain Current Id | 500mA |
| Drain Source On State Resistance | 5ohm |
| Gate Source Threshold Voltage Max | 3V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1431321/)

MMBF170L, NVBF170L 

## Power MOSFET **500 mA, 60 V, N−Channel SOT−23** 

## **Features** 

- NVBF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

**www.onsemi.com** 

- These Devices are Pb−Free and are RoHS Compliant 

**500 mA, 60 V R = 5 DS(on)** 

## **MAXIMUM RATINGS** 

~~a~~ **Rating Symbol Value Unit** Drain−Source Voltage VDSS 60 Vdc ~~a~~ — Drain−Gate Voltage VDGS 60 Vdc ~~7S~~ Gate−Source Voltage − Continuous VGS ± 20 Vdc ~~poe~~ − Non−repetitive (tp ≤ 50 s) VGSM ± 40 Vpk Drain Current − Continuous ~~TT~~ ID 0.5 Adc − Pulsed IDM 0.8 ~~aee ee~~ **THERMAL CHARACTERISTICS Characteristic Symbol Max Unit** Total Device Dissipation FR−5 Board PD 1 (Note 1.) TA = 25 ° C 225 mW Derate above 25 ° C 1.8 mW/ ° C ~~po a~~ Thermal Resistance, Junction−to−Ambient R JA 556 ° C/W ~~a~~ Junction and Storage Temperature TJ, Tstg −55 to ° C +150 Stresses exceeding those listed in the Maximum Ratings table may damage the ~~ee eee~~ device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**SOT−23 CASE 318 STYLE 21** 

**==> picture [75 x 115] intentionally omitted <==**

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N−Channel<br>3<br>1<br>=<br>2<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM & PIN ASSIGNMENT** 

1. FR−5 = 1.0 0.75 0.062 in. 

**==> picture [96 x 79] intentionally omitted <==**

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3<br>Drain<br>6Z M<br>Gate 1 2 Source<br>**----- End of picture text -----**<br>


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6Z = Specific Device Code<br>M = Date Code<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

Publication Order Number: **MMBF170LT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 1994 **October, 2016 − Rev. 10** 

## **MMBF170L, NVBF170L** 

## **ELECTRICAL CHARACTERISTICS** (TC = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TC= 25°C unless otherwise noted)|**ELECTRICAL CHARACTERISTICS**(TC= 25°C unless otherwise noted)|||||
|---|---|---|---|---|---|
|**Characteristic**||**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**||||||
|Drain−Source Breakdown Voltage (VGS= 0, ID= 100�A)||V(BR)DSS|60|−|Vdc|
|Gate−Body Leakage Current, Forward (VGSF= 15 Vdc, VDS= 0)||IGSS|−|10|nAdc|
|**ON CHARACTERISTICS**(Note 1)||||||
|Gate Threshold Voltage (VDS= VGS, ID= 1.0 mA)||VGS(th)|0.8|3.0|Vdc|
|Static Drain−Source On−Resistance (VGS= 10 Vdc, ID= 200 mA)||rDS(on)|−|5.0|�|
|On−State Drain Current (VDS= 25 Vdc, VGS= 0)||ID(off)|−|0.5|�A|
|**DYNAMIC CHARACTERISTICS**||||||
|Input Capacitance<br>(VDS= 10 Vdc, VGS= 0 V, f = 1.0 MHz)||Ciss|−|60|pF|
|**SWITCHING CHARACTERISTICS**(Note 1)||||||
|Turn−On Delay Time|(VDD= 25 Vdc, ID= 500 mA, Rgen= 50�)<br>Figure 1|td(on)|−|10|ns|
|Turn−Off Delay Time||td(off)|−|10||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

1. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2.0%. 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MMBF170LT1G|SOT−23 (TO−236)<br>(Pb−Free)|3000 / Tape & Reel|
|MMBF170LT3G|SOT−23 (TO−236)<br>(Pb−Free)|10000 / Tape & Reel|
|NVBF170LT1G*|SOT−23 (TO−236)<br>(Pb−Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**==> picture [478 x 135] intentionally omitted <==**

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+25 V<br>ton toff<br>td(on) tr td(off) tf<br>125 � TO SAMPLING OUTPUT 90% 90%<br>PULSE Vin SCOPE INVERTED<br>GENERATOR 20 dB 50 � 50 � INPUT Vout 10%<br>ATTENUATOR Vout<br>50 � 40 pF<br>INPUT 90%<br>50% 50%<br>10%<br>50 � 1 M� Vin PULSE WIDTH<br>(Vin AMPLITUDE 10 VOLTS)<br>**----- End of picture text -----**<br>


