# Alphanumeric LCD, 20 x 2, White on Blue, 3V to 5V, I2C, English, Japanese, Transmissive

![Product image](https://novapart.co/image/farnell:2218944/)

**URL**: https://novapart.co/products/MCCOG22005A6W-BNMLWI/alphanumeric-lcd-20-x-2-white-on-blue-3v-to-5v-i2c
**SKU**: MCCOG22005A6W-BNMLWI
**Manufacturer**: MIDAS DISPLAYS
**Category**: Optoelectronics & Displays || Displays || LCD Displays || Alphanumeric LCD Displays
**Price**: €13.2000
**Stock**: 10+
**Lead Time**: 120 days (indicative)

## Description

Character Count x Line:20 x 2; Display Appearance:White on Blue; Logic Voltage:3V to 5V; Interface Type:I2C; Font Set:English, Japanese; Display Mode:Transmissive; Character Size:4.

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| Font Set | English, Japanese |
| Module Size | 74.2mm x 25.2mm |
| Display Mode | Transmissive |
| Logic Voltage | 3V to 5V |
| Product Range | MCCOG22005A6W |
| Character Size | 4.67mm |
| Interface Type | I2C |
| Lcd Display Type | BSTN |
| Display Appearance | White on Blue |
| Backlighting Colour | White |
| Display Construction | COG |
| Character Count X Line | 20 x 2 |
| Operating Temperature Max | 70°C |
| Operating Temperature Min | -20°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2218944/)

**Sauls Wharf House Crittens Road Great Yarmouth Norfolk NR31 0AG** 

Telephone +44 (0)1493 602602 Email:sales@midasdisplays.com Email:tech@midasdisplays.com www.midasdisplays.com 

|MCCOG22005A6W-BNMLWI|MCCOG22005A6W-BNMLWI|2 x 20|5mm Character Height|LCD Module|
|---|---|---|---|---|
|**Specification **|||||
|Version:    7|||Date:04/11/2019||
|**Revision**|||||
|1<br>2<br>3<br>4<br>5<br>6<br>7|02/09/2011<br>28/11/2012<br>24/11/2014<br>26/06/2015<br>25/02/2016<br>22/08/2018<br>01/11/2019||First Release.<br>Modify Backlight Information.<br>Remove IC Information. Modify Response Time & B/L Information.<br>Modify Backlight Information.<br>Modify Precautions in Use of LCD Modules & Static Electricity Test.<br>Updated Mechanical Drawing.<br>Added more technical information.||



|DisplayFeatures|DisplayFeatures|I2C<br>Transmissive|I2C<br>Transmissive|
|---|---|---|---|
|Character Count|2 x 16|||
|Appearance|White on Blue|||
|Logic Voltage|5V|||
|Interface|I2C|||
|Font Set|English / Japanese|||
|DisplayMode|Transmissive|||
|Character Height|4.67mm|||
|LC Type|BSTN|||
|Module Size|74.20 x 25.20 x 6.30 mm|||
|OperatingTemperature|-20°C ~ +70°C|||
|Construction|COG|BoxQuantity|Weight/ Display|
|LED Backlight|White|---|---|



* - For full design functionality, please use this specification in conjunction with the ST7036I specification. (Provided Separately) 

|**Display Accessories**|**Display Accessories**|||**Optional Variants**|**Optional Variants**||
|---|---|---|---|---|---|---|
|**Part Number **|**Description **||**Fonts**||**Appearances**|**Voltage**|
||Fine pitch(1.27mm) COG I2C||||Black on||
|MCCOG-I2C-I-8|interface board. Compatible<br>with both Arduino and UC32||||Yellow/Green<br>Black on White||
||controller boards.||||||



Page 1 of 40001 

## **General Specification** 

The Features of the Module is description as follow: 

Module dimension: 74.2 x 25.2 x 6.3 (max.) mm3 View area: 61.0 x 15.1 mm2 Active area: 58.5 x 9.8 mm2 Number of Characters: 20 characters x 2 Lines Dot size: 0.45 x 0.54 mm2 Dot pitch: 0.50x 0.59 mm2 Character size: 2.45 x 4.67 mm2 Character pitch: 2.95 x 5.17 mm2 LCD type: STN Negative, Blue Transmissive Duty: 1/16 , 1/5 Bias View direction: 6 o’clock Backlight Type: LED, White 

