MC36230

**Surface Mountable PTC Resettable Fuse 1210** 

## **Specifications** 

Applications : All high-density boards. Product features :  Small surface mountable, solid state, faster time to trip than standard SMD devices, lower resistance than standard SMD devices. Max. Voltage : 6V to 60V Temperature Range : -40°C to 85°C. Approval : UL Approved 

## **Electrical Characteristics (23°C)** 

|**Hold**<br>**Current**<br>~~ee~~<br>~~a~~|**Trip**<br>**Current**<br>~~ee~~<br>~~es~~|**Rated**<br>**Voltage**<br>~~ee~~<br>~~ee~~|**Max.**<br>**Current**<br>~~ee~~<br>~~ee~~|**Typical**<br>**Power**<br>~~ee~~|**Max. Time to Trip**<br>~~ee~~|**Max. Time to Trip**<br>~~ee~~|**Resistance**<br>~~ee~~|**Resistance**<br>~~ee~~|**Part Number**<br>~~ee~~|
|---|---|---|---|---|---|---|---|---|---|
||||||**Current**<br>~~ee~~|**Time**<br>~~ee~~|**RMin**<br>~~ee~~|**R1Max**<br>~~ee~~||
|**Ih, A**<br>~~ee~~<br>~~a~~|**It, A**<br>~~ee~~<br>~~es~~|**VMax, V DC**<br>~~ee~~<br>~~ee~~|**IMax, A**<br>~~ee~~<br>~~ee~~|**Pd, W**<br>~~ee~~|**Amperes**<br>~~ee~~|**Seconds**<br>~~ee~~|**Ω**<br>~~ee~~|**Ω**<br>~~ee~~||
|0.05<br>~~a~~<br>~~I~~<br>~~ee~~|0.15<br>~~es ~~<br>~~se~~|60<br> ~~ee ~~<br>~~se~~|10<br> ~~ee~~|0.6|0.25|3<br>~~ON~~|3.6<br>~~QO~~|50<br>~~(OO~~|MC36203|
|0.1<br>~~I~~<br>~~ee~~|0.25<br>~~DD~~|60<br>~~DD~~|10<br>~~DD~~|0.6<br>~~DD~~|0.5<br>~~DD~~|1.5<br>~~DD~~<br>~~ON~~|1.6<br>~~DD~~<br>~~QO~~|15<br>~~DD~~<br>~~(OO~~|MC36205<br>~~DD~~|
|0.2<br>~~ee~~<br>~~ee~~|0.4<br>~~es~~|30<br>~~es~~|10<br>~~I~~|0.6<br>~~DO~~|8<br>~~DO~~|0.02<br>~~ON~~<br>~~OO~~|0.8<br>~~QO~~<br>~~OO~~|5<br>~~(OO~~<br>~~OO~~|MC36208|
|0.35<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.7<br>~~es~~<br>|16<br>~~es~~<br>|40<br>~~I~~|0.6<br>~~DO~~|8<br>~~DO~~|0.2<br>~~ON~~<br>~~OO~~<br>~~QO~~|0.32<br>~~QO~~<br>~~OO~~<br>~~QO~~|1.3<br>~~(OO~~<br>~~OO~~<br>~~(OO~~|MC36212|
|0.5<br>~~ee~~<br>~~a OD~~<br>~~ee~~|1<br>~~es ~~<br>~~OD~~<br>|16<br> ~~es ~~<br>~~OD~~<br>|40<br> ~~I~~<br>~~OD~~|0.6<br>~~DO~~<br>~~OD~~|8<br>~~DO~~<br>~~OD~~|0.1<br>~~OO~~<br>~~OD~~<br>~~QO~~|0.25<br>~~OO~~<br>~~OD~~<br>~~QO~~|0.9<br>~~OO~~<br>~~OD~~<br>~~(OO~~|MC36214<br>~~OD~~|
|0.75<br>~~ee ~~<br>~~ee~~|1.5<br> ~~se~~<br>~~es~~|8<br>~~se~~<br>~~es~~|40<br>~~en~~|0.6<br>~~OO~~|8<br>~~OO~~|0.1<br>~~QO~~<br>~~OO~~|0.13<br>~~QO~~<br>~~OO~~|0.4<br>~~(OO~~<br>~~OO~~|MC36217<br>~~OO~~|
|1.1<br>~~ee ~~<br>~~ee~~<br>~~es~~<br>~~ee~~|2.2<br> <br>~~es~~<br>~~OO~~<br>|6<br><br>~~es~~<br>~~OO~~<br>|100<br>~~en~~<br>~~OO~~<br>|0.8<br>~~OO~~<br>~~OO~~|8<br>~~OO~~<br>~~OO~~|0.3<br>~~QO~~<br>~~OO~~<br>~~OO~~|0.06<br>~~QO~~<br>~~OO~~<br>~~OO~~<br>~~QO~~|0.21<br>~~(OO~~<br>~~OO~~<br>~~OO~~<br>~~OO~~|MC36223<br>~~OO~~<br>~~OO~~|
|1.5<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~es~~|3<br>~~es~~<br>~~OO~~<br>~~ss~~<br>|6<br>~~es~~<br>~~OO~~<br>~~ss~~<br>|100<br>~~en~~<br>~~OO~~<br>~~en~~<br>|0.8<br>~~OO~~<br>~~OO~~<br>|8<br>~~OO~~<br>~~OO~~<br>|0.5<br>~~OO~~<br>~~OO~~<br>|0.04<br>~~OO~~<br>~~OO~~<br>~~QO~~<br>|0.11<br>~~OO~~<br>~~OO~~<br>~~OO~~<br>|MC36230<br>~~OO~~<br>~~OO~~<br>|
|1.75<br>~~es~~<br>~~ee~~<br>~~es~~|4<br>~~OO~~<br>~~ss~~<br>|6<br>~~OO~~<br>~~ss~~<br>|100<br>~~OO~~<br>~~en~~<br>|0.8<br>~~OO~~<br>|8<br>~~OO~~<br>|0.6<br>~~OO~~<br>|0.02<br>~~OO~~<br>~~QO~~<br><br>~~QO~~|0.08<br>~~OO~~<br>~~OO~~<br><br>~~(OO~~|MC36236<br>~~OO~~<br>|
|2<br>~~ee ~~<br>~~es~~|4<br> ~~ss~~<br>~~GO~~|6<br>~~ss~~<br>~~GO~~|100<br>~~en~~<br>~~GO~~|0.8<br>~~GO~~|8<br>~~GO~~|1<br>~~GO~~|0.015<br>~~QO~~<br>~~GO~~<br>~~QO~~|0.07<br>~~OO~~<br>~~GO~~<br>~~(OO~~|MC36239<br>~~GO~~|



