# Graphic OLED, 256 x 64 Pixels, Yellow on Black, 2.5V, Parallel, SPI, 146mm x 45mm, -40 °C

![Product image](https://novapart.co/image/farnell:4685238/)

**URL**: https://novapart.co/products/MCOT256064CY-YM/graphic-oled-256-x-64-pixels-yellow-on-black-25v
**SKU**: MCOT256064CY-YM
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || OLED Displays || Graphic OLED Displays
**Price**: €72.0600
**Stock**: 25+
**Lead Time**: 92 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Resolution | 256 x 64 Pixels |
| Module Size | 146mm x 45mm |
| Logic Voltage | 2.5V |
| Product Range | - |
| Interface Type | Parallel, SPI |
| Display Appearance | Yellow on Black |
| Display Construction | COT |
| Operating Temperature Max | 70°C |
| Operating Temperature Min | -40°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4685238/)

Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

|MCOT256064CY-YM|MCOT256064CY-YM||256x 64|x 64|x 64|x 64|Yellow|
|---|---|---|---|---|---|---|---|
||||||||**Specification**|
|Version:1||1|||||Date: 27/05/2019|
||||||||**Revision**|
|1||15/11/2013|||||First Release.|
|2||24/05/2019||24/05/2019|||Updated AC Characteristics|



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256 x 64<br>Yellow on Black<br>2.5V<br>40 © a<br>Parallel / SPI<br>PO 146.00 x 45.00 x 2.00 mm<br>-40°C ~ +70°C<br>Po<br>**----- End of picture text -----**<br>


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-40°C ~ +70°C<br>Operating Temperature Po Box Quantity<br>OTY<br>[ C onstruction<br>**----- End of picture text -----**<br>


## * - For full design functionality, please use this 

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Interconnect board for standard pitch pinouts  White on Black<br>MDIB-CC1 to fine pitch wires. Providing pinouts for 2.54  Blue on Black<br>pinout. 1.27, 1, 0.845, 0.8, 0.7, 0.65, 0.62,<br>0.6, 0.5 & 0.3 pads.<br>**----- End of picture text -----**<br>


Page 1 of 23 

## **Basic  Specifications** 

## **1. Display Specifications** 

- 1) Display Mode: Passive Matrix 2) Display Color: Monochrome with 16 Gray Scales (Yellow) 3) Drive Duty: 1/64 Duty 

## **2. Mechanical Specifications** 

- 1) Outline Drawing: According to the annexed outline drawing 

- 2) Number of Pixels: 256 × 64 

- 3) Module Size: 146.00 × 65.00 × 2.00 (mm) 4) Panel Size: 146.00 × 45.00 × 2.00 (mm) including “Anti-Glare Polarizer” 5) Active Area: 135.65 × 33.89 (mm) 

- 6) Pixel Pitch: 0.53 × 0.53 (mm) 7) Pixel Size: 0.50 × 0.50 (mm) 8) Weight: 27.1 (g) ±10% 

## **3. Active Area / Memory Mapping & Pixel Construction** 

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P0.53x256-0.03=135.65 (A/A)<br>(0, 0) "A" (112, 0)<br>1 N ™“ = Driver IC Memory Mapping<br>(256  x  64 in 480  x  128)<br>f | y | im Segment 112 ri Segment 367 - (367, 63)<br>(  Column 1  ) (  Column 256  )<br>Segment 239 Segment 240<br>(  Column 128  ) (  Column 129  )<br>Common A0 Common B0<br>(  Row 64  ) (  Row 64  )<br>Common A63 Common B63<br>(  Row 1  ) (  Row 1  )<br>0.53<br>0.5<br>iol<br>ry<br>Detail "A"<br>Scale (5:1)<br>P0.53x64-0.03=33.89 (A/A)<br>0.53 0.5<br>**----- End of picture text -----**<br>


Page 2 of 23 

## **4. Mechanical Drawing** 

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**----- Start of picture text -----**<br>
0.5<br>(46.5) 0.53<br>(38.1) (1.5)<br>(29.1)<br>[ i i Tf,<br>bo 1<br>4±0.5 (Stiffener)<br>Glue<br>Remove Tape Polarizer Contact Side<br>t=0.15mm Max t=0.2mm<br>8<br>3<br>(2.5) P0.53x64-0.03=33.89 (A/A) 4.65<br>(1.5) 35.89 (V/A) 9<br>0.5±0.5 39.5±0.3 (Polarizer) 9.5<br>43±0.3 (Cap Size) 10.62<br>45±0.3 (Panel Size) 20±0.3<br>(65)<br>Rev. A Size A3<br> ) Row 64  )(   ) Row 1 (  Symbol N.C. (GND) VSS VCC VCOMH VLSS D7 D6 D5 D4 D3 D2 D1 D0 E/RD# R/W# BS0 BS1 D/C# CS# RES# FR IREF N.C. VDDIO VDD VCI VSL VLSS VCC N.C. (GND) Sheet 1 of 1<br>Segment 367 Column 256 (  Common B0 Common B63 Material<br>Remark  )<br>Original Drawing Segment 240 Column 129 (  Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Drawing Number Soda Lime / Polyimide Scale 1:1<br>Segment 239 Column 128  )(<br> ) P.M.<br>Date Segment 112 Column 1 (  Common A0 Row 64  )(  Common A63  ) Row 1 (  Tiffany Hsu 20111206<br>20111206<br>Detail "A" Scale (5:1)<br>0.53 0.5<br>Ivy Lo<br>A Panel / E. 20111206<br>Item<br>(2.6)<br>MCOT256064CY-YM E.E.<br>2±0.1 0.3±0.3 0.80 Max 20111206<br>Ting-Kuo Hu<br>Drawn<br>Dora Yang 20111206<br>5 Title By Date<br>mm ±0.30 ±1<br>10 Tolerance<br>Unit Angle<br>Unless Otherwise Specified General Roughness Dimension<br>Signature<br>2-R0.5±0.05<br>Customer Approval<br>30<br>137.65 (V/A)  64 Pixels x W=0.3±0.03 15.5±0.2 60±0.2<br>146±0.3 (Panel Size) 146±0.3 (Cap Size) 145±0.3 (Polarizer) 1 P0.50x(30-1)=14.5±0.05<br>256  40±0.1 (Alignment Hole)<br>P0.53x256-0.03=135.65 (A/A) Active Area 5.50"<br>(43)<br>"A"<br>0.5±0.5 (4.18) (5.18)<br>8-bit 68XX/80XX Parallel, 3-/4-wire SPI<br>Notes: 1. Color: Yellow 2. Driver IC: SSD1322 3. Die Size: 12374um x 1526um 4. COF Number: SSD1322U 5. Interface: 6. General Tolerance: ±0.30 7. The total thickness (2.10 Max) is without polarizer protective film & remove tape.    The actual assembled total thickness with above materials should be 2.35 Max.<br>N.C. (GND)N.C. (GND)V COMHVDDIOE /RD#V LSSV LSSR/W#RE S#I REFVDDD /C#V CCV CCN.C.V SLV SSV CICS#BS1BS0D0D1D2D3D4D5D6D7FR<br>**----- End of picture text -----**<br>