Page 2 of 40002 

## **Interface Pin Function** 

|**Pin No. **|**Symbol**|**Level**|**Description**|
|---|---|---|---|
|1|VOUT||DC/DC voltage converter. Connect a capacitor between<br>this terminal and VIN when the built-in booster is used.|
|2|CAP1N||For voltage booster circuit(VDD-VSS)<br>External capacitor about 0.1u~4.7uf|
|3|CAP1P|||
|4|VDD|3.0/5.0V|Power supply|
|5|VSS||GND|
|6|SDA||I2C bus ).<br>connect a resister between SDA/SCL and the power of<br>SDA and SCL must connect to I2C bus (I2C bus is to<br>(In I2C interface DB7 (SDA) is input data.|
|7|SCL||(In I2C interface DB6 (SCL) is clock input.<br>SDA and SCL must connect to I2C bus (I2C bus is to<br>connect a resister between SDA/SCL and the power of<br>I2C bus ).|
|8|RST||RESET *|



* Please note, if you do not wish to use Reset, it should be tied high 

Page 3 of 40003 

**==> picture [389 x 551] intentionally omitted <==**

**----- Start of picture text -----**<br>
25.2<br>23.0<br>5.5 17.5 1.1<br>V.A15.1 | 2.3<br>T 9.8 H 4.9<br>=H _|<br>0.7<br>0.5 4.67<br>0.59<br>0.54<br>BEE es<br>B ERR a<br>=<br>—_—<———<$<$<—<br>fo<br>A K<br>|<br>15.0 2.0<br>0.3<br>. [oe<br>nn<br>1.1<br>4.9 3.6<br>29.655<br>1<br>0.4 58.5 66.0<br>V.A61.0<br>ST7036i 74.2<br>8<br>0.45 0.5<br>P1.27*7=8.89<br>2.45<br>SCALE 5/1 DOT SIZE<br>0.5<br>1.15 0.6<br>6.3<br>1.1 .1<br>6.8 1 2.8<br>3.0<br>The non-specified tolerance of dimension is<br>8 7 6 5 4 3 2 1<br>0.3mm.<br>RST SCL SDA VSS VDD CAP1P CAP1N VOUT<br>**----- End of picture text -----**<br>


Page 4 of 40004 

## **Application schematic** 

Page 5 of 40005 

|**INITIALIZE:  (3V)**||
|---|---|
|MOV<br>I2C_CONTROL,#00H ;WRITE COMMAND|I2C_CONTROL,#00H ;WRITE COMMAND|
|MOV<br>I2C_DATA,#38H|;Function Set|
|LCALL WRITE_CODE||
|MOV<br>I2C_CONTROL,#00H ;WRITE COMMAND|I2C_CONTROL,#00H ;WRITE COMMAND|
|MOV<br>I2C_DATA,#39H|;Function Set|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#14H|;Internal OSC frequency|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#74H|;Contrast set|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#54H|;Power/ICON control/Contrast set|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#6FH|;Follower control|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#0CH|;Display ON/OFF|
|LCALL WRITE_CODE||
|MOV<br>I2C_DATA,#01H|;Clear Display|
|LCALL WRITE_CODE||



Page 6 of 40006 

## **INITIALIZE: (5V)** 

|MOV|I2C_CONTROL,#00H ;WRITE COMMAND|I2C_CONTROL,#00H ;WRITE COMMAND|
|---|---|---|
|MOV|I2C_DATA,#38H|;Function Set|
|LCALL|WRITE_CODE||
|MOV|I2C_CONTROL,#00H ;WRITE COMMAND|I2C_CONTROL,#00H ;WRITE COMMAND|
|MOV|I2C_DATA,#39H|;Function Set|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#14H|;Internal OSC frequency|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#79H|;Contrast set|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#50H|;Power/ICON control/Contrast set|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#6CH|;Follower control|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#0CH|;Display ON/OFF|
|LCALL|WRITE_CODE||
|MOV|I2C_DATA,#01H|;Clear Display|
|LCALL|WRITE_CODE||



