# TFT LCD, 2.8 ", 240 x 320 Pixels, QVGA, Portrait, RGB, 3.3V

![Product image](https://novapart.co/image/farnell:2664751/)

**URL**: https://novapart.co/products/MCT028D0W240320PMLIPS/tft-lcd-28-240-x-320-pixels-qvga-portrait-rgb-33v
**SKU**: MCT028D0W240320PMLIPS
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || LCD Displays || TFT LCD Displays
**Price**: €15.5700
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Description

Display Size:2.8"; Resolution:240 x 320 Pixels; VGA Size:QVGA; Display Orientation:Portrait; Display Appearance:RGB; Logic Voltage:3.3V; Interface Type:Parallel; Display Brightness:

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Vga Size | QVGA |
| Resolution | 240 x 320 Pixels |
| Module Size | 50.5mm x 69.7mm |
| Touchscreen | No Touchscreen |
| Display Size | 2.8" |
| Logic Voltage | 3.3V |
| Product Range | - |
| Display Pinout | 50 Way FFC |
| Interface Type | Parallel |
| Display Appearance | RGB |
| Display Brightness | 500cd/m² |
| Display Orientation | Portrait |
| Operating Temperature Max | 70°C |
| Operating Temperature Min | -20°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2664751/)

Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

|MCT028D0W240320PMLIPS|MCT028D0W240320PMLIPS|240 x 320|240 x 320|MutliInterface|TFTModule|
|---|---|---|---|---|---|
|**Specification **<br>(MDT0280A1IH-MULTI)||||||
|Version:    2|||Date:06/04/2021|||
|**Revision**||||||
|1<br>2|29/09/2019<br>06/04/2021||06/04/2021<br>First issue<br>Small corrections|||



~~|~~ Display Features ~~ee~~ Display Size 2.8” ~~es~~ Resolution 240 x 320 ~~Pn~~ Orientation ~~Va, «a.~~ Portrait ~~~\ Ree~~ Appearance ~~a 4 Pee 2~~ RGB ~~Pee~~ Logic Voltage ~~oe. er 7...~~ 3.3V Interface Multi Brightness 500 cd/m[2 ] ~~es~~ . Touchscreen --- ~~eS OD | ee~~ compliant ~~ee~~ Module Size 50.50 x 69.70 x 2.60mm ~~es~~ Operating Temperature -20°C ~ +70°C Pinout 50 way FFC Box Quantity Weight / Display ~~esrs Df~~ Pitch 0.5mm ----- 

- - For full design functionality, please use this 

|**Display Accessories**|**Display Accessories**||**Optional Variants**||
|---|---|---|---|---|
|**Part Number **|**Description **||**Appearances**|**Voltage**|
||Interconnect board that||||
|MPBV5 KIT|converts a 50-way FFC to||||
||50 crimp-wire connector.||||



Page 1 of 32 

## **Basic Specifications** 

## *** Description** 

This is a color active matrix TFT (Thin Film Transistor) LCD (liquid crystal display) that uses amorp hous silicon TFT as a switching device. This module is composed of a Transmissive type TFT-LCD P anel, driver circuit, capacitance touch panel, back-light unit. The resolution of a 2.8’TFT-LCD contains 240x320 pixels, and can display up to 65K/262K colors. 

## **1. TFT Features** 

|**General Information**<br>**Items**|**Specification**|**Unit**<br>mm|**Note**<br>-|
|---|---|---|---|
||**Main Panel**|||
|Display area(AA)|43.20(Ｈ)*57.60 (Ｖ)<br>(2.8inch)|||
|Driver element|TFT active matrix|-|-|
|Display colors|65K/262K|colors|-|
|Number of pixels|240(RGB)*320|dots|-|
|TFT Pixel arrangement|RGB vertical stripe|-|-|
|Pixel pitch|0.180(H)*0.180(V)|mm|-|
|Viewing angle|ALL|o'clock|-|
|TFT Controller IC|ST7789V|-|-|
|LCM Interface|8/9/16/18 Bit MCU<br>3/4SPI+16/18Bit RGB<br>3/4 Line Serial|-|-|
|Touch mode|Transmissive/ Normally black|||
|Operating temperature<br>—|-20～+70|℃|-|
|Storage temperature<br>—|-30～+80|℃|-|
|Module bonding technology<br>—|Use Tape bonding between LCM and CTP|-||



## **2. CTP Features** 

|**General Information**<br>**Items**|**Specification**|**Unit**|**Note**|
|---|---|---|---|
||**Main Panel**|||
|Resolution|240(H)*320(V)|-||
|Structure|G+G|-||
|Controller IC|FT5436|-||
|Interface|I2C|-||
|Slave Adress|0x38(7bit)/8bit:0x70(Write) 0x71(Read)|-||
|Touch mode|Five point and Gestures|-|-|