Page 3 of 23 

## **5. Pin Definition** 

|**Pin Definition**||||
|---|---|---|---|
|**Pin Number**|**Symbol**|**I/O**|**Function**|
|**Power Supply**||||
|26<br>25<br>24<br>2<br>3, 29<br>5, 28|VCI<br>VDD<br>VDDIO<br>VSS<br>VCC<br>VLSS|P<br>P<br>P<br>P<br>P<br>P<br>~~S~~|**Power Supply for Operation**<br>This is a voltage supply pin.  It must be connected to external source & should be<br>equal to or higher than VDD& VDDIO.<br>**Power Supply for Core Logic Circuit**<br>This is a voltage supply pin.  It can be supplied externally (within the range of<br>2.4~2.6V) or regulated internally from VCI.<br>A capacitor should be connected between this pin & VSSunder all circumstances.<br>**Power Supply for I/O Pin**<br>This pin is a power supply pin of I/O buffer.  It should be connected to VCIor<br>external source.  All I/O signal should have VIHreference to VDDIO.  When I/O<br>signal pins (BS0~BS1, D0~D7, control signals…) pull high, they should be<br>connected to VDDIO.<br>**Ground of Logic Circuit**<br>This is a ground pin.  It also acts as a reference for the logic pins.  It must be<br>connected to external ground.<br>**Power Supply for OEL Panel**<br>These are the most positive voltage supply pin of the chip.  They must be<br>connected to external source.<br>**Ground of Analog Circuit**<br>These are the analog ground pins.  They should be connected to VSSexternally.<br>~~S~~o|
|**Driver**<br>~~SPrresre—~~||||
|22<br>4<br>27<br>~~SPrresre~~|IREF<br>VCOMH<br>VSL<br>~~SPrresre~~|I<br>P<br>P<br>~~SPrresre~~|**Current Reference for Brightness Adjustment**<br>This pin is segment current reference pin.  A resistor should be connected<br>between this pin and VSS.  Set the current at 10μA maximum.<br>**Voltage Output High Level for COM Signal**<br>This pin is the input pin for the voltage output high level for COM signals.<br>A tantalum capacitor should be connected between this pin and VSS.<br>**Voltage Output Low Level for SEG Signal**<br>This is segment voltage reference pin.<br>When external VSLis not used, this pin should be left open.<br>When external VSLis used, this pin should connect with resistor and diode to<br>ground.<br>~~SPrresre—~~|
|**Testing Pads**<br>~~SPrresre—~~||||
|21<br>~~SPrresre~~|FR<br>~~SPrresre~~|O<br>~~SPrresre~~|**Frame Frequency Triggering Signal**<br>This pin will send out a signal that could be used to identify the driver status.<br>Nothing should be connected to this pin.  It should be left open individually.<br>~~SPrresre—~~|
|**Interface**<br>~~SPrresre —~~||||
|16<br>17<br>20<br>19<br>18|BS0<br>BS1<br>RES#<br>CS#<br>D/C#|I<br>I<br>I<br>I|**Communicating Protocol Select**<br>These pins are MCU interface selection input.  See thefollowing table:<br>BS0<br>BS1<br>3-wire Serial<br>1<br>0<br>4-wire Serial<br>0<br>0<br>8-bit 68XX Parallel<br>1<br>1<br>8-bit 80XX Parallel<br>0<br>1<br>**Power Reset for Controller and Driver**<br>This pin is reset signal input.  When the pin is low, initialization of the chip is<br>executed.  Keep this pin pull high during normal operation.<br>**Chip Select**<br>This pin is the chip select input.<br>The chip is enabled for MCU communication only when CS# is pulled low.<br>**Data/Command Control**<br>This pin is Data/Command control pin.  When the pin is pulled high, the input at<br>D7~D0 is treated as display data.  When the pin is pulled low, the input at D7~D0<br>will be transferred to the command register.<br>When the pin is pulled high and serial interface mode is selected, the data at SDIN<br>is treated as data.  When it is pulled low, the data at SDIN will be transferred to<br>the command register.<br>When 3-wire serial mode is selected, this pin must be connected to VSS.<br>For detail relationship to MCU interface signals, please refer to the Timing<br>CharacteristicsDiagrams.|