Page 7 of 40007 

|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|**Absolute Maximum Ratings**|||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Item**<br>**Symbol**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Operating Temperature<br>TOP<br>-20<br>－<br>+70<br>℃<br>Storage Temperature<br>TST<br>-30<br>－<br>+80<br>℃<br>LCD Driver Voltage<br>VLCD<br>7.0- VSS<br>V<br>-0.3+ VSS<br>Supply voltage for Logic<br>VDD<br>-0.3<br>－<br>6.0<br>V<br>~~=e~~|||||||||||||
|**Electrical Characteristics**|||||||||||||
||**Item**||**Symbol**|**Condition**|||**Min**|**Typ**||**Max**|**Unit**||
|||||||||||5|||
||Supply Voltage For<br>Logic||VDD-VSS||－||3|3.3|(bon=1<br>max=3.5V)||V||
|||||Ta=-20℃|||－|－||－|V||
||Supply Voltage For LCD||VLCD|Ta=25℃|||－|4.5||－|V||
|||||Ta=70℃|||－|－||－|V||
||Input High Volt.||VIH||－||0.7 VDD|－||VDD|V||
||Input Low Volt.||VIL||－||－|－||0.2 VDD|V||
||Output High Volt.||VOH||－||0.8 VDD|－||VDD|V||
||Output Low Volt.||VOL||－||－|－||0.2VDD|V||
||Supply Current(No||IDD||－||－|0.2||－|mA||
||include LED Backlight)||||||||||||



Page 8 of 40008 

## **Optical Characteristics** 

|**Item**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|View Angle|(V)θ|CR<br>2<br>≧|20|－|40|deg|
||(H)φ|CR<br>2<br>≧|-30|－|30|deg|
|Contrast Ratio|CR|－|－|3|－|－|
|Response Time|T rise|－|－|250|400|ms|
||T fall|－|－|100|250|ms|



## **Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )** 

**==> picture [427 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
Non-selected Non-selected<br>Intensity Selected Wave Conition Selected Conition Conition<br>100％ Non-selected Wave<br>Intensity<br>10％<br>Cr Max<br>Cr = Lon / Loff 90％<br>100％<br>es<br>Vop<br>Driving Voltage(V) Tr Tf<br>[positive type] [positive type]<br>**----- End of picture text -----**<br>


## **Conditions :** 

Operating Voltage : Vop Viewing Angle( θ，φ ) : 0° ， 0° Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias **Definition of viewing angle(CR ≧ 2)** 

**==> picture [290 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
θ b<br>f °<br>φ= 180<br>θl<br>θr<br>φ= 270° φ= 90°<br>φ= 0°<br>**----- End of picture text -----**<br>


Page 9 of 40009 

## **Function Description** 

## ● **System Interface** 

This chip has all four kinds of interface type with MPU: 4-bit bus, 8-bit bus, serial and fast I2C interface. 4-bit bus or 8-bit bus is selected by DL bit in the instruction register. 

During read or write operation, two 8-bit registers are used. One is data register (DR), the other is instruction register(IR). 

The data register(DR) is used as temporary data storage place for being written into or read from 

DDRAM/CGRAM/ICON RAM, target RAM is selected by RAM address setting instruction. Each internal operation, reading from or writing into RAM, is done automatically. So to speak, after MPU reads DR data, the data in the next DDRAM/CGRAM/ICON RAM address is transferred into DR automatically. Also after MPU writes data to DR, the data in DR is transferred into DDRAM/CGRAM/ICON RAM automatically. 

The Instruction register(IR) is used only to store instruction code transferred from MPU. MPU cannot use it to read instruction data. 

To select register, use RS input pin in 4-bit/8-bit bus mode. 

## **I2C interface** 

## **It just only could write Data or Instruction to ST7036 by the IIC Interface. It could not read Data or Instruction from ST7036 (except Acknowledge signal).** 

SCL: serial clock input 

SDA_IN: serial data input 

SDA_OUT: acknowledge response output 

## **Slaver address could set from “0111100” to “0111111”.** 

The I2C interface send RAM data and executes the commands sent via the I2C Interface. It could send data in to the RAM. 

The I2C Interface is two-line communication between different ICs or modules. The two lines are a Serial Data line (SDA) and a Serial Clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only when the bus is not busy. 

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## **BIT TRANSFER** 

One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse because changes in the data line at this time will be interpreted as a control signal. Bit transfer is illustrated in Fig.1. 

## **START AND STOP CONDITIONS** 

Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P). The START and STOP conditions are illustrated in Fig.2. 

## **SYSTEM CONFIGURATION** 

The system configuration is illustrated in Fig.3. 

· Transmitter: the device, which sends the data to the bus 

· Master: the device, which initiates a transfer, generates clock signals and terminates a transfer 

· Slave: the device addressed by a master 

- Multi-Master: more than one master can attempt to control the bus at the same time without corrupting the message 

· Arbitration: procedure to ensure that, if more than one master simultaneously tries to control the bus, only one is allowed to do so and the message is not corrupted 

· Synchronization: procedure to synchronize the clock signals of two or more devices. 

