# Resettable Fuse, PPTC, 1210 (3225 Metric), PolySwitch microASMD Series, 30 VDC, 100 mA, 250 mA

![Product image](https://novapart.co/image/farnell:1876426RL/)

**URL**: https://novapart.co/products/MICROASMD010F-2/resettable-fuse-pptc-1210-3225-metric-polyswitch
**SKU**: MICROASMD010F-2
**Manufacturer**: LITTELFUSE
**Category**: Circuit Protection || Thermistors || Resettable Fuses || Surface Mount PPTCs
**Price**: €0.2200
**Stock**: 100+
**Lead Time**: 85 days (indicative)

## Description

Thermistor Mounting:SMD; Product Range:PolySwitch Series; Holding Current:100mA; Tripping Current:250mA; Voltage Rating:30VDC; Operating Temperature Min:-40°C; Operating Temperature Ma

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jun-2015) |
| Time To Trip | 1s |
| Trip Current | 250mA |
| Product Range | PolySwitch microASMD Series |
| Voltage Rating | 30VDC |
| Holding Current | 100mA |
| Pptc Case Style | 1210 (3225 Metric) |
| Current Rating Max | 10A |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |
| Automotive Qualification Standard | AEC-Q200 |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1876426RL/)

PTC **Datasheet** 

## **Automotive microASMD Series** Surface Mount a 

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RoHS<br>**----- End of picture text -----**<br>


## **Description** 

The microASMC is small-sized 1210 PPTC series, helping to reduce weight of wire harnesses. PPTC devices distributed in a circuit can allow the use of smaller wire sizes with the resulting harnesses. Forego looping back and forth around a fuse box and place your protection wherever you see fit. The solid state composition of PPTC devices helps provide reliability. 

## **Features & Benefits** 

## **Additional Information** 

   - Surface-mount form factor 

- Products meet applicable automotive industry standards 

   - High Performance 

   - Expertise from the world’s leading resettable overcurrent protection manufacturer 

- Compatible with high-volume electronics assembly 

- Small footprint – 1210 size 

   - Wide range of dedicated automotive surface-mount and radial-leaded resettable overcurrent devices 

- Resettable solution against overcurrent and short-circuit 

- AEC-Q200 qualified, RoHS overcurrent devices compliant, and ■ High performance transient ISO/TS16949 certified voltage protection devices 

## **Applications** 

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Resources Accessories Samples<br>**----- End of picture text -----**<br>


- Automotive and industrial transportation 

- Actuators and medium motors 

   - Powered outputs 

   - Electronic control modules 

   - Telematics/Infotainment 

- Trace protection 

- Harness/junction box protection 

## **Electrical Characteristics** 

|**Part**|**Ordering**|**IH(A)@**|**IH(A)@**|**IT**|**VMAX**|**IMAX**|**PD Typ**|**Max Time-to-trip**|**Max Time-to-trip**|**RMIN**|**R1MAX**|**RaMAX**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Number**|**Part Number**|**(R1MAX)**|**(RaMAX)**|**(A)**|**(VDC)**|**(A)**|**(W)**|**(A)**|**(s)**|**(Ω)**|**(Ω)**|**(Ω)**|
|||||**microASMD – 13.2-30V**|||||||||
|microASMD005F|RF2149-000|0.05|0.05|0.15|30|10|1.00|0.25|1.50|3.60|50.00|50.00|
|microASMD010F|RF2150-000|0.10|0.10|0.25|30|10|0.80|0.50|1.00|2.10|15.00|15.00|
|microASMD050F|RF4565-000|0.50|0.50|1.00|13.2|40|0.80|8.00|0.05|0.25|0.90|0.90|



## **Notes:** 

IH : Hold current: maximum current device will pass without interruption in 25°C, unless otherwise specified 

- IT : Trip current: minimum current that will switch the device from low-resistance to high-resistance in 25°C still air, unless otherwise specified. 

- VMAX : Maximum voltage device can withstand without damage at rated current. 

