# Graphic OLED, 96 x 32 Pixels, Yellow on Black, 3V, I2C, Parallel, SPI, 19.8mm x 12.32mm, -40 °C

![Product image](https://novapart.co/image/farnell:3407290/)

**URL**: https://novapart.co/products/MDOT096032AV-YM/graphic-oled-96-x-32-pixels-yellow-on-black-3v-i2c
**SKU**: MDOT096032AV-YM
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || OLED Displays || Graphic OLED Displays
**Price**: €6.0200
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Resolution | 96 x 32 Pixels |
| Module Size | 19.8mm x 12.32mm |
| Logic Voltage | 3V |
| Product Range | - |
| Interface Type | I2C, Parallel, SPI |
| Display Appearance | Yellow on Black |
| Display Construction | COT |
| Operating Temperature Max | 80°C |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3407290/)

**Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG** 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

|MDOT096032AV-YM|MDOT096032AV-YM|96 x 32|96 x 32|OLED Module|
|---|---|---|---|---|
|**Specification**|||||
|Version:    1|||Date:02/01/2020||
|**Revision**|||||
|1|24/12/2019||First Issue||



|DisplayFeatures|DisplayFeatures|||
|---|---|---|---|
|Resolution|96 x 32|||
|Appearance|Yellow on Black|||
|Logic Voltage|3V|||
|Interface|Multi|||
|Module Size|19.80 x 12.32 x 1.21mm|||
|OperatingTemperature|-40°C ~ +80°C|BoxQuantity|Weight / Display|
|Construction|COT|---|---|



* - For full design functionality, please use this specification in conjunction with the SSD1305 specification. (Provided Separately) 

|**Display Accessories**|**Display Accessories**|
|---|---|
|**Part Number**|**Description**|



|**Optional Variants**||
|---|---|
|**Appearance**|**Voltage**|
|White on Black||



Page 1 of 20 

## **General Specification** 

The Features is described as follow: 

