# Graphic OLED, 64 x 128 Pixels, White, 3.3V, I2C, SPI, 17.1mm x 35.8mm, -40 °C

![Product image](https://novapart.co/image/farnell:4685264/)

**URL**: https://novapart.co/products/MDOG064128D1Y-WM/graphic-oled-64-x-128-pixels-white-33v-i2c-spi
**SKU**: MDOG064128D1Y-WM
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || OLED Displays || Graphic OLED Displays
**Price**: €7.8700
**Stock**: 10+
**Lead Time**: 106 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Resolution | 64 x 128 Pixels |
| Module Size | 17.1mm x 35.8mm |
| Logic Voltage | 3.3V |
| Product Range | - |
| Interface Type | I2C, SPI |
| Display Appearance | White |
| Display Construction | COG |
| Operating Temperature Max | 80°C |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4685264/)

Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

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||||
|---|---|---|
|MDOG064128D1Y-WM|64 × 128|OLED Module|
|Specification|
|Version:    1|Date:  08/09/2024|
|Revision|
|1|06/09/2024|First Issue|

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~~Oo~~ Display Features ~~a~~ Resolution 64 × 128 ~~a~~ Appearance White RoHS ~~a~~ Supply Voltage 3.3V ~~gompliant eer~~ Interface SPI, I2C y y Module Size 17.1 × 35.80 × 1.41mm CL WE ~~es~~ Operating Temperature -40°C ~ +80°C Box Quantity ~~thee~~ Weight / Display ~~es~~ Construction ~~7 2 eee 2~~ COG ----- ~~a ee 7 eee SD Oe~~ 

## * - For full design functionality, please use this 

specification in conjunction with the SH1107 display driver specification. (Provided Separately) 

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|||
|---|---|
|Display Accessories|
|Part Number|Description|
|Interconnect board for standard pitch|
|pinouts to fine pitch wires. Providing pinouts|
|MDIB-CC1|
|for 2.54 pinout. 1.27, 1, 0.845, 0.8, 0.7,|
|0.65, 0.62, 0.6, 0.5 & 0.3 pads.|
|Board to connect UC32 or other micros|
|MCIB-12|to I2C, SPI and 4/8bit displays. Has a|
|backlight driver|

**----- End of picture text -----**<br>


## **Optional Variants** 

**Appearance Voltage** 

MDOG064128D1Y-WM 

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## **1.General Specification** 

The Features is described as follow: 

- Module dimension: 17.1 × 35.80 × 1.41mm 

- Active area: 14.06 × 29.42 mm 

- Dot Matrix: 64 × 128 

- Pixel size: 0.20 × 0.21 mm 

- Pixel pitch: 0.22 × 0.23 mm 

- Display Mode：Passive Matrix 

- Duty: 1/64 Duty 

- Display Color: White 

- IC: SH1107 

- Interface: 4-wire SPI , I2C 

- SIZE:1.3 inch 

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## **3.Interface Pin Function** 

|No.|Symbol Function|Symbol Function|
|---|---|---|
|1|VSS|Ground.|
|2|D1|When the serial interface is selected, then D0 serves as the serial clock<br>input pad (SCL) and D1 serves as the serial data input pad (SI).<br>When the I2C interface is selected, then D0 serves as the serial clock input<br>pad (SCL) and D1 serves as the serial data input pad (SDA).|
|3|D0||
|4|A0|This is the Data/Command control pad that determines whether the data<br>bits are data or a command.<br>A0 = “H”: Data.<br>A0 = “L”: Command<br>In I2C interface, this pad serves as SA0 to distinguish the different address<br>of OLED driver.|
|5|RES|This is a reset signal input pad. When RES is set to “L”, the settings are<br>initialized. The reset operation is performed by the RES signal level.|
|6|CS|This pad is the chip select input. When CS = “L”, then the chip select<br>becomes active, and data/command I/O is enabled.|
|7|IREF|This is a segment current reference pad. A resistor should be connected<br>between this pad and VSS. Set the current at 15.625uA.|
|8|IM1|These are the MPU interface mode select pads.<br>IM1 connect to VDD is I2C interface.<br>IM1 connect to VSS is 4-wire SPI interface.|
|9|VDD|Power supply for logic and input.|
|10|VCOMH|This is a pad for the voltage output high level for common signals.<br>A capacitor should be connected between this pad and VSS.|
|11|VPP|This is the most positive voltage supply pad of the chip.<br>It should be supplied externally.|
|12|VSS|Ground.|



