# Zener Single Diode, Voltage Regulator, 5.6 V, 500 mW, SOD-523, 2 Pins, 150 °C, Surface Mount ![Product image](https://novapart.co/image/farnell:2463604/) **URL**: https://novapart.co/products/MM5Z5V6ST1G/zener-single-diode-voltage-regulator-56-v-500-mw **SKU**: MM5Z5V6ST1G **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Zener Single Diodes **Price**: €0.0300 **Stock**: 1000+ **Lead Time**: 134 days (indicative) ## Description Zener Voltage Vz Typ:5.6V; Power Dissipation Pd:500mW; Diode Case Style:SOD-523; Zener Tolerance ±:-; No. of Pins:2Pins; Operating Temperature Max:150°C; Product Range:MM5Z5 Series; Aut ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (25-Jun-2025) | | No. Of Pins | 2Pins | | Product Range | MM5Z5 | | Qualification | - | | Diode Mounting | Surface Mount | | Diode Case Style | SOD-523 | | Power Dissipation | 500mW | | Zener Voltage Nom | 5.6V | | Operating Temperature Max | 150°C | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:2463604/) ## Zener Voltage Regulators **500 mW SOD−523, Tight Tolerance Series** ## MM5ZxxxST1G Series, SZMM5ZxxxST1G Series This series of Zener diodes is packaged in a SOD−523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. ## **Specification Features** - Standard Zener Breakdown Voltage Range −2.4 V to 18 V - Tight Tolerance Series - Steady State Power Rating of 500 mW - Small Body Outline Dimensions: 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) - ESD Rating of Class 3 (> 16 kV) per Human Body Model - SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable - These Devices are Pb−Free and are RoHS Compliant* ## **Mechanical Characteristics** > **CASE:** Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0 **LEAD FINISH:** 100% Matte Sn (Tin) **MOUNTING POSITION:** Any **QUALIFIED MAX REFLOW TEMPERATURE:** 260°C Device Meets MSL 1 Requirements ## **www.onsemi.com** **==> picture [38 x 27] intentionally omitted <==** **----- Start of picture text -----**
SOD−523
CASE 502
STYLE 1
**----- End of picture text -----**
**==> picture [146 x 162] intentionally omitted <==** **----- Start of picture text -----**
o—_\¢0
1 2
Cathode Anode
MARKING DIAGRAM
XX M
1 2
| Bi:
XX = Specific Device Code
M Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
**----- End of picture text -----**
*Date Code orientation may vary depending upon manufacturing location. ## **ORDERING INFORMATION** ## **MAXIMUM RATINGS** **Rating Symbol Max Unit** ~~eses ee~~ Total Device Dissipation FR−4 Board, PD (Note 1) @ TA = 25 ° C 500 mW Derate above 25 ° C 4.0 mW/ ° C ~~pe~~ Thermal Resistance from R JA 250 ° C/W Junction−to−Ambient (Note 1) ~~ee~~ Operating Junction and Storage TJ, Tstg −65 to ~~eee~~ ° C Temperature Range +150 ~~eeee~~ Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm[2] . |**Device**|**Package**|**Shipping**†| |---|---|---| |MM5ZxxxST1G|SOD−523
(Pb−Free)|3,000 /
Tape & Reel| |SZMM5ZxxxST1G|SOD−523
(Pb−Free)|3,000 /
Tape & Reel| |MM5ZxxxST5G|SOD−523
(Pb−Free)|8,000 /
Tape & Reel| |SZMM5ZxxxST5G|SOD−523
(Pb−Free)|8,000 /
Tape & Reel| - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ## **DEVICE MARKING INFORMATION** - *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. Publication Order Number: **1** © Semiconductor Components Industries, LLC, 2014 **August, 2020 − Rev. 14** **MM5Z2V4ST1/D** **MM5ZxxxST1G Series, SZMM5ZxxxST1G Series** ## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) |**Symbol**|**Parameter**| |---|---| |VZ|Reverse Zener Voltage @ IZT| |IZT|Reverse Current| |ZZT|Maximum Zener Impedance @ IZT| |IZK|Reverse Current| |ZZK|Maximum Zener Impedance @ IZK| |IR|Reverse Leakage Current @ VR| |VR|Reverse Voltage| |IF|Forward Current| |VF|Forward Voltage @ IF| |�VZ|Maximum Temperature Coefficient of VZ| |C|Max. Capacitance @VR= 0 and f = 1 MHz| **==> picture [173 x 151] intentionally omitted <==** **----- Start of picture text -----**