- Module dimension: 19.80 x 12.32 x 1.21 mm 

- Active area: 16.298 x 5.418 mm 

- Dot Matrix: 96 x 32 

- Dot size: 0.148 x 0.148 mm 

- Dot pitch: 0.17 x 0.17 mm 

- Display Mode: Passive Matrix 

- Duty: 1/32 Duty 

- Display Color: OLED , Yellow 

- Controller IC: SSD1305 

- Interface: 6800,8080,SPI,I2C 

- Size: 0.68 inch 

Page 2 of 20 

## **Interface Pin Function** 

||**Pin**<br>~~ee~~|**Pin**<br>~~ee~~|**Symbol**<br>~~ee~~|**Symbol**<br>~~ee~~|**I/O**<br>~~ee~~|**I/O**<br>~~ee~~|**Function**<br>~~ee~~|**Function**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|
||1<br>~~ee~~<br>~~cc~~||VSS<br>~~ee ~~<br>~~cc~~||-<br> ~~ee~~<br>~~cc~~||Reserved Pin(Supporting Pin)<br>The supporting pins can reduce the influences from stresses on<br>the function pins. These pins must be connected to external<br>ground.<br>~~ee~~<br>~~cc~~||
||2<br>~~cc~~||GDR<br>~~cc~~||-<br>~~cc~~||Reserved pin, not connected.<br>~~cc~~||
||3<br>~~cc~~<br>~~a~~||VDDB<br>~~cc~~<br>~~ee~~||P<br>~~cc~~<br>~~ee~~||Reserved pin, not connected.<br>~~cc~~<br>~~ee~~||
||4<br>~~+--+~~||FB<br>~~+--+~~||-<br>~~+--+~~||Reserved pin, not connected.<br>~~+--+~~||
||5<br>~~+--+~~<br>~~$$~~||NC<br>~~+--+~~<br>~~$$PAS~~||-<br>~~+--+~~<br>~~PAS~~||Not connected.<br>~~+--+~~<br>~~PASAo_e—~~||
||6<br>~~+--+~~<br>~~$$~~||VBREF<br>~~+--+~~<br>~~$$PAS~~||-<br>~~+--+~~<br>~~PAS~~||Reserved pin, not connected.<br>~~+--+~~<br>~~PASAo_e—~~||
||7<br>~~$$~~||NC<br>~~$$PAS~~||-<br>~~PAS~~||Not connected.<br>~~PASAo_e—~~||
||8<br>~~$$~~<br>~~Se~~||NC<br>~~$$ PAS~~<br>~~Se~~||-<br>~~PAS~~<br>~~Se~~||Not connected.<br>~~PAS Ao_e—~~<br>~~Se~~||
||9<br>~~Se~~||VDD<br>~~Se~~||P<br>~~Se~~||Power supply pin for core logic operation.<br>~~Se~~||
||10<br>~~**e**~~||BS1<br>~~**e**~~<br>~~e~~||I<br>~~**e**~~<br>~~e~~||MCU bus interface selection pins. Select appropriate logic setting<br>as described in the following table. BS2, and BS1 are pin select.<br>4-line SPI<br>I2C<br>8-bits 8080<br>8-bits 6800<br>BS1<br>0<br>1<br>1<br>0<br>BS2<br>0<br>0<br>1<br>1<br>~~**e**es~~||
||11<br>~~**e**~~||BS2<br>~~**e**~~<br>~~e~~||I<br>~~**e**~~<br>~~e~~||||
||12<br>~~**e**~~<br>~~a~~||NC<br>~~**e**~~<br>~~e~~<br>~~a~~||-<br>~~**e**~~<br>~~e~~<br>~~ee~~||Not connected.<br>~~**e**es~~<br>~~ee~~||
||13<br>~~a ~~<br>~~a~~||CS#<br> ~~a~~<br>~~a~~||I<br>~~ee~~<br>||This pin is the chip select input connecting to the MCU.<br>The chip is enabled for MCU communication only when CS# is<br>pulled LOW (active LOW).<br>~~ee~~<br>||
||14<br>~~aTh~~||RES#<br>~~aTh~~||I<br>~~Th~~||This pin is reset signal input. When the pin is pulled LOW,<br>initialization of the chip is executed. Keep this pin HIGH (i.e.<br>connect to VDD) during normal operation.<br>~~Th~~||
||15<br>~~Th~~||D/C#<br>~~Th~~||I<br>~~Th~~||This pin is Data/Command control pin connecting to the MCU.<br>When the pin is pulled HIGH, the data at D[7:0] will be interpreted<br>as data.<br>When the pin is pulled LOW, the data at D[7:0] will be transferred<br>to a command register.<br>In I2C mode, this pin acts as SA0 for slave address selection.<br>~~Th~~||
|16<br>~~a~~||WR#<br>~~a~~||I||This is read / write control input pin connecting to the MCU<br>interface.<br>When interfacing to a 6800-series microprocessor, this pin will be|||



Page 3 of 20 

||||used as Read/Write (R/W#) selection input. Read mode will be<br>carried out when this pin is pulled HIGH (i.e. connect to VDD) and<br>write mode when LOW.<br>When 8080 interface mode is selected, this pin will be the Write<br>(WR#) input. Data write operation is initiated when this pin is pulled<br>LOW and the chip is selected.<br>When serial or I2C interface is selected, this pin must be<br>connected to VSS.|
|---|---|---|---|
|17|E/RD#|I|This pin is MCU interface input.<br>When 6800 interface mode is selected, this pin will be used as the<br>Enable (E) signal. Read/write operation is initiated when this pin is<br>pulled HIGH and the chip is selected.<br>When 8080 interface mode is selected, this pin receives the Read<br>(RD#) signal. Read operation is initiated when this pin is pulled<br>LOW and the chip is selected.<br>When serial or I2C interface is selected, this pin must be<br>connected to VSS.|
|18~25|D0~D7|-|These are 8-bit bi-directional data bus to be connected to the<br>microprocessor’s data bus. When serial interface mode is<br>selected, D0 will be the serial clock input: SCLK; D1 will be the<br>serial data input: SDIN.<br>When I2C mode is selected, D2, D1 should be tied together and<br>serve as SDAout, SDAin in application and D0 is the serial clock<br>input, SCL.|
|26|IREF|-|This is segment output current reference pin.<br>When external IREF is used, a resistor should be connected<br>between this pin and VSS to maintain the IREF current at 10uA.|
|27|VCOMH|-|COM signal deselected voltage level.<br>Acapacitorshould be connected betweenthis pinandVSS.|
|28|VCC|-|Power supply for panel driving voltage. This is also the most<br>positive power voltage supply pin.<br>When charge pump is enabled, a capacitor should be connected<br>between this pin and VSS.|