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## **4.1 Application recommendations** 

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VPP<br>VPP<br>VDD IM1<br>VDD IM1<br>VCOMH INTERFACE<br>A0<br>A0(SA0)<br>IREF /RES<br>/RES<br>/CS<br>CS<br>C1 C2 C3 R1<br>D0<br>SCL<br>D1<br>SDA<br>VSS<br>VSS<br>**----- End of picture text -----**<br>


Recommended components ： C1, C2 , C3 ： 4.7uF 

Bus Interface selection ： 

4-wire SPI,I2C 

(Must be set the IM1, refer to 4.Interface Pin Function) 

Voltage at IREF = VPP – 3V. For VPP = 13V, IREF = 15.625uA: 

R1 = (Voltage at IREF - VSS) / IREF 

= (13-3)V / 15.625uA 

- ≧ 640K ohm[(2)] 

Note: 

(1).The capacitor value is recommended value. Select appropriate value against module application. 

(2). Minimum value. When OLED product application, then R1 must be greater than the calculated value. 

(3). I2C Mode ： Both the data line (SDA) and the clock line (SCL) should be pulled up by external resistors. 

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## **5.Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Notes**|
|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|-0.3|+3.6|V|1,2|
|Supply Voltage for Display|VPP|7.0|17.0|V|1,2|
|Operating Temperature|TOP|-40|+80|°C|—|
|Storage Temperature|TSTG|-40|+85|°C|—|



## Note ： 

1. All the above voltages are on the basis of “VSS = 0V”. 

2. When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 

3. The absolute limit temperature was verified according to the test conditions of reliability test (See section 9. Reliability) , and module was met all criteria. 

4. The defined temperature ranges do not include the polarizer. The maximum withstood temperature of the polarizer should be 80 °C. 

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## **6.Electrical Characteristics** 

## **6.1 DC Electrical Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Supply Voltage for Logic|VDD|－|1.65|3.3|3.5|V|
|Supply Voltage for Display|VPP|－|7.0|13.0|13.5|V|
|Input High Volt.|VIH|－|0.8×VDD|0.8×VDD<br>－|VDD|V|
|Input Low Volt.|VIL|－|VSS|－|0.2×VDD|0.2×VDD<br>V|
|Output High Volt.|VOH|－|0.8×VDD|0.8×VDD<br>－|VDD|V|
|Output Low Volt.|VOL|－|VSS|－|0.2×VDD|0.2×VDD<br>V|
|Display 50% Pixel on|IPP|VPP=13V|－|10|15|mA|



Note: The VCC (VPP) value can be adjusted according to the demand brightness. When VCC (VPP) is lowered, the brightness decreases or when VCC (VPP) is increased, the brightness increases. The VCC (VPP) value is set within the recommended range. The life time of OLED is directly related to the set brightness, and lower brightness helps to improve the life time. 

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## **6.2 Initial code** 

void INIT_SH1107(void){ 

WriteCommand(0xAE); /*display off*/ WriteCommand(0x00); /*set lower column address*/ WriteCommand(0x10); /*set higher column address*/ WriteCommand(0xB0); /*set page address*/ WriteCommand(0xdc); /*set display start line*/ WriteCommand(0x00); WriteCommand(0x81); /*contract control*/ WriteCommand(0x1E); WriteCommand(0x20); /*Set Memory addressing mode (0x20/0x21) */ WriteCommand(0xA0); /*set segment remap*/ WriteCommand(0xC0); /*Com scan direction*/ WriteCommand(0xA4); /*Disable Entire Display On (0xA4/0xA5)*/ WriteCommand(0xA6); /*normal / reverse*/ 

WriteCommand(0xA8); /*multiplex ratio*/ WriteCommand(0x3F); /*duty = 1/64*/ WriteCommand(0xD3); /*set display offset*/ WriteCommand(0x60); WriteCommand(0xD5); /*set osc division*/ WriteCommand(0x51); WriteCommand(0xD9); /*set pre-charge period*/ WriteCommand(0x22); WriteCommand(0xdb); /*set vcomh*/ WriteCommand(0x35); WriteCommand(0xad); /*set charge pump enable*/ WriteCommand(0x8a); /*Set DC-DC enable (a=0:disable; a=1:enable) */ WriteCommand(0xAF); /*display ON*/ 

## } 

Note1: Initial code is for reference only. Please make the best adjustment with the OLED module. Note2: Command: Set Contrast Control (0x81) , This command sets the Contrast Setting of the display. The chip has 256 contrast steps from 00h to FFh. The segment output current increases as the contrast step value increases. The segment current increases, the OLED brightness increases. 