Page 2 of 32 

**3. Mechanical Information** 

**Item Min. Typ. Max. Unit Note** Horizontal(H) 50.50 mm - Module Vertical(V) 69.70 mm - size Depth(D) 4.36 mm - Weight 30 g - ~~.=S5SS>~~ **Block Diagram TOUCH TOUCH PANEL CONTROLLER I2C** HPS **LCD TFT LCD PANEL Input CONTROLLER Signal SOURCE DRIVER LEDA LEDK LED BACKLIGHT UNIT** ~~= [=~~ Page 3 of 32 

## **Outline dimension** 

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Page 4 of 32 

## **Input terminal Pin Assignment** 

## **1. TFT** 

|**1. TFT**||||
|---|---|---|---|
|NO.|SYMBOL|DISCRIPTION|I/O|
|1|GND|Ground.|P|
|2|XR(NC)|Touch panel Right Glass Terminal|A/D|
|3|YD(NC)|Touch panel Bottom Film Terminal|A/D|
|4|XL(NC)|Touch panel LIFT Glass Terminal|A/D|
|5|YU(NC)|Touch panel Top Film Terminal|A/D|
|6|IOVCC|Supply voltage for IO (1.65-3.3V).|P|
|7|IOVCC|Supply voltage for IO (1.65-3.3V).|P|
|8|VCI|Supply voltage (3.3V).|P|
|9|VCI|Supply voltage (3.3V).|P|
|10|IM2|MPU Parallel interface bus and serial interface<br>select If use RGB Interface must select serial interface.<br>Fix this pin at IOVCC and GND.|I|
|11|IM1|||
|12|IM0|||
|13|RESET|This signal will reset the device and must be applied to properly<br>initialize the chip.|I|
|14|CS|Chip select input pin (“Low” enable).<br>Fix this pin at IOVCC or GND when not in use.|I|
|15|RS(SPI-SCL)|This pin is used to select “Data or Command” in the parallel<br>interface. When RS = ‘1‘, data is selected. When RS = ‘0‘, command<br>is selected. This pin is used serial interface clock in 3-wire 9-bit / 4-<br>wire 8-bit serial data interface.<br>Fix this pin at IOVCC or GND when not in use.|I|
|16|WR(SPI-RS)|The data is applied on the rising edge of the SCL signal.<br>Fix this pin at IOVCC or GND when not in use.|I|
|17|RD|Serves as a read signal and MCU read data at the rising edge.<br>Fix this pin at IOVCC or GND when not in use|I|
|18|VSYNC|Frame synchronizing signal for RGB interface operation.<br>Fix this pin at IOVCC or GND when not in use.|I|
|19|HSYNC|Line synchronizing signal for RGB interface operation.<br>Fix this pin at IOVCC or GND when not in use.|I|



Page 5 of 32 

|20|ENABLE|Data enable signal for RGB interface operation.<br>Fix this pin at IOVCC or GND when not in use.|I|
|---|---|---|---|
|21|DOTCLK|Dot clock signal for RGB interface operation. Fix this pin at IOV<br>CC or GND when not in use.|I|
|22|SDA|Serial input signal.The data is applied on the rising edge of the SCL<br>signal.<br>If not used, fix this pin at IOVCC or GND.|I|
|23-40|DB0-DB17|Data bus.<br>If not used pin, fix this pin to GND.|I/O|
|41|SDO|SPI interface output pin.<br>-The data is output on the falling edge of the SCL signal.<br>-If not used, let this pin open.|O|
|42|GND|Ground.|P|
|43|LEDA|Anode pin of backlight|P|
|44|LEDK1|Cathode pin OF backlight|P|
|45|LEDK2|Cathode pin OF backlight|P|
|46|LEDK3|Cathode pin OF backlight|P|
|47|LEDK4|Cathode pin OF backlight|P|
|48|LEDK5|Cathode pin OF backlight|P|
|49|LEDK6|Cathode pin OF backlight|P|
|50|GND|Ground.|P|



Page 6 of 32 

## **LCD Optical Characteristics** 

## **1. Optical specification** 

|Item|Item|Item|Symbol|Condition|Min.|Typ.|Max.|Unit.|Note|
|---|---|---|---|---|---|---|---|---|---|
|Contrast Ratio|||CR|Θ=0<br>Normal viewing<br>angle|600|800|||(1)(2)|
|Response<br>time|Rising||TR+TF||--|30|40|msec|(1)(3)|
||Falling|||||||||
|Color gamut|||S(%)||60|65|--|%||
|Color Filter<br>Chromacicity||White|WX||0.237|0.277|0.317||(1)(4)<br>CF glass|
||||WY||0.256|0.296|0.336|||
|||Red|RX||0.577|0.617|0.657|||
||||RY||0.303|0.343|0.383|||
|||Green|GX||0.261|0.301|0.341|||
||||GY||0.545|0.585|0.625|||
|||Blue|BX||0.108|0.148|0.188|||
||||BY||0.012|0.052|0.092|||
|Viewing angle||Hor.|ΘL|CR>10|--|80|--||(1)(4)<br>Measuring<br>withPolarizer<br>Reference<br>Only|
||||ΘR||--|80|--|||
|||Ver.|ΘU||--|80|--|||
||||ΘD||--|80|--|||
|Option View Direction|||FREE||||||(5)|



## **2. Measuring Condition** 

■Measuring surrounding ： dark room 

## ■Ambient temperature ： 25±2 ℃ 

■15min. warm-up time. 