Page 4 of 23 

## **5. Pin Definition (Continued)** 

|**Pin Number**|**Symbol**|**I/O**|**Function**|
|---|---|---|---|
|**Interface (Continued)**<br>14<br>E/RD#<br>I<br>**Read/Write Enable or Read**<br>This pin is MCU interface input.  When interfacing to a 68XX-series<br>microprocessor, this pin will be used as the Enable (E) signal. Read/write operation<br>is initiated when this pin is pulled high and the CS# is pulled low.<br>When connecting to an 80XX-microprocessor, this pin receives the Read (RD#)<br>signal.  Data read operation is initiated when this pin is pulled low and CS# is<br>pulled low.<br>When serial mode is selected, this pin must be connected to VSS.<br>15<br>R/W#<br>I<br>**Read/Write Select or Write**<br>This pin is MCU interface input.  When interfacing to a 68XX-series<br>microprocessor, this pin will be used as Read/Write (R/W#) selection input.  Pull<br>this pin to “High” for read mode and pull it to “Low” for write mode.<br>When 80XX interface mode is selected, this pin will be the Write (WR#) input.<br>Data write operation is initiated when this pin is pulled low and the CS# is pulled<br>low.<br>When serial mode is selected, this pin must be connected to VSS.<br>6~13<br>D7~D0<br>I/O<br>**Host Data Input/Output Bus**<br>These pins are 8-bit bi-directional data bus to be connected to the<br>microprocessor’s data bus.<br>When serial mode is selected, D1 will be the serial data input SDIN and D0 will be<br>the serial clock input SCLK.<br>Unused pins must be connected to VSSexcept for D2 in serial mode.||||
|**Reserve**||||
|23<br>1, 30|N.C.<br>N.C. (GND)|-<br>-|**Reserved Pin**<br>The N.C. pin between function pins is reserved for compatible and flexible design.<br>**Reserved Pin (Supporting Pin)**<br>The supporting pins can reduce the influences from stresses on the function pins.<br>These pinsmust be connected to externalground as theESDprotectioncircuit.|



Page 5 of 23 

## **6. Block Diagram** 

C1, C3, C5 :0.1μF C2, C4 :4.7μF C6 :20μF C7 :1μF C8 :4.7μF / 25V Tantalum Capacitor R1 :910kΩ, R1 = (Voltage at IREF - VSS) / IREF R2 :50Ω, 1/4W D1, D2 :0.7V, 0.5W 

MCU Interface Selection : Base on BS0 and BS1 connection 

Pins connected to MCU interface : D7~D0, E/RD#, R/W#, D/C#, CS#, and RES# 

## Showed as below table : 

|BS1<br>~~RR~~|BS0|Interface<br>mode<br>~~a~~<br>~~es~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Data bus<br>~~a~~|Control bus|Control bus|Control bus|Control bus|Control bus|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||D7 D6 D5<br>~~a~~<br>~~es~~|D7 D6 D5<br>~~a~~<br>~~es~~|D7 D6 D5<br>~~es~~|D4<br>~~es~~|D3<br>~~Gd~~|D2<br>~~rs~~|D1<br>~~rs~~|D0<br>~~GOs~~|CS#<br>~~GOs~~|D/C# R/W# E/RD# RES#<br>~~GO~~|D/C# R/W# E/RD# RES#|D/C# R/W# E/RD# RES#|D/C# R/W# E/RD# RES#|
|0<br>~~RR~~<br>~~Rs~~|0<br>~~Rs~~|4-wire SPI<br>~~es~~<br>~~Rs~~|**0**<br>~~es~~<br>~~es~~|**0**<br>~~es~~<br>~~es~~|**0**<br>~~es~~<br>~~es~~|**0**<br>~~es~~<br>~~es~~|**0**<br>~~Gd~~<br>~~Gn~~|**NC**<br>~~rs~~<br>~~Gs~~|SDIN<br>~~rs~~<br>~~Gs~~|SCLK<br>~~GOs~~<br>~~GD~~|CS#<br>~~GOs~~<br>~~QOD~~|D/C#<br>~~GO~~<br>~~GO~~|**0**|**0**|RES#|
|0<br>~~RR~~<br>~~Rs~~<br>~~Rs~~|1<br>~~Rs~~|3-wire SPI<br>~~es ~~<br>~~Rs~~<br>~~es~~|**0**<br> ~~es ~~<br>~~es~~<br>~~es~~|**0**<br> ~~es ~~<br>~~es~~<br>~~es~~|**0**<br> ~~es ~~<br>~~es~~<br>~~es~~|**0**<br> ~~es~~<br>~~es~~<br>~~Gn~~|**0**<br>~~Gd~~<br>~~Gn~~<br>~~Gn~~|**NC**<br>~~rs~~<br>~~Gs~~|SDIN<br>~~rs~~<br>~~Gs~~<br>~~GGG~~|SCLK<br>~~GOs~~<br>~~GD~~<br>~~GGG~~|CS#<br>~~GOs ~~<br>~~QOD~~<br>~~GGG~~|**0**<br> ~~GO~~<br>~~GO~~<br>~~GGG~~|**0**|**0**|RES#|
|1<br>~~Rs~~<br>~~Rs~~<br>~~Rs~~|0<br>~~Rs~~<br>~~Rs~~|8bit 8080<br>~~Rs ~~<br>~~es~~<br>~~Rs~~|D7 D6 D5<br> ~~es ~~<br>~~es~~<br>~~es~~|D7 D6 D5<br> ~~es ~~<br>~~es~~<br>~~es~~|D7 D6 D5<br> ~~es~~<br>~~es~~<br>~~es~~|D4<br>~~es~~<br>~~Gn~~<br>~~ss~~|D3<br>~~Gn~~<br>~~Gn~~<br>~~ss~~|D2<br>~~Gs~~<br>~~rn~~|D1<br>~~Gs~~<br>~~GGG~~<br>~~rn~~|D0<br>~~GD~~<br>~~GGG~~<br>~~Gs~~|CS#<br>~~QOD~~<br>~~GGG~~<br>~~Gs~~|D/C# R/W#<br>~~GO~~<br>~~GGG~~|D/C# R/W#|E|RES#|
|1<br>~~Rs~~<br>~~Rs~~|1<br>~~Rs~~|8bit 6800<br>~~es ~~<br>~~Rs~~|D7 D6 D5<br> ~~es ~~<br>~~es~~|D7 D6 D5<br> ~~es~~<br>~~es~~|D7 D6 D5<br>~~es~~<br>~~es~~|D4<br>~~Gn~~<br>~~ss~~|D3<br>~~Gn~~<br>~~ss~~|D2<br>~~rn~~|D1<br>~~GGG~~<br>~~rn~~|D0<br>~~GGG~~<br>~~Gs~~|CS#<br>~~GGG~~<br>~~Gs~~|D/C# WR#<br>~~GGG~~|D/C# WR#|RD# RES#|RD# RES#|



Note : 

a. ” 0 ” is connected to VSS. 

b. ” 1 ” is connected to VDD. 

c. ” NC ” is non-connected. 