Page 4 of 20 

**==> picture [377 x 663] intentionally omitted <==**

**----- Start of picture text -----**<br>
29¡ Ó0.5 12.32¡ Ó0.2<br>8.62¡ Ó0.2 Cover<br>7.62¡ Ó0.2 Polarizer 0.5¡ Ó0.5<br>6.418 VA 1.1<br>5.418 AA 1.6<br>5 4<br>3<br>| rey<br>i aa<br>ry ! 1<br>f<br>|i<br>|<br>| , :<br>1 s<br>rt | vy |<br>Boscrsasns s Voy y oy<br>N<br>' -, ie Sa yt !<br>A ~ peo<br>2.0 Max.<br>Non-bending area<br>0.17<br>0.148<br>|<br>yy<br>io<br>|<br>2-  0.8<br>1.751 1.251 0.5¡ Ó0.5<br>2.65<br>0.5<br>1.5<br>1<br>¡14.5 ¡13.5 11.5 10 986.21 917.2 ¡18.8 ¡9.81<br> Ó0.1  Ó0.05 (0.68")  AA 8 VA  Ó0.2<br>96x32 dots<br> Ó0.2 Polarizer<br>   28<br>0.35<br>Pull tape<br>Shading tap<br>e<br>Contact side<br>¡0.3 0.5 0.5 ¡1.21<br> Ó0.03 Stiffener  Ó0.2<br>(Row 2) COM 32 (Row 32) COM 47<br>SEG 113<br>(Column 96)<br>  Detail A<br>SCALE 1:10<br>0.148 0.17<br>14 13 12 11 10 9 8 7 6 5 4 3 2 1<br>PIN NO.<br>RES# CS# NC BS2 BS1 VDD NC NC VBREF NC FB VDDB GDR VSS SYMBOL<br>SEG 18 28 27 26 25 24 23 22 21 20 19 18 17 16 15<br>(Column 1)<br>PIN NO.<br>The non-specified tolerance of dimension is ¡ Ó0.3 mm .<br>(Row 1) COM 0 (Row 31) COM 15 VCC IREF D7 D6 D5 D4 D3 D2 D1 D0 E/RD# WR# D/C# SYMBOL<br>VCOMH<br>**----- End of picture text -----**<br>


Page 5 of 20 

## **Application recommendations** 

Recommended components: 

C1, C2 ： 2.2uF/25V/0603 C3 ： 1.0uF/16V/0603 

Bus Interface selection: (Must be set the BS[2:1], refer to item 3) 

8-bits 6800 and 8080 parallel, 4-wire SPI, I2C 

Voltage at IREF ≈ VCC – 3V. For VCC = 12V, IREF = 10uA: 

R1 = (Voltage at IREF - VSS) / IREF 

≈ (12 - 3)V / 10uA ≈ 900K Ω 

Page 6 of 20 

## **Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Notes**|
|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|-0.3|4|V|1, 2|
|Supply Voltage for Display|VCC|0|16|V|1, 2|
|Operating Temperature|TOP|-40|+80|°C|-|
|Storage Temperature|TSTG|-40|+85|°C|-|



Note 1: All the above voltages are on the basis of “VSS = 0V”. Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate 