Page 7 of 32 

## **3. Measuring Equipment** 

■FPM520 of Westar Display technologies, INC., which utilized SR-3 for Chromaticity and BM-5A for other optical characteristics. 

Page 8 of 32 

Page 9 of 32 

## **Electrical Characteristics** 

## **1. Absolute Maximum Rating (Ta=25 VSS=0V)** 

|**Characteristics**|**Symbol**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Digital Supply Voltage|VCI/VDD|-0.3|4.6|**V**|
|Digital interface supple Voltage|IOVCC|-0.3|4.6|**V**|
|Operating temperature|TOP|-20|+70|℃|
|Storage temperature|TST|-30|+80|℃|



NOTE: If the absolute maximum rating of even is one of the above parameters is exceeded even momentarily, the quality of the product may be degraded. Absolute maximum ratings, therefore, specify the values exceeding which the product may be physically damaged. Be sure to use the product within the range of the absolute maximum ratings. 

## **2. DC Electrical Characteristics** 

|**Characteristics**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Note**|
|---|---|---|---|---|---|---|
|Digital Supply Voltage|VCI/VDD|2.4|3.3|3.6|V||
|Digital interface supple Voltage|IOVCC|1.65|1.8|3.3|V||
|Normal mode Current<br>consumption|IDD|--|8|16|mA||
|Level input voltage|VIH|0.7IOVCC||IOVCC|V||
||VIL|GND||0.3IOVCC|V||
|Level output voltage|VOH|0.8IOVCC||IOVCC|V||
||VOL|GND||0.2IOVCC|V||



Page 10 of 32 

## **3. LED Backlight Characteristics** 

## The back-light system is edge-lighting type with 6 chips White LED 

|**Item**|**Symbol**|**Min.**|**Typ.**|**Max.**|**Unit**|**Note**|
|---|---|---|---|---|---|---|
|Forward Current|IF|90|120|--|mA||
|Forward Voltage|VF|--|3.2|--|V||
|LCM Luminance|LV|550|600|--|cd/m2|Note3|
|LED life time|Hr|50000|--|--|Hour|Note1,2|
|Uniformity|AVg|80|--|--|﹪|Note3|



Note (1) LED life time (Hr) can be defined as the time in which it continues to operate under the condition: 

Ta=25±3 ℃ , typical IL value indicated in the above table until the brightness becomes less than 50%. Note (2) The “LED life time” is defined as the module brightness decrease to 50% original brightness at Ta=25 ℃ and IL=120mA. The LED lifetime could be decreased if operating IL is larger than 120mA. The constant current driving method is suggested. 

Page 11 of 32 

NOTE 3 ： Luminance Uniformity of these 9 points is defined as below: 

Total Luminance of 9 points Luminance= 9 

Page 12 of 32 

## **AC Characteristic** 

## **1. 8080 Series MCU Parallel Interface Timing Characteristics: 18/16/9/8-bit Bus** 

**Figure6-1-1 Parallel Interface Timing Characteristics (8080-Series MCU Interface)** 

_VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta= -30 to 70_ ℃ 

|**Signal**|**Symbol**|**Parameter**|**Min**|**Max**|**Unit**|**Description**|
|---|---|---|---|---|---|---|
|D/CX|TAST|Address setup time|0||ns||
||TAHT|Address hold time (Write/Read)|10||ns||
|CSX|TCHW|Chip select “H” pulse width|0||ns||
||TCS|Chip select setup time (Write)|15||ns||
||TRCS|Chip select setup time (Read ID)|45||ns||
||TRCSFM|Chip select setup time (Read FM)|355||ns||
||TCSF|Chip select wait time (Write/Read)|10||ns||
||TCSH|Chip select hold time|10||ns||
|WRX|TWC|Write cycle|66||ns||



