# Bipolar (BJT) Single Transistor, General Purpose, PNP, 100 V, 3 A, 15 W, TO-252 (DPAK)

![Product image](https://novapart.co/image/farnell:9557121/)

**URL**: https://novapart.co/products/MJD32CG/bipolar-bjt-single-transistor-general-purpose-pnp
**SKU**: MJD32CG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Transistors || Bipolar Transistors || Single Bipolar Junction Transistors - BJT
**Price**: €0.2540
**Stock**: 1000+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:PNP; Collector Emitter Voltage V(br)ceo:100V; Transition Frequency ft:3MHz; Power Dissipation Pd:15W; DC Collector Current:3A; DC Current Gain hFE:10hFE; Transistor Case Style:

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | Lead (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | MJxxxx |
| Qualification | AEC-Q101 |
| Power Dissipation | 15W |
| Transistor Mounting | Surface Mount |
| Transistor Polarity | PNP |
| Transition Frequency | 3MHz |
| Transistor Case Style | TO-252 (DPAK) |
| Dc Current Gain Hfe Min | 10hFE |
| Operating Temperature Max | 150°C |
| Continuous Collector Current | 3A |
| Collector Emitter Voltage Max | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:9557121/)

## Complementary Power Transistors **DPAK For Surface Mount Applications** 

## MJD31 (NPN), MJD32 (PNP) 

Designed for general purpose amplifier and low speed switching applications. 

**www.onsemi.com** 

## **Features** 

**SILICON POWER TRANSISTORS 3 AMPERES 40 AND 100 VOLTS 15 WATTS** 

- Lead Formed for Surface Mount Applications in Plastic Sleeves 

- Straight Lead Version in Plastic Sleeves (“1” Suffix) 

- Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix) 

- Electrically Similar to Popular TIP31 and TIP32 Series 

- Epoxy Meets UL 94, V−0 @ 0.125 in 

- NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

## **COMPLEMENTARY** 

**==> picture [174 x 89] intentionally omitted <==**

**----- Start of picture text -----**<br>
COLLECTOR COLLECTOR<br>2,4 2,4<br>1 1<br>BASE BASE<br>3 3<br>EMITTER EMITTER<br>**----- End of picture text -----**<br>


- These Devices are Pb−Free and are RoHS Compliant 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Max**|**Unit**|
|Collector−Emitter Voltage<br>MJD31, MJD32<br>MJD31C, MJD32C|VCEO|40<br>100|Vdc|
|Collector−Base Voltage<br>MJD31, MJD32<br>MJD31C, MJD32C|VCB|40<br>100|Vdc|
|Emitter−Base Voltage|VEB|5.0|Vdc|
|Collector Current − Continuous|IC|3.0|Adc|
|Collector Current − Peak|ICM|5.0|Adc|
|Base Current|IB|1.0|Adc|
|Total Power Dissipation<br>@ TC= 25°C<br>Derate above 25°C|PD|15<br>0.12|W<br>W/°C|
|Total Power Dissipation<br>@ TA= 25°C<br>Derate above 25°C<br>~~ee~~|PD<br>~~ee~~|1.56<br>0.012<br>~~ee~~|W<br>W/°C<br>~~ee~~|
|Operating and Storage Junction Temperature<br>Range<br>~~ee~~|TJ, Tstg<br>~~ee~~|−65 to<br>+150<br>~~ee~~|°C<br>~~ee~~|
|ESD − Human Body Model<br>~~ee~~|HBM<br>~~ee~~|3B<br>~~ee~~|V<br>~~ee~~|
|ESD − Machine Model<br>~~ee~~|MM<br>~~ee~~|C<br>~~ee~~|V<br>~~ee~~|



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4<br>4<br>1 2<br>3<br>12 3<br>DPAK IPAK<br>CASE 369C CASE 369D<br>STYLE 1 STYLE 1<br>**----- End of picture text -----**<br>


**MARKING DIAGRAMS** 

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AYWW YWW<br>J3xxG J3xxG<br>DPAK IPAK<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
A = Site Code<br>Y = Year<br>WW = Work Week<br>xx = 1, 1C, 2, or 2C<br>G = Pb−Free Package<br>**----- End of picture text -----**<br>


## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Thermal Resistance, Junction−to−Case|R JC|8.3|°C/W|
|Thermal Resistance, Junction−to−Ambient*|R JA|80|°C/W|
|Lead Temperature for Soldering Purposes|TL|260|°C|



## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. 