## **ACKNOWLEDGE** 

## **Acknowledge signal (ACK) is not BF signal in parallel interface.** 

Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is 

addressed must generate an acknowledge after the reception of each byte. A master receiver must also generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. 

The device that acknowledges must pull-down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end-of-data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a STOP 

condition. Acknowledgement on the I2C Interface is illustrated in Fig.4. 

Page 11 of 40011 

Page 12 of 40012 

## **I2C Interface protocol** 

The ST7036 supports command, data write addressed slaves on the bus. 

Before any data is transmitted on the I2C Interface, the device, which should respond, is addressed first. Four 7-bit slave addresses (01111 **00** to 01111 **11** ) are reserved for the ST7036. The R/W is assigned to 0 for Write only. 

The I2C Interface protocol is illustrated in Fig.5. 

The sequence is initiated with a START condition (S) from the I2C Interface master, which is followed by the slave address. 

All slaves with the corresponding address acknowledge in parallel, all the others will ignore the I2C Interface transfer. After acknowledgement, one or more command words follow which define the status of the addressed slaves. 

A command word consists of a control byte, which defines Co and RS, plus a data byte. The last control byte is tagged with a cleared most significant bit (i.e. the continuation bit Co). After a control byte with a cleared Co bit, only data bytes will follow. The state of the RS bit defines whether the data byte is interpreted as a command or as RAM data. All addressed slaves on the bus also acknowledge the control and data bytes. After the last control byte, depending on the RS bit setting; either a series of display data bytes or command data bytes may follow. If the RS bit is set to logic 1, these display bytes are stored in the display RAM at the address specified by the data pointer. The data pointer is automatically updated and the data is directed to the intended ST7036i device. If the RS bit of the last control byte is set to logic 0, these command bytes will be decoded and the setting of the device will be changed according to the received commands. Only the addressed slave makes the acknowledgement after each byte. At the end of the transmission the I2C INTERFACE-bus master issues a STOP condition (P). 

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During write operation, two 8-bit registers are used. One is data register (DR), the other is instruction 

register(IR). 

The data register(DR) is used as temporary data storage place for being written into DDRAM/CGRAM/ICON 

RAM, target RAM is selected by RAM address setting instruction. Each internal operation, writing into RAM, is done automatically. So to speak, after MPU writes data to DR, the data in DR is transferred into 

DDRAM/CGRAM/ICON RAM automatically. 

The Instruction register(IR) is used only to store instruction code transferred from MPU. MPU cannot use it to read instruction data. 

To select register, use RS bit input in IIC interface. 

## ● **Busy Flag (BF)** 

When BF = "High”, it indicates that the internal operation is being processed. So during this time the next 

instruction cannot be accepted. BF can be read, when RS = Low and R/W = High (Read Instruction Operation), through DB7 port. Before executing the next instruction, be sure that BF is not High. 

## ● **Address Counter (AC)** 

Address Counter(AC) stores DDRAM/CGRAM/ICON RAM address, transferred from IR. 

After writing into (reading from) DDRAM/CGRAM/ICON RAM, AC is automatically increased (decreased) by 1. 

When RS = "Low" and R/W = "High", AC can be read through DB0 ~ DB6 ports. 

## ● **Display Data RAM (DDRAM)** 

Display data RAM (DDRAM) stores display data represented in 8-bit character codes. Its extended capacity is 80x 8 bits, or 80 characters. The area in display data RAM (DDRAM) that is not used for display can be used as general data RAM. See Figure 6 for the relationships between DDRAM addresses and positions on the liquid crystal display. 

The DDRAM address (ADD ) is set in the address counter (AC) as hexadecimal. 

## ● **1-line display (N3=0,N = 0) (Figure 7)** 

When there are fewer than 80 display characters, the display begins at the head position. For example, if using only the ST7036, 20 characters are displayed. See Figure 7. 

When the display shift operation is performed, the DDRAM address shifts. See Figure 8. 

Page 14 of 40014 

## ● **2-line display (N3=0,N = 1) (Figure 9)** 

Case 1: When the number of display characters is less than 40 x _2 lines, the two lines are displayed from the head. Note that the first line end address and the second line start address are not consecutive. For example, when just the ST7036 is used, 20 characters x _2 lines are displayed. See Figure 9. 

