# Graphic OLED, 256 x 64 Pixels, Yellow on Black, 3.3V, Parallel, SPI, 97mm x 32.5mm, -40 °C

![Product image](https://novapart.co/image/farnell:3154929/)

**URL**: https://novapart.co/products/MDOB256064AX-YM/graphic-oled-256-x-64-pixels-yellow-on-black-33v
**SKU**: MDOB256064AX-YM
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || OLED Displays || Graphic OLED Displays
**Price**: €47.4800
**Stock**: 10+
**Lead Time**: 176 days (indicative)

## Description

Resolution:256 x 64 Pixels; Display Appearance:Yellow on Black; Logic Voltage:3.3V; Interface Type:Parallel, SPI; Module Size:97mm x 32.5mm; Operating Temperature Min:-40°C; Opera

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Resolution | 256 x 64 Pixels |
| Module Size | 97mm x 32.5mm |
| Logic Voltage | 3.3V |
| Product Range | - |
| Interface Type | Parallel, SPI |
| Display Appearance | Yellow on Black |
| Display Construction | COB |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3154929/)

**Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG** 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

|MDOB256064AX-YM|MDOB256064AX-YM|256 x 64|256 x 64|OLED Module|
|---|---|---|---|---|
|**Specification **|||||
|Version:    1|||Date:  18/07/2010||
|**Revision**|||||
|1|18/07/2010||||



|DisplayFeatures|DisplayFeatures|||
|---|---|---|---|
|Resolution|256 x 64|||
|Appearance|Yellow on Black|||
|Logic Voltage|3.3V|||
|Interface|Parallel,SPI|||
|Module Size|97.00 x 32.50 x 6.30mm|||
|OperatingTemperature|-40°C ~ +85°C|BoxQuantity|Weight / Display|
|Construction|COB|---|---|



* - For full design functionality, please use this specification in conjunction with the SSD1322 specification. (Provided Separately) 

|**Display Accessories**|**Display Accessories**|
|---|---|
|**Part Number**|**Description**|



|**Optional Variants**||
|---|---|
|**Appearance**|**Voltage**|



Page 1 of 29 

## **1 Basic Specifications** 

## 1.1 Display Specifications 

|Item|Specs|
|---|---|
|Display Mode/Colour|Passive Matrix OLED. Yellow/Blue|
|Interface|8-Bit 68XX/80XX Parallel、SPI|
|Drive Duty|1/64|
|Driver IC|SSD1322|
|Shell|0.5T|
|Other||



## 1.2 Mechanical Specifications 

|Item|Specs|Unit|Remark|
|---|---|---|---|
|Outline Drawing|97.0(W)x32.5(H)x6.3Max(T)|mm||
|View Area|71.104(W)x319.264(H)|mm||
|Active Area|69.104(W)x17.264(H)|mm||
|Lattice|256dots x 64dots|--||
|Pixel Pitch|0.27(W)x0.27(H)|mm||
|Pixel Size|0.254(W)x0.254(H)|mm||



## 1.3 Active Area & Pixel Construction 

Page 2 of 29 

## 1.4 Mechanical Drawing 

**==> picture [394 x 633] intentionally omitted <==**

**----- Start of picture text -----**<br>
2Sesis 8aesasigssasic Sg<br>3 TPF FF FPR gi—i<<br>wialalsleleajafa SPS VRpRpsapePs<br>27.5± 0.02<br>2.6<br>i 8©09000900-~<br>|__1“*r-@ 2.54 © P2.54 x(8-1)=1 7.78 ± 0.2 @@0 0 8.89  OG<br>1.8± 0.02<br>1.5± 0.02<br>et<br>P2.54x(8-1)=17.78<br>1.N \ i \<br>$0 6 O}.0,. 00% 4<br>t<br>1± 0.02<br>SS} :<br>5.5± 0.02 P0.27x64-0.016=17.264(A,A)<br>4.5± 0.02 19.264(V,A)<br>1.7± 0.02 28.3± 0.2(铁框)<br>32.5± 0.02<br>R1.5 R1.5<br>R1.5<br>R0.8± 0.02<br>R1.5<br>R1.5<br>R0.4± 0.02<br>PIN ASSIGNMENT Count Drawing<br>FILE NAME<br>2.5<br>2.5<br>Glass No.<br>APPROVED<br>元件区域<br>VERIFIED<br>97± 0.02<br>CHECKED<br>NO.<br>MODULE DESIGNED<br>2.54 SCALE FIT<br>1.5<br>2.5± 0.02 6.30± 0.2 SIZE A4<br>1± 0.02 UNIT mm<br>2.80<br>3± 0.02 6± 0.02 13.45± 0.02 14.45± 0.02<br>DATE<br>2010 - 07-18<br>32± 0.02<br>铁框)<br>97± 0.02 91.5± 0.02 86± 0.2( 71.104(V,A)<br>32± 0.02<br>P0.27x256-0.016=69.104(A,A)<br>DESCRIPTION<br>THE FIRST ISSUE<br>Count drawing's modified record with customer VER. #1<br>**----- End of picture text -----**<br>