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## **I2C-bus data format** 

## **Note1:** 

1. Co ＝“ 0 ” : The last control byte , only data bytes to follow, 

   - Co ＝“ 1 ” : Next two bytes are a data byte and another control byte; 

2. D/C ＝“ 0 ” : The data byte is for command operation, 

   - D/C ＝“ 1 ” : The data byte is for RAM operation. 

3. SA0 ＝ Slave address bit 

## **I2C address bit (SA0)** 

The slave address is following the start condition for recognition use. The slave address is either “b0111100” or “b0111101” by changing the SA0 to LOW or HIGH (A0 pin acts as SA0). 

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## **7.Optical Characteristics** 

|Item|Symbol|Condition|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|
|View Angle|(V)θ|－|160|－|－|deg|
||(H)φ|－|160|－|－|deg|
|Contrast Ratio|CR|Dark|10,000:1|10,000:1<br>－|－|－|
|Response Time|T rise|－|－|10|－|μs|
||T fall|－|－|10|－|μs|
|Display with 50% checkerboard Brightness(1)|||100|120|－|cd/m2|
|CIEx(White)||(CIE1931)|0.23|0.27|0.31|－|
|CIEy(White)||(CIE1931)|0.25|0.29|0.33|－|



Note ： 

1. The brightness value is based on the setting of VCC(VPP) equal to the Typical value. 

2. 50% checkerboard means half of the display area turn on & half area turn off, shown as a checkerboard. 

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## **8.OLED Lifetime** 

|**ITEM**|**Conditions**|**Min**|**Typ**|**Remark**|
|---|---|---|---|---|
|Operating<br>Life Time|Ta=25℃<br>/ Initial 50%<br>checkerboard brightness<br>100cd/m2|20,000 Hrs|-|Note|



Note: 

1. Lifetime is defined the amount of time when the luminance has decayed to <50% of the minimal brightness. 

2. This analysis method uses life data obtained under accelerated conditions to extrapolate an estimated probability density function ( _pdf_ ) for the product under normal use conditions. 

3. Screen saving mode will extend OLED lifetime. 

4. Lifetime is not guaranteed one but expected lifetime in normal condition. 

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## **9.Reliability** 

## **Content of Reliability Test** 

|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|**Contentntenttentntt of Reliability Testf Reliability Testeliability Testliability Testability Testility Testty Test Testest**|
|---|---|---|---|---|
|**Environmental Test**|||||
|**Test Item**|**Content of Test**|**Test Condition**|**Applicable**<br>**Standard**||
|High<br>Temperature<br>storage|Endurance test applying the high<br>storage temperature for a long time.|85°C<br>240hrs|——||
|Low<br>Temperature<br>storage|Endurance test applying the low storage<br>temperature for a long time.|Endurance test applying the low storage<br>-40°C<br>240hrs|——||
|High<br>Temperature<br>Operation|Endurance test applying the electric<br>stress (Voltage & Current) and the<br>thermal stress to the element for a long<br>time.|80°C<br>240hrs|——||
|Low<br>Temperature<br>Operation|Endurance test applying the electric<br>stress under low temperature for a long<br>time.|-40°C<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Storage|Endurance test applying the high<br>temperature and high humidity storage<br>for a long time.|60°C,90%RH<br>240hrs|——||
|High<br>Temperature/<br>Humidity<br>Operation|Endurance test applying the high<br>temperature and high humidity<br>Operation for a long time.|60°C,90%RH<br>120hrs|——||
|Temperature<br>Cycle|Endurance test applying the low and<br>high temperature cycle.<br>-40°C    25°C     80°C<br>30min    5min     30min<br>1cycle|-40°C /80°C<br>30 cycles|——||
|Mechanical Test|||||
|Vibration test|Endurance test applying the vibration<br>during transportation and using.|Frequency:10~55Hz<br>amplitude:1.5mm<br>Time:0.5hrs/axis<br>Test axis:X,Y,Z|——||
|Others|||||
|Static<br>electricity test|Endurance test applying the electric<br>stress to the finished product housing.|Air Discharge model<br>±4kv,10 times||——|



*** Supply voltage for OLED system =Operating voltage at 25°C 

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## **Test and measurement conditions** 

1. All measurements shall not be started until the specimens attain to temperature stability. After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the functional test at 23±5°C; 55±15% RH. 