- *These ratings are applicable when surface mounted on the minimum pad sizes recommended. 

Publication Order Number: **MJD31/D** 

**1** 

© Semiconductor Components Industries, LLC, 2016 **May, 2020 − Rev. 17** 

## **MJD31 (NPN), MJD32 (PNP)** 

## **ELECTRICAL CHARACTERISTICS** (TC = 25 � C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TC= 25�C unless otherwise noted)|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Collector−Emitter Sustaining Voltage (Note 1)<br>(IC= 30 mAdc, IB= 0)<br>MJD31, MJD32<br>MJD31C, MJD32C|VCEO(sus)|40<br>100|−<br>−|Vdc|
|Collector Cutoff Current<br>(VCE= 40 Vdc, IB= 0)<br>MJD31, MJD32<br>(VCE= 60 Vdc, IB= 0)<br>MJD31C, MJD32C|ICEO|−<br>−|50<br>50|�Adc|
|Collector Cutoff Current<br>(VCE= Rated VCEO, VEB= 0)|ICES|−|20|�Adc|
|Emitter Cutoff Current<br>(VBE= 5 Vdc, IC= 0)|IEBO|−|1|mAdc|
|**ON CHARACTERISTICS**(Note 1)|||||
|DC Current Gain<br>(IC= 1 Adc, VCE= 4 Vdc)<br>(IC= 3 Adc, VCE= 4 Vdc)|hFE|25<br>10|−<br>50||
|Collector−Emitter Saturation Voltage<br>(IC= 3 Adc, IB= 375 mAdc)|VCE(sat)|−|1.2|Vdc|
|Base−Emitter On Voltage<br>(IC= 3 Adc, VCE= 4 Vdc)|VBE(on)|−|1.8|Vdc|
|**DYNAMIC CHARACTERISTICS**|||||
|Current Gain − Bandwidth Product (Note 2)<br>(IC= 500 mAdc, VCE= 10 Vdc, ftest= 1 MHz)|fT|3|−|MHz|
|Small−Signal Current Gain<br>(IC= 0.5 Adc, VCE= 10 Vdc, f = 1 kHz)|hfe|20|−||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

1. Pulse Test: Pulse Width � 300 � s, Duty Cycle � 2%. 2. fT = ⎪ hfe ⎪• ftest. 

**www.onsemi.com** 

**2** 

**MJD31 (NPN), MJD32 (PNP)** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
TA TC<br>2.5 25<br>2 20<br>1.5 15 TA (SURFACE MOUNT)<br>TC<br>1 10<br>0.5 5<br>0 0<br>25 50 75 100 125 150<br>T, TEMPERATURE (°C)<br>PD, POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 1. Power Derating** 

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**----- Start of picture text -----**<br>
VCC<br>+�30 V<br>RC<br>25 �s<br>+11 V RB SCOPE<br>0<br>-�9 V 51 D1<br>tr, tf ≤ 10 ns -�4 V<br>DUTY CYCLE = 1%<br>RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS<br>�D1 MUST BE FAST RECOVERY TYPE, e.g.:<br>��1N5825 USED ABOVE IB ≈ 100 mA<br>��MSD6100 USED BELOW IB ≈ 100 mA<br>REVERSE ALL POLARITIES FOR PNP.<br>**----- End of picture text -----**<br>