Page 3 of 29 

## 1.5 Pin Definition 

|Pin No.|Symbol|I/O|Function|
|---|---|---|---|
|1|Vss|P|Ground of Logic Circuit<br>This is a ground pin. It also acts as a reference for the<br>logicpins. It must be connected to externalground.|
|2|VBAT 3.3--5V|VBAT 3.3--5V|VBAT 3.3--5V<br>Power Supply for Display Module Circuit<br>This is a voltage supply pin. It connected to external<br>source.|
|3|NC|-|Please let it Float.|
|4--11|DB0—DB7|DB0—DB7I/O|Host Data Input/Output Bus<br>These pins are 8-bit bi-directional data bus to be connected<br>to the microprocessor’s data bus. When serial mode is<br>selected, D1 will be the serial data input SDIN and D0 will<br>be the serial clock input SCLK.|
|12|/RD|I|Read/Write Enable or Read<br>This pin is MCU interface input, When interfacing to an<br>68XX-series microprocessor, this pin will be used as the<br>Enable(E) signal. Read/Write operation is initiated when<br>this pin is pulled high and the CS is pulled low. When<br>connecting to an 80XX-microprocessor,this pin receives<br>the Read(RD) signal. Data read operation is initiated<br>when thispin ispulled low CS ispulled low.|
|13|/WR|I|Read/Write Select or Write<br>This pin is MCU interface input, When interfacing to an<br>68XX-series microprocessor, this pin will be used as<br>Read/Write (R/W) selection input. Pull this pin to “High”<br>for read mode and pull it to “Low” for write mode. When<br>80XX interface mode is selected, this pin will be the<br>Write (WR) input. Data write operation is initiated when<br>thispin ispulled low and the CS ispulled low.|
|14|/DC|I|Data/Command Control<br>This pin is Data/Command control pin. When the pin is<br>pulled high, the input at D7~D0 is treated as display data.<br>When the pin is pulled low, the input at D7~D0 will be<br>transferred to the command register. For detail<br>relationship to MCU interface signals, please refer to the<br>Timing Characteristics Diagrams.|
|15|/Reset|I|Power Reset for Controller and Driver<br>This pin is reset signal input. When the pin is low,<br>initialization of the chipis executed.|



Page 4 of 29 

Chip Select 16 /CS I This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled low. 

* Aboat the MCU interface Selectable(Such as: 3/4-wire Serial Peripheral 

Interface and 8-bit 6800/8080-series parallel interface), Please tell us the specific 

requirements of your company, we will provide the appropriate interface to your company. 

## 1.6 Elements Block Diagram 

(MCU Interface Selection:   By the Module internal of the Pin BS1 and Pin BS2) Pins Connected to MCU interface:D7~D0,/RD, /WR,/CS,DC,and /RES. 

Page 5 of 29 

**2. Absolute Maximum Ratings** Parameter Symbol Min Max Unit Notes Power Supply VBAT 3.3 5 V - Logic Supply Voltage VDD 2.5 3.3 V 1,2 Driver Supply Voltage Vcc 0 15 V 1,2 Vcc Supply Current Icc - 55 mA 1,2 Operating Temperature Top -40 85 ℃ **-** ~~Soe~~ Storage Temperature Tstg -45 90 ℃ **-** Note 1: All the above voltage are on the basis of “GND=0V”. Note 2: When this module is used beyond the above absolute maximum 

Ratings, permanent breakage of the module may occur. Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Electrical Characteristics”. If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 

## **3.Electrical Characteristics** 

3.1 DC Charateristics 

Characteristics Symbol Conditions Min Typ Max Unit Supply Voltage VDD 2.8 3.0 3.3 V High Level Input Iout=100Ua, VIH 0.8xVdd - Vdd V 3.3MHz Low Level Input Iout=100Ua, VIL 0 - 0.2xVdd V 3.3MHz Logic Current Note IVBAT - 250 -- mA Display voltage VCC Ta=25℃ 11.5 12.0 12.5 V ~~ore~~ Note:VDD=3.0V,VCC=12.0V(VDD,VCC Supply by the module internal generate) 100%   Display Area Turn on. 