2. All-pixels on/off exchange is used as operation test pattern. 

3. The degradation of Polarizer are ignored for High Temperature storage, High Temperature/ Humidity Storage, Temperature Cycle. 

4. No Condensation. 

## **Evaluation criteria** 

1. The function test is OK. 

2. No observable defects. 

3. Luminance: > 50% of initial value. 

4. Current consumption: within ± 50% of initial value. 

## **APPENDIX:** 

## **RESIDUE IMAGE** 

Because the pixels are lighted in different time, the luminance of active pixels may reduce or differ from inactive pixels. Therefore, the residue image will occur. To avoid the residue image, every pixel needs to be lighted up uniformly. 

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## **10.Inspection specification Inspection Standard:** 

MIL-STD-105E table normal inspection single sample level II. 

## **Definition** 

1 Major defect : The defect that greatly affect the usability of product. 

2 Minor defect : The other defects, such as cosmetic defects, etc. Definition of inspection zone: 

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Zone A: Active Area Zone B: Viewing Area except Zone A Zone C: Outside Viewing Area 

Note: As a general rule, visual defects in Zone C are permissible, when it is no trouble of quality and assembly to customer`s product. 

## **Inspection Methods** 

1 The general inspection : Under fluorescent light illumination: 750~1500 Lux, about 30cm viewing distance, within 45º viewing angle, under 25±5°C. 

2 The luminance and color coordinate inspection : By SR-3 or BM-7 or the equal equipments, in the dark room, under 25±5°C. NO Item Criterion AQL 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. Electrical 1.4 No function or no display. 01 0.65 Testing 1.5 Current consumption exceeds product specifications. 1.6 OLED viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. Black or white 2.1 White and black spots on display ≦0.25mm, no more than spots on 02 three white or black spots present. 2.5 OLED 2.2 Densely spaced: No more than two spots or lines within 3mm. (display only) ~~—~~ 

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|NO<br>~~a~~|Item<br>~~a~~|Criterion<br>|AQL<br>|
|---|---|---|---|
|03<br>|OLED<br>black<br>spots,<br>white<br>spots,<br>contamination<br>(non-display)<br>~~=!~~<br>~~fiez=s|~~|3.1 Round type :<br>As following<br>drawing<br>Φ=( x + y ) / 2<br>SIZE<br>Acceptable<br>QTY<br>Zone<br>Φ≦0.10<br>ignore<br>A+ B<br>0.10＜Φ≦0.20<br>2<br>A+ B<br>0.20＜Φ≦0.25<br>1<br>A+ B<br>0.25＜Φ<br>0<br>A+ B<br>~~=!~~<br>;<br>~~fiez=s|~~|2.5<br>~~=!~~<br>~~fiez=s|~~|
||~~=!~~<br>~~fiez=s|~~|3.2 Line type : (As following drawing)<br>Length<br>Width<br>Acceptable<br>Q TY<br>Zone<br>---<br>W≦0.02<br>ignore<br>A+B<br>L≦3.0<br>0.02＜W≦0.03<br>2<br>A+B<br>L≦2.5<br>0.03＜W≦0.05<br>A+B<br>---<br>0.05＜W<br>As round type<br>~~=!~~<br>~~fiez=s|~~|2.5<br>~~=!~~<br>~~fiez=s|~~|
|04|Polarizer<br>bubbles<br>/Dent<br>~~fiez=s|~~|4.1 If bubbles<br>are visible, judge<br>using black spot<br>specifications,<br>not easy to find,<br>must check in<br>specify direction.<br>4.2 The polarizer dent follows this specification.<br>Size Φ<br>Acceptable Q TY<br>Zone<br>Φ≦0.20<br>ignore<br>A+B<br>0.20＜Φ≦0.50<br>3<br>A+B<br>0.50＜Φ≦1.00<br>2<br>A+B<br>1.00＜Φ<br>0<br>A+B<br>Total Q TY<br>3<br>~~fiez=s|~~|2.5<br>~~fiez=s|~~|
|05<br>~~i~~|Scratches<br>~~i~~|Follow NO.3 OLED black spots, white spots, contamination.||