Page 6 of 23 

## **Absolute  Maximum  Ratings** 

|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Notes**|
|---|---|---|---|---|---|
|Supply Voltage for Operation<br>Supply Voltage for Logic<br>Supply Voltage for I/O Pins<br>Supply Voltage for Display<br>Operating Temperature<br>Storage Temperature<br>Life Time (60 cd/m2)<br>Life Time (40 cd/m2)|VCI<br>VDD<br>VDDIO<br>VCC<br>TOP<br>TSTG|-0.3<br>-0.5<br>-0.5<br>-0.5<br>-40<br>-40<br>100,000<br>150,000|4<br>2.75<br>VCI<br>16<br>70<br>85<br>-<br>-|V<br>V<br>V<br>V<br>°C<br>°C<br>hour<br>hour|1, 2<br>1, 2<br>1, 2<br>1, 2<br>3<br>3<br>4<br>4|



Note 1: All the above voltages are on the basis of “VSS = 0V”. 

- Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the module may occur.  Also, for normal operations, it is desirable to use this module under the conditions according to Section 3. “Optics & Electrical Characteristics”.  If this module is used beyond these conditions, malfunctioning of the module can occur and the reliability of the module may deteriorate. 

- Note 3: The defined temperature ranges do not include the polarizer.  The maximum withstood temperature of the polarizer should be 80°C. 

- Note 4: VCC = 15.0V, Ta = 25°C, 50% Checkerboard. 

   - Software configuration follows Section 4.4 Initialization. 

   - End of lifetime is specified as 50% of initial brightness reached.  The average operating lifetime at room temperature is estimated by the accelerated operation at high temperature conditions. 

Page 7 of 23 

## **Optics  &  Electrical  Characteristics** 

## **1. Optics Characteristics** 

|**1. Optics Characteristics**|||||||
|---|---|---|---|---|---|---|
|**Characteristics**|**Symbol**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|Brightness<br>C.I.E. (Yellow)<br>Dark Room Contrast<br>Viewing Angle|Lbr<br>(x)<br>(y)<br>CR|Note 5<br>C.I.E. 1931|40<br>0.46<br>0.45<br>-<br>-|60<br>0.50<br>0.49<br>>10,000:1<br>Free|-<br>0.54<br>0.53<br>-<br>-|cd/m2<br>degree|



* Optical measurement taken at VCI = 2.8V, VCC = 15.0V. Software configuration follows Section 4 Initialization. 

## **2. DC Characteristics** 

|**2. DC Characteristics**|||||||
|---|---|---|---|---|---|---|
|**Characteristics**|**Symbol**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|Supply Voltage for Operation<br>Supply Voltage for Logic<br>Supply Voltage for I/O Pins<br>Supply Voltage for Display<br>High Level Input<br>Low Level Input<br>High Level Output<br>Low Level Output<br>Operating Current for VCI<br>Operating Current for VCC<br>Sleep Mode Current for VCI<br>Sleep Mode Current for VCC|VCI<br>VDD<br>VDDIO<br>VCC<br>VIH<br>VIL<br>VOH<br>VOL<br>ICI<br>ICC<br>ICI, SLEEP<br>ICC, SLEEP|Note 5<br>Iout= 100μA<br>Iout= 100μA<br>Note 6<br>Note 7<br>Note 8|2.4<br>2.4<br>1.65<br>14.5<br>0.8×VDDIO<br>0<br>0.9×VDDIO<br>0<br>-<br>-<br>-<br>-<br>-<br>-|2.8<br>2.5<br>1.8<br>15.0<br>-<br>-<br>-<br>-<br>180<br>26.7<br>40.1<br>64.0<br>20<br>2|3.5<br>2.6<br>VCI<br>15.5<br>VDDIO<br>0.2×VDDIO<br>VDDIO<br>0.1×VDDIO<br>300<br>33.4<br>50.1<br>80.0<br>100<br>10|V<br>V<br>V<br>V<br>V<br>V<br>V<br>V<br>μA<br>mA<br>mA<br>mA<br>μA<br>μA|



Note 5: Brightness (Lbr) and Supply Voltage for Display (VCC) are subject to the change of the panel characteristics and the customer’s request. 

Note 6: VCI = 2.8V, VCC = 15.0V, 30% Display Area Turn on. Note 7: VCI = 2.8V, VCC = 15.0V, 50% Display Area Turn on. Note 8: VCI = 2.8V, VCC = 15.0V, 100% Display Area Turn on. 

* Software configuration follows Section 4 Initialization. 