Page 6 of 29 

## 3.2 Optics & Electrical Characteristics 

|Characteristics|Symbol|Conditions|Min|Typ|Max|Unit|
|---|---|---|---|---|---|---|
|Brightness(Yellow)|Lbr|With Polarizer<br>(Note 3)|60|90|-|Cd/m2|
|C.I.E.(Yellow)|(X)<br>(Y)|With Polarizer|0.44<br>0.46|0.48<br>0.50|0.52<br>0.54||
|Dark Room Contrast|CR||-|>2000:1|-||
|View Angle|||>160|-|-|degree|



* Optical measurement taken at VDD =3.0V.VCC=12V,and software configuration follows Sec4.8 “Software Initial Setting”. 

## **3.3 AC Characteristics** 

## 3.3.1 6800-Series MPU Parallel Interface Timing Characteristics: 

|Symbol|Description|Min|Max|Unit|
|---|---|---|---|---|
|tcycle|Clock Cycle Time(write cycle)|300|-|ns|
|PWcsl|Control Pulse Low Width(writer cycle)|60|-|ns|
|PWcsh|Control Pulse High Width(write cycle)|60|-|ns|
|PWcsl|Control Pulse Low Width(read cycle)|120|-|ns|
|PWcsh|Control Pulse High Width(read cycle)|60|-|ns|
|tAS|Address Setup Time|10|-|ns|
|tAH|Address Hold Time|0|-|ns|
|tDSW|Write Data Setup Time|40|-|ns|
|tDHW|Write Data Hold Time|7|-|ns|
|tDHR|Read Data Hold Time|20|-|ns|
|tACC|Access Time|-|140|ns|
|tOH|Output Disable Time|-|70|ns|
|tR|Rise Time|-|15|ns|
|tF|Fall Time|-|15|ns|



*(VDD-VSS=2.4V to 3.3V, TA=25 ℃ ) 

Page 7 of 29 

## 3.3.2 8080-Series MPU Parallel Interface Timing Charavteristics: 

|Symbol|Description|Min|Max|Unit|
|---|---|---|---|---|
|**t**cycle|Clock Cycle Time|300|-|ns|
|**t**AS|Address Setup Time|10|-|ns|
|**t**AH|Address Hold Time|0|-|ns|
|**t**DSW|Write Data Setup Time|40|-|ns|
|**t**DHW|Write Data Hold Time|7|-|ns|
|**t**DHR|Read Data Hold Time|20|-|ns|
|**t**OH|Output Disable Time|-|70|ns|
|**t**ACC|Access Time|-|140|ns|
|**PW**CSL|Chip Select Low Pulse Width(Read)<br>Chip Select Low Pulse Width(write)|120<br>60|-|ns|
|**PW**CSH|Chip Select High Pulse Width(Read)<br>Chip Select High Pulse Width(write)|60<br>60|-|ns|
|**t**R|Rise Time|-|15|ns|
|**t**F|Fall Time|-|15|ns|
|**t**cs|Chip select setup time|0|-|ns|
|**t**CSH|Chip select hold time to read signal|0|-|ns|
|**t**CSF|Chip select hold time|20|-|ns|



*(VDD-VSS=2.4V to 3.3V, TA=25 ℃ ) 

Page 8 of 29 

## 3.3.3 Serial Interface Timing Characteristics: 

|Symbol|Description|Min|Max|Unit|
|---|---|---|---|---|
|**t**cycle|Clock Cycle Time|100|-|ns|
|**t**AS|Address Setup Time|15|-|ns|
|**t**AH|Address Hold Time|15|-|ns|
|**t**CSS|Chip Select Setup Time|20|-|ns|
|**t**CSH|Chip Select Hold Time|10|-|ns|
|**t**DSW|Write Data Setup Time|15|-|ns|
|**t**DHW|Write Data Hold Time|15|-|ns|
|**t**CLKL|Clock Low Time|20|-|ns|
|**t**CLKH|Clock High Time|200|-|ns|
|**t**R|Rise Time|-|15|ns|
|**t**F|Fall Time|-|15|ns|



## *(VDD-VSS=2.4V to 3.3V, TA=25 ℃ ) 

Page 9 of 29 

## **4 Functional Specificaton** 

## **MCU Interface selection:** 

MCU Interface assignment under different bus interface mode: 

## 4.1 MCU parallel 6800-series interface 

The parallel interface consists of 8 bi-directional data pins (DB[7:0]), R/W, D/C, E and /CS.A LOW in R/W indicates WRITE operation and HIGH in R/W indicates READ operation. A LOW in D/C indicates COMMAND read/write and HIGH in D/C indicates DATA read/write. The E input serves as data latch signal while /CS is LOW. Data is latched at the falling edge of E signal. 