## **Electrical Characteristics** 

## **DC Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|－|2.8|3.0|3.3|V|
|Supply Voltage for Display|VCC|－|11.5|12|12.5|V|
|High Level Input|VIH|－|0.8×VDD|－|VDD|V|
|Low Level Input|VIL|－|0|－|0.2×VDD|0.2×VDD<br>V|
|High Level Output|VOH|Iout = 100uA|0.9×VDD|－|VDD|V|
|Low Level Output|VOL|Iout = 100uA|0|－|0.1×VDD|0.1×VDD<br>V|



Page 7 of 20 

## **Initial code** 

void Initial_SSD1305(){ 

Write_command(0xAE);  // Display Off 

Write_command(0xAD);  // Master Configuration Write_command(0x8E);  // Select external VCC supply Write_command(0xA8); // Select Multiplex Ratio Write_command(0x1F); // Default => 0x3F (1/64 Duty) 0x1F(1/32 Duty) Write_command(0xD3); //Setting Display Offset Write_command(0x00);  //00H Reset 

Write_command(0x20); //Set Memory Addressing Mode Default => 0x02 Write_command(0x02);  // Page Addressing Mode 

Write_command(0x02); //Set Column Address LSB Write_command(0x11); //Set Column Address MSB Write_command(0x40); //Set Display Start Line Write_command(0xA6); //Set Normal Display Write_command(0xDB); //Set Deselect Vcomh level Write_command(0x3C); //~0.83xVCC Write_command(0xA4); //Entire Display ON Write_command(0x81); //Set Contrast Control Write_command(0x6F) 

Write_command(0xD5); //SET DISPLAY CLOCK Write_command(0x71);  //105HZ Write_command(0xD8);  //Select Area color ON/OFF Write_command(0x00);   //MONO Mode Write_command(0xA1);  //Set Segment Re-Map Default => 0xA0 Write_command(0xC8);  //Set COM Output Scan Direction Default => 0xC0 Write_command(0xDA);  //Set COM Hardware Configuration Write_command(0x12);   //Alternative COM Pin Write_command(0xD9); //Set Pre-Charge period Write_command(0x22); //Refer to SPEC 34PAGE Write_command(0xAF); // Display ON 

} 

Page 8 of 20 

## **Optical Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|View Angle|(V)θ|－|160|－|－|deg|
||(H)φ|－|160|－|－|deg|
|Contrast Ratio|CR|Dark|2000:1|－|－|－|
|Response Time|T rise|－|－|10|－|μs|
||T fall|－|－|10|－|μs|
|Display with 100% check Board Brightness|||100|120|－|cd/m2|
|CIEx(Yellow)||(CIE1931)|0.45|0.47|0.49|－|
|CIEy(Yellow)||(CIE1931)|0.48|0.50|0.52|－|



## **OLED Lifetime** 

|**ITEM**|**Conditions**|**Min**|**Typ**|**Remark**|
|---|---|---|---|---|
|Operating<br>Life Time|Ta=25°C<br>/ Initial 50% check board<br>brightness Typical Value|50,000 Hrs|-|Note|



Notes: 

1. Life time is defined the amount of time when the luminance has decayed to <50% of the initial value. 

2. This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function ( _pdf_ ) for the product under normal use conditions. 

3. Screen saving mode will extend OLED lifetime. 

Page 9 of 20 

## **Reliability** 

## **Content of Reliability Test** 

|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|
|---|---|---|---|---|
|**Environmental Test**|||||
|**Test Item**|**Content of Test**|**Test Condition**|**Applicable**<br>**Standard**||
|High<br>Temperature<br>storage|Endurance test applying the high<br>storage temperature for a long time.|85°C<br>240hrs|——||
|Low<br>Temperature<br>storage|Endurance test applying the low storage<br>temperature for a long time.|Endurance test applying the low storage<br>-40°C<br>240hrs|——||
|High<br>Temperature<br>Operation|Endurance test applying the electric<br>stress (Voltage & Current) and the<br>thermal stress to the element for a long<br>time.|80°C<br>240hrs|——||
|Low<br>Temperature<br>Operation|Endurance test applying the electric<br>stress under low temperature for a long<br>time.|-40°C<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Storage|Endurance test applying the high<br>temperature and high humidity storage<br>for a long time.|60°C,90%RH<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Operation|Endurance test applying the high<br>temperature and high humidity<br>Operation for a long time.|60°C,90%RH<br>120hrs|——||
|Temperature<br>Cycle|Endurance test applying the low and<br>high temperature cycle.<br>-40°C    25°C 80°C<br>30min    5min     30min<br>1cycle|-40°C /80°C<br>30 cycles|——||
|Mechanical Test|||||
|Vibration test|Endurance test applying the vibration<br>during transportation and using.|Frequency:10~55Hz<br>amplitude:1.5mm<br>Time:0.5hrs/axis<br>Test axis:X,Y,Z|——||
|Others|||||
|Static<br>electricity test|Endurance test applying the electric<br>stress to the finished product housing.|Air Discharge model<br>±4kv,10 times||——|