I
IF
VZ VR
V
IR VF
IZT
**----- End of picture text -----**
**Figure 1. Zener Voltage Regulator** ## **ELECTRICAL CHARACTERISTICS − Tight Tolerance Series** (VF = 0.9 Max @ IF = 10 mA for all types) |**Device***|**Device**
**Marking**|**Test**
**Current**
**Izt mA**|**Zener Voltage**
**VZ**|**Zener Voltage**
**VZ**|**ZZK IZ**
**= 1.0**
**mA�**
**Max**|**ZZT**
**IZ = IZT**
**@ 10%**
**Mod�**
**Max**|**Max**
**IR @ VR**|**Max**
**IR @ VR**|**dVZ/dt**
**@ IZT1**|**(mV/k)**
**= 5 mA**|**C pF Max @**
**VR = 0**
**f = 1 MHz**| |---|---|---|---|---|---|---|---|---|---|---|---| ||||**Min**|**Max**|||**�A**|**V**|**Min**|**Max**|| |MM5Z2V4ST1G/T5G|T2|5.0|2.43|2.63|1000|100|120|1.0|−3.5|0|450| |MM5Z2V7ST1G|T3|5.0|2.67|2.91|1000|100|100|1.0|−3.5|0|450| |MM5Z3V3ST1G|T5|5.0|3.32|3.53|1000|95|5.0|1.0|−3.5|0|450| |MM5Z3V6ST1G|T6|5.0|3.60|3.85|1000|90|5.0|1.0|−3.5|0|450| |MM5Z3V9ST1G|T7|5.0|3.89|4.16|1000|90|3.0|1.0|−3.5|−2.5|450| |MM5Z4V3ST1G|T8|5.0|4.17|4.43|1000|90|3.0|1.0|−3.5|0|450| |MM5Z4V7ST1G/T5G|T9|5.0|4.55|4.75|800|80|3.0|2.0|−3.5|0.2|260| |MM5Z5V1ST1G/T5G|TA|5.0|4.98|5.2|500|60|2.0|2.0|−2.7|1.2|225| |MM5Z5V6ST1G/T5G|TC|5.0|5.49|5.73|200|40|1.0|2.0|−2.0|2.5|200| |MM5Z6V2ST1G/T5G|TE|5.0|6.06|6.33|100|10|3.0|4.0|0.4|3.7|185| |MM5Z6V8ST1G/T5G|TF|5.0|6.65|6.93|160|15|2.0|4.0|1.2|4.5|155| |MM5Z7V5ST1G|TG|5.0|7.28|7.6|160|15|1.0|5.0|2.5|5.3|140| |MM5Z8V2ST1G/T5G|TH|5.0|8.02|8.36|160|15|0.7|5.0|3.2|6.2|135| |MM5Z9V1ST1G/T5G|TK|5.0|8.85|9.23|160|15|0.5|6.0|3.8|7.0|130| |MM5Z12VST1G|TN|5.0|11.74|12.24|80|25|0.1|8.0|6.0|10|130| |MM5Z16VST1G|TU|5.0|15.85|16.51|80|40|0.05|11.2|10.4|14|105| |MM5Z18VST1G|TW|5.0|17.56|18.35|80|45|0.05|12.6|12.4|16|100| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Includes SZ-prefix devices where applicable. **www.onsemi.com** **2** **MM5ZxxxST1G Series, SZMM5ZxxxST1G Series** ## **TYPICAL CHARACTERISTICS** **==> picture [250 x 172] intentionally omitted <==** **----- Start of picture text -----**
100
80
60
40
20
0
0 25 50 75 100 125 150
TEMPERATURE ( ° C)
POWER DISSIPATION (%)
**----- End of picture text -----**
**Figure 2. Steady State Power Derating** **www.onsemi.com** **3** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [196 x 333] intentionally omitted <==** **----- Start of picture text -----**
o 2 © 2
1 1
STYLE 1 STYLE 2
SCALE 4:1
−X−
D
−Y−
— —
E
1 2
2X b qe
0.08 M X Y
TOP VIEW
A
id 4,
c IL HE
SIDE VIEW
2X L
ste
2X L2 JE
BOTTOM VIEW
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**==> picture [144 x 104] intentionally omitted <==** **----- Start of picture text -----**
RECOMMENDED
SOLDERING FOOTPRINT*
2X 1.80
0.48 2X
0.40
TH ) ,
PACKAGE ao
OUTLINE DIMENSION: MILLIMETERS
**----- End of picture text -----**
**SOD−523** CASE 502−01 ISSUE E ## DATE 28 SEP 2010 ## NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. **==> picture [185 x 292] intentionally omitted <==** **----- Start of picture text -----**
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.50 0.60 0.70
b 0.25 0.30 0.35
c 0.07 0.14 0.20
D 1.10 1.20 1.30
E 0.70 0.80 0.90
H E 1.50 1.60 1.70
L 0.30 REF
L2 0.15 0.20 0.25
====
GENERIC
MARKING DIAGRAM*
XX XX
1 2 1 2
dj Ff q_
STYLE 1 STYLE 2
XX = Specific Device Code
M Date Code Ff
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
STYLE 1: STYLE 2:
PIN 1. CATHODE (POLARITY BAND) NO POLARITY
2. ANODE
M M
**----- End of picture text -----**
- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON11524D** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: SOD−523 PAGE 1 OF 1** ~~_ 1~~ ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. www.onsemi.com © Semiconductor Components Industries, LLC, 2019 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. 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