**Figure 2. Switching Time Test Circuit** 

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**----- Start of picture text -----**<br>
2 3<br>IC/IB = 10 2 IB1 = IB2<br>0.70.51 tr @ VCC = 30 V TJ = 25°C 0.71 tf @ VCC = 30 V ts′ tITCsJ′/I = t = 25B = 10s - 1/8 t°C f<br>0.5<br>0.3 tr @ VCC = 10 V<br>0.3 tf @ VCC = 10 V<br>0.2<br>0.1<br>0.07 td @ VBE(off) = 2 V 0.1<br>0.05 0.07<br>0.05<br>0.03<br>0.02 0.03<br>0.03 0.05 0.07 0.1 0.3 0.5 0.7 1 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1 2 3<br>IC, COLLECTOR CURRENT (AMPS) IC, COLLECTOR CURRENT (AMPS)<br>μ μ<br>t, TIME (��s) t, TIME (��s)<br>**----- End of picture text -----**<br>


**Figure 3. Turn−On Time** 

**Figure 4. Turn−Off Time** 

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100<br>Duty Cycle = 0.5<br>0.2<br>0.1<br>10 0.05<br>0.02<br>1<br>0.01<br>0.1<br>Single Pulse<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, PULSE TIME (sec)<br>C/W)<br>°<br> (<br>JA<br>�<br>R<br>**----- End of picture text -----**<br>


**Figure 5. Thermal Response** 

**www.onsemi.com** 

**3** 

**MJD31 (NPN), MJD32 (PNP)** 

## **TYPICAL CHARACTERISTICS − MJD31, MJD31C (NPN)** 

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**----- Start of picture text -----**<br>
1000<br>1000<br>150 ° C VCE = 4 V 150 ° C VCE = 2 V<br>100 25 ° C ° 25 ° C<br>−55 C 100 −55 ° C<br>10 10<br>1 1<br>0.01 0.1 1 10 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 6. DC Current Gain at VCE = 4 V Figure 7. DC Current Gain at VCE = 2 V<br>0.6 1.2<br>IC/IB = 10 IC/IB = 10<br>1.1<br>0.5<br>1.0<br>0.4 0.9 −55 ° C<br>0.8<br>150 ° C 25 ° C<br>0.3 0.7<br>0.6<br>0.2 150 ° C<br>0.5<br>25 ° C 0.4<br>0.1<br>−55 ° C 0.3<br>0 0.2<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 8. Collector−Emitter Saturation Voltage Figure 9. Base−Emitter Saturation Voltage<br>1.2 2<br>VCE = 5 V TA =<br>1.1 25 ° C<br>1.0 1.6<br>0.9<br>−55 ° C<br>0.8 1.2<br>100 mA 500 mA<br>0.7 25 ° C<br>0.6 0.8 IC = 3 A<br>0.5 150 ° C 1 A<br>0.4 0.4<br>0.3<br>10 mA<br>0.2 0<br>0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (mA)<br>, DC CURRENT GAIN , DC CURRENT GAIN<br>FE FE<br>h h<br>VOLTAGE (V)<br>, COLL−EMITT SATURATION<br>CE(sat)<br>V , BASE−EMITT SATURATION VOLTAGE (V)<br>BE(sat)<br>V<br>, BASE−EMITTER ON VOLTAGE (V) , COLLECTOR−EMITTER VOLTAGE (V)<br>VBE(on) VCE<br>**----- End of picture text -----**<br>


