MBRS1540T3G

## MBRS1540T3 

## Surface Mount Schottky Power Rectifier 

## **SMB Power Surface Mount Package** 

These devices employ the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. 

## **Features** 

## **http://onsemi.com** 

## **SCHOTTKY BARRIER RECTIFIER 1.5 AMPERES, 40 VOLTS** 

- Compact Package with J−Bend Leads Ideal for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Guard−Ring for Over−Voltage Protection 

- Low Forward Voltage Drop 

- Pb−Free Package is Available 

## **Mechanical Characteristics** 

- Case: Molded Epoxy 

**SMB CASE 403A PLASTIC** 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 95 mg (Approximately) 

- Cathode Polarity Band 

## **MARKING DIAGRAM** 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

## **MAXIMUM RATINGS** 

**Rating Symbol Value Unit** Peak Repetitive Reverse Voltage VRRM 40 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR ~~ee~~ Average Rectified Forward Current ~~ee~~ IO 1.5 A (At Rated VR, TC = 100 ° C) Peak Repetitive Forward Current IFRM 3.0 A (At Rated VR, Square Wave, 100 kHz, TC = 105 ° C) ~~ee~~ Non−Repetitive Peak Surge Current IFSM 40 A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Tstg, TC −55 to +150 ° C Operating Junction Temperature TJ −55 to +125 ° C Voltage Rate of Change dv/dt 10,000 V/ s (Rated VR, TJ = 25 ° C) ~~eeee~~ Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 

**==> picture [190 x 259] intentionally omitted <==**

**----- Start of picture text -----**<br>
AYWW<br>BGJ<br>BGJ = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>ORDERING INFORMATION<br>e<br>Device Package Shipping [†]<br>MBRS1540T3 SMB 2500/Tape & Reel<br>MBRS1540T3G SMB 2500/Tape & Reel<br>(Pb−Free)<br>†For information on tape and reel specifications,<br>including part orientation and tape sizes, please<br>—— refer to our Tape and Reel Packaging Specification<br>Brochure, BRD8011/D.<br>**----- End of picture text -----**<br>


Publication Order Number: **MBRS1540T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2005 **August, 2005 − Rev. 3** 

**MBRS1540T3** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**||**Unit**|
|Thermal Resistance,<br>Junction−to−Lead (Note 1)<br>Thermal Resistance,<br>Junction−to−Ambient (Note 2)|R�JL<br>R�JA|24<br>80||°C/W|
|**ELECTRICAL CHARACTERISTICS**|||||
|Maximum Instantaneous Forward Voltage (Note 3)<br>(iF= 1.5 A)<br>see Figure 2<br>(iF= 3.0 A)|vF|**TJ = 25**°**C**|**TJ = 125**°**C**|V|
|||0.46<br>0.54|0.39<br>0.54||
|Maximum Instantaneous Reverse Current (Note 3)<br>(VR= 40 V)<br>see Figure 4<br>(VR= 20 V)|IR|**TJ = 25**°**C**|**TJ = 100**°**C**|mA|
|||0.8<br>0.1|5.7<br>1.6||



1. Mounted with minimum recommended pad size, PC Board FR4. 

2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 

3. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2.0%. 

**http://onsemi.com** 

**2** 

**MBRS1540T3** 

**==> picture [491 x 401] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>10 10<br>TJ = 125°C 25°C TJ = 125°C<br>1.0 1.0<br>100°C 100°C<br>−�40 °C<br>25°C<br>0.1 0.1<br>0.1 0.3 0.5 0.7 0.9 0.1 0.3 0.5 0.7 0.9<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100E−3 100E−3<br>10E−3 TJ = 125°C 10E−3 TJ = 125°C<br>1.0E−3 1.0E−3 100°C<br>100°C<br>100E−6 100E−6 25°C<br>10E−6 25°C 10E−6<br>1.0E−6 1.0E−6<br>0 10 20 30 40 0 10 20 30 40<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>iF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Current** 