*** Supply voltage for OLED system =Operating voltage at 25°C 

Page 10 of 20 

## **Test and measurement conditions** 

1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 

2. All-pixels on/off exchange is used as operation test pattern. 

3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/ Humidity Storage, Temperature Cycle 

## **Evaluation criteria** 

1. The function test is OK. 

2. No observable defects. 

3. Luminance: > 50% of initial value. 

4. Current consumption: within ± 50% of initial value. 

## **APPENDIX:** 

## **RESIDUE IMAGE** 

Because the pixels are lighted in different time, the luminance of active pixels may reduce or differ from inactive pixels. Therefore, the residue image will occur. To avoid the residue image, every pixel needs to be lighted up uniformly. 

Page 11 of 20 

## **Inspection specification Inspection Standard:** 

MIL-STD-105E table normal inspection single sample level II. 

## **Definition** 

1 Major defect : The defect that greatly affect the usability of product. 

2 Minor defect : The other defects, such as cosmetic defects, etc. Definition of inspection zone: 

C B A 

Zone A: Active Area 

Zone B: Viewing Area except Zone A 

Zone C: Outside Viewing Area 

Note: As a general rule, visual defects in Zone C are permissible, when it is no trouble of quality and assembly to customer`s product. 

## **Inspection Methods** 

1 The general inspection : Under fluorescent light illumination: 750~1500 Lux, about 30cm viewing distance, within 45º viewing angle, under 25±5°C. 

2 The luminance and color coordinate inspection : By SR-3 or BM-7 or the equal equipments, in the dark room, under 25±5°C. 

**==> picture [480 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|NO|Item|Criterion|AQL|
|1.1 Missing vertical, horizontal segment, segment contrast defect.|
|1.2 Missing character , dot or icon.|
|1.3 Display malfunction.|
|Electrical|1.4 No function or no display.|
|01|0.65|
|Testing|1.5 Current consumption exceeds product specifications.|
|1.6 OLED viewing angle defect.|
|1.7 Mixed product types.|
|1.8 Contrast defect.|
|Black or|
|white|
|2.1 White and black spots on display|≦|0.25mm, no more than|
|spots on|
|02|three white or black spots present.|2.5|
|OLED|
|2.2 Densely spaced: No more than two spots or lines within 3mm.|
|(display|
|only)|