**Figure 10. Base-Emitter “On” Voltage** 

**Figure 11. Collector Saturation Region** 

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**4** 

**MJD31 (NPN), MJD32 (PNP)** 

## **TYPICAL CHARACTERISTICS − MJD31, MJD31C (NPN)** 

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**----- Start of picture text -----**<br>
1000 100<br>TA = 25 ° C VCE = 5 V<br>TA = 25 ° C<br>Cib<br>100<br>Cob 10<br>10<br>1 1<br>0.1 1 10 100 0.001 0.01 0.1 1 10<br>VR, REVERSE VOLTAGE (V) IC, COLLECTOR CURRENT (A)<br>Figure 12. Capacitance Figure 13. Current−Gain−Bandwidth Product<br>10<br>1 s<br>1 100 ms<br>10 ms<br>1 ms<br>500  � s<br>0.1<br>0.01<br>Single Pulse Test @ TA = 25 ° C<br>0.001<br>0.01 0.1 1 10 100<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>PRODUCT (MHz)<br>C, CAPACITANCE (pF)<br>, CURRENT−GAIN − BANDWIDTH<br>fT<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 14. Safe Operating Area** 

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**5** 

**MJD31 (NPN), MJD32 (PNP)** 

## **TYPICAL CHARACTERISTICS − MJD32, MJD32C (PNP)** 

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**----- Start of picture text -----**<br>
1000 1000<br>150 ° C 25 ° C VCE = 4 V 150 ° C 25 ° C VCE = 2 V<br>100 100<br>−55 ° C −55 ° C<br>10 10<br>1 1<br>0.01 0.1 1 10 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 15. DC Current Gain at VCE = 4 V Figure 16. DC Current Gain at VCE = 2 V<br>1 1.4<br>0.9 IC/IB = 10 150 ° C IC/IB = 10<br>1.2<br>0.8 −55 ° C<br>0.7<br>1.0<br>0.6<br>−55 ° C<br>0.5 0.8<br>0.4 25 ° C<br>0.6<br>0.3<br>0.2 150 ° C<br>25 ° C 0.4<br>0.1<br>0 0.2<br>0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10<br>IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)<br>Figure 17. Collector−Emitter Saturation Figure 18. Base−Emitter Saturation Voltage<br>Voltage<br>1.2 2<br>VCE = 5 V TA =<br>1.1 500 mA 25 ° C<br>1.0 1.6<br>0.9 100 mA IC = 3 A<br>0.8 150 ° C 1.2 1 A<br>0.7 25 ° C<br>0.6 0.8<br>0.5<br>−55 ° C 0.4<br>0.4<br>0.3<br>10 mA<br>0<br>0.2<br>0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 1000<br>IC, COLLECTOR CURRENT (A) IB, BASE CURRENT (mA)<br>, DC CURRENT GAIN , DC CURRENT GAIN<br>FE FE<br>h h<br>, BASE−EMITTER<br>VOLTAGE (V)<br>, COLL−EMITT SATURATION BE(sat)<br>V<br>SATURATION VOLTAGE (V)<br>CE(sat)<br>V<br>, BASE−EMITTER ON VOLTAGE (V)<br>BE(on)<br>V<br>, COLLECTOR−EMITTER VOLTAGE (V)<br>CE<br>V<br>**----- End of picture text -----**<br>


**Figure 19. Base−Emitter “On” Voltage** 

**Figure 20. Collector Saturation Region** 

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**6** 

**MJD31 (NPN), MJD32 (PNP)** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
1000 100<br>TA = 25 ° C VCE = 5 V<br>TA = 25 ° C<br>Cib<br>100<br>Cob<br>10<br>10<br>1 1<br>0.1 1 10 100 0.001 0.01 0.1 1 10<br>VR, REVERSE VOLTAGE (V) IC, COLLECTOR CURRENT (A)<br>Figure 21. Capacitance Figure 22. Current−Gain−Bandwidth Product<br>10<br>1 s<br>100 ms<br>1<br>10 ms<br>1 ms<br>500  � s<br>0.1<br>0.01<br>Single Pulse Test @ TA = 25 ° C<br>0.001<br>0.01 0.1 1 10 100<br>VCE, COLLECTOR−EMITTER VOLTAGE (V)<br>PRODUCT (MHz)<br>C, CAPACITANCE (pF)<br>, CURRENT−GAIN − BANDWIDTH<br>fT<br>, COLLECTOR CURRENT (A)<br>IC<br>**----- End of picture text -----**<br>


