# Schottky Rectifier, 35 V, 10 A, Dual Common Cathode, TO-252 (DPAK), 4 Pins, 470 mV ![Product image](https://novapart.co/image/farnell:9556974/) **URL**: https://novapart.co/products/MBRD1035CTLG/schottky-rectifier-35-v-10-a-dual-common-cathode **SKU**: MBRD1035CTLG **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes **Price**: €0.7830 **Stock**: 500+ **Lead Time**: 2 days (indicative) ## Description Repetitive Reverse Voltage Vrrm Max:35V; Forward Current If(AV):5A; Diode Configuration:Dual Common Cathode; Diode Case Style:TO-252; No. of Pins:4Pins; Forward Voltage VF Max:470mV; Forward S ## Specifications | Parameter | Value | |---|---| | No. Of Pins | 4Pins | | Product Range | - | | Qualification | - | | Diode Mounting | Surface Mount | | Diode Case Style | TO-252 (DPAK) | | Diode Configuration | Dual Common Cathode | | Forward Voltage Max | 470mV | | Forward Surge Current | 50A | | Average Forward Current | 10A | | Operating Temperature Max | 150°C | | Repetitive Peak Reverse Voltage | 35V | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:9556974/) ## MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series ## Switch-mode Schottky Power Rectifier **DPAK Power Surface Mount Package** The MBRD1035CTL employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. **www.onsemi.com** **SCHOTTKY BARRIER RECTIFIER 10 AMPERES 35 VOLTS** ## **Features** - Highly Stable Oxide Passivated Junction - Guardring for Stress Protection - Matched Dual Die Construction − May be Paralleled for High Current Output - High dv/dt Capability - Short Heat Sink Tap Manufactured − Not Sheared - Very Low Forward Voltage Drop **==> picture [44 x 17] intentionally omitted <==** **----- Start of picture text -----**
DPAK
CASE 369C
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1 4 3 ~~at~~ - Epoxy Meets UL 94 V−0 @ 0.125 in - SBRD8 and NRVBD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable - These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant ## **Mechanical Characteristics:** - Case: Epoxy, Molded - Weight: 0.4 Gram (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ## **MARKING DIAGRAM** YWW B10 35CLG ~~4)~~ Y = Year WW = Work Week B1035CL = Device Code G = Pb−Free Package ## **ORDERING INFORMATION** See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. - ESD Rating: - ♦ Human Body Model = 3B (> 8 kV) - ♦ Machine Model = C (> 400 V) Publication Order Number: **MBRD1035CTL/D** **1** © Semiconductor Components Industries, LLC, 2016 **April, 2017 − Rev. 12** ## **MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage|VRRM
VRWM
VR|35|V| |Average Rectified Forward Current
(At Rated VR, TC= 115°C)
Per Leg
Per Package|IO|5.0
10|A| |Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC= 115°C)
Per Leg|IFRM|10|A| |Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Per Package|IFSM|50|A| |Storage / Operating Case Temperature|Tstg,Tc|−55 to +150|°C| |Operating Junction Temperature (Note 1)|TJ|−55 to +150|°C| |Voltage Rate of Change (Rated VR, TJ= 25°C)|dv/dt|10,000|V/�s| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Thermal Resistance, Junction−to−Case
Per Leg|R�JC|3.0|°C/W| |Thermal Resistance, Junction−to−Ambient (Note 2)
Per Leg|R�JA|137|°C/W| 2. Rating applies when using minimum pad size, FR4 PC Board ## **ELECTRICAL CHARACTERISTICS** |**ELECTRICAL CHARACTERISTICS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Maximum Instantaneous Forward Voltage (Note 3) (See Figure 2)
Per Leg
(IF= 5 Amps, TJ= 25°C)
(IF= 5 Amps, TJ= 100°C)
(IF= 10 Amps, TJ= 25°C)
(IF= 10 Amps, TJ= 100°C)|VF|0.47
0.41
0.56
0.55|V| |Maximum Instantaneous Reverse Current (Note 3) (See Figure 4)
Per Leg
(VR= 35 V, TJ= 25°C)
(VR= 35 V, TJ= 100°C)
(VR= 17.5 V, TJ= 25°C)
(VR= 17.5 V, TJ= 100°C)|IR|2.0
30
0.20
5.0|mA| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2.0% **www.onsemi.com** **2** **MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series** ## **ORDERING INFORMATION** |**ORDERING INFORMATION**||| |---|---|---| |**Device**|**Package**|**Shipping**†| |MBRD1035CTLG|DPAK
(Pb−Free)|75 Units / Rail| |SBRD81035CTLG*||75 Units / Rail| |SBRD81035CTLG−VF01*||75 Units / Rail| |MBRD1035CTLT4G||2,500 Units / Tape & Reel| |NRVBD1035VCTLT4G*||2,500 Units / Tape & Reel| |SBRD81035CTLT4G*||2,500 Units / Tape & Reel| †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *SBRD8 and NRVBD Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 388] intentionally omitted <==** **----- Start of picture text -----**
100 100
TJ = 125°C
10 TJ = 100°C 10 TJ = 125°C
TJ = 25°C
1.0 TJ = - 40°C 1.0 TJ = 25°C
TJ = 100°C
0.1 0.1
0.10 0.30 0.50 0.70 0.90 1.10 0.10 0.30 0.50 0.70 0.90 1.10
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage Per Leg Figure 2. Maximum Forward Voltage Per Leg