**----- End of picture text -----**<br>


Page 12 of 20 

|NO<br>~~a~~|Item<br>~~aaa!~~|Criterion<br>~~aa!~~|AQL<br>~~aa!~~|
|---|---|---|---|
|03<br>~~a~~|OLED<br>black<br>spots,<br>white<br>spots,<br>contamin<br>ation<br>(non-display)<br>~~aaa!~~<br>~~Ripa~~|3.1 Round type :<br>As following<br>drawing<br>Φ=( x + y ) / 2<br>SIZE<br>Acceptable QTY<br>Zone<br>Φ≦0.10<br>ignore<br>A+ B,<br>0.10＜Φ≦0.20<br>2<br>A+ B<br>0.20＜Φ≦0.25<br>1<br>A+ B<br>0.25＜Φ<br>0<br>A+ B<br>~~aa!~~<br>;<br>~~Ripa~~|2.5<br>~~aa!~~<br>~~|~~|
||~~aa!~~<br>~~Ripa~~|3.2 Line type : (As following drawing)<br>Length<br>Width<br>Acceptable<br>Q TY<br>Zone<br>---<br>W≦0.02<br>ignore<br>A+B<br>L≦3.0<br>0.02＜W≦0.03<br>2<br>A+B<br>L≦2.5<br>0.03＜W≦0.05<br>A+B<br>---<br>0.05＜W<br>As round type<br>~~aa!~~<br>~~Ripa~~|2.5<br>~~aa!~~<br>~~|~~|
|04|Polarizer<br>bubbles<br>~~Ripa~~|If bubbles are<br>visible, judge<br>using black spot<br>specifications,<br>not easy to find,<br>must check in<br>specify direction.<br>Size Φ<br>Acceptable Q TY<br>Zone<br>Φ≦0.20<br>ignore<br>A+B<br>0.20＜Φ≦0.50<br>3<br>A+B<br>0.50＜Φ≦1.00<br>2<br>A+B<br>1.00＜Φ<br>0<br>A+B<br>Total Q TY<br>3<br>~~Ripa ~~|2.5<br> ~~|~~|
|05<br>~~i~~|Scratches<br>~~i ee~~|Follow NO.3 OLED black spots, white spots, contamination.<br>~~ee~~|~~ee~~|



Page 13 of 20 

|NO|Item|Criterion|AQL|
|---|---|---|---|
|06|Chipped<br>glass<br>~~samara~~|Symbols Define:<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length:<br>6.1 General glass chip :<br>6.1.1 Chip on panel surface and crack between panels:<br>z: Chip thickness<br>y: Chip width<br>x: Chip length<br>Z≦1/2t<br>Not over viewingarea<br>x≦1/8a<br>1/2t＜z≦2t<br>Not exceed 1/3k<br>x≦1/8a<br>☉If there are 2 or more chips, x is total length of each chip.<br>|<br>x<br>.yky<br>eA).<br>5<br>~~samara~~|2.5<br>~~samara~~|
|||6.1.2 Corner crack:<br>z: Chip thickness<br>y: Chip width<br>x: Chip length<br>Z≦1/2t<br>Not over viewingarea<br>x≦1/8a<br>1/2t＜z≦2t<br>Not exceed 1/3k<br>x≦1/8a<br>☉If there are 2 or more chips, x is the total length of each chip.<br>~~samara~~|2.5<br>~~samara~~|
||Glass<br>crack<br>~~samara~~<br>~~a~~|Symbols :<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length<br>6.2 Protrusion over terminal :<br>6.2.1 Chip on electrode pad :<br>y: Chip width<br>x: Chip length<br>z: Chip thickness<br>y≦0.5mm<br>x≦1/8a<br>0＜z≦t<br>~~samara~~<br>~~a~~|2.5<br>~~samara~~<br>~~a~~|



|NO|Item|Criterion|AQL|
|---|---|---|---|
|06|Glass<br>crack|6.2.2 Non-conductive portion:<br>y: Chip width<br>x: Chip length<br>z: Chip thickness<br>y≦L<br>x≦1/8a<br>0＜z≦t<br>☉If the chipped area touches the ITO terminal, over 2/3 of the ITO<br>must remain and be inspected according to electrode terminal<br>specifications.<br>☉If the product will be heat sealed by the customer, the alignment<br>mark not be damaged.<br>6.2.3 Substrate protuberanc~~e and internal crack.~~<br>y: width<br>x: length<br>y≦1/3L<br>x≦a<br>L<br>L<br>KS*<br>;<br>ae<br>X<br>E<br>~~-F\~~<br>~~— —_~~|2.5|
|07|Cracked<br>glass|The OLED with extensive crack is not acceptable.|2.5|
|08|Backlight<br>elements|8.1 Illumination source flickers when lit.<br>8.2 Spots or scratched that appear when lit must be judged. Using<br>OLED spot, lines and contamination standards.<br>8.3 Backlight doesn’t light or color wrong.|0.65<br>2.5<br>0.65|
|09|Bezel|9.1 Bezel may not have rust, be deformed or have fingerprints,<br>stains or other contamination.<br>9.2 Bezel must comply with job specifications.|2.5<br>0.65|