- IMAX : Maximum fault current device can withstand without damage at rated voltage. 

- PD : Power dissipated from device when in the tripped state in 25°C still air, unless otherwise specified. 

- RMIN : Minimum resistance of device as supplied at 25°C, unless otherwise specified. 

- R1MAX : Maximum resistance of device when measured one hour post reflow, unless otherwise specified. 

RaMAX : Maximum functional resistance of device after being subjected to the stresses described in PS400 at 25°C, unless otherwise specified. 

© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**1** 

PTC **Datasheet** 

## **Automotive microASMD Series** Surface Mount 

## **Temperature Rerating** 

||||**Maximum Ambient Temperature**|**Maximum Ambient Temperature**|||||
|---|---|---|---|---|---|---|---|---|
|Part Number|-40°C|-20°C|0°C<br>20°C<br>25°C|40°C|50°C|60°C|70°C|85°C|
||||**Hold Current (A)**<br>**microASMD – 13.2-30V**||||||
|microASMD005F|0.08|0.07|0.06<br>0.05<br>0.05|0.04|0.04|0.03|0.03|0.02|
|microASMD010F|0.15|0.13|0.12<br>0.10<br>0.10|0.09|0.08|0.06|0.06|0.05|
|microASMD050F|0.76|0.66|0.58<br>0.50<br>0.48|0.42|0.38|0.35|0.29|0.23|



## **Temperature Rerating Curve** 

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150 200 SEES ESESESececavetetatatsese<br>100  sae ESET<br>50<br>EEEEEEEEEEEEEEEEAEPRRREEEEEEH<br>BEE<br>0  sssrasassavevasravetseraretzers<br>-40  -20  0  20  40  60  80  100  120<br>Ambient Temperature (°C)<br>% of Rated Hold and Trip Current<br>**----- End of picture text -----**<br>


## **Typical Time-to-Trip Curves at 25°C** 

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**----- Start of picture text -----**<br>
microASMD 100<br>A  =  microASMD005F<br>B =  microASMD010F 10<br>C =  microASMD050F A B<br>C<br>1<br>0.1<br>0.01<br>C<br>A<br>B<br>0.001<br>0.1 1 10<br>Fault Current (A)<br>Time-to-Trip (s)<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**2** 

PTC **Datasheet** 

**Automotive microASMD Series** Surface Mount 

## **Physical Specifications** 

||**Physical Specifications**|
|---|---|
|**Terminal Pad Material**|100% Matte Tin with Nickel Underplate|
|**Soldering Characteristics**|Solderability per ANSI-J-STD-002 Category 3|
|**Solder Heat Withstand**|per IEC 60068-2-20, Test Tb, Section 5, Method 1a|
|**Flammability**|per IEC 60695-11-5 Needle Flame Test for 20 seconds|
|**Recommended Storage**<br>**Conditions**|40°C max, 70% RH max; Devices May Not Meet Specified Ratings if Storage Conditions are Exceeded|
|**Operation Temperature**|-40°C~85°C|



**Note:** See PS400 for other physical specifications. 

## **Environmental Specifications** 

|**Test**<br>**Conditions**|**Resistance Change**|
|---|---|
|**Passive Aging**<br>60°C, 1000 hrs<br>85°C, 1000 hrs|±3% Typical<br>±5% Typical|
|**Humidity Aging**<br>85°C, 85% R.H., 100 hrs|±1.2% Typical|
|**Thermal Shock**<br>85°C, -40°C 20 times<br>125°C, -55°C 10 times|-33% Typical<br>-33% Typical|
|**Solvent Resistance**<br>Freon<br>Trichloroethane<br>Hydrocarbons|No change<br>No change<br>No change|
|**Note:**See PS400 for other environmental specifications.||
|**Moisture Resistance Level**<br>Level 2a, J-STD-020||
|**Storage Conditions**<br>40°C max, 70% RH max; devices should remain in original sealed bags prior to use.<br>Devices may not meet specified values if these storage conditions are exceeded.||



© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**3** 

PTC **Datasheet** 

**Automotive microASMD Series** Surface Mount 

## **Dimension Figures** 

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A B<br>HW a<br>C<br>D E<br>ima e i- :<br>Figure 1<br>Dimensions<br>**----- End of picture text -----**<br>


|||||**Dimensions in Millimeters (Inches)**|**Dimensions in Millimeters (Inches)**|**Dimensions in Millimeters (Inches)**|**Dimensions in Millimeters (Inches)**|||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|**Part Number**|**A**||**B**||**C**||**D**||**E**||**Figure**|
||**Min**|**Max**|**Min**|**Max**|**Min**|**Max**|**Min**|**Max**|**Min**|**Max**||
|||||**microASMD – 13.2-30V**||||||||
|microASMD005F|3.0<br>(0.118)|3.43<br>(0.135)|0.50<br>(0.019)|0.85<br>(0.034)|2.35<br>(0.092)|2.80<br>(0.110)|0.25<br>(0.010)|0.75<br>(0.030)|0.076<br>(0.003)|—|1|
|microASMD010F|3.0<br>(0.118)|3.43<br>(0.135)|0.50<br>(0.019)|0.85<br>(0.034)|2.35<br>(0.092)|2.80<br>(0.110)|0.25<br>(0.010)|0.75<br>(0.030)|0.076<br>(0.003)|—|1|
|microASMD050F|3.0<br>(0.118)|3.43<br>(0.135)|0.38<br>(0.015)|0.62<br>(0.025)|2.35<br>(0.092)|2.80<br>(0.110)|0.25<br>(0.010)|0.75<br>(0.030)|0.076<br>(0.003)|—|1|



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Recommended Pad Layout<br>T<br>A<br>it B C B<br>**----- End of picture text -----**<br>


## **Packaging and Marking Information** 

|**Part**|**Tape and Reel**|**Standard**<br>**Part**|**Recommended Pad Layout Figures**<br>**[mm (in)]**|**Recommended Pad Layout Figures**<br>**[mm (in)]**|
|---|---|---|---|---|
|**Number**|**Quantity**|**Package**<br>**Marking**|**Dimension A**<br>**(Min*/Nom)**|**Dimension B**<br>**(Nom)**<br>**Dimension C**<br>**(Nom)**|
|||**microASMD – 13.2-30V**|||
|microASMD005F|4,000|20,000<br>05|2.50 (0.098)|1.00 (0.039)<br>2.00 (0.079)|
|microASMD010F|4,000|20,000<br>10|2.50 (0.098)|1.00 (0.039)<br>2.00 (0.079)|
|microASMD050F|4,000|20,000<br>50|2.50 (0.098)|1.00 (0.039)<br>2.00 (0.079)|



* These devices are intended for use in automotive applications. 

© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**4** 

PTC **Datasheet** 

**Automotive microASMD Series** Surface Mount 

## **Solder Reflow Recommendations** 

|**Profile Feature**<br>**Average ramp up rate (TsMAX to Tp)**<br>**Preheat**<br>•  Temperature min (TsMIN)<br>•  Temperature max (TsMAX)<br>•  Time (tsMINto tsMAX)<br>**Time maintained above:**<br>•  Temperature (TL)|Pb-Free Assembly<br>3°C/s max<br>150°C<br>200°C<br>60-120 s<br>217°C||**Temperature**<br>I——|**Temperature**<br>I——|TL<br>Tp<br>——|Ramp Up<br>ts<br>Preheat<br>TsMAX<br>TsMIN<br>——|Ramp Up<br>ts<br>Preheat<br>TsMAX<br>TsMIN<br>——|Ramp Up<br>ts<br>Preheat<br>TsMAX<br>TsMIN<br>——|Ramp Up<br>ts<br>Preheat<br>TsMAX<br>TsMIN<br>——|Ramp Up<br>ts<br>Preheat<br>TsMAX<br>TsMIN<br>——|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|Critical Zone<br>TLto Tp<br>Ramp Down<br>tp<br>tL<br> ~~Ae~~|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|•  Time (tL)|60-150 s||||25|||t 25˚C to Peak||||||||||
|**Peak/Classification temperature (Tp)**|260°C|||Reflow Profile|||||**Time**|||||||||
|**Time within 5°C of actual peak temperature**||||||||||||||||||
|Time (tp)|30 s max|||||||||||||||||
|**Ramp down rate**|3°C/s max|||||||||||||||||
|**Time 25°C to peak temperature**|8 min max|||||||||||||||||



