# Zener Single Diode, 3 V, 300 mW, SOD-323, 2 Pins, 150 °C, Surface Mount ![Product image](https://novapart.co/image/farnell:2463510/) **URL**: https://novapart.co/products/MM3Z3V0T1G/zener-single-diode-3-v-300-mw-sod-323-2-pins-150-c **SKU**: MM3Z3V0T1G **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Zener Single Diodes **Price**: €0.0270 **Stock**: 500+ **Lead Time**: 104 days (indicative) ## Description Zener Voltage Vz Typ:3V; Power Dissipation Pd:300mW; Diode Case Style:SOD-323; Zener Tolerance ±:5%; No. of Pins:2Pins; Operating Temperature Max:150°C; Product Range:MM3Z3 Series; Automo ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (25-Jun-2025) | | No. Of Pins | 2Pins | | Product Range | MM3Z3 | | Qualification | AEC-Q101 | | Diode Mounting | Surface Mount | | Diode Case Style | SOD-323 | | Power Dissipation | 300mW | | Zener Voltage Nom | 3V | | Operating Temperature Max | 150°C | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:2463510/) ## MM3ZxxxT1G Series, SZMM3ZxxxT1G Series ## Zener Voltage Regulators **300 mW SOD−323 Surface Mount** This series of Zener diodes is packaged in a SOD−323 surface mount package that has a power dissipation of 300 mW. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. ## **Specification Features:** - Standard Zener Breakdown Voltage Range − 2.4 V to 75 V ## **http://onsemi.com** **SOD−323 CASE 477 STYLE 1** - Steady State Power Rating of 300 mW - Small Body Outline Dimensions: 0.067” x 0.049” (1.7 mm x 1.25 mm) - Low Body Height: 0.035” (0.9 mm) - Package Weight: 4.507 mg/Unit **==> picture [105 x 17] intentionally omitted <==** **----- Start of picture text -----**
1 2
Cathode Anode
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**==> picture [90 x 7] intentionally omitted <==** **----- Start of picture text -----**
MARKING DIAGRAM
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- ESD Rating of Class 3 (> 16 kV) per Human Body Model - SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable - These are Pb−Free Devices* **==> picture [80 x 46] intentionally omitted <==** **----- Start of picture text -----**
xx
|
M
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## **Mechanical Characteristics:** **CASE:** Void-free, Transfer-Molded Plastic **FINISH:** All External Surfaces are Corrosion Resistant **MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:** 260°C for 10 Seconds **LEADS:** Plated with Pb−Sn or Sn Only (Pb−Free) **POLARITY:** Cathode Indicated by Polarity Band **FLAMMABILITY RATING:** UL 94 V−0 **MOUNTING POSITION:** Any ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Max**|**Unit**| |Total Device Dissipation FR−4 Board,
(Note 1) @ TA= 25°C
Derate above 25°C|PD|300
2.4|mW
mW/°C| |Thermal Resistance, Junction−to−Ambient|R JA|416|°C/W| |Junction and Storage Temperature Range|TJ, Tstg|−65 to +150|°C| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm[2] . xx = Specific Device Code M = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. **ORDERING INFORMATION** **Device Package Shipping** † MM3ZxxxT1G SOD−323 3,000 / (Pb−Free) Tape & Reel SZMM3ZxxxT1G SOD−323 3,000 / (Pb−Free) Tape & Reel ~~===~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ## **DEVICE MARKING INFORMATION** See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. - *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: **1** © Semiconductor Components Industries, LLC, 2014 **September, 2014 − Rev. 11** **MM3Z2V4T1/D** **MM3ZxxxT1G Series, SZMM3ZxxxT1G Series** ## **ELECTRICAL CHARACTERISTICS** |**Symbol**|**Parameter**| |---|---| |VZ|Reverse Zener Voltage @ IZT| |IZT|Reverse Current| |ZZT|Maximum Zener Impedance @ IZT| |IZK|Reverse Current| |ZZK|Maximum Zener Impedance @ IZK| |IR|Reverse Leakage Current @ VR| |VR|Reverse Voltage| |IF|Forward Current| |VF|Forward Voltage @ IF| |�VZ|Maximum Temperature Coefficient of VZ| |C|Max. Capacitance @VR= 0 and f = 1 MHz| **==> picture [185 x 174] intentionally omitted <==** **----- Start of picture text -----**