Page 13 of 32 

|ee|TWRH<br>ee<br>a<br>a|Control pulse “H” duration<br>ee<br><br>|15<br>ee<br>ee<br><br>ee<br>|ee<br>eee<br><br>|ns<br>ee<br>eee<br><br>|ee|
|---|---|---|---|---|---|---|
||TWRL<br>ee<br>a<br>a<br>a|Control pulse “L” duration<br>ee<br>ee<br><br>|15<br>ee<br>ee<br>ee<br>ee<br><br>ee<br>|ee<br>eee<br>ee<br><br>|ns<br>ee<br>eee<br>ee<br><br>||
|RDX(ID)<br>ee|TRC<br>ee<br>a<br>a<br>a<br>a|Read cycle (ID)<br>ee<br><br>ee<br><br>|160<br>ee<br>ee <br><br>ee<br>ee<br>ee<br><br>ee<br>|ee<br> eee<br><br>ee<br><br>|ns<br>ee<br>eee<br><br>ee<br><br>|When read ID data<br>ee|
||TRDH<br>a<br>a<br>a<br>a|Control pulse “H” duration (ID)<br>ee<br>ee<br><br>|90<br>ee<br>ee<br>ee<br>ee<br>ee<br><br>ee<br>|ee<br>ee<br><br>|ns<br>ee<br>ee<br><br>||
||TRDL<br>a<br>aee<br>a|Control pulse “L” duration (ID)<br>ee<br>ee<br>|45<br>ee<br>ee<br>ee<br>ee<br>ee<br>|ee<br>ee<br>|ns<br>ee<br>ee<br>||
|RDX(FM)|TRCFM<br>a|Read cycle (FM)<br>ee|450<br>ee<br>ee|ee|ns<br>ee|When read from<br>frame memory|
||TRDHFM<br>a<br>a|Control pulse “H” duration(FM)<br>|90<br>ee<br>||ns<br>||
||TRDLFM<br>a<br>a|Control pulse “L” duration(FM)<br>ee<br>|355<br>ee<br>ee<br>|ee<br>|ns<br>ee<br>||
|DB[17:0]<br>YT|TDST<br>a|Data setup time<br>ee|10<br>ee<br>ee|ee|ns<br>ee|For CL=30pF|
||TDHT<br>a<br>a|Data hold time<br>ee<br>ee|10<br>ee<br>ee<br>ee|ee<br>ee|ns<br>ee<br>ee||
||TRAT<br>a|Read access time (ID)<br>ee|ee|40<br>ee|ns<br>ee||
||TRATFM<br>a<br>YT<br>TN|Read access time (FM)<br>ee<br>TN|ee<br>A|340<br>ee<br>Cc|ns<br>ee<br>Cc<br>|||
||TODH<br>a<br>YT<br>TN|Output disable time<br>ee<br>TN<br>AtT=™|!||20<br>ee<br>AtT=™|!|<br>A|80<br>ee<br>AtT=™|!|<br>Cc|ns<br>ee<br>AtT=™|!|<br>Cc<br>|||



**Figure6-1-2 Rising and Falling Timing for I/O Signal** 

**==> picture [531 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
VIH VIH<br>WRX<br>VIL | | VIL<br>QL NO.<br>——_—_—_—_—_____— l VIH | >—————_<br>RDX TWRH VIL TRDH<br>**----- End of picture text -----**<br>


**Figure6-1-3 Write-to-Read and Read-to-Write Timing** 

_Note: The rising time and falling time (Tr, Tf) of input signal and fall time are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals._ 

Page 14 of 32 

## **2. Display Serial Interface Timing Characteristics (3-line SPI system)** 

**Figure6-2-1 3-line serial Interface Timing Characteristics** 

_VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta= -30 to 70_ ℃ 

|**Signal**|**Symbol**|**Parameter**|**Min**|**Max**|**Unit**|**Description**|
|---|---|---|---|---|---|---|
|**Signal**<br>CSX|**Symbol**<br>TCSS|Chip select setup time (Write)|15||ns|**Description**|
||TCSH|Chip select hold time (write)|15||ns||
||TCSS|Chip select setup time (read)|60||ns||
||TSCC|Chip select hold time (read)|65||ns||
||TCHW|Chip select “H” pulse width|40||ns||
|SCL|TSCYCW|Serial clock cycle (Write)|66||ns||
||TSHW|SCL “H” pulse width (Write)|15||ns||
||TSLW|SCL “L” pulse width (Write)|15||ns||
||TSCYCR|Serial clock cycle (Read)|150||ns||
||TSHR|SCL “H” pulse width (Read)|60||ns||
||TSLR|SCL “L” pulse width (Read)|60||ns||
|SDA<br>(DIN)|TSDS|Data setup time|10||ns||
||TSDH|Data hold time|10||ns||
|DOUT|TACC|Access time|10|50|ns|For maximum CL=30pF<br>For minimum CL=8pF|
||TOH|Output disable time|15|50|ns||



**Table6-2-1 3-line serial Interface Characteristics** 

_Note: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals._ 

Page 15 of 32 

## **3. Display Serial Interface Timing Characteristics (4-line SPI system)** 

**Figure6-3-1 4-line serial Interface Timing Characteristics** 

_VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta= -30 to 70_ ℃ 

|**Signal**|**Symbol**|**Parameter**|**Min**|**Max**|**Unit**|**Description**|
|---|---|---|---|---|---|---|
|CSX|TCSS|Chip select setup time (Write)|15||ns||
||TCSH|Chip select hold time (write)|15||ns||
||TCSS|Chip select setup time (read)|60||ns||
||TSCC|Chip select hold time (read)|65||ns||
||TCHW|Chip select “H” pulse width|40||ns||
|SCL|TSCYCW|Serial clock cycle (Write)|66||ns|-write command & data<br>ram|
||TSHW|SCL “H” pulse width (Write)|15||ns||
||TSLW|SCL “L” pulse width (Write)|15||ns||
||TSCYCR|Serial clock cycle (Read)|150||ns|-read command & data<br>ram|
||TSHR|SCL “H” pulse width (Read)|60||ns||
||TSLR|SCL “L” pulse width (Read)|60||ns||
|D/CX|TDCS|D/CX setup time|10||Ns||
||TDCH|D/CX hold time|10||ns||
|SDA|TSDS|Data setup time|10||ns||
|(DIN)|TSDH|Data hold time|10||ns||
|DOUT|TACC|Access time|10|50|ns|For maximum CL=30pF<br>For minimum CL=8pF|
||TOH|Output disable time|15|50|ns||