**Figure 23. Safe Operating Area** 

**www.onsemi.com** 

**7** 

**MJD31 (NPN), MJD32 (PNP)** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Device**|**Package Type**|**Package**|**Shipping**†|
|MJD31CG|DPAK<br>(Pb−Free)|369C|75 Units / Rail|
|NJVMJD31CG*|DPAK<br>(Pb−Free)|369C|75 Units / Rail|
|MJD31C1G|IPAK<br>(Pb−Free)|369D|75 Units / Rail|
|MJD31CRLG|DPAK<br>(Pb−Free)|369C|1,800 / Tape & Reel|
|NJVMJD31CRLG*|DPAK<br>(Pb−Free)|369C|1,800 / Tape & Reel|
|MJD31CT4G|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|NJVMJD31CT4G*|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|MJD31T4G|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|NJVMJD31T4G*|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|MJD32CG|DPAK<br>(Pb−Free)|369C|75 Units / Rail|
|NJVMJD32CG*|DPAK<br>(Pb−Free)|369C|75 Units / Rail|
|MJD32CRLG|DPAK<br>(Pb−Free)|369C|1,800 / Tape & Reel|
|MJD32CT4G|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|NJVMJD32CT4G*|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|MJD32RLG|DPAK<br>(Pb−Free)|369C|1,800 / Tape & Reel|
|MJD32T4G|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|
|NJVMJD32T4G*|DPAK<br>(Pb−Free)|369C|2,500 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

*NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. 

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**8** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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IPAK<br>CASE 369D−01<br>ISSUE C<br>,<br>B C NOTES:<br>SCALE 1:1 1. DIMENSIONING AND TOLERANCING PER<br>V R E ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>INCHES MILLIMETERS<br>4 Z DIM MIN MAX MIN MAX<br>A 0.235 0.245 5.97 6.35<br>S i s A q leo B 0.250 0.265 6.35 6.73<br>1 2 3 C 0.086 0.094 2.19 2.38<br>D 0.027 0.035 0.69 0.88<br>E 0.018 0.023 0.46 0.58<br>−T− F 0.037 0.045 0.94 1.14<br>SEATING G 0.090 BSC 2.29 BSC<br>PLANE K H 0.034 0.040 0.87 1.01<br>J 0.018 0.023 0.46 0.58<br>K 0.350 0.380 8.89 9.65<br>R 0.180 0.215 4.45 5.45<br>J S 0.025 0.040 0.63 1.01<br>F<br>H V 0.035 0.050 0.89 1.27<br>Z 0.155 −−− 3.93 −−−<br>D 3 PL<br>aE G 0.13 (0.005) M 1 T<br>MARKING<br>DIAGRAMS<br>STYLE 1:PIN 1. BASE STYLE 2:PIN 1. GATE STYLE 3:PIN 1. ANODE STYLE 4:PIN 1. CATHODE Integrated<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. ANODE Discrete Circuits<br>3. EMITTER 3. SOURCE 3. ANODE 3. GATE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. ANODE<br>YWW xxxxx<br>STYLE 5: STYLE 6: STYLE 7: xxxxxxxx ALYWW<br>PIN 1. GATE PIN 1. MT1 PIN 1. GATE<br>2. ANODE 2. MT2 2. COLLECTOR x<br>3. CATHODE 3. GATE 3. EMITTER<br>4. ANODE 4. MT2 4. COLLECTOR<br>4 00<br>xxxxxxxxx = Device Code<br>A = Assembly Location<br>lL = Wafer Lot<br>Y =  Year<br>WW = Work Week<br>**----- End of picture text -----**<br>