I
IF
VZ VR
V
IR VF
IZT
Zener Voltage Regulator
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## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) |**Device***|**Device**
**Marking**|**Zener Voltage**(Note 2)|**Zener Voltage**(Note 2)|**Zener Voltage**(Note 2)|**Zener Voltage**(Note 2)|**Zener Impedance**|**Zener Impedance**|**Zener Impedance**|**Leakage Current**|**Leakage Current**|**�VZ**
**(mV/k)**
**@ IZT**|**�VZ**
**(mV/k)**
**@ IZT**|**C**
**@ VR = 0**
**f = 1 MHz**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |||**VZ (Volts)**|||**@ IZT**|**ZZT**
**@ IZT**|**ZZK **|**@ IZK**|**IR @ VR**||||| |||**Min**|**Nom**|**Max**|**mA**|**�**|**�**|**mA**|**�A**|**Volts**|**Min**|**Max**|**pF**| |MM3Z2V4T1G
MM3Z2V7T1G
MM3Z3V0T1G
MM3Z3V3T1G
MM3Z3V6T1G|00
01
02
05
06|2.2
2.5
2.8
3.1
3.4|2.4
2.7
3.0
3.3
3.6|2.6
2.9
3.2
3.5
3.8|5
5
5
5
5|100
100
100
95
90|1000
1000
1000
1000
1000|0.5
0.5
0.5
0.5
0.5|50
20
10
5
5|1.0
1.0
1.0
1.0
1.0|−3.5
−3.5
−3.5
−3.5
−3.5|0
0
0
0
0|450
450
450
450
450| |MM3Z3V9T1G
MM3Z4V3T1G
MM3Z4V7T1G
MM3Z5V1T1G
MM3Z5V6T1G|07
08
09
0A
0C|3.7
4.0
4.4
4.8
5.2|3.9
4.3
4.7
5.1
5.6|4.1
4.6
5.0
5.4
6.0|5
5
5
5
5|90
90
80
60
40|1000
1000
800
500
200|0.5
0.5
0.5
0.5
0.5|3
3
3
2
1|1.0
1.0
2.0
2.0
2.0|−3.5
−3.5
−3.5
−2.7
−2.0|−2.5
0
0.2
1.2
2.5|450
450
260
225
200| |MM3Z6V2T1G
MM3Z6V8T1G
MM3Z7V5T1G
MM3Z8V2T1G
MM3Z9V1T1G|0E
0F
0G
0H
0K|5.8
6.4
7.0
7.7
8.5|6.2
6.8
7.5
8.2
9.1|6.6
7.2
7.9
8.7
9.6|5
5
5
5
5|10
15
15
15
15|100
160
160
160
160|0.5
0.5
0.5
0.5
0.5|3
2
1
0.7
0.2|4.0
4.0
5.0
5.0
7.0|0.4
1.2
2.5
3.2
3.8|3.7
4.5
5.3
6.2
7.0|185
155
140
135
130| |MM3Z10VT1G
MM3Z11VT1G
MM3Z12VT1G
MM3Z13VT1G
MM3Z15VT1G|0L
0M
0N
0P
0T|9.4
10.4
11.4
12.4
14.3|10
11
12
13.25
15|10.6
11.6
12.7
14.1
15.8|5
5
5
5
5|20
20
25
30
30|160
160
80
80
80|0.5
0.5
0.5
0.5
0.5|0.1
0.1
0.1
0.1
0.05|8.0
8.0
8.0
8.0
10.5|4.5
5.4
6.0
7.0
9.2|8.0
9.0
10
11
13|130
130
130
120
110| |MM3Z16VT1G
MM3Z18VT1G
MM3Z20VT1G
MM3Z22VT1G
MM3Z24VT1G|0U
0W
0Z
10
11|15.3
16.8
18.8
20.8
22.8|16.2
18
20
22
24.2|17.1
19.1
21.2
23.3
25.6|5
5
5
5
5|40
45
55
55
70|80
80
100
100
120|0.5
0.5
0.5
0.5
0.5|0.05
0.05
0.05
0.05
0.05|11.2
12.6
14.0
15.4
16.8|10.4
12.4
14.4
16.4
18.4|14
16
18
20
22|105
100
85
85
80| |MM3Z27VT1G
MM3Z30VT1G
MM3Z33VT1G
MM3Z36VT1G
MM3Z39VT1G|12
14
18
19
20|25.1
28
31
34
37|27
30
33
36
39|28.9
32
35
38
41|2
2
2
2
2|80
80
80
90
130|300
300
300
500
500|0.5
0.5
0.5
0.5
0.5|0.05
0.05
0.05
0.05
0.05|18.9
21.0
23.2
25.2
27.3|21.4
24.4
27.4
30.4
33.4|25.3
29.4
33.4
37.4
41.2|70
70
70
70
45| |MM3Z43VT1G
MM3Z47VT1G
MM3Z51VT1G
MM3Z56VT1G|21
1A
1C
1D|40
44
48
52|43
47
51
56|46
50
54
60|2
2
2
2|150
170
180
200|500
500
500
500|0.5
0.5
0.5
0.5|0.05
0.05
0.05
0.05|30.1
32.9
35.7
39.2|37.6
42.0
46.6
52.2|46.6
51.8
57.2
63.8|40
40
40
40| |MM3Z62VT1G
MM3Z68VT1G
MM3Z75VT1G|2A
1F
1G|58
64
70|62
68
75|66
72
79|2
2
2|215
240
255|500
500
500|0.5
0.5
0.5|0.05
0.05
0.05|43.4
47.6
52.5|58.9
65.6
73.4|71.8
79.8
88.6|35
35