Page 8 of 23 

## **3. AC Characteristics** 

## 3.1. 68XX-Series MPU Parallel Interface Timing Characteristics: 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tAS<br>tAH<br>tDSW<br>tDHW<br>tDHR<br>tOH<br>tACC<br>PWCSL<br>PWCSH<br>tR<br>tF|Clock Cycle Time<br>(Read)<br>(Write)<br>Address Setup Time<br>Address Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Read Data Hold Time<br>Output Disable Time<br>Access Time<br>Chip Select Low Pulse Width (Read)<br>Chip Select Low Pulse Width (Write)<br>Chip Select High Pulse Width (Read)<br>Chip Select High Pulse Width (Write)<br>Rise Time<br>Fall Time|400<br>100<br>20<br>0<br>40<br>10<br>20<br>-<br>-<br>450<br>60<br>60<br>60<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>70<br>200<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



* (VDDIO =1.65V~ 2.1V, VCI = 2.4V~3.5V, Ta = 25°C) 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tAS<br>tAH<br>tDSW<br>tDHW<br>tDHR<br>tOH<br>tACC<br>PWCSL<br>PWCSH<br>tR<br>tF|Clock Cycle Time<br>(Read)<br>(Write)<br>Address Setup Time<br>Address Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Read Data Hold Time<br>Output Disable Time<br>Access Time<br>Chip Select Low Pulse Width (Read)<br>Chip Select Low Pulse Width (Write)<br>Chip Select High Pulse Width (Read)<br>Chip Select High Pulse Width (Write)<br>Rise Time<br>Fall Time|300<br>100<br>15<br>0<br>40<br>10<br>20<br>-<br>-<br>150<br>60<br>60<br>60<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>70<br>200<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



* (VDDIO =2.1V~ VCI , VCI = 2.4V~3.5V, Ta = 25°C) 

Page 9 of 23 

3.2. 80XX-Series MPU Parallel Interface Timing Characteristics: 

|**Symbol**<br>**Description**<br>**Min**<br>**Max**<br>**Unit**<br>tcycle<br>Clock Cycle Time<br>(Read)<br>400<br>-<br>ns<br>(Write)<br>100<br>-<br>ns<br>tAS<br>Address Setup Time<br>10<br>-<br>ns<br>tAH<br>Address Hold Time<br>0<br>-<br>ns<br>tDSW<br>Write Data Setup Time<br>40<br>-<br>ns<br>tDHW<br>Write Data Hold Time<br>10<br>-<br>ns<br>tDHR<br>Read Data Hold Time<br>20<br>-<br>ns<br>tOH<br>Output Disable Time<br>-<br>70<br>ns<br>tACC<br>Access Time<br>-<br>220<br>ns<br>tPWLR<br>Read Low Time<br>200<br>-<br>ns<br>tPWLW<br>Write Low Time<br>60<br>-<br>ns<br>~~esa==~~<br>~~e~~e<br>~~|~~<br>~~e~~s<br>~~e~~s~~ee~~<br>ee<br>~~e~~s<br>~~|~~<br>~~e~~e<br>~~|~~<br>~~e~~e~~QO~~|
|---|
|tPWHR<br>Read High Time<br>60<br>-<br>ns<br>tPWHW<br>Write High Time<br>60<br>-<br>ns<br>tCS<br>Chip Select Setup Time<br>0<br>-<br>ns<br>tCSH<br>Chip Select Hold Time to Read Signal<br>0<br>-<br>ns<br>tCSF<br>Chip Select Hold Time<br>20<br>-<br>ns<br>tR<br>Rise Time<br>-<br>15<br>ns<br>tF<br>Fall Time<br>-<br>15<br>ns<br>~~e~~s<br>~~|~~<br>~~ee~~<br>ee ee<br>~~e~~e<br>~~|~~<br>~~e~~sG~~O~~<br>~~QO~~<br>~~es~~|
|* (VDDIO= 1.65V~2.1V, VCI= 2.4V~3.5V, Ta= 25°C)|
|**Symbol**<br>**Description**<br>**Min**<br>**Max**<br>**Unit**<br>tcycle<br>Clock Cycle Time<br>(Read)<br>300<br>-<br>ns<br>(Write)<br>100<br>-<br>ns<br>tAS<br>Address Setup Time<br>10<br>-<br>ns<br>tAH<br>Address Hold Time<br>0<br>-<br>ns<br>tDSW<br>Write Data Setup Time<br>40<br>-<br>ns<br>tDHW<br>Write Data Hold Time<br>10<br>-<br>ns<br>tDHR<br>Read Data Hold Time<br>20<br>-<br>ns<br>tOH<br>Output Disable Time<br>-<br>70<br>ns<br>~~MAW 4 Ee Wy 4 Ce~~<br>~~eee eee~~<br>~~ihfa~~<br>~~ae~~<br>~~ee~~<br>ee<br>~~[~~|<br>F~~y~~ |<br>Cf<br>DH I<br>fn<br>NZ~~]~~<br>~~|~~<br>~~ee~~<br>a a<br>~~e~~e<br>~~|~~<br>~~e~~e<br>~~a ~~e~~e~~|
|tACC<br>Access Time<br>-<br>140<br>ns<br>tPWLR<br>Read Low Time<br>150<br>-<br>ns<br>~~H~~—I— ~~NN~~<br>gw NAAR ICACTIIDE =~~|~~<br>~~|~~|
|tPWLW<br>Write Low Time<br>60<br>-<br>ns|
|tPWHR<br>Read High Time<br>60<br>-<br>ns<br>tPWHW<br>Write High Time<br>60<br>-<br>ns<br>tCS<br>Chip Select Setup Time<br>0<br>-<br>ns<br>~~e~~e<br>~~|~~<br>~~e~~e~~Ge~~|
|tCSH<br>Chip Select Hold Time to Read Signal<br>0<br>-<br>ns<br>tCSF<br>Chip Select Hold Time<br>20<br>-<br>ns<br>~~e~~e<br>~~|~~|
|tR<br>Rise Time<br>-<br>15<br>ns|
|tF<br>Fall Time<br>-<br>15<br>ns<br>* (VDDIO= 2.1V~VCI, VCI= 2.4V~3.5V, Ta= 25°C)<br>~~a~~<br>~~|~~|



