# Schottky Rectifier, 100 V, 8 A, Single, TO-263 (D2PAK), 3 Pins, 710 mV

![Product image](https://novapart.co/image/farnell:2463427/)

**URL**: https://novapart.co/products/MBRB8H100T4G/schottky-rectifier-100-v-8-a-single-to-263-d2pak-3
**SKU**: MBRB8H100T4G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.8790
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):8A; Diode Configuration:Single; Diode Case Style:TO-263; No. of Pins:3Pins; Forward Voltage VF Max:710mV; Forward Surge Curren

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | MBRB8 |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-263 (D2PAK) |
| Diode Configuration | Single |
| Forward Voltage Max | 710mV |
| Forward Surge Current | 250A |
| Average Forward Current | 8A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2463427/)

## MBRB8H100T4G 

## SWITCHMODE Schottky Power Rectifier **Surface Mount Power Package** 

This series of Power Rectifiers employs the Schottky Barrier principle in a large metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. 

## **Features** 

## **http://onsemi.com** 

## **SCHOTTKY BARRIER RECTIFIER 8 AMPERES, 100 VOLTS** 

- Guardring for Stress Protection 

- Low Forward Voltage 

- 175°C Operating Junction Temperature 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Short Heat Sink Tab Manufactured − Not Sheared! 

1 4 3 (Pin 1 = No Connect) 

- This is a Pb−Free Device 

## **Mechanical Characteristics:** 

**==> picture [468 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
MARKING<br>• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 DIAGRAM<br>• Weight: 1.7 grams (approximately)<br>• Finish: All External Surfaces Corrosion Resistant and Terminal 4<br>AY   WW<br>Leads are Readily Solderable<br>• Lead and Mounting Surface Temperature for Soldering Purposes: 1 B8H100G<br>260°C Max. for 10 Seconds 3<br>• Device Meets MSL1 Requirements D [2] PAK<br>• ESD Ratings: Machine Model, C (>400 V) ° CASE 418B C<br>PLASTIC<br>Human Body Model, 3B (>8000 V)<br>MAXIMUM RATINGS A = Assembly Location<br>Y = Year<br>Rating Symbol Value Unit<br>WW = Work Week<br>Peak Repetitive Reverse Voltage VRRM 100 V B8H100 = Device Code<br>Working Peak Reverse Voltage VRWM G = Pb−Free Package<br>**----- End of picture text -----**<br>


|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRMRRM<br>VRWMRWM<br>VR|100|V|
|Average Rectified Forward Current<br>(Rated VR) TC= 171°C|IF(AV)|8|A|
|Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz)<br>TC= 171°C|IFRM|16|A|
|Max Nonrepetitive Peak Surge Current<br>(Surge applied at rated load conditions<br>halfwave, single phase, 60 Hz, 25°C)|IFSM|250|A|
|Operating Junction and Storage<br>Temperature Range (Note 1)|TJ, Tstg|−65 to +175|°C|



## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R JA. 

Publication Order Number: **MBRB8H100/D** 

**1** 

© Semiconductor Components Industries, LLC, 2008 **December, 2008 − Rev. 3** 

**MBRB8H100T4G** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance,<br>− Junction−to−Case (Note 2)<br>− Junction−to−Ambient|R�JC<br>R�JA|1.1<br>44|°C/W|



2. When mounted using minimum recommended pad size on FR−4 board. 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(IF= 8 A, TJ= 25°C)<br>(IF= 8 A, TJ= 125°C)|VF|0.71<br>0.55|V|
|Maximum Instantaneous Reverse Current (Note 3)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 125°C)|IR|4.5<br>5.3|�A<br>mA|
|**DYNAMIC CHARACTERISTICS**(Per Leg)||||
|Capacitance (VR= 4.0 V, TC= 25°C, Frequency = 1.0 MHz)|CT|600|pF|



3. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0% 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBRB8H100T4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**http://onsemi.com** 

**2** 

**MBRB8H100T4G** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [491 x 589] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>125 ° C<br>10 10<br>150 ° C 25 ° C<br>1 1<br>150 ° C 25 ° C<br>125 ° C<br>0.1 0.1<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100 100<br>150 ° C<br>10 150 ° C 10<br>1 1 125 ° C<br>125 ° C<br>0.1 0.1<br>0.01 0.01<br>0.001 0.001 25 ° C<br>25 ° C<br>0.0001 0.0001<br>0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>2000 14<br>dc<br>1800<br>1600 T J  = 25 ° C 12<br>f = 1 MHz<br>1400 10 Square Wave<br>1200<br>8<br>1000<br>6<br>800<br>600 4<br>400<br>2<br>200 R � JC = 1.1  ° C/W<br>0 0<br>0 10 20 30 40 50 60 70 80 90 100 150 155 160 160 170 175<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>, REVERSE CURRENT (mA) , REVERSE CURRENT (mA)<br>IR IR<br>CURRENT (A)<br>C, CAPACITANCE (pF) , AVERAGE FORWARD<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

