MBRS2040LT3G

## MBRS2040LT3G, NRVBS2040LT3G 

## Surface Mount Schottky Power Rectifier **SMB Power Surface Mount Package** 

## **http://onsemi.com** 

. . . employing the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. 

**SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 40 VOLTS** 

## **Features** 

- Compact Package with J−Bend Leads Ideal for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Guardring for Over−Voltage Protection 

- Low Forward Voltage Drop 

- ESD Ratings: 

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SMB<br>CASE 403A<br>**----- End of picture text -----**<br>


- Human Body Model = 3B (> 16000 V) 

- Machine Model = C (> 400 V) 

## **MARKING DIAGRAM** 

- AEC−Q101 Qualified and PPAP Capable 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- All Packages are Pb−Free* 

## **Mechanical Characteristics** 

- Case: Molded Epoxy 

- Epoxy Meets UL94, VO at 1/8  

- Weight: 95 mg (approximately) 

- Maximum Temperature of 260  C / 10 Seconds for Soldering 

- Cathode Polarity Band 

- Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add “T3” Suffix to Part Number 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Marking: BKJL 

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AYWW<br>BKJL<br>BKJL = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


**ORDERING INFORMATION** 

**Device Package Shipping**[†] MBRS2040LT3G SMB 2,500 / (Pb−Free) Tape & Reel NRVBS2040LT3G SMB 2,500 / (Pb−Free) Tape & Reel ~~Ff~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRS2040LT3/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 4** 

**MBRS2040LT3G, NRVBS2040LT3G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|40|V|
|Average Rectified Forward Current<br>(At Rated VR, TC= 103C)|IO|2.0|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz, TC= 104C)|IFRM|4.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|70|A|
|Storage Temperature|Tstg, TC|−55 to +150|C|
|Operating Junction Temperature|TJ|−55 to +125|C|
|Voltage Rate of Change<br>(Rated VR, TJ= 25C)|dv/dt|10,000|V/�s|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance — Junction−to−Lead (Note 1)<br>Thermal Resistance — Junction−to−Ambient (Note 2)|RJL<br>RJA|22.5<br>78|C/W|



1. Minimum pad size (0.108 X 0.085 inch) for each lead on FR4 board. 

2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 

## **ELECTRICAL CHARACTERISTICS** 

|**Characteristic**|**Symbol**|**Value**|**Value**|**Unit**|
|---|---|---|---|---|
|Maximum Instantaneous Forward Voltage (Note 3)<br>see Figure 2<br>(IF= 2.0 A)<br>(IF= 4.0 A)|VF|**TJ = 25****C**|**TJ = 125****C**|Volts|
|||0.43<br>0.50|0.34<br>0.45||
|Maximum Instantaneous Reverse Current (Note 3)<br>see Figure 4<br>(VR= 40 V)<br>(VR= 20 V)|IR|**TJ = 25****C**|**TJ = 100****C**|mA|
|||0.8<br>0.1|20<br>6.0||



3. Pulse Test: Pulse Width  250 s, Duty Cycle  2.0%. 

**http://onsemi.com** 

**2** 

**MBRS2040LT3G, NRVBS2040LT3G** 

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100<br>100 100<br>10 10<br>1.0 TJ = 100  C TJ = 25  C 1.0 TJ = 125  C TJ = 25  C<br>TJ = 100  C<br>TJ = 125  C<br>TJ = -40  C<br>0.1 0.1<br>0 0.2 0.4 0.6 0.8 0 0.2 0.4 0.6 0.8<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100E-3 100E-3<br>TJ = 125  C<br>10E-3 10E-3<br>TJ = 125  C TJ = 100  C<br>1.0E-3 TJ = 100  C 1.0E-3<br>100E-6 100E-6 TJ = 25  C<br>10E-6 TJ = 25  C 10E-6<br>1.0E-6 1.0E-6<br>0 10 20 30 40 0 10 20 30 40<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>3.5 1.2<br>dc<br>SQUARE WAVE<br>3.0<br>1.0<br>Ipk/Io = � dc<br>2.5<br>SQUARE WAVE 0.8<br>2.0 Ipk/Io = 5<br>Ipk/Io = � 0.6<br>1.5 I pk /I o  = 5 Ipk/Io = 10<br>0.4<br>1.0 I pk /I o  = 10 Ipk/Io = 20<br>0.5 I pk /I o = 20 0.2<br>0 0<br>0 20 40 60 80 100 120 140 0 0.5 1.0 1.5 2.0 2.5 3.0<br>TL, LEAD TEMPERATURE (  C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>iF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IO<br>PFO, AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

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**3** 

**MBRS2040LT3G, NRVBS2040LT3G** 

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1000 125<br>Rtja = 22.5  C/W<br>115<br>TJ = 25  C<br>105<br>100 95<br>42  C/W<br>85 61  C/W<br>78  C/W<br>75<br>92  C/W<br>10 65<br>0 5.0 10 15 20 25 30 35 40 0 5.0 10 15 20 25 30 35 40<br>VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)<br>Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating*<br>* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-<br>verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating<br>TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where<br>r(t) = thermal impedance under given conditions,<br>Pf = forward power dissipation, and<br>Pr = reverse power dissipation<br>This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,<br>where r(t) = Rthja. For other power applications further calculations must be performed.<br>1.0<br>50%<br>20%<br>10%<br>0.1<br>5.0%<br>2.0%<br>0.01 1.0%<br>Rtjl(t) = Rtjl * r(t)<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100<br>T, TIME (s)<br>Figure 9. Thermal Response Junction to Lead<br>1.0<br>50%<br>20%<br>0.1<br>10%<br>5.0%<br>2.0%<br>0.01<br>1.0%<br>Rtjl(t) = Rtjl * r(t)<br>0.001<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000<br>T, TIME (s)<br><br>C, CAPACITANCE (pF)<br>, DERATED OPERATING TEMPERATURE (  C)<br>TJ<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>(T)<br>R<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>(T)<br>R<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response Junction to Ambient** 

**http://onsemi.com** 

**4** 

**MBRS2040LT3G, NRVBS2040LT3G** 

## **PACKAGE DIMENSIONS** 

**SMB** CASE 403A−03 ISSUE H 

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HE<br>NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>= = SS A 1.90 2.20 2.28 0.075 0.087 0.090<br>b D A1 0.05 0.10 0.19 0.002 0.004 0.007<br>b 1.96 2.03 2.20 0.077 0.080 0.087<br>c 0.15 0.23 0.31 0.006 0.009 0.012<br>D 3.30 3.56 3.95 0.130 0.140 0.156<br>E 4.06 4.32 4.60 0.160 0.170 0.181<br>U. POLARITY INDICATOROPTIONAL AS NEEDED H E 5.21 5.44 5.60 0.205 0.214 0.220<br>L 0.76 1.02 1.60 0.030 0.040 0.063<br>L1 0.51 REF 0.020 REF<br>A<br>A1<br>ee L L1 c [oo] ——" a<br>SOLDERING FOOTPRINT*<br>2.261<br>0.089<br>PT<br>L 2.743<br>0.108<br>Lo<br>2.159<br>0.085 mm<br>SCALE 8:1<br>cs (—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**MBRS2040LT3/D** 

**5**