DATE 15 DEC 2010 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON10528D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: IPAK (DPAK INSERTION MOUNT) PAGE 1 OF 1** ~~—~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ~~ee~~ ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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4 DPAK (SINGLE GAUGE)<br>CASE 369C<br>ISSUE F<br>1 ® [2]<br>DATE 21 JUL 2015<br>3<br>SCALE 1:1<br>NOTES:<br>A 1. DIMENSIONING AND TOLERANCING PER ASME<br>Y14.5M, 1994.<br>E C 2. CONTROLLING DIMENSION: INCHES.<br>A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-<br>b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLDMENSIONS b3, L3 and Z.<br>FLASH, PROTRUSIONS, OR BURRS. MOLD<br>FLASH, PROTRUSIONS, OR GATE BURRS SHALL<br>4 NOT EXCEED 0.006 INCHES PER SIDE.<br>L3 Ele 4| Of Z 5. DIMENSIONS D AND E ARE DETERMINED AT THE<br>D DETAIL A H OUTERMOST EXTREMES OF THE PLASTIC BODY.<br>6. DATUMS A AND B ARE DETERMINED AT DATUM<br>1 2 3 PLANE H.<br>7. OPTIONAL MOLD FEATURE.<br>L4 NOTE 7 DIM MININCHESMAX MILLIMETERSMIN MAX<br>b2 c BOTTOM VIEW A 0.086 0.094 2.18 2.38<br>e SIDE VIEW A1 0.000 0.005 0.00 0.13<br>b b 0.025 0.035 0.63 0.89<br>TOP VIEW 0.005 (0.13) M C b2b3 0.0280.180 0.0450.215 0.724.57 1.145.46<br>c 0.018 0.024 0.46 0.61<br>c2 0.018 0.024 0.46 0.61<br>H Z Z D 0.235 0.245 5.97 6.22<br>E 0.250 0.265 6.35 6.73<br>e 0.090 BSC 2.29 BSC<br>L2 [GAUGE] PLANE C SEATINGPLANE H 0.370 0.410 9.40 10.41<br>L 0.055 0.070 1.40 1.78<br>L1 0.114 REF 2.90 REF<br>L2 0.020 BSC 0.51 BSC<br>L L3 0.035 0.050 0.89 1.27<br>A1 BOTTOM VIEW L4 −−− 0.040 −−− 1.01<br>wat L1 h GF CONSTRUCTIONSALTERNATE Z 0.155 −−− 3.93 −−−<br>DETAIL A<br>ROTATED 9  CW GENERIC<br>MARKING DIAGRAM*<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. ANODE 2. ANODE<br>3. EMITTER 3. SOURCE 3. ANODE 3. GATE 3. CATHODE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. ANODE 4. ANODE XXXXXXG AYWW<br>ALYWW XXX<br>STYLE 6: STYLE 7: STYLE 8: STYLE 9: STYLE 10: XXXXXG<br>PIN 1. MT1 PIN 1. GATE PIN 1. N/C PIN 1. ANODE PIN 1. CATHODE<br>2. MT2 2. COLLECTOR 2. CATHODE 2. CATHODE 2. ANODE<br>3. GATE 3. EMITTER 3. ANODE 3. RESISTOR ADJUST 3. CATHODE a d<br>4. MT2 4. COLLECTOR 4. CATHODE 4. CATHODE 4. ANODE<br>IC Discrete<br>SOLDERING FOOTPRINT* XXXXXX = Device Code<br>A = Assembly Location<br>6.20 3.00<br>L = Wafer Lot<br>0.244 0.118<br>2.58 Y =  Year<br>0.102 WW = Work Week<br>G = Pb−Free Package<br>5.80 *This information is generic. Please refer<br>0.228 1.60 6.17 to device data sheet for actual part<br>0.063 0.243 marking.<br>Ts.<br>SCALE 3:1 mm<br>inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON10527D** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: DPAK (SINGLE GAUGE) PAGE 1 OF 1** ~~ee~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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