Page 10 of 23 

## 3.3. Serial Interface Timing Characteristics: (4-wire Serial) 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tAS<br>tAH<br>tCSS<br>tCSH<br>tDSW<br>tDHW<br>tCLKL<br>tCLKH<br>tR<br>tF|Clock Cycle Time<br>Address Setup Time<br>Address Hold Time<br>Chip Select Setup Time<br>Chip Select Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Clock Low Time<br>Clock High Time<br>Rise Time<br>Fall Time|300<br>15<br>35<br>20<br>10<br>15<br>20<br>40<br>40<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



- (VDDIO = 1.65~2.1V, VCI = 2.4V~3.5V, Ta = 25°C) 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tAS<br>tAH<br>tCSS<br>tCSH<br>tDSW<br>tDHW<br>tCLKL<br>tCLKH<br>tR<br>tF|Clock Cycle Time<br>Address Setup Time<br>Address Hold Time<br>Chip Select Setup Time<br>Chip Select Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Clock Low Time<br>Clock High Time<br>Rise Time<br>Fall Time|300<br>15<br>25<br>20<br>10<br>15<br>20<br>25<br>40<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



- (VDDIO = 2.1~ VCI, VCI = 2.4V~3.5V, Ta = 25°C) 

Page 11 of 23 

## 3.4. Serial Interface Timing Characteristics: (3-wire Serial) 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tCSS<br>tCSH<br>tDSW<br>tDHW<br>tCLKL<br>tCLKH<br>tR<br>tF|Clock Cycle Time<br>Chip Select Setup Time<br>Chip Select Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Clock Low Time<br>Clock High Time<br>Rise Time<br>Fall Time|300<br>20<br>35<br>15<br>20<br>40<br>25<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



- (VDDIO = 1.65V~2.1V, VCI = 2.4~3.5V, Ta = 25°C) 

|**Symbol**|**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|tcycle<br>tCSS<br>tCSH<br>tDSW<br>tDHW<br>tCLKL<br>tCLKH<br>tR<br>tF|Clock Cycle Time<br>Chip Select Setup Time<br>Chip Select Hold Time<br>Write Data Setup Time<br>Write Data Hold Time<br>Clock Low Time<br>Clock High Time<br>Rise Time<br>Fall Time|300<br>20<br>25<br>15<br>20<br>25<br>25<br>-<br>-|-<br>-<br>-<br>-<br>-<br>-<br>-<br>15<br>15|ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns|



Page 12 of 23 

## **Functional  Specification** 

## **1. Commands** 

Refer to the Technical Manual for the SSD1322 

## **2. Power down and Power up Sequence** 

To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off.  It gives the OEL panel enough time to complete the action of charge and discharge before/after the operation. 

## 2.1. Power up Sequence: 

   1. Power up VCI / VDDIO 

   2. Send Display off command 

   3. Initialization 

   4. Clear Screen 

   5. Power up VCC 

   6. Delay 200ms 

      - (When VCC is stable) 

   7. Send Display on command 

- 2.2. Power down Sequence: 

   1. Send Display off command 

   2. Power down VCC 

   3. Delay 100ms (When VCC is reach 0 and panel is completely discharges) 

   4. Power down VCI / VDDIO 

**==> picture [182 x 210] intentionally omitted <==**

**----- Start of picture text -----**<br>
VCI / VDDIO on<br>VCC on<br>Display on<br>VCC<br>VCI/VDDIO<br>VSS/Ground<br>Display off<br>VCC off<br>VCI / VDDIO off<br>VCC<br>VCI/VDDIO<br>VSS/Ground<br>**----- End of picture text -----**<br>


Note 9: 

- 1) Since an ESD protection circuit is connected between VCI, VDDIO and VCC inside the driver IC, VCC becomes lower than VCI whenever VDD, VDDIO is ON and VCC is OFF. 

- 2) VCC should be kept float (disable) when it is OFF. 

- 3) Power Pins (VDD, VDDIO, VCC) can never be pulled to ground under any circumstance. 

- 4) VCI, VDDIO should not be power down before VCC power down. 

## **3. Reset Circuit** 

When RES# input is low, the chip is initialized with the following status: 

1. Display is OFF 

2. 480×128 Display Mode 

3. Normal segment and display data column and row address mapping (SEG0 mapped to column address 00h and COM0 mapped to row address 00h) 

4. Display start line is set at display RAM address 0 

5. Column address counter is set at 0 

6. Normal scan direction of the COM outputs 

7. Contrast control register is set at 7Fh 

Page 13 of 23 

## **4. Actual Application Example** 

Command usage and explanation of an actual example 

<Power up Sequence> 

**==> picture [402 x 471] intentionally omitted <==**

**----- Start of picture text -----**<br>
Set Display Start Line  Enhance Driving Scheme Capability<br>VCI/VDDIO/VCC off State  0xA1, 0x00  0xD1, 0x82, 0x20<br>Power up VCI/VDDIO Set Re-Map & Dual COM Line Mode Set Pre-Charge Voltage<br>(RES# as Low State)  0xA0, 0x14, 0x11  0xBB, 0x1F<br>Power Stabilized  Set GPIO  Set Second Pre-Charge Period<br>(300ms Delay Recommended)  0xB5, 0x00  0xB6, 0x08<br>Set RES# as High  Function Selection  Set VCOMH Deselect Level<br>(100μs Delay Minimum)  0xAB, 0x01  0xBE, 0x07<br>Initialized State  Set Segment Low Voltage  Set Display Mode<br>(Parameters as Default)  0xB4, 0xA0, 0xFD  0xA6<br>Command Lock  Set Contrast Current<br>Clear Screen<br>0xFD, 0x12  0xC1, 0x DF<br>Set Display Off  Master Contrast Current Control Power up VCC & Stabilized<br>0xAE  0xC7, 0x0F  (Delay Recommended)<br>Initial Settings  Select Gray Scale Table  Set Display On<br>Configuration 0xB8,  0xAF<br>0x00, 0x00, 0x00, 0x03,<br>0x06, 0x10, 0x1D, 0x2A,<br>Set Display Clock Divide Ratio/Oscillator Frequency  0x37, 0x46, 0x58, 0x6A,  Power Stabilized<br>0x7F, 0x96, 0xB4, 0x00,<br>0xB3, 0x91  (200ms Delay Recommended)<br>Set Multiplex Ratio  Enable Gray Scale Table<br>0xCA, 0x3F  0x00  Display Data Sent<br>Set Display Offset  Set Phase Length<br>0xA2, 0x00  0xB1, 0xE8<br>**----- End of picture text -----**<br>


If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function. 