Control pins of 6800 interface 

|**Function**|**E**|**R/W**|**/CS**|**D/C**|
|---|---|---|---|---|
|Write command|↓|L|L|L|
|Read status|↓|H|L|L|
|Write data|↓|L|L|H|
|Read data|↓|H|L|H|



Note (1)↓ stands for falling edge of signal 

H stands for HIGH in signal 

L stands for LOW in signal 

In order to match the operating frequency of display RAM with that of the microprocessor, some pipeline processing is internally performed which requires the insertion of a dummy read before the first actual display data read. This is shown as follows. 

Data read back procedure - insertion of dummy read 

Page 10 of 29 

## 4.2 MCU parallel 8080-series interface 

The parallel interface consists of 8 bi-directional data pins (DB[7:0]), /RD, /WR, D/C and /CS.A LOW in A0 indicates COMMAND read/write and HIGH in D/C indicates DATA read/write. A rising edge of /RD input serves as a data READ latch signal while /CS is kept LOW.A rising edge of /WR input serves as a data/command WRITE latch signal while /CS is kept LOW. 

|**Function**<br>~~====—~~|/RD<br>~~====—~~|/WR<br>~~====—~~|/CS<br>~~====—~~|D/C<br>~~====—~~|
|---|---|---|---|---|
|Write command<br>~~====—~~|H<br>~~====—~~|↑<br>~~====—~~|L<br>~~====—~~|L<br>~~====—~~|
|Read status<br>~~====—~~|↑<br>~~====—~~|H<br>~~====—~~|L<br>~~====—~~|L<br>~~====—~~|
|Write data<br>~~====—~~|H<br>~~====—~~|↑<br>~~====—~~|L<br>~~====—~~|H<br>~~====—~~|
|Read data<br>~~====—~~|↑<br>~~====—~~|H<br>~~====—~~|L<br>~~====—~~|H<br>~~====—~~|



## Note (1) ↑ stands for rising edge of signal 

- (2) H stands for HIGH in signal 

- (3) L stands for LOW in signal 

(4) Refer to Figure 13-2 for Form 1 8080-Series MPU Parallel Interface Timing Characteristics 

Alternatively, /RD and /WR can be keep stable while /CS serves as the data/command latch signal. 

Control pins of 8080 interface (Form 2) 

|**Function**<br>~~SSeS~~|/RD<br>~~SSeS~~|/WR<br>~~SSeS~~|/CS<br>~~SSeS~~|D/C<br>~~SSeS~~|
|---|---|---|---|---|
|Write command<br>~~SSeS~~|H<br>~~SSeS~~|L<br>~~SSeS~~|↑<br>~~SSeS~~|L<br>~~SSeS~~|
|Read status<br>~~SSeS~~|L<br>~~SSeS~~|H<br>~~SSeS~~|↑<br>~~SSeS~~|L<br>~~SSeS~~|
|Write data<br>~~SSeS~~|H<br>~~SSeS~~|L<br>~~SSeS~~|↑<br>~~SSeS~~|H<br>~~SSeS~~|
|Read data<br>~~SSeS~~|L<br>~~SSeS~~|H<br>~~SSeS~~|↑<br>~~SSeS~~|H<br>~~SSeS~~|



Note 

- (1) ↑ stands for rising edge of signal 

- (2) H stands for HIGH in signal 

- (3) L stands for LOW in signal 

(4) Refer to Figure 13-3 for Form 2 8080-Series MPU Parallel Interface Timing Characteristics In order to match the operating frequency of display RAM with that of the 

microprocessor, some pipeline processing is internally performed which requires the insertion of a dummy read before the first actual display data read. This is shown as follows. 

Page 11 of 29 

Display data read back procedure - insertion of dummy read 

## 4.3 MCU Serial Interface 

The serial interface consists of serial clock SCLK, serial data SDIN, D/C, /CS.In SPI mode, D0 acts as SCLK, D1 acts as SDIN. For the unused data pins, D2 should be left open. The pins from D3 to D7, E and R/W can be connected to an external ground. 

Control pins of Serial interface 

|**Function**|E|R/W|/CS|D/C|
|---|---|---|---|---|
|Write command|Tie Low|Tie Low|L|L|
|Write data|Tie Low|Tie Low|L|H|



SDIN is shifted into an 8-bit shift register on every rising edge of SCLK in the order of D7, D6, ...D0. A0 is sampled on every eighth clock and the data byte in the shift register is written to the Graphic Display Data RAM (GDDRAM) or 

command register in the same clock. Under serial mode, only write operations are allowed. 