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NO  Item  Criterion  AQL<br>a<br>Symbols Define:<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length:<br>6.1 General glass chip :<br>6.1.1 Chip on panel surface and crack between panels:<br>2.5<br>z: Chip thickness  y: Chip width  x: Chip length<br>Z ≦ 1/2t  Not over viewing area  x ≦ 1/8a<br>Chipped  ———— 1/2t ＜ z ≦ 2t  Not exceed 1/3k  x ≦ 1/8a<br>glass  ☉ If there are 2 or more chips, x is total length of each chip.<br>6.1.2 Corner crack:<br>06<br>2.5<br>z: Chip thickness  y: Chip width  x: Chip length<br>Z ≦ 1/2t  Not over viewing area  x ≦ 1/8a<br>1/2t ＜ z ≦ 2t  Not exceed 1/3k  x ≦ 1/8a<br>☉ If there are 2 or more chips, x is the total length of each chip.<br>a<br>Symbols :<br>x: Chip length      y: Chip width     z: Chip thickness<br>k: Seal width       t: Glass thickness  a: OLED side length<br>L: Electrode pad length<br>6.2 Protrusion over terminal :<br>6.2.1 Chip on electrode pad :<br>Glass<br>2.5<br>crack<br>y: Chip width  x: Chip length  z: Chip thickness<br>[J y ≦ 0.5mm  x ≦ 1/8a  0  ＜  z  ≦  t<br>**----- End of picture text -----**<br>


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|NO|Item|Criterion|AQL|
|---|---|---|---|
|06|Glass<br>crack|6.2.2 Non-conductive portion:<br>y: Chip width<br>x: Chip length<br>z: Chip thickness<br>y≦L<br>x≦1/8a<br>0＜z≦t<br>☉If the chipped area touches the ITO terminal, over 2/3 of the ITO<br>must remain and be inspected according to electrode terminal<br>specifications.<br>☉If the product will be heat sealed by the customer, the alignment<br>mark not be damaged.<br>6.2.3 Substrate protuberance and internal crack.<br>y: width<br>x: length<br>y≦1/3L<br>x≦a<br>L<br>L<br>X<br>x|2.5|
|07|Cracked<br>glass|The OLED with extensive crack is not acceptable.|2.5|
|08|Backlight<br>elements|8.1 Illumination source flickers when lit.<br>8.2 Spots or scratched that appear when lit must be judged. Using<br>OLED spot, lines and contamination standards.<br>8.3 Backlight doesn’t light or color wrong.|0.65<br>2.5<br>0.65|
|09|Bezel|9.1 Bezel may not have rust, be deformed or have fingerprints,<br>stains or other contamination.<br>9.2 Bezel must comply with job specifications.|2.5<br>0.65|



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|NO|Item|Criterion|AQL|
|---|---|---|---|
|10|PCB , COB|10.1 COB seal may not have pinholes larger than 0.2mm or<br>contamination.<br>10.2 COB seal surface may not have pinholes through to the<br>IC.<br>10.3 The height of the COB should not exceed the height<br>indicated in the assembly diagram.<br>10.4 There may not be more than 2mm of sealant outside the<br>seal area on the PCB. And there should be no more than<br>three places.<br>10.5 No oxidation or contamination PCB terminals.<br>10.6 Parts on PCB must be the same as on the production<br>characteristic chart. There should be no wrong parts,<br>missing parts or excess parts.<br>10.7 The jumper on the PCB should conform to the product<br>characteristic chart.<br>10.8 If solder gets on bezel tab pads, OLED pad, zebra pad or<br>screw holdpad, make sure it is smoothed down.|2.5<br>2.5<br>0.65<br>2.5<br>2.5<br>0.65<br>0.65<br>2.5|
|11|Soldering|11.1 No un-melted solder paste may be present on the PCB.<br>11.2 No cold solder joints, missing solder connections,<br>oxidation or icicle.<br>11.3 No residue or solder balls on PCB.<br>11.4 No short circuits in components on PCB.|2.5<br>2.5<br>2.5<br>0.65|
|12|General<br>appearance|12.1 No oxidation, contamination, curves or, bends on interface<br>Pin (OLB) of TCP.<br>12.2 No cracks on interface pin (OLB) of TCP.<br>12.3 No contamination, solder residue or solder balls on<br>product.<br>12.4 The IC on the TCP may not be damaged, circuits.<br>12.5 The uppermost edge of the protective strip on the interface<br>pin must be present or look as if it cause the interface pin<br>to sever.<br>12.6 The residual rosin or tin oil of soldering (component or<br>chip component) is not burned into brown or black color.<br>12.7 Sealant on top of the ITO circuit has not hardened.<br>12.8 Pin type must match type in specification sheet.<br>12.9 OLED pin loose or missing pins.<br>12.10 Product packaging must the same as specified on<br>packaging specification sheet.<br>12.11 Product dimension and structure must conform to product<br>specification sheet.|2.5<br>0.65<br>2.5<br>2.5<br>2.5<br>2.5<br>2.5<br>0.65<br>0.65<br>0.65<br>0.65|