**Figure 1. Switching Test Circuit** 

**Figure 2. Switching Waveform** 

**www.onsemi.com** 

**2** 

**MMBF170L, NVBF170L** 

## **TYPICAL ELECTRICAL CHARACTERISTICS** 

**==> picture [239 x 158] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.2<br>VGS = 10 V 5.0 V<br>1.0 TJ = 25 ° C<br>4.5 V<br>0.8<br>4.2 V<br>0.6 4.0 V<br>3.8 V<br>0.4 3.6 V<br>3.4 V<br>0.2 3.2 V<br>3.0 V<br>2.8 V<br>0<br>0 1 2 3 4 5 6 7<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**==> picture [150 x 9] intentionally omitted <==**

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VDS, DRAIN−TO−SOURCE VOLTAGE (V)<br>**----- End of picture text -----**<br>


**Figure 3. On−Region Characteristics** 

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**----- Start of picture text -----**<br>
1.0<br>VDS ≥  10 V<br>0.8<br>0.6<br>0.4<br>TJ = 150 ° C<br>0.2 T J  = 25 ° C<br>TJ = −55 ° C<br>0<br>1 2 3 4 5 6 7 8<br>VGS, GATE−TO−SOURCE VOLTAGE (V)<br>, DRAIN CURRENT (A)<br>ID<br>**----- End of picture text -----**<br>


**Figure 4. Transfer Characteristics** 

**==> picture [492 x 409] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 15 30<br>° QT<br>TJ = 25 C<br>7<br>12.5 25<br>6<br>10 20<br>5<br>VDS VGS<br>4 7.5 15<br>3 5 Qgs Qgd 10<br>VGS = 4.5 V<br>2<br>1 2.5 TIDJ = 0.5 A = 25 ° C 5<br>VGS = 10 V<br>0 0 0<br>0.15 0.25 0.35 0.45 0.55 0.65 0.75 0.85 0 0.5 1 1.5 2<br>ID, DRAIN CURRENT (A) Qg, TOTAL GATE CHARGE (nC)<br>Figure 5. On−Resistance vs. Drain Current and Figure 6. Gate−to−Source and<br>Gate Voltage Drain−to−Source Voltage vs. Total Charge<br>0.24<br>0.22 V GS  = 0 V<br>0.20 TJ = 25 ° C<br>0.18<br>0.16<br>0.14<br>0.12<br>0.10<br>0.08<br>0.06<br>0.04<br>0.02<br>0<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0<br>VSD, SOURCE−TO−DRAIN VOLTAGE (V)<br>) �<br>V<br>DS<br>, GATE−TO−SOURCE VOLTAGE (V)<br>, DRAIN−TO−SOURCE RESISTANCE (<br>GS<br>V , DRAIN−TO−SOURCE VOLTAGE (V)<br>DS(on)<br>R<br>, SOURCE CURRENT (A)<br>IS<br>**----- End of picture text -----**<br>


**Figure 7. Diode Forward Voltage vs. Current** 

**www.onsemi.com** 

**3** 

**MMBF170L, NVBF170L** 

## **TYPICAL ELECTRICAL CHARACTERISTICS** 

**==> picture [488 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.4 1.2<br>2.2 VGS = 10 V 1.05 VDS = VGS<br>ID = 200 mA ID = 1.0 mA<br>2.0 1.1<br>1.8 1.10<br>1.6 1.0<br>1.4 0.95<br>1.2 0.9<br>1.0 0.85<br>0.8 0.8<br>0.6 0.75<br>0.4 0.7<br>−60 −20 20 60 100 140 −60 −20 20 60 100 140<br>T, TEMPERATURE ( ° C) T, TEMPERATURE ( ° C)<br>(NORMALIZED)<br>r DS(on), STATIC DRAIN-SOURCE ON-RESISTANCE VGS(th), THRESHOLD VOLTAGE (NORMALIZED)<br>**----- End of picture text -----**<br>


**Figure 8. Temperature versus Static Drain−Source On−Resistance** 

**Figure 9. Temperature versus Gate Threshold Voltage** 

**www.onsemi.com** 

**4** 

**MMBF170L, NVBF170L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

**==> picture [468 x 183] intentionally omitted <==**

**----- Start of picture text -----**<br>
D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>Tae 3 THE BASE MATERIAL.<br>E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>: : e VIEW C . c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 −−− 10 0 −−− 10<br>GE A1 SIDE VIEW Se SEE VIEW C GR, c STYLE 21: SSS<br>END VIEW PIN 1. GATE<br>2. SOURCE<br>3. DRAIN<br>**----- End of picture text -----**<br>


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RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 T O 0.90<br>L o| cr<br>3X 0.80 | LLL 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

◊ 

**www.onsemi.com** 

**MMBF170LT1/D** 

**5** 



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