# Schottky Rectifier, 30 V, 40 A, Single, TO-263 (D2PAK), 3 Pins, 550 mV

![Product image](https://novapart.co/image/farnell:1431091/)

**URL**: https://novapart.co/products/MBRB4030G/schottky-rectifier-30-v-40-a-single-to-263-d2pak-3
**SKU**: MBRB4030G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €2.7100
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Product Range | MBRB4 |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-263 (D2PAK) |
| Diode Configuration | Single |
| Forward Voltage Max | 550mV |
| Forward Surge Current | 300A |
| Average Forward Current | 40A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1431091/)

## MBRB4030G, NRVBB4030T4G 

## **Preferred Device** 

## SWITCHMODE Power Rectifier 

These state−of−the−art devices use the Schottky Barrier principle with a proprietary barrier metal. 

**http://onsemi.com** 

## **Features** 

- Guardring for Stress Protection 

- Maximum Die Size 

- 175  C Operating Junction Temperature 

**SCHOTTKY BARRIER RECTIFIER 40 AMPERES, 30 VOLTS** 

- Short Heat Sink Tab Manufactured − Not Sheared 

- AEC−Q101 Qualified and PPAP Capable 

- NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- All Packages are Pb−Free* 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 

- Weight: 1.7 Grams (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable 

- Device Meets MSL1 Requirements 

- ESD Ratings: 

   - Machine Model = C (> 400 V) 

   - Human Body Model = 3B (> 8000 V) 

**==> picture [114 x 254] intentionally omitted <==**

**----- Start of picture text -----**<br>
D [2] PAK<br>CASE 418B<br>STYLE 3<br>1<br>4<br>3 b re<br>_<br>MARKING DIAGRAM<br>AY   WW<br>B4030G<br>AKA<br>a<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>B4030 = Device Code<br>G = Pb−Free Package<br>AKA = Diode Polarity<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

**Preferred** devices are recommended choices for future use and best overall value. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRB4030/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 7** 

**MBRB4030G, NRVBB4030T4G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|30|V|
|Average Rectified Forward Current<br>(At Rated VR) TC= +115C (Note 1)|IF(AV)|40|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 20 kHz), TC= +112C|IFRM|80|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|300|A|
|Peak Repetitive Reverse Surge Current (2.0�s, 1.0 kHz)|IRRM|2.0|A|
|Storage Temperature Range|Tstg|−65 to +175|C|
|Operating Junction Temperature Range (Note 2)|TJ|−65 to +175|C|
|Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s|
|Reverse Energy (Unclamped Inductive Surge), (TC= 25C, L = 3.0 mH)|W|600|mJ|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. Rating applies when pins 1 and 3 are connected. 

2. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Case|R�JC|1.0|C/W|
|Thermal Resistance, Junction−to−Ambient (Note 3)|R�JA|50|C/W|



3. Rating applies when surface mounted on the miniumum pad size recommended. 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Notes 4 and 5), per Device<br>(IF= 20 A, TC= + 25C)<br>(IF= 20 A, TC= +150C)<br>(IF= 40 A, TC= + 25C)<br>(IF= 40 A, TC= +150C)|VF|0.46<br>0.34<br>0.55<br>0.45|V|
|Maximum Instantaneous Reverse Current (Note 5), per Device<br>(Rated DC Voltage, TC= + 25C)<br>(Rated DC Voltage, TC= +125C)|IR|0.35<br>150|mA|



4. Rating applies when pins 1 and 3 are connected. 

5. Pulse Test: Pulse Width = 300 � s, Duty Cycle  2.0% 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBRB4030G|D2PAK<br>(Pb−Free)|50 Units / Rail|
|MBRB4030T4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|
|NRVBB4030T4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**http://onsemi.com** 

**2** 

**MBRB4030G, NRVBB4030T4G** 

## **ELECTRICAL CHARACTERISTICS** 

**==> picture [490 x 400] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 100<br>TJ = 150  C TJ = 150  C<br>10 10<br>100  C 25  C 100  C 25  C<br>1.0 1.0<br>0.1 0.1<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>VF, INSTANTANEOUS VOLTAGE (V) VF, INSTANTANEOUS VOLTAGE (V)<br>Figure 1. Maximum Forward Voltage Figure 2. Typical Forward Voltage<br>1.0 1.0<br>T J  = 150  C TJ = 150  C<br>0.1 0.1<br>100  C<br>0.01 100  C 0.01<br>10 [-3] 10 [-3]<br>10 [-4] 25  C 10 [-4] 25  C<br>10 [-5] 10 [-5]<br>0 5 10 15 20 25 30 0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>(PIN 1 SHORTED TO PIN 3) (PIN 1 SHORTED TO PIN 3)<br>IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A)<br>IR, REVERSE CURRENT (A)<br>IR, REVERSE CURRENT (A)<br>**----- End of picture text -----**<br>