When display shift operation is performed, the DDRAM address shifts. See Figure 10. 

Page 15 of 40015 

## _ **3-line display (N3=1,N =1) (Figure 11)** 

Case 1: When the number of display characters is less than 16 x _3 lines, the tree lines are displayed from the head. For example, when just the ST7036 is used, 16 characters x _3 lines are displayed. See Figure 11. When display shift operation is performed, the DDRAM address shifts. See Figure 12. 

Page 16 of 40016 

## ● **Character Generator ROM (CGROM)** 

The character generator ROM generates 5 x 8 dot character patterns from 8-bit character codes. It can generate 240/250/248/256 5 x 8 dot character patterns(select by OPR1/2 ITO pin). User-defined character patterns are also available by mask-programmed ROM. 

## ● **Character Generator RAM (CGRAM)** 

In the character generator RAM, the user can rewrite character patterns by program. For 5 x 8 dots, eight character patterns can be written. 

Write into DDRAM the character codes at the addresses shown as the left column of Table 5 to show the character patterns stored in CGRAM. 

See Table 5 for the relationship between CGRAM addresses and data and display patterns. Areas that are not used for display can be used as general data RAM. 

Page 17 of 40017 

## ● **ICON RAM** 

## **In the ICON RAM, the user can rewrite icon pattern by program.** 

## **There are totally 80 dots for icon can be written.** 

## **See Table 6 for the relationship between ICON RAM address and data and the display patterns.** 

## ● **Timing Generation Circuit** 

The timing generation circuit generates timing signals for the operation of internal circuits such as DDRAM, CGROM and CGRAM. RAM read timing for display and internal operation timing by MPU access are generated separately to avoid interfering with each other. Therefore, when writing data to DDRAM, for example, there will be no undesirable interference, such as flickering, in areas other than the display area. 

## ● **LCD Driver Circuit(N3=0)** 

LCD Driver circuit has 17 common and 100 segment signals for LCD driving. Data from CGRAM/CGROM/ICON is transferred to 100 bit segment latch serially, and then it is stored to 100 bit shift latch. When each common is selected by 17 bit common register, segment data also output through segment driver from 100 bit segment latch. In case of 1-line display mode, COM1 ~ COM8(with COMI) have 1/9 duty, and in 2-line mode, COM1 ~ COM16(with COMI) have 1/17 duty ratio. 

## ● **LCD Driver Circuit(N3=1)** 

LCD Driver circuit has 25 common and 80 segment signals for LCD driving. Data from CGRAM/CGROM/ICON is transferred to 80 bit segment latch serially, and then it is stored to 80 bit shift latch. When each common is selected by 25 bit common register, segment data also output through segment driver from 80 bit segment latch. In case of 3-line display mode, COM1 ~ COM24(with COMI) have 1/25 duty. 

## ● **Cursor/Blink Control Circuit** 

It can generate the cursor or blink in the cursor/blink control circuit. The cursor or the blink appears in the digit at 

the display data RAM address set in the address counter. 

Page 18 of 40018 

Page 19 of 40019 

Notes: 

1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 types). 

2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the cursor position and its display is formed by a logical OR with the cursor. Maintain the 8th line data, corresponding to the cursor display position, at 0 as the cursor display. If the 8th line data is 1, 1 bits will light up the 8th line regardless of the cursor presence. 

3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left). 

4. As shown Table 5, CGRAM character patterns are selected when character code bits 4 to 7 are all 0. However, since character code bit 3 has no effect, the T display example above can be selected by either character code 00H or 08H. 

5. “1” for CGRAM data corresponds to display selection and “0” to non-selection,“-“ Indicates no effect. 

6. Different OPR1/2 ITO option can select different CGRAM size. 

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## ■ **Instructions** 

There are four categories of instructions that: 

- **Designate ST7036 functions, such as display format, data length, etc.** 

- **Set internal RAM addresses** 

- **Perform data transfer with internal RAM** 

## ● **Others** 

- **instruction table at “Normal mode”** 

(when “EXT” option pin connect to VDD, the instruction set follow below table) 

## Note: 

Be sure the ST7036 is not in the busy state (BF = 0) before sending an instruction from the MPU to the ST7036. 

If an instruction is sent without checking the busy flag, the time between the first instruction and next instruction 

will take much longer than the instruction time itself. Refer to Instruction Table for the list of each instruction 

execution time. 