**Table6-2-1 4-line serial Interface Characteristics** 

_Note: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals._ 

Page 16 of 32 

## **4. Parallel RGB Interface Timing Characteristics** 

**Figure6-4-1 RGB Interface Timing Characteristics** _VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta= -30 to 70_ ℃ 

|**Signal**|**Symbol**|**Parameter**|**Min**|**Max**|**Unit**|**Description**|
|---|---|---|---|---|---|---|
|HSYNC,<br>VSYNC|TSYNCS|VSYNC, HSYNC Setup Time|30||ns||
|ENABLE|TENS|Enable Setup Time|25||ns||
||TENH|Enable Hold Time|25||ns||
|DOTCLK|PWDH|DOTCLK High-level Pulse Width|60||ns||
||PWDL|DOTCLK Low-level Pulse Width|60||ns||
||TCYCD|DOTCLK Cycle Time|120||ns||
||Trghr<br>Trghf|DOTCLK Rise/Fall time||20|ns||
|DB|TPDS|PD Data Setup Time|50||ns||
||TPDH|PD Data Hold Time|50||ns||



**Table6-4-1 18/16 Bits RGB Interface Timing Characteristics** 

Page 17 of 32 

## **5. Reset Timing Characteristics** 

**Figure6-5-1 Reset Timing** 

_VDDI=1.65 to 3.3V, VDD=2.4 to 3.3V, AGND=DGND=0V, Ta= -30 to 70_ ℃ 

|**Signal**|**Symbol**|**Parameter**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|---|
|RESX|TRW|Reset pulse duration|10||us|
||TRT|Reset cancel||5 (Note 1, 5)|ms|
|||||120 (Note 1, 6, 7)|ms|



_Notes:_ 

_1. The reset cancel includes also required time for loading ID bytes, VCOM setting and other settings from NVM (or similar device) to registers. This loading is done every time when there is HW reset cancel time (tRT) within 5 ms after a rising edge of RESX._ 

_2. Spike due to an electrostatic discharge on RESX line does not cause irregular system reset according to the table_ 

_below:_ 

|RESX|Action|
|---|---|
|Shorter than 5us|Reset Rejected|
|Longer than 9us|Reset|
|Between 5us and 9us|Reset starts|



_3. During the Resetting period, the display will be blanked (The display is entering blanking sequence, which_ 

_maximum time is 120 ms, when Reset Starts in Sleep Out –mode. The display remains the blank state in Sleep In –mode.) and then return to Default condition for Hardware Reset._ 

_4. Spike Rejection also applies during a valid reset pulse as shown below:_ 

_5. When Reset applied during Sleep In Mode._ 

_6. When Reset applied during Sleep Out Mode._ 

_7. It is necessary to wait 5msec after releasing RESX before sending commands. Also Sleep Out command cannot_ 

_be sent for 120msec._ 

Page 18 of 32 

## **CTP Specification** 

## **1. Electrical Characteristics** 

## **1.1 Absolute Maximum Rating** 

|**Item**|**Symbol**|**Min.**|**Max.**|**Unit**|**Note**|
|---|---|---|---|---|---|
|Power Supply Voltage|VDD|2.7|3.6|V|--|
|I/O Digital Voltage|VDDIO|1.8|3.6|V|--|



## **1.2 DC Electrical Characteristics (Ta=25** ℃ **)** 

|**Item**|**Min.**|**Typ.**|**Max.**|**Unit**|**Note**|
|---|---|---|---|---|---|
|Power Supply Voltage/VDD|2.7|3.3|3.47|V||
|I/O Digital Voltage/VDDIO|1.8|-|3.6|||
|Normal mode operating current|--|11|--|mA||
|Sleep mode operating current|--|42|--|uA||
|Monitor mode operating current|--|0.43|--|mA||
|Digital Input low voltage/VIL|-0.3|--|0.3*VDDIO|V||
|Digital Input high voltage/VIH|0.7*VDDIO|--|VDDIO|V||
|Digital Output low voltage/VOL|--|--|0.3*VDDIO|V||
|Digital Output high voltage/VOH|0.7*VDDIO|--|--|V||



