# Bipolar (BJT) Single Transistor, NPN, 250 V, 1 A, 40 mW, TO-220, Through Hole

![Product image](https://novapart.co/image/farnell:2845315/)

**URL**: https://novapart.co/products/MJF47G/bipolar-bjt-single-transistor-npn-250-v-1-a-40-mw
**SKU**: MJF47G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.4650
**Stock**: 10+

## Description

Transistor Polarity:NPN; Collector Emitter Voltage V(br)ceo:250V; Transition Frequency ft:10MHz; Power Dissipation Pd:40mW; DC Collector Current:1A; DC Current Gain hFE:10hFE; Transisto

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 40mW |
| Transistor Mounting | Through Hole |
| Transistor Polarity | NPN |
| Transition Frequency | 10MHz |
| Transistor Case Style | TO-220 |
| Dc Current Gain Hfe Min | 10hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 1A |
| Collector Emitter Voltage Max | 250V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2845315/)

## MJF47G 

## High Voltage Power Transistor **Isolated Package Applications** 

Designed for line operated audio output amplifiers, switching power supply drivers and other switching applications, where the mounting surface of the device is required to be electrically isolated from the heatsink or chassis. 

## **Features** 

- Electrically Similar to the Popular TIP47 

- 250 VCEO(sus) 

## **http://onsemi.com** 

**NPN SILICON POWER TRANSISTOR 1 AMPERE 250 VOLTS, 28 WATTS** 

• 1 A Rated Collector Current 

• No Isolating Washers Required • Reduced System Cost • UL Recognized, File #E69369, to 3500 VRMS Isolation • This is a Pb−Free Device* **MAXIMUM RATINGS Rating Symbol Value Unit** ~~a a~~ Collector−Emitter Voltage VCEO 250 Vdc Collector−Base Voltage VCB 350 Vdc Emitter−Base Voltage VEB 5 Vdc RMS Isolation Voltage (Note 1) VISOL V Test No. 1 Per Figure 10 4500 Test No. 2 Per Figure 11 3500 Test No. 3 Per Figure 12 1500 ~~tt~~ (for 1 sec, R.H. < 30%, TA = 25 C) Collector Current − Continuous IC 1 Adc − Peak 2 ~~a~~ Base Current − Continuous IB 0.6 Adc ~~ee~~ Total Power Dissipation (Note 2) @ TC = 25 C PD 28.4 W Derate above 25 C 0.227 W/ C ~~ee~~ Total Power Dissipation @ TA = 25 C PD 2.0 W Derate above 25 C 0.016 W/ C ~~eea~~ Operating and Storage Temperature Range TJ, Tstg –65 to +150 ~~ee~~ C 

**THERMAL CHARACTERISTICS** 

~~a~~ **Characteristic Symbol Max Unit** ~~a~~ Thermal Resistance, Junction−to−Ambient R JA 62.5 C/W Thermal Resistance, Junction−to−Case (Note 2) R JC 4.4 C/W Lead Temperature for Soldering Purposes TL 260 C 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. Proper strike and creepage distance must be provided. 

**TO−220 FULLPACK CASE 221D STYLE 2** 1 bd 2 3 

> **MARKING DIAGRAM** ~~log~~ MJF47G AYWW Za To OUT G = Pb−Free Package A = Assembly Location Y = Year WW = Work Week 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**|
|---|---|---|
|MJF47G|TO−220 FULLPACK<br>(Pb−Free)|50 Units/Rail|



2. Measurement made with thermocouple contacting the bottom insulated surface (in a location beneath the die), the devices mounted on a heatsink with thermal grease and a mounting torque of ≥ 6 in. lbs. 

- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2012 **October, 2012 − Rev. 6** 

**MJF47/D** 

## **MJF47G** 

## **ELECTRICAL CHARACTERISTICS** (TC = 25 � C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TC= 25�C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Sustaining Voltage (Note 3)<br>(IC= 30 mAdc, IB= 0)|VCEO(sus)|250|−|Vdc|
|Collector Cutoff Current<br>(VCE= 150 Vdc, IB= 0)|ICEO|−|0.2|mAdc|
|Collector Cutoff Current<br>(VCE= 350 Vdc, VBE= 0)|ICES|−|0.1|mAdc|
|Emitter Cutoff Current<br>(VBE= 5 Vdc, IC= 0)|IEBO|−|1|mAdc|
|**ON CHARACTERISTICS**(Note 3)|||||
|DC Current Gain<br>(IC= 0.3 Adc, VCE= 10 Vdc)<br>(IC= 1 Adc, VCE= 10 Vdc)|hFE|30<br>10|150<br>−|−|
|Collector−Emitter Saturation Voltage<br>(IC= 1 Adc, IB= 0.2 Adc)|VCE(sat)|−|1|Vdc|
|Base−Emitter On Voltage<br>(IC= 1 Adc, VCE= 10 Vdc)|VBE(on)|−|1.5|Vdc|
|**DYNAMIC CHARACTERISTICS**|||||
|Current Gain − Bandwidth Product<br>(IC= 0.2 Adc, VCE10 Vdc, f = 2 MHz)|fT|10|−|MHz|



3. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2%. 

## **TYPICAL CHARACTERISTICS** 

**==> picture [487 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
200 1.4<br>VCE = 10 V<br>100 1.2<br>TJ = 150°C<br>60 1<br>40 25°C<br>0.8 VBE(sat) @ IC/IB = 5<br>20<br>-�55°C 0.6 VBE(on) @ VCE = 4 V<br>10<br>0.4 TJ = 25°C<br>6<br>4 0.2 VCE(sat) @ IC/IB = 5 V<br>2 0<br>0.02 0.04 0.06 0.1 0.2 0.4 0.6 1 2 0.02 0.04 0.06 0.1 0.2 0.4 0.6 1 2<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMPS)<br>V, VOLTAGE (VOLTS)<br>hFE, DC CURRENT GAIN<br>**----- End of picture text -----**<br>


**Figure 1. DC Current Gain** 

**Figure 2. “On” Voltages** 

**http://onsemi.com** 

**2** 

**MJF47G** 

**==> picture [486 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 5 T J  = 25°C<br>0.5 tr TVJCC = 25 = 200 V°C 2 ts VICCC/IB = 200 V = 5<br>IC/IB = 5<br>0.2 1<br>0.1 td 0.5<br>0.05<br>0.2 tf<br>0.02 0.1<br>0.01 0.05<br>0.02 0.05 0.1 0.2 0.5 1 2 0.02 0.05 0.1 0.2 0.5 1 2<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMPS)<br>μ μ<br>t, TIME (��s) t, TIME (��s)<br>**----- End of picture text -----**<br>


**Figure 3. Turn−On Time** 

**Figure 4. Turn−Off Time** 

**==> picture [483 x 402] intentionally omitted <==**

**----- Start of picture text -----**<br>
TURN-ON PULSE<br>VCC<br>APPROX<br>RC<br>+11 V<br>Vin 0 Vin SCOPE<br>VEB(off) 51 RB<br>t1<br>APPROX t3 Cjd << Ceb<br>+11 V t1 ≤ 7 ns -�4 V<br>100 < t2 < 500 �s<br>Vin t3 < 15 ns<br>DUTY CYCLE ≈ 2%<br>t2 APPROX -�9 V<br>TURN-OFF PULSE RB and RC VARIED TO OBTAIN<br>DESIRED CURRENT LEVELS.<br>Figure 5. Switching Time Equivalent Circuit<br>1<br>0.5<br>0.3<br>0.2<br>0.1<br>SINGLE PULSE<br>R�JC(t) = r(t) R�JC<br>0.05 R�JC = 4.4 ° C/W MAX<br>0.03 T J(pk) - T C = P (pk)  R �JC (t)<br>0.02<br>0.01<br>0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500 1K 2K 3K 5K 10 K<br>t, TIME (msec)<br>r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>**----- End of picture text -----**<br>


**Figure 6. Thermal Response** 

**http://onsemi.com** 

**3** 

**MJF47G** 

**==> picture [233 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
3<br>2 100 �s<br>500 �s<br>1<br>1�ms<br>0.5<br>dc<br>0.3<br>0.2<br>0.1 CURRENT LIMIT<br>THERMAL LIMIT @ TC = 25°C<br>0.05 SECONDARY BREAKDOWN LIMIT<br>0.03<br>10 20 30 50 100 200 300<br>VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)<br>IC, COLLECTOR CURRENT (AMPS)<br>**----- End of picture text -----**<br>


There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC − VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. 