**Figure 6. Current Derating, Case** 

**http://onsemi.com** 

**3** 

**MBRB8H100T4G** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [488 x 182] intentionally omitted <==**

**----- Start of picture text -----**<br>
8 5<br>dc RJA = 44 ° C/W TJ = 175 ° C<br>7 Square Wave<br>RJA = 80 ° C/W 4<br>6<br>dc<br>5<br>3 dc<br>4<br>2<br>3<br>Square Wave<br>2<br>1<br>1<br>0 0<br>0 20 40 60 80 100 120 140 160 180 0 1 2 3 4 5 6 7 8<br>TA, AMBIENT TEMPERATURE ( ° C) IF(AV), AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD CURRENT (A) , AVERAGE POWER DISSIPATION (W)<br>IF(AV) PF(AV)<br>**----- End of picture text -----**<br>


**Figure 7. Current Derating, Ambient** 

**Figure 8. Typical Forward Power Dissipation** 

**==> picture [489 x 394] intentionally omitted <==**

**----- Start of picture text -----**<br>
5<br>TJ = 175 ° C Square Wave<br>4<br>dc<br>3<br>2<br>1<br>0<br>0 1 2 3 4 5 6 7 8<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>Figure 9. Maximum Forward Power Dissipation<br>100<br>50% (DUTY CYCLE)<br>20%<br>10<br>10%<br>5.0%<br>2.0%<br>1.0<br>1.0%<br>0.1<br>0.01<br>SINGLE PULSE<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>PULSE TIME (s)<br>, MAXIMUM POWER DISSIPATION (W)<br>F(MAX)<br>P<br>C/W)<br>°<br>, TRANSIENT THERMAL RESPONSE (<br>(t)<br>R<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response, Junction−to−Ambient** 

**http://onsemi.com** 

**4** 

**MBRB8H100T4G** 

## **PACKAGE DIMENSIONS** 

**D[2] PAK 3** CASE 418B−04 ISSUE K 

**==> picture [328 x 345] intentionally omitted <==**

**----- Start of picture text -----**<br>
C<br>E<br>V<br>−B−<br>W<br>4<br>A<br>S<br>1 2 3<br>−T−<br>K<br>SEATING W<br>PLANE G J<br>H<br>D 3 PL<br>0.13 (0.005) M T B M<br>VARIABLE<br>CONFIGURATION<br>ZONE N P<br>R<br>U<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>**----- End of picture text -----**<br>


|NO<br>1. <br>2. <br>3.|TES:<br> DIME<br>PER<br> CON<br> 418B<br>NEW|NSIONING AND TOLERANCING<br>ANSI Y14.5M, 1982.<br>TROLLING DIMENSION: INCH.<br>−01 THRU 418B−03 OBSOLETE,<br>STANDARD 418B−04.|NSIONING AND TOLERANCING<br>ANSI Y14.5M, 1982.<br>TROLLING DIMENSION: INCH.<br>−01 THRU 418B−03 OBSOLETE,<br>STANDARD 418B−04.|NSIONING AND TOLERANCING<br>ANSI Y14.5M, 1982.<br>TROLLING DIMENSION: INCH.<br>−01 THRU 418B−03 OBSOLETE,<br>STANDARD 418B−04.|NSIONING AND TOLERANCING<br>ANSI Y14.5M, 1982.<br>TROLLING DIMENSION: INCH.<br>−01 THRU 418B−03 OBSOLETE,<br>STANDARD 418B−04.|
|---|---|---|---|---|---|
||**DIM**|**INCHES**||**MILLIMETERS**||
|||**MIN**<br>|**MAX**<br>|**MIN**<br>|**MAX**<br>|
||**A**|0.340|0.380|8.64|9.65|
||**B**|0.380|0.405|9.65|10.29|
||**C**|0.160|0.190|4.06|4.83|
||**D**|0.020|0.035|0.51|0.89|
||**E**|0.045|0.055|1.14|1.40|
||**F**|0.310|0.350|7.87|8.89|
||**G**<br>|0100 BSC<br><br>||254 BSC<br><br>||
||**H**|.<br>0.080|<br>0.110|.<br>2.03|<br>2.79|
||**J**|0018|002|046|064|
||**K**|.<br>0.090|.5<br>0.110|.<br>2.29|.<br>2.79|
||**L**|0.052|0.072|1.32|1.83|
||**M**|0.280|0.320|7.11|8.13|
||**N**|0.197 REF||5.00 REF||
||**P**|<br>0.079 REF||<br>2.00 REF||
||**R**|<br>0039 REF||<br>099 REF||
||**S**<br>|0.575<br>.|0.625<br>|14.60<br>.|15.88<br>|
||**V**|0.045|0.055|1.14|1.40|



## **SOLDERING FOOTPRINT*** 

**==> picture [148 x 173] intentionally omitted <==**

**----- Start of picture text -----**<br>
10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**http://onsemi.com** 

**5** 

**MBRB8H100T4G** 

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com 

**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada 

**Europe, Middle East and Africa Technical Support:** Phone: 421 33 790 2910 **Japan Customer Focus Center** Phone: 81−3−5773−3850 

**ON Semiconductor Website** : **www.onsemi.com** 

**Order Literature** : http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 

**MBRB8H100/D** 

**http://onsemi.com** 

**6** 



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