Page 14 of 23 

<Power down Sequence> 

**==> picture [438 x 721] intentionally omitted <==**

**----- Start of picture text -----**<br>
Function Selection<br>Normal Operation Power down VCI/VDDIO<br>0xAB, 0x00<br>Set Display Off  Power down VCC<br>0xAE  (100ms Delay Recommended) VCI/VDDIO/VCC off State<br>=Ses==<br><Entering Sleep Mode><br>Function Selection<br>Normal Operation Sleep Mode<br>0xAB, 0x00<br>Set Display Off<br>0xAE Power down VCC<br><Exiting Sleep Mode><br>— = i<br>Function Selection  Power Stablized<br>Sleep Mode<br>0xAB, 0x01 (200ms Delay Recommended)<br>Power up VCC & Stabilized  Set Display On<br>(Delay Recommended) 0xAF Normal Operation<br>—<br>Page 15 of 23<br>**----- End of picture text -----**<br>


## **Reliability** 

## **1 Contents of Reliability Tests** 

|**1 Contents of Reliability Tests**|||
|---|---|---|
|**Item**|**Conditions**|**Criteria**|
|High Temperature Operation<br>Low Temperature Operation<br>High Temperature Storage<br>Low Temperature Storage<br>High Temperature/Humidity Operation<br>Thermal Shock|70°C, 240 hrs<br>-40°C, 240 hrs<br>85°C, 240 hrs<br>-40°C, 240 hrs<br>60°C, 90% RH, 120 hrs<br>-40°C⇔85°C, 24 cycles<br>60 mins dwell|The operational<br>functions work.|



* The samples used for the above tests do not include polarizer. 

* No moisture condensation is observed during tests. 

## **2 Failure Check Standard** 

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH. 

Page 16 of 23 

## **Outgoing  Quality  Control  Specifications** 

## **1. Environment Required** 

Customer’s test & measurement are required to be conducted under the following conditions: Temperature: 23 ± 5°C Humidity: 55 ± 15% RH Fluorescent Lamp: 30W Distance between the Panel & Lamp: ≥ 50cm Distance between the Panel & Eyes of the Inspector: ≥ 30cm Finger glove (or finger cover) must be worn by the inspector. Inspection table or jig must be anti-electrostatic. 

## **2. Sampling Plan** 

Level II, Normal Inspection, Single Sampling, MIL-STD-105E 

## **3. Criteria & Acceptable Quality Level** 

**==> picture [449 x 493] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||
|---|---|---|
|Partition|AQL|Definition|
|Major|0.65|Defects in Pattern Check (Display On)|
|Minor|1.0|Defects in Cosmetic Check (Display Off)|
|3.1. Cosmetic Check (Display Off) in Non-Active Area|
|Check Item|Classification|Criteria|
|X > 6 mm (Along with Edge)|
|Y > 1 mm (Perpendicular to edge)|
|X|
|Y|
|Panel General Chipping|Minor|
|X|
|Y|
|A|
|"e|
|Page 17 of 23|

**----- End of picture text -----**<br>


## 3.1. Cosmetic Check (Display Off) in Non-Active Area (Continued) 

|3.1. Cosmetic Check (Display Off) in Non-Active Area (Continued)|3.1. Cosmetic Check (Display Off) in Non-Active Area (Continued)|3.1. Cosmetic Check (Display Off) in Non-Active Area (Continued)|
|---|---|---|
|**Check Item**|**Classification**|**Criteria**|
|Panel Crack<br>Copper Exposed<br>(Even Pin or Film)<br>Film or Trace Damage<br>Terminal Lead Prober Mark<br>Glue or Contamination on Pin<br>(Couldn’t Be Removed by Alcohol)<br>Ink Marking on Back Side of panel<br>(Exclude on Film)|Minor<br>Minor<br>Minor<br>Acceptable<br>Minor<br>Acceptable|Any crack is not allowable.<br>Not Allowable by Naked Eye Inspection<br>Ignore for Any<br>=<br>, 4<br>A<br>-_<br>am<br>US|



Page 18 of 23 

## 3.2. Cosmetic Check (Display Off) in Active Area 

**==> picture [424 x 439] intentionally omitted <==**

**----- Start of picture text -----**<br>
It is recommended to execute in clear room environment (class 10k) if actual in necessary.<br>Check Item  Classification Criteria<br>Any Dirt & Scratch on Polarizer’s<br>Acceptable  Ignore for not Affect the Polarizer<br>Protective Film<br>W ≤ 0.1  Ignore<br>—_ a<br>Scratches, Fiber, Line-Shape Defect W > 0.1<br>Minor<br>(On Polarizer)  L ≤ 2  n ≤ 1<br>L > 2  n = 0<br>Φ ≤ 0.1  Ignore<br>Dirt, Black Spot, Foreign Material,<br>Minor  0.1 < Φ ≤ 0.25  n ≤ 1<br>(On Polarizer)<br>0.25 < Φ  n = 0<br>Φ ≤ 0.5<br>>  Ignore if no Influence on Display<br>0.5 < Φ  n = 0<br>Dent, Bubbles, White spot<br>Minor<br>(Any Transparent Spot on Polarizer)<br>Fingerprint, Flow Mark<br>Minor Not Allowable<br>(On Polarizer)<br>* Protective film should not be tear off when cosmetic check.<br>** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2<br>L<br>b: Minor Axis<br>W<br>a: Major Axis<br>**----- End of picture text -----**<br>