MDOG064128D1Y-WM 

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|**Check Item**|**Classification**|**Criteria**|
|---|---|---|
|No Display|Major|PTT~~TTTTT~~|
|Missing Line|Major|PTT~~TT~~ ~~TTT~~<br>PTTTTT Ty<br>yy Ty<br>SERRE<br>PET TTT TTT TT TT<br>PTTTTTTTT TT TT Ty<br>FE<br>EEE<br>PTTTTT Ty<br>**T**T<br>PTTTTT<br>yy<br>T<br>SEREEE SREEREEE<br>SERGE ERREREEE<br>PTTTTT ry<br>**T**y<br>PTTTTT<br>yy<br>T|
|Pixel Short|Major|~~PTT~~<br>TT<br>~~TT~~<br>PETTe TT<br>PTTTT TT TT<br>PTT<br>ETTT<br>PTT**T**M **T**T**T** TT TTT<br>PTT TT<br>T<br>T<br>Pe<br>ET ET<br>TT<br>~~PETTTTTTTTyTy~~<br>PyTTT|
|Dark Pixel|Major|~~PET TTT TTT Ty Ty~~<br>Py TTT~~TT~~<br>PTT **TTT** **T**y<br>T**y**<br>PTT<br>y Ty y<br>SERREEERE<br>TT Tm<br>PTTTTT Ty Ty Ty<br>PTTTTT Ty Ty Ty<br>~~PTTTTT~~TT|
|Wrong Display|Major|~~PTT TTT~~<br>BERGER Ee ~~Bee~~<br>SERGE GS ERGs<br>SEREEE ES Sees<br>SEREEE<br>EEREEE<br>PTTTTT EE TT yy<br>SEREEE 6s<br>BERGE<br>88 Sees<br>SERGE SERRE|
|Un-uniform<br>B/A x 100% < 70%<br>A/C x 100% < 70%|Major|~~PE~~<br>TT~~eT~~<br>SERRERERREERE<br>Pee<br>TTTT<br>SERRE ERR<br>PETTTT TTT TTTT<br>Pee<br>TTTT<br>Pe<br>ET<br>TE<br>SERRE<br>|fee<br>|feet|<br>Bm<br>A|_|sormal<br>BB<br>BBiHak Fixe!<br>YE] oc[Blick<br>Fined<br>Bite<br>|eet|



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## **11.Precautions in use of OLED Modules** 

## Modules 

- (1) Avoid applying excessive shocks to module or making any alterations or modifications to it. 

- (2) Don’t make extra holes on the printed circuit board, change the components or modify its shape of OLED display module. 

- (3) Don’t disassemble the OLED display module. 

- (4) Do not apply input signals while the logic power is off. 

- (5) Don’t operate it above the absolute maximum rating. 

- (6) Don’t drop, bend or twist OLED display module. 

- (7) Soldering: only to the I/O terminals. 

- (8) Hot-Bar FPC soldering condition: 280~350C, less than 5 seconds. 

- (9) Midas Displays has the right to change the passive components (Resistors, capacitors and other passive components will have different appearance and color caused by the different supplier.) and change the PCB Rev. (In order to satisfy the supplying stability, management optimization and the best product performance...etc, under the premise of not affecting the electrical characteristics and external dimensions, Midas Displays have the right to modify the version.) 