Page 15 of 20 

|NO|Item|Criterion|AQL|
|---|---|---|---|
|10|PCB , COB|10.1 COB seal may not have pinholes larger than 0.2mm or<br>contamination.<br>10.2 COB seal surface may not have pinholes through to the IC.<br>10.3 The height of the COB should not exceed the height<br>indicated in the assembly diagram.<br>10.4 There may not be more than 2mm of sealant outside the<br>seal area on the PCB. And there should be no more than<br>three places.<br>10.5 No oxidation or contamination PCB terminals.<br>10.6 Parts on PCB must be the same as on the production<br>characteristic chart. There should be no wrong parts,<br>missing parts or excess parts.<br>10.7 The jumper on the PCB should conform to the product<br>characteristic chart.<br>10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or<br>screw hold pad, make sure it is smoothed down.|2.5<br>2.5<br>0.65<br>2.5<br>2.5<br>0.65<br>0.65<br>2.5|
|11|Soldering|11.1 No un-melted solder paste may be present on the PCB.<br>11.2 No cold solder joints, missing solder connections, oxidation<br>or icicle.<br>11.3 No residue or solder balls on PCB.<br>11.4 No short circuits in components on PCB.|2.5<br>2.5<br>2.5<br>0.65|
|12|General<br>appearance|12.1 No oxidation, contamination, curves or, bends on interface<br>Pin (OLB) of TCP.<br>12.2 No cracks on interface pin (OLB) of TCP.<br>12.3 No contamination, solder residue or solder balls on<br>product.<br>12.4 The IC on the TCP may not be damaged, circuits.<br>12.5 The uppermost edge of the protective strip on the interface<br>pin must be present or look as if it cause the interface pin to<br>sever.<br>12.6 The residual rosin or tin oil of soldering (component or chip<br>component) is not burned into brown or black color.<br>12.7 Sealant on top of the ITO circuit has not hardened.<br>12.8 Pin type must match type in specification sheet.<br>12.9 OLED pin loose or missing pins.<br>12.10 Product packaging must the same as specified on<br>packaging specification sheet.<br>12.11 Product dimension and structure must conform to product<br>specification sheet.|2.5<br>0.65<br>2.5<br>2.5<br>2.5<br>2.5<br>2.5<br>0.65<br>0.65<br>0.65<br>0.65|



Page 16 of 20 

|**Check Item**|**Classification**|**Criteria**|
|---|---|---|
|No Display|Major||
|Missing Line|Major|'<br>\<br>|[<br>|<br>j|
|Pixel Short|Major|SGGG88 SGReeeen<br>\eleneeatenaea<br>yes) |<br>||
|Darker Short|Major|:|
|Wrong Display|Major|.<br>:<br>}|
|Un-uniform<br>B/A x 100% < 70%<br>A/C x 100% < 70%|Major|BE<br>me<br>Be<br>A|_ |Normal<br>|| |<br>B<br>Dark Pixel<br>ee)|<br>sc EBSLight Pixel<br>ne<br>Ee|



Page 17 of 20 

## **Precautions in use of OLED Modules** 

## Modules 

- (1) Avoid applying excessive shocks to module or making any alterations or modifications to it. 

- (2) Don’t make extra holes on the printed circuit board, change the components or modify its shape of OLED display module. 

- (3) Don’t disassemble the OLED display module. 

- (4) Do not apply input signals while the logic power is off. 

- (5) Don’t operate it above the absolute maximum rating. 

- (6) Don’t drop, bend or twist OLED display module. 

- (7) Soldering: only to the I/O terminals. 

- (8) Hot-Bar FPC soldering condition: 280~350C, less than 5 seconds. 

- (9) Midas has the right to change the passive components (Resistors, capacitors and other passive components will have different appearance and color caused by the different supplier.) and change the PCB Rev. (In order to satisfy the supplying stability, management optimization and the best product performance...etc, under the premise of not affecting the electrical characteristics and external dimensions, Midas have the right to modify the version.) 