The data of Figure 7 is based on TJ(pk) = 150�C; TC is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided TJ(pk) � 150°C.  TJ(pk) may be calculated from the data in Figure 6. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. 

**Figure 7. Maximum Forward Bias Safe Operating Area** 

**==> picture [239 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
40<br>30<br>20<br>10<br>0<br>0 50 100 150 200<br>TC, CASE TEMPERATURE (°C)<br>PD(AV), AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 8. Power Derating** 

**==> picture [239 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
2<br>1.5<br>1<br>0.5<br>0<br>0 50 100 150 200<br>TA, AMBIENT TEMPERATURE (°C)<br>PD(AV), AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 9. Power Derating** 

**http://onsemi.com 4** 

**MJF47G** 

## **TEST CONDITIONS FOR ISOLATION TESTS*** 

**==> picture [455 x 94] intentionally omitted <==**

**----- Start of picture text -----**<br>
MOUNTED MOUNTED MOUNTED<br>FULLY ISOLATED FULLY ISOLATED FULLY ISOLATED<br>CLIP PACKAGE CLIP PACKAGE 0.099" MIN PACKAGE 0.099" MIN<br>LEADS LEADS<br>LEADS<br>HEATSINK HEATSINK HEATSINK<br>0.110" MIN<br>**----- End of picture text -----**<br>


**Figure 10. Clip Mounting Position Figure 11. Clip Mounting Position for Isolation Test Number 1 for Isolation Test Number 2** 

**Figure 12. Screw Mounting Position for Isolation Test Number 3** 

*Measurement made between leads and heatsink with all leads shorted together 

## **MOUNTING INFORMATION** 

**==> picture [305 x 158] intentionally omitted <==**

**----- Start of picture text -----**<br>
4-40 SCREW CLIP<br>PLAIN WASHER<br>HEATSINK<br>COMPRESSION WASHER<br>NUT HEATSINK<br>**----- End of picture text -----**<br>


**==> picture [63 x 78] intentionally omitted <==**

**Figure 13. Typical Mounting Techniques*** 

Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in **[.]** lbs is sufficient to provide maximum power dissipation capability.  The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. 

Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in **[.]** lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. 

Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in **[.]** lbs without adversely affecting the package.  However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in **[.]** lbs of mounting torque under any mounting conditions. 

** For more information about mounting power semiconductors see Application Note AN1040. 

**http://onsemi.com** 

**5** 

**MJF47G** 

## **PACKAGE DIMENSIONS** 

**TO−220 FULLPAK** CASE 221D−03 ISSUE K 

**==> picture [360 x 203] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTES:<br>−T− SEATINGPLANE 1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>−B− C 2. CONTROLLING DIMENSION: INCH<br>F 3. 221D-01 THRU 221D-02 OBSOLETE, NEW<br>S STANDARD 221D-03.<br>Q U INCHES MILLIMETERS<br>i DIM MIN MAX MIN MAX<br>A A 0.617 0.635 15.67 16.12<br>B 0.392 0.419 9.96 10.63<br>1 2 3 C 0.177 0.193 4.50 4.90<br>D 0.024 0.039 0.60 1.00<br>H F 0.116 0.129 2.95 3.28<br>−Y− G 0.100 BSC 2.54 BSC<br>K<br>H 0.118 0.135 3.00 3.43<br>J 0.018 0.025 0.45 0.63<br>Th a<br>K 0.503 0.541 12.78 13.73<br>G J L 0.048 0.058 1.23 1.47<br>N 0.200 BSC 5.08 BSC<br>N 1 R Q 0.122 0.138 3.10 3.50<br>L R 0.099 0.117 2.51 2.96<br>S 0.092 0.113 2.34 2.87<br>D 3 PL U 0.239 0.271 6.06 6.88<br>0.25 (0.010) M B M Y STYLE 2:<br>PIN 1. BASE<br>2. COLLECTOR<br>3. EMITTER<br>**----- End of picture text -----**<br>


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**MJF47/D** 

**6** 



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