Page 19 of 32 

## **1.3 AC Characteristics** 

## **2. POWER ON/Reset Sequence** 

Page 20 of 32 

**==> picture [337 x 228] intentionally omitted <==**

**----- Start of picture text -----**<br>
I  I<br>!  !<br>I  I<br>I  I<br>I  I<br>I  I<br>I  I<br>0. :IV  ------------------------- -- ------------------------<br>Power aw Ane<br>Figure 3-4 Power Cycle requirement<br>•  1, _Trtp.<br>rvc1r ' I I I  I I I I<br>I  I<br>VD ' | _ i<br>Reset —_ NN i!p3} \<br>M<br>I2C  ! X x<br>Figure 3-5 Power on Sequence<br>**----- End of picture text -----**<br>


|Reset time must be enough to guarantee reliable reset|Reset time must be enough to guarantee reliable reset|Reset time must be enough to guarantee reliable reset,the time of starting to report point after resetting|Reset time must be enough to guarantee reliable reset,the time of starting to report point after resetting|the time of starting to report point after resetting|the time of starting to report point after resetting|the time of starting to report point after resetting|
|---|---|---|---|---|---|---|
|approach to the time ef starting to report point aer ROWeringon.<br>f~~i~~|||||=||
|||**Tni **<br>| ~~+--+~~|||>||
|||1<br>i]|||||
||I<br>I<br>I<br>I<br>I<br>I<br>~~·~~<br>~~u~~<br>1<br>Power “A~~a~~<br>~~aS~~<br>se. SS SS<br>Reset<br>t||||||
||INT||||||
||12C|~~a.~~<br>~~E> Ce~~|||||
|||**Table 3-5 Power on/Reset Sequence Parameters**|||||
|**Parameter**||**Description**||**Min**|**Max**|**Units**|
|Tris|Rise time from 0.1|me from 0.1vob||..|5|ms|
|Tpdt|Time of thevoltage of supply being below 0.3V|||5|..|ms|
|Trtp|Time of resetting to be low before powering on|||100|..|**µS**|
|Tvdr|Reset time after VDD powering on|||1|..|ms|
|Trsi|Time of starting to report point after resetting|||..|200|ms|
|Trst|Re\et time|||1|~~--~~|ms|



Page 21 of 32 

## **3. I2C Timing** 

FT5436 supports the I2C interfaces, which can be used by a host processor or other devices. The I2C is always configured in the Slave mode. The data transfer format is shown in **Figure 2-4.** 

Page 22 of 32 

|**Mnemonics**<br>s|**Descriotion**<br>**12C Start or 12C Restart**|
|---|---|
|**A[6:0)**|**Slave address**|
|**R/W**|**READ/WRITE bit, '1' for read, '0'for write**|
|**A(N)**|**ACK(NACK) bit**<br>**STOP: the indication of the end of a packet (if this bit is missing, S will indicate**|



## **12C Interface Timing Characteristics is shown in Table 2 -2.** 

**Table 2-2 12C Timing Characte,-istcs Parameter Min Max Unit** ~~eeeee~~ eee ~~=e p~~ **SCL frequency** ~~O~~ **0 KHz** ~~p~~ **Bus free time between a STOP and START condition** ~~O~~ **Hold time (repeated) START condition** ~~a~~ BEAN fs **Data setup time** ~~es~~ eee Be... SN om. **Setup time for a** ~~|~~ ) ee / eee WE a See **Setup Time for STOP co'! ..** ~~a tepeated~~ START condition | GY | nus 

Page 23 of 32 

## **LCD Module Out-Going Quality Level** 

## **1. VISUAL & FUNCTION INSPECTION STANDARD** 

## **1.1 Inspection conditions** 

Inspection performed under the following conditions is recommended. 

Temperature : 25±5 ℃ 

Humidity : 65%±10%RH 

Viewing Angle : Normal viewing Angle. Illumination: Single fluorescent lamp (300 to 700Lux) Viewing distance:30-50cm 

**==> picture [232 x 90] intentionally omitted <==**

**----- Start of picture text -----**<br>
Upper<br>aAS Polarizer<br>ME N<br>Bottom glass Upper Glas<br>Bottom Polarizer<br>Light Source<br>**----- End of picture text -----**<br>


## **1.2 Definition** 

**==> picture [300 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zone D<br>SSSss9|<br>Zone B ECEECEEERECCcorrrPccocococococococococococoME‘onseeessseesseee ECEEeeeeeseeseee eee eeei”/:ii?im/:/:/:/:/:/:/:/:/:/:i” Zone ZoneA C<br>**----- End of picture text -----**<br>


Zone A : Effective Viewing Area(Character or Digit can be seen) 

Zone B : Viewing Area except Zone A 

Zone C : Outside (Zone A+Zone B) which can not be seen after assembly by customer .) 