Write procedure in SPI mode 

Page 12 of 29 

## 4.4 Command Decoder 

Refer to the Technical Manual for the SSD1322. 

## 4.5 FR synchronization 

Refer to the Technical Manual for the SSD1322. 

## 4.6 Reset Circuit 

When /RES input is low, the chip is initialized with the following status: 1. Display is OFF. 

- 2.480 x 128 Display Mode. 

3. Normal segment and display data column address and row address mapping (SEG0 mapped to address 00h and COM0 mapped to address 00h). 

4. Display start line is set at display RAM address 0. 

5. Column address counter is set at 0. 

6. Normal scan direction of the COM outputs. 

7. Contrast control register is set at 7Fh. 

## 4.7 Actual Application Example 

Actual software example 

//******************************************** 

#include <W78E516B.H> 

#define  DBL P0 unsigned char a; unsigned int pic; bit delayflag=0; //********************************************* void Initial(void); void writelcm(unsigned int x,bit R); void Write_Command(unsigned char RegisterName); void Write_Data(unsigned char RegisterValue); void Field(void); void fill(unsigned char dat1,unsigned  char dat2); void AddressSlect(unsigned char Add); void Delay(unsigned char i); void dummy(); 

//****************************************** 

sbit CS     =P3^4; sbit RS     =P3^2; sbit W_R    =P3^1; sbit R_D    =P3^0; sbit RES =P3^3; //****************************************** 

Page 13 of 29 

void Delay(unsigned char times) { unsigned char b; bit key=0; for(;times>0;times--) { b=delayflag==0?1:20; for(;b>0;b--) { TH0=0x7e;TL0=0x00;TR0=1; do{key=KeyScan();}while((TF0==0)&&(key==0)); TF0=0; if(key==1) { times=1; b=1; } } } TR0=0; delayflag=key; } void uDelay(unsigned char l) { while(l--); } void Delay1(unsigned char n) { unsigned char i,j,k; 

for(k=0;k<n;k++) { for(i=0;i<131;i++) { for(j=0;j<15;j++) { uDelay(203); } } } } 

Page 14 of 29 

void Write_Command(unsigned char RegisterName) { CS=0; RS=0; DBL=RegisterName; W_R=0; W_R=1; CS=1; } //*********************************** void Write_Data(unsigned int RegisterValue) { CS=0; RS=1; DBL=RegisterValue; W_R=0; W_R=1; CS=1; } //*********************************** void Initial(void) { unsigned int x,y; //SSD1322IC Write_Command(0xFD);    /*SET COMMAND LOCK*/ Write_Data(0x12); /* UNLOCK */ Write_Command(0xAE);    /*DISPLAY OFF*/ 

Write_Command(0xB3);/*DISPLAYDIVIDE CLOCKRADIO/OSCILLATAR FREQUANCY*/ Write_Data(0x91); Write_Command(0xCA);    /*multiplex ratio*/ Write_Data(0x3F);         /*duty = 1/64*/ Write_Command(0xA2);    /*set offset*/ Write_Data(0x00); Write_Command(0xA1);    /*start line*/ Write_Data(0x00); Write_Command(0xA0);    /*set remap*/ Write_Data(0x14); Write_Data(0x11); /*Write_Command(0xB5);    //GPIO Write_Command(0x00);   */ Write_Command(0xAB);    /*funtion selection*/ Write_Data(0x01); /* selection external vdd */ Write_Command(0xB4);    /*  */ Write_Data(0xA0); 

Page 15 of 29 

Write_Data(0xfd); Write_Command(0xC1);    /*set contrast current */ Write_Data(0x9f); Write_Command(0xC7);    /*master contrast current control*/ Write_Data(0x0f); /* Write_Command(0xB9);    GRAY TABLE*/ Write_Command(0xB1);     /*SET PHASE LENGTH*/ Write_Data(0xE2); Write_Command(0xD1);    /**/ Write_Data(0x82); Write_Data(0x20); Write_Command(0xBB);    /*SET PRE-CHANGE VOLTAGE*/ Write_Data(0x1F); Write_Command(0xB6);   /*SET SECOND PRE-CHARGE PERIOD*/ Write_Data(0x08); Write_Command(0xBE);    /* SET VCOMH */ Write_Data(0x07); Write_Command(0xA6);    /*normal display*/ // clear(); Write_Command(0xAF);    /*display ON*/ } void  fill(unsigned  char  dat1,unsigned char dat2) { unsigned  char  x,y; Write_Command(0x15);   /*SET SECOND PRE-CHARGE PERIOD*/ Write_Data(0x00); Write_Data(0x77); Write_Command(0x75);   /*SET SECOND PRE-CHARGE PERIOD*/ Write_Data(0x00); Write_Data(0x7f); Write_Command(0x5c); for(y=0;y<128;y++) { for(x=0;x<120;x++) Write_Data(dat1); Write_Data(dat2); } Delay1(1); } void showframe(void) { 