35| |*Includes SZ-prefix devices where applicable.|||||||||||||| 2. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25 ° C. **http://onsemi.com** **2** **MM3ZxxxT1G Series, SZMM3ZxxxT1G Series** ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 597] intentionally omitted <==** **----- Start of picture text -----**
1000 1000
TJ = 25 ° C
IZ(AC) = 0.1 IZ(DC)
f = 1 kHz
100 100
I Z = 1 mA
5 mA 150 ° C
10 10
75 ° C 25 ° C 0 ° C
1.0 1.0
3.0 10 80 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
VZ, NOMINAL ZENER VOLTAGE VF, FORWARD VOLTAGE (V)
Figure 1. Effect of Zener Voltage on Zener Impedance Figure 2. Typical Forward Voltage
1000 1000
TA = 25 ° C 100
10
0 V BIAS 1 V BIAS
100
1.0
+150 ° C
0.1
BIAS AT
0.01
10 50% OF VZ NOM
+25 ° C
0.001
−55 ° C
0.0001
1.0 0.00001
4.0 10 70 0 10 20 30 40 50 60 70
VZ, NOMINAL ZENER VOLTAGE (V) VZ, NOMINAL ZENER VOLTAGE (V)
Figure 3. Typical Capacitance Figure 4. Typical Leakage Current
100 100
TA = 25 ° C TA = 25 ° C
10 10
1.0 1
0.1 0.1
0.01 0.01
0 2.0 4.0 6.0 8.0 10 12 10 30 50 70 90
VZ, ZENER VOLTAGE (V) VZ, ZENER VOLTAGE (V)
) Ω IF, FORWARD CURRENT (mA)
ZZT, DYNAMIC IMPEDANCE (
A)
μ
C, CAPACITANCE (pF)
IR, LEAKAGE CURRENT (
IZ, ZENER CURRENT (mA) IZ, ZENER CURRENT (mA)
**----- End of picture text -----**
**Figure 5. Zener Voltage versus Zener Current (VZ Up to 12 V)** **Figure 6. Zener Voltage versus Zener Current (12 V to 75 V)** **http://onsemi.com** **3** **MM3ZxxxT1G Series, SZMM3ZxxxT1G Series** ## **TYPICAL CHARACTERISTICS** **==> picture [242 x 168] intentionally omitted <==** **----- Start of picture text -----**
100
80
60
40
20
0
0 25 50 75 100 125 150
TEMPERATURE ( ° C)
POWER DISSIPATION (%)
**----- End of picture text -----**
**Figure 7. Steady State Power Derating** **http://onsemi.com** **4** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** DATE 13 MAR 2007 **SOD−323** CASE 477−02 ISSUE H **==> picture [216 x 228] intentionally omitted <==** **----- Start of picture text -----**
a 2 2
1 1
STYLE 1 STYLE 2
SCALE 4:1
HE
D
=
b 1 2 E
=
A3
A
C if NOTE 5L A1 C o,
NOTE 3
**----- End of picture text -----**
**==> picture [141 x 108] intentionally omitted <==** **----- Start of picture text -----**
SOLDERING FOOTPRINT*
0.63
0.025
se
0.83
0.033
1.60
Ua
0.063
2.85
0.112
**----- End of picture text -----**
- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. **==> picture [145 x 92] intentionally omitted <==** **----- Start of picture text -----**
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.80 0.90 1.00 0.031 0.035 0.040
A1 0.00 0.05 0.10 0.000 0.002 0.004
A3 0.15 REF 0.006 REF
b 0.25 0.32 0.4 0.010 0.012 0.016
C 0.089 0.12 0.177 0.003 0.005 0.007
D 1.60 1.70 1.80 0.062 0.066 0.070
E 1.15 1.25 1.35 0.045 0.049 0.053
L 0.08 0.003
HE 2.30 2.50 2.70 0.090 0.098 0.105
Pt —— —*| 4 ]
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**==> picture [93 x 18] intentionally omitted <==** **----- Start of picture text -----**
GENERIC
MARKING DIAGRAM*
**----- End of picture text -----**
**==> picture [161 x 77] intentionally omitted <==** **----- Start of picture text -----**
XX M XX M
qf p 2:
STYLE 1 STYLE 2
XX = Specific Device Code
M = Date Code
**----- End of picture text -----**
- *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. STYLE 1: STYLE 2: PIN 1. CATHODE (POLARITY BAND) NO POLARITY 2. ANODE Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB17533C** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: SOD−323 PAGE 1 OF 1** ~~ee~~ ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2019 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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