Zone D : IC Bonding Area 

Note: 

As a general rule ,visual defects in Zone C can be ignored when it doesn’t effect product function or ap pearance after assembly by customer 

Page 24 of 32 

## **1.3 Sampling Plan** 

According to GB/T 2828.1-2003 ; , normal inspection, Class Ⅱ AQL: 

|**No**|**Items to be inspected**|**Criteria**|**Classification of defect**<br>**s**|
|---|---|---|---|
|1|Functional defects|1) No display, Open or miss line<br>2) Display abnormally, Short<br>3) Backlight no lighting, abnormal lighting.<br>4) TP no function|Major|
|2|Missing|Missing component||
|3|Outline dimension|Overall outline dimension beyond the drawi<br>ng is not allowed||
|4|Color tone|Color unevenness, refer to limited sample|Minor|
|5|Spot Line defect|Light dot，Dim spot,Polarizer<br>Bubble ;<br>Polarizer accidented spot.||
|6|Soldering appearance|Good soldering , Peeling off is not allowed.||
|7|LCD/Polarizer/TP|Black/White spot/line, scratch, crack, etc.||



Page 25 of 32 

## **1.4 Criteria (Visual)** 

|Number|Items|Criteria(mm)|
|---|---|---|
|1.0<br>LCD<br>Crack/Broken<br>NOTE:<br>X: Length<br>Y: Width<br>Z: Height<br>L: Length of IT<br>O,<br>T: Height of LCD<br>Nip)|(1) The edge of LCD<br>broken<br>Le<br>Nip)|X<br>Y<br>Z<br>≤3.0mm<br><Inner border line of t<br>he seal<br>≤T<br>y<br>rae<br>~<br>Le<br>Nip)|
||(2)LCD corner broken<br>Nip)|X<br>Y<br>Z<br>≤3.0mm<br>≤L<br>≤T<br>Nip)<br>~<br>A|
||(3) LCD crack<br>Nip)|Crack<br>Not<br>allowed<br>Nip)<br>Ss<br>SS|



Page 26 of 32 

Spot defect ① light dot（LCD/TP/Polarizer black/white spot , light dot, pinhole, dent, stain） Acceptable Qty Zone Y A B C Size (mm) Φ≤0.10 Ignore 0.10<Φ≤0.25 3( distance ≧ 10mm) X Ignore 0.25<Φ≤0.3 2 Φ>0.35 0 Φ=(X+Y)/2 ② Dim spot（LCD/TP/Polarizer dim dot, light leakage、dark spot） Acceptable Qty Zone A B C Size (mm) Φ≤0.1 Ignore 0.10<Φ≤0.25 3( distance ≧ 10mm) Ignore 0.25<Φ≤0.3 2 Φ>0.35 0 ③ Polarizer accidented spot Acceptable Qty Zone A B C Size (mm) Φ≤0.2 Ignore 2.0 0.3<Φ≤0.5 2( distance ≧ 10mm) Ignore Φ>0.5 0 = ④ Pixel bad points（light dot ， Dim dot , color dot ） Acceptable Qty Zone A B C Size (mm) Φ≤0.1 Ignore 0.15<Φ≤0.25 2( distance ≧ 10mm) Ignore Φ>0.3 0 ⑤ Polarizer Bubble Acceptable Qty Zone Size (mm) A B C Φ≤0.2 Ignore 0.3<Φ≤0.4 3(distance ≧ 10mm) Ignore 0.5<Φ≤0.6 2 =———0.6<Φ 0[a] Page 27 of 32 

Length(m Acceptable Qty Line defect (LCD/ Width(mm) m) A B C TP Φ≤0.05 Ignore Ignore /Polarizer backligh 3.0 0.05<W≤0.06 L≤4.0 N≤3 Ignore t black/white line, 0.07<W≤0.08 L≤3.0 N≤2 scratch, stain) 0.08<W Define as spot defect 4.0 Electronic Comp Not allow missing parts ， solderless connection ， cold solder joint ， misma tch ， The positive and negative polarity opposite onents SMT = 5.0 1. Color ： Measuring the color coordinates, The measurement standard Display color& B according to the datasheet or samples. 2. Brightness ： Measuring the brightness of White screen, The measure rightness ment standard according to the datasheet or Samples. 6.0 LCD Mura By 5% ND filter invisible. |Minas CTP Cover — Acceptable Qty Size Φ(mm) sensor acc A B C CTP idented Φ≤0.1 Ignore Related 7.0 black/white 0.1<Φ≤0.2 3（distance ≧ 10mm） spot 0.20<Φ≤0.25 2 Ignore Φ＞0.3 0 Ignore Acceptable Qty Width(mm) CTP Cover (mm) A B C Φ≤0.05 Ignore Ignore 0.05<W≤0.06 L≤4.0 N≤3 scratch 0.07<W≤0.08 L≤3.0 N≤2 0.08<W Define as spot defect ji==> Page 28 of 32 

Acceptable Qty Zone C CTP Cover Size (mm) Pinhole/ L Φ≤0.1 Ignore ack of ink 0.1<Φ≤0.2 3(distance ≧ 10mm) 0.25<Φ≤0.3 2 Φ>0.35 0 = Acceptable Qty CTP Bondi Size Φ(mm) A B ng bubble/ Φ≤0.1 Ignore accidented 0.15<Φ≤0.2 3(distance ≧ 10mm） spot 0.2<Φ≤0.25 2 Φ>0.25 0 Assembly beyond the edge of backlight ≤0.2mm deflection X Y Z Y TP cover b X Z<cover t roken X≤0.5mm Y≤0.5mm hicknes Z X：length s Y：width * Z：height Circuitry broken is not allowed. X Y Z Y X TP cover b Z<LCD Z roken X≤0.3mm Y≤0.3mm thicknes X：length s Y：width * Circuitry broken is not allowe Z：height d. :[oe] ~~T~~ Criteria ( functional items) e Number Items Criteria (mm) 1 No display Not allowed 2 Missing segment Not allowed 3 Short Not allowed 4 Backlight no lighting Not allowed 5 TP no function Not allowed ~~P~~ fft Page 29 of 32 