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Page 23 of 40023 

Page 24 of 40024 

## **Instruction Description** 

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## **Backlight Information** 

## **Specification** 

|**Specification**|||||||
|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL **|**MIN**|**TYP**|**MAX**|**UNIT**|**TEST CONDITION**|
|**Supply Current **|**ILED**|**28.8**|**32**|**50**|**mA**|**V=3.5V**|
|**Supply Voltage V**|**Supply Voltage V**|**3.4**|**3.5**|**3.6**|**V**||
|**Reverse Voltage **|**VR**|**－**|**－**|**5**|**V**|**－**|
|**Luminous**<br>**Intensity**<br>**(Without LCD)**|**IV**|**409.6**|**512.0**|**－**|**CD/M2**|**ILED=32mA**|
|**LED Life Time**|**－**|**－**|**50000**|**－**|**Hr.**|**ILED≦32mA**|
|**Color**|**White**||||||



**Note: The LED of B/L is drive by current only ； driving voltage is only for reference To make driving current in safety area (waste current between minimum and maximum).** 

**Note1 :50K hours is only an estimate for reference.** 

LED B\L Drive Method Drive from A , K R A B/L K ~~_~~ 

Page 33 of 40033 

## **Reliability** 

## **Content of Reliability Test (wide temperature, -20 ℃ ~70 ℃ )** 

|**Content of Reliability Test (wide temperature, -20y Test (wide temperature, -20 Test (wide temperature, -20perature, -20erature, -20℃~70℃) **|**Content of Reliability Test (wide temperature, -20y Test (wide temperature, -20 Test (wide temperature, -20perature, -20erature, -20℃~70℃) **|**Content of Reliability Test (wide temperature, -20y Test (wide temperature, -20 Test (wide temperature, -20perature, -20erature, -20℃~70℃) **|**Content of Reliability Test (wide temperature, -20y Test (wide temperature, -20 Test (wide temperature, -20perature, -20erature, -20℃~70℃) **|
|---|---|---|---|
|**Environmental Test**||||
|**Test Item**|**Content of Test**|**Condition Note**|**Condition Note**|
|High Temperature storage|Endurance test applying the high storage temperature for a long<br>time.|Endurance test applying the high storage temperature for a long<br>80℃<br>200hrs|2|
|Low Temperature storage|Endurance test applying the high storage temperature for a long<br>time.|Endurance test applying the high storage temperature for a long<br>-30℃<br>200hrs|1,2|
|High Temperature Operation|Endurance test applying the electric stress (Voltage & Current)<br>and the thermal stress to the element for a long time.|Endurance test applying the electric stress (Voltage & Current)<br>70℃<br>200hrs|-|
|Low Temperature Operation|Endurance test applying the electric stress under low<br>temperature for a long time.|Endurance test applying the electric stress under low<br>-20℃<br>200hrs|1|
|High Temperature/<br>Humidity Operation|The module should be allowed to stand at 60℃,90%RH max<br>For 96hrs under no-load condition excluding the polarizer,<br>Then taking it out and drying it at normal temperature.|96hrs<br>-20℃/70℃<br>10 cycles<br>60℃,90%RH|1,2|
|Thermal shock resistance|operation<br>-20℃<br>25℃<br>70℃<br>30min   5min<br>30min<br>1 cycle<br>The sample should be allowed stand the following 10 cycles of||-|
|Vibration test|Endurance test applying the vibration during transportation and<br>using.|Endurance test applying the vibration during transportation and<br>Each 15<br>minutes<br>fixed<br>amplitude:<br>15mm<br>Vibration.<br>Frequency:<br>10~55Hz.<br>One cycle 60<br>seconds to 3<br>directions of<br>X,Y,Z for|3|
|Static electricity test|Endurance test applying the electric stress to the terminal.|VS=800V,RS=<br>1.5kΩ<br>CS=100pF<br>1 time|——|