- (10) Midas has the right to upgrade or modify the product function. 

## **1. Handling Precautions** 

- (1) Since the display panel is being made of glass, do not apply mechanical impacts such as dropping from a high position. 

- (2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 

- (3) If pressure is applied to the display surface or its neighborhood of the OLED display module, the cell structure may be damaged. So, be careful not to apply pressure to these sections. 

- (4) The polarizer covering the surface of the OLED display module is soft and easily scratched. (5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It takes advantage by using following adhesion tape. 

   - Scotch Mending Tape No. 810 or an equivalent 

   - Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water 

   - Ketone 

   - Aromatic Solvents 

- (6) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OLED display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5. 

- (7) Do not touch the following sections whenever possible while handling the OLED display modules. 

   - Pins and electrodes 

   - Pattern layouts such as the TCP & FPC 

- (8) Hold OLED display module very carefully when placing OLED display module into the System housing. Do not apply excessive stress or pressure to OLED display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the 

Page 18 of 20 

display performance. Also, secure sufficient rigidity for the outer cases. 

- (9) Do not apply stress to the LSI chips and the surrounding molded sections. 

- (10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. 

   - Be sure to make human body grounding when handling OLED display modules. 

   - Be sure to ground tools to use or assembly such as soldering irons. 

   - To suppress generation of static electricity, avoid carrying out assembly work under dry 

   - environments. 

   - Protective film is being applied to the surface of the display panel of the OLED display 

   - module. Be careful since static electricity may be generated when exfoliating the protective film. 

## **2. Storage Precautions** 

- (1) When storing OLED display modules, put them in static electricity preventive bags to avoid be directly exposed to sun or lights of fluorescent lamps. (We recommend you to store these modules in the packaged state when they were shipped from Midas Displays. At that time, be careful not to let water drops adhere to the packages or bags.) 

- (2) When the OLED display module is being dewed or when it is placed under high temperature or high humidity environments, the electrodes may be corroded if electric current is applied. Please store it in clean environment. 

## **3. Designing Precautions** 

- (1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display module, and if these values are exceeded, OLED display module may be damaged. 

- (2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specification and to make the signal line cable as short as possible. 

- (3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD / VCC). (Recommend value: 0.5A) 

- (4) Pay sufficient attention to avoid occurrence of mutual noise interference with the nearby devices. 

- (5) As for EMI, take necessary measures on the equipment side basically. 

- (6) If the power supplied to the OLED display module is forcibly shut down by such errors as taking out the main battery while the OLED display panel is in operation, we cannot guarantee the quality of this OLED display module. 

   - Connection (contact) to any other potential than the above may lead to rupture of the IC. 

- (7) If this OLED driver is exposed to light, malfunctioning may occur and semiconductor elements may change their characteristics. 

- (8) The internal status may be changed, if excessive external noise enters into the module. Therefore, it is necessary to take appropriate measures to suppress noise generation or to protect module from influences of noise on the system design. 

Page 19 of 20 

- (9) We recommend you to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 

- (10) It's pretty common to use "Screen Saver" to extend the lifetime and Don't use the same image for long time in real application. When an OLED display module is operated for a long of time with fixed pattern, an afterimage or slight contrast deviation may occur. 

- (11) The limitation of FPC and Film bending. 

- (12) The module should be fixed balanced into the housing, or the module may be twisted. 

**==> picture [254 x 50] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.1<br>(0.1 Max.)<br>**----- End of picture text -----**<br>


- (13) Please heat up a little the tape sticking on the components when removing it; otherwise the components might be damaged. 

## **4. Precautions when disposing of the OLED display modules** 

- (1) Request the qualified companies to handle industrial wastes when disposing of the OLED display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 

Page 20 of 20 



## Links

- [View this product on Novapart](https://novapart.co/products/MDOT096032AV-YM/graphic-oled-96-x-32-pixels-yellow-on-black-3v-i2c)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/midas/mdot096032av-ym/oled-display-cot-96-x-32-pixel/dp/3407290)
---

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