Page 16 of 29 

unsigned char x,y; Write_Command(0x15); Write_Data(0x1c); Write_Data(0x5b); Write_Command(0x75); Write_Data(0x00); Write_Data(0x3F); Write_Command(0x5C); for(x=0;x<64;x++) { Write_Data(0xFF); Write_Data(0xFF); } for(y=0;y<62;y++) { Write_Data(0xf0); Write_Data(0x00); for(x=0;x<62;x++) { Write_Data(0x00); Write_Data(0x00); } Write_Data(0x00); Write_Data(0x0f); } for(x=0;x<64;x++) { Write_Data(0xFF); Write_Data(0xFF); } Delay1(1); } 

void ver() { unsigned char x,y; Write_Command(0x15); Write_Data(0x1c); Write_Data(0x5b); Write_Command(0x75); Write_Data(0x00); Write_Data(0x3F); Write_Command(0x5C); for(y=0;y<64;y++) 

Page 17 of 29 

{ for(x=0;x<64;x++) { Write_Data(0xf0); Write_Data(0xf0); } } Delay1(1); } void hor() { unsigned char x,y; Write_Command(0x15); Write_Data(0x1c); Write_Data(0x5b); Write_Command(0x75); Write_Data(0x00); Write_Data(0x3F); Write_Command(0x5C); for(y=0;y<32;y++) { for(x=0;x<64;x++) { Write_Data(0xff); Write_Data(0xff); } for(x=0;x<64;x++) { Write_Data(0x00); Write_Data(0x00); } } Delay1(1); } void snow() { unsigned char x,y; Write_Command(0x15); Write_Data(0x1c); Write_Data(0x5b); Write_Command(0x75); Write_Data(0x00); 

Page 18 of 29 

Write_Data(0x3F); Write_Command(0x5C); for(y=0;y<32;y++) { 

for(x=0;x<64;x++) { Write_Data(0xf0); Write_Data(0xf0); } for(x=0;x<64;x++) { Write_Data(0x0f); Write_Data(0x0f); } } 

Delay1(1); } void clear() { unsigned char x,y; Write_Command(0x15); Write_Data(0x00); Write_Data(0x77); Write_Command(0x75); Write_Data(0x00); Write_Data(0x7f); Write_Command(0x5C); for(y=0;y<128;y++) { for(x=0;x<120;x++) 

{ Write_Data(0x00); Write_Data(0x00); } } 

} 

void Set_Column_Address(unsigned char a, unsigned char b) { Write_Command(0x15); Write_Data(a); /* Default => 0x00*/ Write_Data(b); /* Default => 0x77*/ 

} 

Page 19 of 29 

void Set_Row_Address(unsigned char a, unsigned char b) 

{ Write_Command(0x75); Write_Data(a); /* Default => 0x00 */ Write_Data(b); /* Default => 0x7F */ } 

void Fill_Block(unsigned char Data, unsigned char a, unsigned char b, unsigned char c, unsigned char d) 

{ 

unsigned char i,j; 

Set_Column_Address(0x1C+a,0x1C+b); Set_Row_Address(c,d); Write_Command(0x5C); 

for(i=0;i<(d-c+1);i++) { 

for(j=0;j<(b-a+1);j++) { Write_Data(Data); Write_Data(Data); } } 

} 

void Grayscale() { /* Level 16 => Column 1~16 */ Fill_Block(0xFF,0x00,0x03,0x00,0x3f); /* Level 15 => Column 17~32*/ Fill_Block(0xEE,0x04,0x07,0x00,0x3f); /* Level 14 => Column 33~48*/ Fill_Block(0xDD,0x08,0x0B,0x00,0x3f); /* Level 13 => Column 49~64*/ Fill_Block(0xCC,0x0C,0x0F,0x00,0x3f) /* Level 12 => Column 65~80*/ Fill_Block(0xBB,0x10,0x13,0x00,0x3f); /* Level 11 => Column 81~96*/ Fill_Block(0xAA,0x14,0x17,0x00,0x3f); /* Level 10 => Column 97~112*/ Fill_Block(0x99,0x18,0x1B,0x00,0x3f); /* Level 9 => Column 113~128*/ Fill_Block(0x88,0x1C,0x1F,0x00,0x3f); /* Level 8 => Column 129~144*/ 