## **Note1: No dew condensation to be observed.** 

**Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.** 

Page 34 of 40034 

**Inspection specification** NO Item Criterion AQL 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. Electrical 01 1.4 No function or no display. 0.65 Testing 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. 2.1 White and black spots on display ≦ 0.25mm, no more Black or than three white or black spots present. white spots 02 2.2 Densely spaced: No more than two spots or lines within 2.5 on LCD 3mm (display only) ~~{|~~ 3.1 Round type : As following drawing Φ =( x + y ) / 2 2.5 LCD black spots, white spots, 03 contaminatio n 3.2 Line type : (As following drawing) (non-display) Length Width Acceptable Q TY --W ≦ 0.02 Accept no 2.5 dense L ≦ 3.0 0.02 ＜ W ≦ 0.03 2 L ≦ 2.5 0.03 ＜ W ≦ 0.05 ~~Noses==~~ --0.05 ＜ W As round type If bubbles are visible, Size Φ Acceptable Q judge using black spot TY specifications, not Φ≦ 0.20 Accept no Polarizer 04 easy to find, must dense 2.5 bubbles check in specify 0.20 ＜Φ≦ 0.50 3 direction. 0.50 ＜Φ≦ 1.00 2 1.00 ＜Φ 0 Total Q TY 3 in ~~m==~~ Page 35 of 40035 

|NO<br>~~a~~|Item<br>~~a~~|Criterion|AQL|
|---|---|---|---|
|05<br>~~a~~|Scratches<br>~~a~~|Follow NO.3LCDblackspots,white spots, contamination||
|06|Chipped<br>glass|x≦1/8a<br>z: Chip thickness<br>y: Chip width<br>x: Chip length<br>Z≦1/2t<br>Not over viewing<br>area<br>x≦1/8a<br>1/2t＜z≦2t<br>Not exceed 1/3k<br>x≦1/8a<br>☉If there are 2 or more chips, x is the total length of each chip.<br>Symbols Define:<br>x: Chip length<br>y: Chip width     z: Chip thickness<br>k: Seal width<br>t: Glass thickness  a: LCD side length<br>L: Electrode pad length:<br>6.1 General glass chip :<br>6.1.1 Chip on panel surface and crack between panels:<br>☉If there are 2 or more chips, x is total length of each chip.<br>6.1.2 Corner crack:<br>1/2t＜z≦2t<br>Not exceed 1/3k<br>Z≦1/2t<br>Not over viewing<br>area<br>x≦1/8a<br>z:Chip thickness<br>y:Chipwidth<br>x:Chiplength<br>.,<br>2CNN|2.5|



Page 36 of 40036 

**==> picture [491 x 560] intentionally omitted <==**

**----- Start of picture text -----**<br>
a NO Item  es Criterion  AQL<br>Symbols :<br>x: Chip length  y: Chip width  z: Chip thickness<br>k: Seal width   t: Glass thickness  a: LCD side length<br>L: Electrode pad length<br>6.2 Protrusion over terminal :<br>6.2.1 Chip on electrode pad :<br>Z<br>y: Chip width  x: Chip length  z: Chip thickness<br>y ≦ 0.5mm  x ≦ 1/8a  0  ＜  z  ≦  t<br>6.2.2 Non-conductive portion:<br>i L<br>Glass<br>06 2.5<br>crack te z Ke agua d<br>A A<br>y: Chip width  x: Chip length  z: Chip<br>thickness<br>y ≦  L  x ≦ 1/8a  0  ＜  z  ≦  t<br>☉ If the chipped area touches the ITO terminal, over 2/3 of the<br>ITO must remain and be inspected according to electrode<br>terminal specifications.<br>☉ If the product will be heat sealed by the customer, the<br>alignment mark not be damaged.<br>6.2.3 Substrate protuberance and internal crack.<br>x<br>y: width  x: length<br>y ≦ 1/3L  x  ≦  a<br>**----- End of picture text -----**<br>


Page 37 of 40037 

|NO|Item|Criterion|AQL|
|---|---|---|---|
|07<br>~~ee~~|Cracked<br>glass<br>~~ee~~|The LCD with extensive crack is not acceptable.<br>~~ee~~|2.5<br>~~ee~~|
|08|Backlight<br>elements|8.1 Illumination source flickers when lit.<br>8.2 Spots or scratched that appear when lit must be judged.<br>Using LCD spot, lines and contamination standards.<br>8.3 Backlight doesn’t light or color wrong.|0.65<br>2.5<br>0.65|
|09|Bezel|9.1 Bezel may not have rust, be deformed or have<br>fingerprints, stains or other contamination.<br>9.2 Bezel must comply with job specifications.|2.5<br>0.65|
|10|PCB、COB|~~**X**~~<br>**X* Y<=2mm2**<br>10.1 COB seal may not have pinholes larger than 0.2mm or<br>contamination.<br>10.2 COB seal surface may not have pinholes through to the<br>IC.<br>10.3 The height of the COB should not exceed the height<br>indicated in the assembly diagram.<br>10.4 There may not be more than 2mm of sealant outside<br>the seal area on the PCB. And there should be no more<br>than three places.<br>10.5 No oxidation or contamination PCB terminals.<br>10.6 Parts on PCB must be the same as on the production<br>characteristic chart. There should be no wrong parts,<br>missing parts or excess parts.<br>10.7 The jumper on the PCB should conform to the product<br>characteristic chart.<br>10.8 If solder gets on bezel tab pads, LED pad, zebra pad or<br>screw hold pad, make sure it is smoothed down.<br>10.9 The Scraping testing standard for Copper Coating of<br>PCB<br>~~**Y**~~|2.5<br>2.5<br>0.65<br>2.5<br>2.5<br>0.65<br>0.65<br>2.5<br>2.5|
|11|Soldering|11.1 No un-melted solder paste may be present on the PCB.<br>11.2 No cold solder joints, missing solder connections,<br>oxidation or icicle.<br>11.3 No residue or solder balls on PCB.<br>11.4 No short circuits in components on PCB.|2.5<br>2.5<br>2.5<br>0.65|