**Figure 4. Maximum Reverse Current** 

**==> picture [490 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5 1.2<br>FREQ = 20 kHz<br>dc dc<br>1.0 SQUARE WAVE<br>2.0<br>SQUARE WAVE Ipk/Io = �<br>0.8<br>1.5 Ipk/Io = 5.0<br>Ipk/Io = �<br>0.6<br>Ipk/Io = 5.0 Ipk/Io = 10<br>1.0<br>0.4 Ipk/Io = 20<br>Ipk/Io = 10<br>0.5 Ipk/Io = 20<br>0.2<br>0 0<br>25 45 65 85 105 125 0 0.5 1.0 1.5 2.0 2.5<br>TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IO<br>PFO, AVERAGE POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

**http://onsemi.com** 

**3** 

**MBRS1540T3** 

**==> picture [490 x 660] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 125<br>TJ = 25°C Rtja = 24°C/W<br>115<br>43°C/W<br>105 63°C/W<br>100 95 80°C/W<br>85<br>93°C/W<br>75<br>10 65<br>0 5.0 10 15 20 25 30 35 40 0 5.0 10 15 20 25 30 35 40<br>VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)<br>Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating*<br>* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-<br>verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating<br>TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where<br>r(t) = thermal impedance under given conditions,<br>Pf = forward power dissipation, and<br>Pr = reverse power dissipation<br>This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,<br>where r(t) = Rthja. For other power applications further calculations must be performed.<br>1.0E+00<br>50%<br>20%<br>1.0E−01<br>10%<br>5.0%<br>1.0E−02 2.0%<br>1.0%<br>1.0E−03<br>Rtjl(t) = Rtjl*r(t)<br>1.0E−04<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, TIME (s)<br>Figure 9. Thermal Response — Junction to Case<br>1.0E+00<br>50%<br>20%<br>1.0E−01<br>10%<br>5.0%<br>1.0E−02<br>2.0%<br>1.0E−03<br>1.0%<br>Rtjl(t) = Rtjl*r(t)<br>1.0E−04<br>0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>t, TIME (s)<br>°<br>C, CAPACITANCE (pF)<br>, DERATED OPERATING TEMPERATURE (  C)<br>TJ<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>T<br>R<br>, TRANSIENT THERMAL RESISTANCE (NORMALIZED)<br>T<br>R<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response — Junction to Ambient** 

**http://onsemi.com** 

**4** 

**MBRS1540T3** 

## **PACKAGE DIMENSIONS** 

**SMB** PLASTIC PACKAGE CASE 403A−03 ISSUE E 

**==> picture [475 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||||||||
|---|---|---|---|---|---|---|---|---|---|
|HE|NOTES:1.|DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.|
|2.|CONTROLLING DIMENSION: INCH.|
|E|3.|D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.|
|MILLIMETERS|INCHES|
|DIM|MIN|NOM|MAX|MIN|NOM|MAX|
|A|1.90|2.13|2.41|0.075|0.084|0.095|
|= a|L|,|A1|0.05|0.10|0.15|0.002|0.004|0.006|
|b|D|b|1.96|2.03|2.11|0.077|0.080|0.083|
|c|0.15|0.23|0.30|0.006|0.009|0.012|
|D|3.30|3.56|3.81|0.130|0.140|0.150|
|E|4.06|4.32|4.57|0.160|0.170|0.180|
|io|H|E|5.21|5.44|5.59|0.205|0.214|0.220|
|L|0.76|1.02|1.27|0.030|0.040|0.050|
|L1|0.51 REF|0.020 REF|
|A|
|A1|
|ee|L|L1|c|[oo,]|—- TO|

**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [233 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.261<br>0.089<br>PT<br>L 2.743<br>0.108<br>Lo<br>2.159<br>0.085 mm<br>SCALE 8:1<br>c— (—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**ON Semiconductor Website** :  http://onsemi.com 

**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative. 

**http://onsemi.com** 

**MBRS1540T3/D** 

**5**