**Note:** All temperatures refer to topside of the package, measured on the package body surface. 

## **Solder Reflow** 

- Recommended reflow method: IR, hot air, nitrogen. 

- Recommended maximum paste thickness: 0.25mm (0.010in) 

- Devices can be cleaned using standard methods and aqueous solvents. 

- Experience has shown the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device’s termination.  As such, we request that customers comply with our recommended solder pad layouts. 

- Customer should validate that the solder paste amount and reflow recommendations meet its application. 

- We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. 

## **Rework** 

- Standard industry practices. (Please also avoid direct contact to the device.) 

## **Part Ordering Number System** 

## **microASMD   005   F    -2** 

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**----- Start of picture text -----**<br>
Packaging<br>2 = Tape and Reel<br>Lead Free<br>Hold Current Indicator<br>Product Series<br>**----- End of picture text -----**<br>


© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**5** 

PTC **Datasheet** 

**Automotive microASMD Series** Surface Mount 

## **Tape and Reel Specifications** 

|**Description**<br>**W**|**microASMD**<br>**EIA 481-1**|
|---|---|
||**microASMD005F**<br>**microASMD010F**<br>**microASMD050F**<br>8.0 ± 0.30|
|**P0**|4.0 ± 0.10|
|**P1**|4.0 ± 0.10|
|**P2**|2.0 ± 0.05|
|**A0**|2.9 ± 0.10|
|**B0**|3.50 ± 0.10|
|**B1 max**|4.35|
|**D0**|1.55 ± .05|
|**F**|3.50 ± 0.05|
|**E1**|1.75 ± 0.10|
|**E2 min**|6.25|
|**T max**|0.3|
|**T1 max**|0.1|
|**K0**|0.9 ± 0.1|
|**A max**|185|
|**N min**|50|
|**W1**|8.4 + 1.5/-.00|
|**W2 max**|14.4|



© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/26/21 

**6** 

PTC **Datasheet** 

## **Automotive microASMD Series** Surface Mount 

## **Tape and Reel Diagrams** 

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**----- Start of picture text -----**<br>
Embossment<br>P 0<br>= e T + D0 ok = a P 2<br>E1<br>Cover Tape<br>A 0 F<br>W<br>: O OO )<br>E2<br>B1 K0 B0<br>{ et T1 P 1<br>Center Lines<br>of Cavity<br>**----- End of picture text -----**<br>


**Figure 1** 

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**----- Start of picture text -----**<br>
W2 (Measured at Hub)<br>A N (Hub Dia.)<br>Cover Tape<br>Carrier Tape W1 (Measured at Hub)<br>Embossed Cavity<br>**----- End of picture text -----**<br>


**Figure 2** 

## **Warning** 

- Users should independently evaluate the suitability of and test each product selected for their own application. 

- Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. 

- These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. 

- Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices. 

- Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. 

- PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion. 

- Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device. 

**Disclaimer Notice** - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 

© 2021 Littelfuse, Inc. **7** Specifications are subject to change without notice. Pdlitefuse ~~=~~ Revised: GD. 05/26/21 



## Links

- [View this product on Novapart](https://novapart.co/products/MICROASMD010F-2/resettable-fuse-pptc-1210-3225-metric-polyswitch)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/littelfuse/microasmd010f-2/fuse-ptc-reset-30vdc-100ma-smd/dp/1876426RL)
---

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