Page 38 of 40038 

|NO|Item|Criterion|AQL|
|---|---|---|---|
|12|General<br>appearance|12.1 No oxidation, contamination, curves or, bends on<br>interface Pin (OLB) of TCP.<br>12.2 No cracks on interface pin (OLB) of TCP.<br>12.3 No contamination, solder residue or solder balls on<br>product.<br>12.4 The IC on the TCP may not be damaged, circuits.<br>12.5 The uppermost edge of the protective strip on the<br>interface pin must be present or look as if it causes the<br>interface pin to sever.<br>12.6 The residual rosin or tin oil of soldering (component or<br>chip component) is not burned into brown or black color.<br>12.7 Sealant on top of the ITO circuit has not hardened.<br>12.8 Pin type must match type in specification sheet.<br>12.9 LCD pin loose or missing pins.<br>12.10 Product packaging must the same as specified on<br>packaging specification sheet.<br>12.11 Product dimension and structure must conform to<br>product specification sheet.|0.65<br>0.65<br>0.65<br>2.5<br>2.5<br>2.5<br>2.5<br>2.5<br>0.65<br>2.5<br>0.65|



## **Precautions in use of LCD Modules** 

1. Avoid applying excessive shocks to the module or making any alterations or modifications to it. 

2. Don’t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. 

3. Don’t disassemble the LCM. 

4. Don’t operate it above the absolute maximum rating. 

5. Don’t drop, bend or twist LCM. 

6. Soldering: only to the I/O terminals. 

7. Storage: please storage in anti-static electricity container and clean environment. 

8. Midas have the right to change the passive components 

   - (Resistors,capacitors and other passive components will have different appearance and color caused by the different supplier.) 

9. Midas have the right to change the PCB Rev. 

Page 39 of 40039 

## **Material List of Components for RoHs** 

1. Midas Components Ltd. hereby declares that all of or part of products, including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. 

Exhibit A ： The Harmful Material List 

|Material|(Cd)|(Pb)|(Hg)|(Cr6+)|PBBs|PBDEs|
|---|---|---|---|---|---|---|
|Limited<br>Value|100<br>ppm|1000<br>ppm|1000<br>ppm|1000<br>ppm|1000<br>ppm|1000<br>ppm|
|Above limited value is set upaccordingto RoHS.|||||||



2. Process for RoHS requirement ： 

   - (1) Use the Sn/Ag/Cu soldering surface ； the surface of Pb-free solder is rougher than we used before. 

   - (2) Heat-resistance temp. ： 

      - Reflow ： 250 ℃ , 30 seconds Max. ； 

Connector soldering wave or hand soldering ： 320 ℃ , 10 seconds max. 

- (3) Temp. curve of reflow, max. Temp. ： 235±5 ℃； 

Recommended customer’s soldering temp. of connector ： 280 ℃ , 3 seconds. 

## **Recommendable storage** 

1. Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH 

2. Do not place the module near organics solvents or corrosive gases. 

3. Do not crush, shake, or jolt the module 

Page 40 of 40040 



## Links

- [View this product on Novapart](https://novapart.co/products/MCCOG22005A6W-BNMLWI/alphanumeric-lcd-20-x-2-white-on-blue-3v-to-5v-i2c)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/midas/mccog22005a6w-bnmlwi/lcd-cog-20x2-i2c-bstn-white-on/dp/2218944)
---

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