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Fill_Block(0x77,0x20,0x23,0x00,0x3f); /* Level 7 => Column 145~160*/ Fill_Block(0x66,0x24,0x27,0x00,0x3f); /* Level 6 => Column 161~176*/ Fill_Block(0x55,0x28,0x2B,0x00,0x3f); /* Level 5 => Column 177~192*/ Fill_Block(0x44,0x2C,0x2F,0x00,0x3f); /* Level 4 => Column 193~208*/ Fill_Block(0x33,0x30,0x33,0x00,0x3f); /* Level 3 => Column 209~224*/ Fill_Block(0x22,0x34,0x37,0x00,0x3f); /* Level 2 => Column 225~240*/ Fill_Block(0x11,0x38,0x3B,0x00,0x3f); /* Level 1 => Column 241~256*/ Fill_Block(0x00,0x3C,0x3f,0x00,0x3f); Delay1(1); } //************************************************* void main(void) { TMOD=0x01; Delay(5); RES=0; Delay(10); RES=1; Delay(10); Initial(); while(1) { fill(0xff,0xff); Delay(20); clear(); Grayscale(); Delay(20); clear(); snow(); Delay(20); clear(); showframe(); Delay(20); clear(); hor(); Delay(20); clear(); 

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ver(); Delay(20); clear(); 

} } 

## **5. Reliability** 

## 5.1 Contents of Reliability Tests 

|5.1 Contents of Reliability Tests|5.1 Contents of Reliability Tests|5.1 Contents of Reliability Tests||
|---|---|---|---|
|Item|Conditions||Criteria|
|High Temperature Operation|85℃|TBD|The operational<br>Functions work|
|Low Temperature Operation|-40℃|TBD||
|High Temperature Storage|90℃|TBD||
|Low Temperature Storage|-45℃|TBD||
|High Temperature/Humidity<br>Operation|60℃|TBD||
|Thermal Shock|-40℃<br>90℃|TBD||



* The samples used for the above tests do not include polarizer. 

* No moisture condensation is observed during tests. 

## 5.2 Lifetime 

|5.2 Lifetime|5.2 Lifetime|
|---|---|
|End of lifetime is specified as 50% of initial brightness.<br>Parameter<br>Min<br>Max<br>Unit<br>Condition<br>Notes<br>OperatingLife Time<br>50,000<br>-<br>Hrs<br>80 cd/m2,50%checkerboard<br>6<br>Storage Life Time<br>100,000<br>-<br>Hrs<br>Ta=25℃,50%RH<br>-<br>Note 6: The average operating lifetime at room temperature is estimated by the<br>~~ee~~<br>~~os~~||
|accelerated operation at high temperature conditions.||



## 5.3 Failure Check Standard 

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23+/-5℃; 55+/-15%RH. 

## **6. Outgoing Quality Control Specifications** 

## 6.1 Environment Required 

Customer’s test & measurement are required to be conducted under the following conditions: 

Temperature:                                  23+/-5℃ 

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Humidity: 55+/-15%RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: >=50 cm Distance between the Panel & Eyes of the Inspector   >=30 cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic. 

## 6.2 Sampling Plan 

Level II, Normal Inspection, Single Sampling,MIL-STD-105E 

## 6.3 Criteria & Acceptable Quality Level 

|Partition|AQL|Definition|
|---|---|---|
|Major|0.61|Defects in Pattern Check(DisplayOn)|
|Minor|1.0|Defects in Cosmetic Check(DisplayOff)|



## 6.3.1 Cosmetic Check (Display Off) in Non-Active Area 

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## 6.3.2 Cosmetic Check (Display Off) in Active Area 

It is recommended to execute in clear room environment (class 10K) if actual in necessary. 

- Protective film should not be tear off  when cosmetic chech. 

- ** Definition of W & L & φ (Unit: mm): φ=(a+b)/2 

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6.3.3 Pattern Check (Display On) in Active Area 

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## **7. Precautions When Using These OEL Display Modules** 

- 7.1 Handling Precautions 

   - 1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. 

   - 2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 

   - 3) If pressure is applied to the display surface or its neighborhood of the OLED display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 

   - 4) The polarizer covering the surface of the OLED display module is soft and easily scratched. Please be careful when handling the OLED display module. 

   - 5) When the surface of the polarizer of the OLED display module has soil,clean the surface. It takes advantage of by using following adhesion tape. 