Page 30 of 32 

## **Reliability Test Result** 

|**Item**|**Condition**|**Inspection after test**|
|---|---|---|
|High Temperature Operating|70℃,96H|Inspection after 2~4hours storage<br>at room temperature, the sample<br>shall be free from defects:<br>1.Air bubble in the LCD;<br>2.Non-display;<br>3.Missing segments/line;<br>4.Glass crack;<br>5.Current IDD is twice higher than<br>initial value.|
|Low Temperature Operating|-20℃, 96HR||
|High Temperature Storage|80℃, 96HR||
|Low Temperature Storage|-30℃, 96HR||
|High Temperature & High<br>Humidity Operating|+60℃, 90% RH ,96 hours.||
|Thermal Shock (Non-operation)|-10℃,30 min ↔60℃,30 min,<br>Change time:5min 20CYC.||
|ESD test|C=150pF, R=330,5points/panel<br>Air:±8KV, 5times; Contact:±6KV, 5 times;<br>(Environment: 15℃~35℃, 30%~60%).||
|Vibration (Non-operation)|Frequency range:10~55Hz, Stroke:1.5mm<br>Sweep:10Hz~55Hz~10Hz 2 hours for each direction of<br>X.Y.Z. (6 hours for total) (Package condition).||
|Box Drop Test|1 Corner 3 Edges 6 faces,80㎝(MEDIUM BOX)||



Remark: 

1.The test samples should be applied to only one test item. 

2.Sample size for each test item is 5~10pcs. 

3.For Damp Proof Test, Pure water(Resistance ＞ 10M Ω ) should be used. 

4.In case of malfunction defect caused by ESD damage, if it would be recovered to normal state after resetting, it would be judged as a good part. 

5.Failure Judgment Criterion: Basic Specification, Electrical Characteristic, Mechanical Characteristic, Optical Characteristic. 

6. The color fading mura of polarizing filter should not care. 

Page 31 of 32 

## **Cautions and Handling Precautions** 

## **1. Handling and Operating the Module** 

- (1) When the module is assembled, it should be attached to the system firmly. 

Do not warp or twist the module during assembly work. 

- (2) Protect the module from physical shock or any force. In addition to damage, this may cause improper operation or damage to the module and back-light unit. 

- (3) Note that polarizer is very fragile and could be easily damaged. Do not press or scratch the surface. 

- (4) Do not allow drops of water or chemicals to remain on the display surface. 

If you have the droplets for a long time, staining and discoloration may occur. 

- (5) If the surface of the polarizer is dirty, clean it using some absorbent cotton or soft cloth. 

- (6) The desirable cleaners are water, IPA (Isopropyl Alcohol) or Hexane. 

Do not use ketene type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. It might permanent damage to the polarizer due to chemical reaction. 

- (7) If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth. In case of contact with hands, legs, or clothes, it must be washed away thoroughly with soap. 

- (8) Protect the module from static; it may cause damage to the CMOS ICs. 

- (9) Use finger-stalls with soft gloves in order to keep display clean during the incoming inspection and assembly process. 

- (10) Do not disassemble the module. 

- (11) Protection film for polarizer on the module shall be slowly peeled off just before use so that the electrostatic charge can be minimized. 

- (12) Pins of I/F connector shall not be touched directly with bare hands. 

- (13) Do not connect, disconnect the module in the “Power ON” condition. 

- (14) Power supply should always be turned on/off by the item 6.1 Power On Sequence &6.2 Power Off Sequence 

## **2. Storage and Transportation.** 

- (1) Do not leave the panel in high temperature, and high humidity for a long time. 

It is highly recommended to store the module with temperature from 0 to 35 ℃ and relative humidity of less than 70% 

- (2) Do not store the TFT-LCD module in direct sunlight. 

- (3) The module shall be stored in a dark place. When storing the modules for a long time, be sure to adopt effective measures for protecting the modules from strong ultraviolet radiation, sunlight, or fluorescent light. 

- (4) It is recommended that the modules should be stored under a condition where no condensation is allowed. Formation of dewdrops may cause an abnormal operation or a failure of the module. 

In particular, the greatest possible care should be taken to prevent any module from being operated where condensation has occurred inside. 

- (5) This panel has its circuitry FPC on the bottom side and should be handled carefully in order not to be stressed. 

Page 32 of 32 



## Links

- [View this product on Novapart](https://novapart.co/products/MCT028D0W240320PMLIPS/tft-lcd-28-240-x-320-pixels-qvga-portrait-rgb-33v)
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---

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