1E+0 1E+0
100E-3 100E-3
TJ = 125°C TJ = 125°C
10E-3 10E-3
1E-3 TJ = 100°C 1E-3 TJ = 100°C
100E-6 TJ = 25°C 100E-6
T J = 25°C
10E-6 10E-6
1E-6 1E-6
0 10 20 30 35 0 10 20 30 35
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
, REVERSE CURRENT (AMPS)
IR
, MAXIMUM REVERSE CURRENT (AMPS)
IR
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**Figure 3. Typical Reverse Current Per Leg** **Figure 4. Maximum Reverse Current Per Leg** **www.onsemi.com** **3** **MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series** **==> picture [299 x 396] intentionally omitted <==** **----- Start of picture text -----**
4.0
SQUARE WAVE
3.5
(50% DUTY CYCLE) dc
3.0
Ipk/Io = �
2.5
Ipk/Io = 5
2.0 Ipk/Io = 10
1.5 I pk /I o = 20
1.0
0.5
0
120 140 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation Per Leg
125
TJ = 25°CJ = 25°C = 25°C°CC R�JA = 2.43°C/W
115
R�JA = 25°C/W
105
R�JA = 48°C/W
95
R�JA = 67.5°C/W
85
R�JA = 84°C/W
75
65
25 0 5 10 15 20 25 30 35
VR, DC REVERSE VOLTAGE (VOLTS)
PFO, AVERAGE POWER DISSIPATION (WATTS)
°
TJ , DERATED OPERATING TEMPERATURE ( C)
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**==> picture [237 x 174] intentionally omitted <==** **----- Start of picture text -----**
8.0
dc
7.0
SQUARE WAVE
6.0 (50% DUTY CYCLE)
5.0
Ipk/Io = �
4.0
Ipk/Io = 5
3.0
Ipk/Io = 10
2.0
Ipk/Io = 20
1.0
freq = 20 kHz
0
0 20 40 60 80 100 120 140
TL, LEAD TEMPERATURE (°C)
, AVERAGE FORWARD CURRENT (AMPS)
IO
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**Figure 5. Current Derating Per Leg** **==> picture [237 x 175] intentionally omitted <==** **----- Start of picture text -----**
1000
TJ = 25°CJ = 25°C = 25°C°CC
100
10
0 5 10 15 20 25
VR, REVERSE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
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**Figure 8. Typical Operating Temperature Derating Per Leg *** **Figure 7. Capacitance Per Leg** * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. **www.onsemi.com** **4** **MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series** **==> picture [485 x 182] intentionally omitted <==** **----- Start of picture text -----**
1.0
50%(DUTY CYCLE)
20%
10%
5.0%
0.1
2.0%
1.0%
SINGLE PULSE Rtjl(t) = Rtjl • r(t)
0.01
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
t, TIME (s)
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
r(t)
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**Figure 9. Thermal Response Junction to Case (Per Leg)** **==> picture [491 x 180] intentionally omitted <==** **----- Start of picture text -----**
1.0E+00
50% (DUTY CYCLE)
20%
10%
1.0E-01
5.0%
2.0%
1.0E-02
1.0%
1.0E-03
SINGLE PULSE
Rtjl(t) = Rtjl • r(t)
1.0E-04
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000
t, TIME (s)
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
r(t)
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**Figure 10. Thermal Response Junction to Ambient (Per Leg)** **www.onsemi.com** **5** **MBRD1035CTL, NRVBD1035VCTL, SBRD81035CTL Series** ## **PACKAGE DIMENSIONS** **==> picture [104 x 29] intentionally omitted <==** **----- Start of picture text -----**
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
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**==> picture [23 x 6] intentionally omitted <==** **----- Start of picture text -----**
NOTES:
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**==> picture [481 x 410] intentionally omitted <==** **----- Start of picture text -----**
A 1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
E C 2. CONTROLLING DIMENSION: INCHES.
A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLDMENSIONS b3, L3 and Z.
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
4 NOT EXCEED 0.006 INCHES PER SIDE.
L3 bale Z 5. DIMENSIONS D AND E ARE DETERMINED AT THE
D DETAIL A H 6. DATUMS A AND B ARE DETERMINED AT DATUMOUTERMOST EXTREMES OF THE PLASTIC BODY.
1 2 3 PLANE H.
7. OPTIONAL MOLD FEATURE.
L4 NOTE 7 DIM MININCHESMAX MILLIMETERSMIN MAX
b2 c BOTTOM VIEW A 0.086 0.094 2.18 2.38
e SIDE VIEW A1 0.000 0.005 0.00 0.13
b b 0.025 0.035 0.63 0.89
TOP VIEW 0.005 (0.13) M C b2b3 0.0280.180 0.0450.215 0.724.57 1.145.46
c 0.018 0.024 0.46 0.61
c2 0.018 0.024 0.46 0.61
H Z Z D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
L2 [GAUGE] PLANE C SEATINGPLANE HL 0.3700.055 0.4100.070 9.401.40 10.411.78
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
L L3 0.035 0.050 0.89 1.27
A1 BOTTOM VIEW L4 −−− 0.040 −−− 1.01
ptf L1 fe CONSTRUCTIONSALTERNATE Z 0.155 −−− 3.93 −−−
DETAIL A
ROTATED 9 CW SOLDERING FOOTPRINT*
6.20 3.00
0.244 0.118
2.58
0.102
5.80
1.60 6.17
0.228
0.063 0.243
Te
SCALE 3:1 mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
**----- End of picture text -----**
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