      - Scotch Mending Tape No. 810 or an equivalent 

      - Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. 

Also, pay attention that the following liquid and solvent may spoil the polarizer 

- Water 

- Ketone 

- Aromatic Solvents 

- 6) When installing the OLED display module, be careful not to apply twisting stress or deflection stress to the OLED display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 

- 7) Do not apply stress to the LSI chips and the surrounding molded sections. 8) Do not disassemble nor modify the OLED display module. 

- 9) Do not apply input signals while the logic power is off. 

- 10) Pay sufficient attention to the working environments when handing OLED display modules to prevent occurrence of element breakage accidents by static electricity. 

- Be sure to make human body grounding when handling OLED display modules. 

- Be sure to ground tools to use or assembly such as soldering irons. 

- To suppress generation of static electricity, avoid carrying out assembly work under dry environments. 

- Protective film is being applied to the surface of the display panel of the OLED display module. Be careful since static electricity may be generated when exfoliating the protective film. 

- 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OLED display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display 

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panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 

   - 12) If electric current is applied when the OLED display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above. 

- 7.2  Storage Precautions 

   - 1) When storing OLED display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps.and, also, avoiding high temperature and high humidity environment or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Topwin International CO., LTD) 

      - At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 

   - 2) If electric current is applied when water drops are adhering to the surface of the OLED display module, when the OLED display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 

- 7.3  Designing Precautions 

   - 1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED display module, and if these values are exceeded, panel damage may be happen. 

   - 2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. 

   - 3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 

   - 4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. 

   - 5) As for EMI, take necessary measures on the equipment side basically. 

   - 6) When fastening the OLED display module, fasten the external plastic housing section. 

   - 7) If power supply to the OLED display module is forcibly shut down by such errors as taking out the main battery while the OLED display panel is in operation, we cannot guarantee the quality of this OLED display module. 

   - 8) The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1331 

      - Connection (contact) to any other potential than the above may lead to rupture of the IC. 

- 7.4 Precautions when disposing of the OLED display modules 

   - 1) Request the qualified companies to handle industrial wastes when disposing of the OLED display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 

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- 7.5 Other Precautions 

   - 1) When an OLED display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. 

   - 2) To protect OLED display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OLED display modules. 

   - Pins and electrodes 

   - Pattern layouts such as the COF 

   - 3) With this OLED display module, the OLED driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OLED driver is exposed to light, malfunctioning may occur. 

   - Design the product and installation method so that the OLED driver may be shielded from light in actual usage. 

   - Design the product and installation method so that the OLED driver may be shielded from light during the inspection processes. 

   - 4) Although this OLED display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. 

   - 5) We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 

## **8. Appendixes** 

## 8.1 Display-module Software Initial Setting 

Write_Command(0xFD);    /*SET COMMAND LOCK*/ Write_Data(0x12); /* UNLOCK */ Write_Command(0xAE);    /*DISPLAY OFF*/ Write_Command(0xB3); /*DIVIDE CLOCKRADIO/OSCILLATAR FREQUANCY*/ Write_Data(0x91); Write_Command(0xCA); /*multiplex ratio*/ Write_Data(0x3F); /*duty = 1/64*/ Write_Command(0xA2); /*set offset*/ Write_Data(0x00); Write_Command(0xA1); /*start line*/ 

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Write_Data(0x00); Write_Command(0xA0);    /*set remap*/ Write_Data(0x14); Write_Data(0x11); /*Write_Command(0xB5); //GPIO Write_Command(0x00);     */ Write_Command(0xAB);    /*funtion selection*/ Write_Data(0x01); /* selection external vdd */ Write_Command(0xB4);    /*  */ Write_Data(0xA0); Write_Data(0xfd); Write_Command(0xC1);    /*set contrast current */ Write_Data(0x9f); Write_Command(0xC7);    /*master contrast current control*/ Write_Data(0x0f); /* Write_Command(0xB9); GRAY TABLE*/ Write_Command(0xB1); /*SET PHASE LENGTH*/ Write_Data(0xE2); Write_Command(0xD1); /**/ Write_Data(0x82); Write_Data(0x20); Write_Command(0xBB);    /*SET PRE-CHANGE VOLTAGE*/ Write_Data(0x1F); Write_Command(0xB6);    /*SET SECOND PRE-CHARGE PERIOD*/ Write_Data(0x08); Write_Command(0xBE);    /* SET VCOMH */ Write_Data(0x07); Write_Command(0xA6);    /*normal display*/ // clear(); Write_Command(0xAF);    /*display ON*/ 

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---

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