- **Ih** = Hold current-maximum current at which the device will not trip at 23°C still air. **It** = Trip current-minimum current at which the device will always trip at 23°C still air. 

- **VMax** = Maximum voltage device can withstand without damage at it rated current (I maximum). 

- **IMax** = Maximum fault current device can withstand without damage at rated voltage (V maximum). 

**Pd** =  Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. 

- **RMin** = Minimum device resistance at 23°C prior to tripping. 

**R1Max** = Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260°C for 20 seconds. Termination pad characteristics 

Termination pad materials: Pure tin. 

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**Surface Mountable PTC Resettable Fuse 1210** 

## **FSMD Production Dimensions (Millimetre)** 

## **Dimensions Table** 

|**A**|**A**|**B**<br>**C**<br>**D**<br>**E**||
|---|---|---|---|
|**Figure**<br>**Part Number**<br>**Min.**<br>**Max.**<br>**Min.**<br>**Max.**<br>**Min.**<br>**Max.**<br>**Min.**<br>**Max.**<br>**Min.**<br>**Max.**<br>3<br>3.43<br>2.35<br>2.8<br>0.6<br>1.15<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36203<br>3<br>3.43<br>2.35<br>2.8<br>0.6<br>1.15<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36205<br>3<br>3.43<br>2.35<br>2.8<br>0.4<br>0.85<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36208<br>3<br>3.43<br>2.35<br>2.8<br>0.4<br>0.8<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36212<br>3<br>3.43<br>2.35<br>2.8<br>0.3<br>0.75<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36214<br>3<br>3.43<br>2.35<br>2.8<br>0.3<br>0.7<br>0.25<br>0.75<br>-<br>-<br>1<br>MC36217<br>3<br>3.43<br>2.35<br>2.8<br>0.6<br>1<br>0.25<br>0.75<br>0.1<br>0.45<br>2<br>MC36223<br>~~a~~<br>~~esee~~<br>~~ee~~<br>~~a~~<br>~~es es se~~<br>~~a~~<br>~~es es ee~~<br>~~po~~<br>~~a~~<br>~~es se~~<br>~~a~~<br>~~ss es es~~<br>~~A~~<br>~~ss~~<br>~~es~~<br>~~se~~||||
|**Thermal Derating Curve**<br>3<br>3.43<br>2.35<br>2.8<br>0.5<br>0.9<br>0.25<br>0.75<br>0.1<br>0.45<br>2<br>MC36230<br>3<br>3.43<br>2.35<br>2.8<br>0.8<br>1.4<br>0.25<br>0.75<br>0.1<br>0.45<br>2<br>MC36236<br>3<br>3.43<br>2.35<br>2.8<br>0.8<br>1.4<br>0.25<br>0.75<br>0.1<br>0.45<br>2<br>MC36239<br>~~a~~<br>~~ss es~~<br>~~a~~<br>~~se~~<br>~~es ss~~<br>~~ee~~<br>~~se OO~~||||
|||**Thermal Derating Curve**||
|200%eee||eee||
|**Percent of Rated Hold and Trip**<br>**Current**<br>qsom <br>- <br>soy <br>oy||aeee<br>aeee<br>a<br>ee<br>ee eee<br> EET Pt tet tt tt tt tt ep et tee et ee<br>eB<br>a<br>a a<br>a<br>a<br>eee<br>a in 8<br>aee<br>a a<br>ineee<br>ee...See<br> pf ft<br>tT tf<br>f<br>f<br>tT ft ft ft<br>ft pt<br>|<br>f<br>tT tT tT tf ft<br>ft ft et<br>eee<br>Pt tT tt ep et et<br>i<br>Tt<br>eee<br>eee<br> ELT Tt tt tt tt tt pt tp ot<br>ee<br>aeee<br>eee<br>a<br>**ee**<br>ee eee<br>Pt tT tt Pp et p<br>h<br>a<br>ee<br>ee eee<br> DLE<br>| ttt||
|||-40<br>-20<br>0<br>20<br>40<br>60<br>80||
|||**Ambient Temperature (°C)**||