- (10) Midas Displays has the right to upgrade or modify the product function. 

- (11) For COG & COF structure OLED products, customers should reserve VCC (VPP) adjustment function or software update function when designing OLED supporting circuit. (The progress of OLED light-emitting materials will increase the conversion efficiency and the brightness. The brightness can be adjusted if necessary).. 

## **11.1. Handling Precautions** 

- (1) Since the display panel is being made of glass, do not apply mechanical impacts such as dropping from a high position. 

- (2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 

- (3) If pressure is applied to the display surface or its neighborhood of the OLED display module, the cell structure may be damaged. So, be careful not to apply pressure to these sections. 

- (4) The polarizer covering the surface of the OLED display module is soft and easily scratched. 

- (5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It takes advantage by using following adhesion tape. 

   - Scotch Mending Tape No. 810 or an equivalent 

   - Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: 

   - Water 

   - Ketone 

   - Aromatic Solvents 

- (6) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OLED display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5. 

- (7) Do not touch the following sections whenever possible while handling the OLED display modules. 

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   - Pins and electrodes 

   - Pattern layouts such as the TCP & FPC 

- (8) Hold OLED display module very carefully when placing OLED display module into the System housing. Do not apply excessive stress or pressure to OLED display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 

- (9) Do not apply stress to the LSI chips and the surrounding molded sections. 

- (10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. 

   - Be sure to make human body grounding when handling OLED display modules. 

   - Be sure to ground tools to use or assembly such as soldering irons. 

   - To suppress generation of static electricity, avoid carrying out assembly work under dry 

   - environments. 

   - Protective film is being applied to the surface of the display panel of the OLED display 

   - module. Be careful since static electricity may be generated when exfoliating the protective film. 

## **11.2. Storage Precautions** 

- (1) When storing OLED display modules, put them in static electricity preventive bags to avoid be directly exposed to sun or lights of fluorescent lamps. And, also, place in the temperature 25±5°C and Humidity below 65% RH.(We recommend you to store these modules in the packaged state when they were shipped from Midas Displays. At that time, be careful not to let water drops adhere to the packages or bags.) 

- (2) When the OLED display module is being dewed or when it is placed under high temperature or high humidity environments, the electrodes may be corroded if electric current is applied. Please store it in clean environment. 

## **11.3. Designing Precautions** 

- (1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display module, and if these values are exceeded, OLED display module may be damaged. 

- (2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specification and to make the signal line cable as short as possible. 

- (3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD / VCC). (Recommend value: 0.5A) 

- (4) Pay sufficient attention to avoid occurrence of mutual noise interference with the nearby devices. 

- (5) As for EMI, take necessary measures on the equipment side basically. 

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- (6) If the power supplied to the OLED display module is forcibly shut down by such errors as taking out the main battery while the OLED display panel is in operation, we cannot guarantee the quality of this OLED display module. 

   - Connection (contact) to any other potential than the above may lead to rupture of the IC. 

- (7) If this OLED driver is exposed to light, malfunctioning may occur and semiconductor elements may change their characteristics. 

- (8) The internal status may be changed, if excessive external noise enters into the module. Therefore, it is necessary to take appropriate measures to suppress noise generation or to protect module from influences of noise on the system design. 

- (9) We recommend you to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 

- (10) It's pretty common to use "Screen Saver" to extend the lifetime and Don't use the same image for long time in real application. When an OLED display module is operated for a long of time with fixed pattern, an afterimage or slight contrast deviation may occur. 

- (11) The limitation of FPC and Film bending. 

- (12) The module should be fixed balanced into the housing, or the module may be twisted. 

**==> picture [254 x 50] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.1<br>ry xP<br>(0.1 Max.)<br>**----- End of picture text -----**<br>


- (13) Please heat up a little the tape sticking on the components when removing it; otherwise the components might be damaged. 

## **11.4. Precautions when disposing of the OLED display modules** 

- (1) Request the qualified companies to handle industrial wastes when disposing of the OLED display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 

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## Links

- [View this product on Novapart](https://novapart.co/products/MDOG064128D1Y-WM/graphic-oled-64-x-128-pixels-white-33v-i2c-spi)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/midas-displays/mdog064128d1y-wm/oled-module-64-x-128-pixel-cog/dp/4685264)
---

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