**Figure 3. Maximum Reverse Current** 

**Figure 4. Typical Reverse Current** 

**==> picture [245 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 [4]<br>T J  = 25  C<br>TYPICAL MAXIMUM<br>1000<br>1 10<br>VR, REVERSE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Maximum and Typical Capacitance** 

**http://onsemi.com** 

**3** 

**MBRB4030G, NRVBB4030T4G** 

## **ELECTRICAL CHARACTERISTICS** 

**==> picture [490 x 619] intentionally omitted <==**

**----- Start of picture text -----**<br>
70 20 R� JA  = 25  C/W<br>DC DC<br>60  (RESISTIVE LOAD) SQUARE WAVE SURFACE MOUNTED ON<br>15 MINIMUM RECOMMENDED<br>50 SQUARE WAVE IPK = 5.0 (CAPACITIVE  PAD SIZE<br>I AV LOAD) (RESISTIVE LOAD)<br>4030 10 I IPK AV = 5.0 (CAPACITIVELOAD)<br>10<br>10<br>20<br>5<br>10 20 20<br>0 0<br>100 110 120 130 140 150 50 100 150<br>TC, CASE TEMPERATURE (  C) TA, AMBIENT TEMPERATURE (  C)<br>Figure 6. Current Derating, Infinite Heatsink Figure 7. Current Derating<br>12 50<br>R�JA = 50  C/W TJ = 150  C<br>DC<br>10   (RESISTIVE LOAD)<br> (RESISTIVE LOAD) 40 SQUARE WAVE<br>IPK = 5.0 (CAPACITIVE<br>8 SQUARE WAVE IAV LOAD)<br>30<br>6 IIPKAV = 5.0 (CAPACITIVE LOAD) 20 10<br>20<br>4 10 DC<br>10<br>2 20<br>0 0<br>0 50 100 150 0 10 20 30 40 50 60 70 80<br>TA, AMBIENT TEMPERATURE (  C) IF(AV), AVERAGE FORWARD CURRENT (A)<br>Figure 8. Current Derating, Free Air Figure 9. Forward Power Dissipation<br>1.0<br>SINGLE PULSE<br>0.1 tp Ppk Ppk DUTY CYCLEPEAK POWER, D = t, P pk ,p is /t1peak of an<br>TIME equivalent square power pulse.<br>t1<br>�TJL = Ppk   R�JL [D + (1 - D)    r(t1 + tp) + r(tp) - r(t1)]<br>where<br>�TJL = the increase in junction temperature above the lead temperature<br>r(t) = normalized value of transient thermal resistance at time, t, for example,<br>r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.<br>0.01<br>0.1 1.0 10 100 1000<br>t, TIME (ms)<br>(PIN 1 SHORTED TO PIN 3) (PIN 1 SHORTED TO PIN 3)<br>IF(AV), AVERAGE FORWARD CURRENT (A) IF(AV), AVERAGE FORWARD CURRENT (A)<br>(PIN 1 SHORTED TO PIN 3) (PIN 1 SHORTED TO PIN 3)<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)<br>RESISTANCE (NORMALIZED)<br>R(t), EFFECTIVE TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response** 

**http://onsemi.com** 

**4** 

**MBRB4030G, NRVBB4030T4G** 

## **PACKAGE DIMENSIONS** 

**D[2] PAK 3** CASE 418B−04 ISSUE K 

**==> picture [458 x 554] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTES:<br>C 1. DIMENSIONING AND TOLERANCING<br>PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.<br>W<br>4 INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.340 0.380 8.64 9.65<br>B 0.380 0.405 9.65 10.29<br>A C 0.160 0.190 4.06 4.83<br>S D 0.020 0.035 0.51 0.89<br>1 2 3 E 0.045 0.055 1.14 1.40<br>F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>−T− H 0.080 0.110 2.03 2.79<br>K J 0.018 0.025 0.46 0.64<br>SEATINGPLANE G J W KL 0.0520.090 0.0720.110 2.291.32 2.791.83<br>M 0.280 0.320 7.11 8.13<br>H N 0.197 REF 5.00 REF<br>D 3 PL P 0.079 REF 2.00 REF<br>R 0.039 REF 0.99 REF<br>0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88<br>V 0.045 0.055 1.14 1.40<br>VARIABLE STYLE 3:<br>CONFIGURATION PIN 1. ANODE<br>ZONE N P 2. CATHODE<br>R 3. ANODE<br>U 4. CATHODE<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>SOLDERING FOOTPRINT*<br>10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**http://onsemi.com** 

**5** 

**MBRB4030G, NRVBB4030T4G** 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 

**ON Semiconductor Website** : **www.onsemi.com** 

**Order Literature** : http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 

**MBRB4030/D** 

**http://onsemi.com** 

**6** 



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