## **Thermal Derating Curve** 

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**Surface Mountable PTC Resettable Fuse 1210** 

## **Typical Time-To-Trip at 23°C** 

- A = MC36203 

- B = MC36205 C = MC36208 

- D = MC36212 E = MC36214 F = MC36217 G = MC36223 H = MC36230 I = MC36236 J = MC36239 

**==> picture [169 x 118] intentionally omitted <==**

**----- Start of picture text -----**<br>
/ |“NENT,—} Af a<br>001<br>ooolt_| | TPT WWD TOW<br>o.1 1<br>Fault current (A)<br>Time-to-trip (S)<br>**----- End of picture text -----**<br>


## **Material Specification** 

Terminal pad material : Pure tin. Soldering characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 category 3. 

## **Pad Layouts Solder Reflow and Rework Recommendations** 

The dimension in the table below provide the recommended pad layout for each 1210 device. 

|**Device**<br>~~a~~|**A**<br>**Nominal**<br>~~ee~~|**B**<br>**Nominal**<br>~~ee~~|**C**<br>**Nominal**|
|---|---|---|---|
|All 1210 Series<br>~~a~~|2mm<br>~~ee~~|1mm<br>~~ee~~|2.8mm|



|**Profile Feature**|**Pb-Free Assembly**|
|---|---|
|Average Ramp-UpRate(Ts max. to Tp)|3°C/seconds max.|
|Preheat:<br>Temperature Min. (Ts min.)<br>Temperature Max. (Ts max.)<br>Time(ts min. to ts max.)|150°C<br>200°C<br>60 -180 seconds|
|Time maintained above:<br>Temperature(Tl)<br>Time(tl)|217°C<br>60-150 seconds|
|Peak/Classification Temperature(Tp):|260°C|
|Time within 5°C of actual Peak :<br>Temperature(tp)|20-40 seconds|
|Ramp-Down Rate:|6°C/seconds max.|
|Time 25°C to Peak Temperature:|8 minutes max.|



Note: 1All temperatures refer to of the package, measured on the package body surface. 

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## **Surface Mountable PTC Resettable Fuse 1210** 

## **Solder reflow** 

Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 

1. Recommended max past thickness > 0.25mm. 

2. Devices can be cleaned using standard methods and aqueous solvent. 

3. Rework use standard industry practices. 

4. Storage Environment : < 30°C/60% RH. 

## **Caution:** 

1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 

2. Devices are not designed to be wave soldered to the bottom side of the board. 

## **Reflow Profile** 

## **Part Number Table** 

|**Part Number Table**||
|---|---|
|**Description**|**Part Number**|
|Surface Mountable PTC Resettable Fuse|MC36203|
|Surface Mountable PTC Resettable Fuse, Full Reel|MC36203|
|Surface Mountable PTC Resettable Fuse|MC36205|
|Surface Mountable PTC Resettable Fuse, Full Reel|MC36205|
|Surface Mountable PTC Resettable Fuse|MC36208|
||MC36212|
||MC36214|
||MC36217|
||MC36223|
||MC36230|
||MC36236|
||MC36239|



**Important Notice :** This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019. 

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