Page 19 of 23 

## 3.3. Pattern Check (Display On) in Active Area 

|**Check Item**|**Classification**|**Criteria**|
|---|---|---|
|No Display<br>Missing Line<br>Pixel Short<br>Darker Pixel<br>Wrong Display<br>Un-uniform<br>~~|~~Mi~~D~~|Major<br>Major<br>Major<br>Major<br>Major<br>Major<br>~~D~~s|Seartattaltatatalctatatattatata'cta wia'ctytatstatctatata'ctataty'stataty'sta<br>ats sta ats"<br>ataffatutafafatetafatatetatatatetata"a feetfatetatataMetatataMetaetatetatetatataferstata<br>seatatattatytatntattatntattatatatcta wiatctrtatntattatetatctatatstctatatststatatststaats'<br>statfanrsurTavrsarcereseTcanesetern Ufservcovesetccave‘aecaverseraersevsersersnare'<br>reatetattatytatatatatatntattatntatctn wlatctrtatntattatatatctatatatctatatstctatatststatatst<br>itatafanrSurfonnsatcove*eTcaneeeiecn UretercovetetcaveratecaverstecatersTeraurstersearet<br>seatatatatatytatatatetatntattatntatctn wlatctrtatntatctatatatctatatatctatatstctatatststatetst<br>itetatstetaetaintetstetetateistatetsts afstatetsistetse'siersiss'ststsis'e'siste's's"sists!<br>itatafarntaTaTaNnsaTAcoreteTca"eceTacn fae"\"oreteTcavereTsca"ernerareraerararnerscare<br>Matatecatesetecateretacsterstacy<br>Shtetusatvtatecstersterssenvecssarvearicateanira'c"a"iesetr<br>uietusuterstarrsatstaresetfanetutursersatvTarrcars<br>"sess rcanieretecavereiscarey<br>mena cPaaMacPaaRsaPaPOMs"aPaPSMtaPataP tae<br>aratatatahtatahahPatahat|



Page 20 of 23 

## **Precautions  When  Using  These  OEL  Display  Modules** 

## **1. Handling Precautions** 

- 1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. 

- 2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 

- 3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 

- 4) The polarizer covering the surface of the OEL display module is soft and easily scratched.  Please be careful when handling the OEL display module. 

- 5) When the surface of the polarizer of the OEL display module has soil, clean the surface.  It takes advantage of by using following adhesion tape. 

   - Scotch Mending Tape No. 810 or an equivalent 

Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water 

   - Ketone 

   - Aromatic Solvents 

- 6) Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module.  And, do not over bend the film with electrode pattern layouts.  These stresses will influence the display performance.  Also, secure sufficient rigidity for the outer cases. 

- 7) Do not apply stress to the driver IC and the surrounding molded sections. 

- 8) Do not disassemble nor modify the OEL display module. 

- 9) Do not apply input signals while the logic power is off. 

- 10) Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. 

   - Be sure to make human body grounding when handling OEL display modules. 

   - Be sure to ground tools to use or assembly such as soldering irons. 

   - To suppress generation of static electricity, avoid carrying out assembly work under dry environments. 

   - Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film. 

- 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it.  At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film.  In such case, remove the residue material by the method introduced in the above Section 5). 

- 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above. 

## **2. Storage Precautions** 

- 1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding high temperature and high 

Page 21 of 23 

humidity environment or low temperature (less than 0°C) environments.  (We recommend you to store these modules in the packaged state when they were shipped from Midas Displays.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 

- 2) If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above. 

## **3. Designing Precautions** 

- 1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. 

- 2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. 

- 3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VCI). (Recommend value: 0.5A) 

- 4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. 

- 5) As for EMI, take necessary measures on the equipment side basically. 

- 6) When fastening the OEL display module, fasten the external plastic housing section. 

- 7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. 

- 8) The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1322 * Connection (contact) to any other potential than the above may lead to rupture of the IC. 

## **4. Precautions when disposing of the OEL display modules** 

- 1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules.  Or, when burning them, be sure to observe the environmental and hygienic laws and regulations. 

## **5. Other Precautions** 

- 1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored.  Also, there will be no problem in the reliability of the module. 

- 2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes 

   - Pattern layouts such as the COF 

- 3) With this OEL display module, the OEL driver is being exposed.  Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery.  Consequently, if this OEL driver is exposed to light, malfunctioning may occur. 

   - Design the product and installation method so that the OEL driver may be shielded from light in actual usage. 

   - Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. 

- 4) Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed.  It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. 

- 5) We recommend you to construct its software to make periodical refreshment of the operation 

Page 22 of 23 

statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise. 

## **Warranty:** 

The warranty period shall last twelve (12) months from the date of delivery.  Buyer shall be completed to assemble all the processes within the effective twelve (12) months. Midas Displays shall be liable for replacing any products which contain defective material or process which do not conform to the product specification, applicable drawings and specifications during the warranty period.  All products must be preserved, handled and appearance to permit efficient handling during warranty period.  The warranty coverage would be exclusive while the returned goods are out of the terms above. 

## **Notice:** 

No part of this material may be reproduces or duplicated in any form or by any means without the written permission of Midas Displays reserves the right to make changes to this material without notice. Midas Displays does not assume any liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as, medical products.  Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this material will be free from any patent or copyright infringement of a third party.  This material or portions thereof may contain technology or the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of Taiwan and may require an export license from the Ministry of International Trade and Industry or other approval from another government agency. 

## **© Midas Displays 2019, All rights reserved.** 

All other product names mentioned herein are trademarks and/or registered trademarks of their respective companies. 

Page 23 of 23 



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> [Request a quote](https://novapart.co/quote/) — it's free and there's no
> minimum order.