# Schottky Rectifier, 30 V, 30 A, Dual Common Cathode, TO-263 (D2PAK), 3 Pins, 670 mV

![Product image](https://novapart.co/image/farnell:3606402/)

**URL**: https://novapart.co/products/MBRB3030CTT4G./schottky-rectifier-30-v-a-dual-common-cathode-to
**SKU**: MBRB3030CTT4G.
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €1.7100
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 3Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-263 (D2PAK) |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 670mV |
| Forward Surge Current | 200A |
| Average Forward Current | 30A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 30V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3606402/)

**Preferred Device** 

## MBRB3030CT 

## SWITCHMODE Power Rectifier 

These state−of−the−art devices use the Schottky Barrier principle with a proprietary barrier metal. 

## **Features** 

## **http://onsemi.com** 

- Guardring for Stress Protection 

- Maximum Die Size 

- 175 ° C Operating Junction Temperature 

- Short Heat Sink Tab Manufactured − Not Sheared 

- Pb−Free Packages are Available 

**SCHOTTKY BARRIER RECTIFIER 30 AMPERES, 30 VOLTS** 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 

- Weight: 1.7 Grams (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

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- Lead and Mounting Surface Temperature for Soldering Purposes: 260 ° C Max. for 10 Seconds 

- Device Meets MSL1 Requirements 

- ESD Ratings: Machine Model, C (>400 V) 

Human Body Model, 3B (>8000 V) 

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## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**|~~ae~~|||
|---|---|---|---|
|**Rating**<br>~~ee~~|**Symbol**<br>~~ee~~<br>~~ae~~|**Value**<br>~~ee~~|**Unit**<br>~~ee~~|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>~~ee~~|VRRM<br>VRWM<br>VR<br>~~ee~~<br>~~ae~~|30<br>~~ee~~|V<br>~~ee~~|
|Average Rectified Forward Current<br>(At Rated VR, TC= 134°C)<br>Per Device<br>Per Leg|IF(AV)<br>~~ae~~|30<br>15|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave,<br>20 kHz, TC= +137°C) Per Leg|IFRM|30|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions,<br>Halfwave, Single Phase, 60 Hz)|IFSM|200|A|
|Peak Repetitive Reverse Surge Current<br>(2.0 s, 1.0 kHz)|IRRM<br>~~Ge~~|2.0<br>~~en~~|A|
|Storage Temperature Range<br>~~en~~<br>~~rn~~|Tstg<br>~~en~~<br>~~Ge~~<br>~~Ge~~<br>|−55 to +175<br>~~en~~<br>~~en~~<br>~~Gn~~<br>|°C<br>~~en~~<br>~~Ge~~<br>|
|Operating Junction Temperature (Note 1)<br>~~en~~<br>~~rn~~|TJ<br>~~Ge~~<br>~~en~~<br>~~Ge~~<br>|−55 to +175<br>~~en~~<br>~~en~~<br>~~Gn~~<br>|°C<br>~~en~~<br>~~Ge~~<br>|
|Voltage Rate of Change (Rated VR)<br>~~rn~~|dv/dt<br>~~Ge~~<br>~~se~~|10,000<br>~~Gn~~<br>~~se~~|V/ s<br>~~Ge~~<br>~~se~~|
|Reverse Energy<br>(Unclamped Inductive Surge)<br>(Inductance = 3 mH, TC= 25°C)<br>~~rn ~~|W<br>~~Ge~~<br> ~~se~~|100<br>~~Gn~~<br>~~se~~|mJ<br>~~Ge~~<br>~~se~~|



1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R JA. 

**D[2] PAK CASE 418B STYLE 3** 

## **MARKING DIAGRAM** 

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AY   WW<br>B3030CTG<br>AKA<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>B3030CT = Device Code<br>G = Pb−Free Package<br>AKA = Diode Polarity<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

**Preferred** devices are recommended choices for future use and best overall value. 

Publication Order Number: **MBRB3030CT/D** 

**1** 

 Semiconductor Components Industries, LLC, 2006 **February, 2006 − Rev. 6** 

**MBRB3030CT** 

## **THERMAL CHARACTERISTICS** (Per Leg) 

|**THERMAL CHARACTERISTICS** (Per Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, −Junction−to−Case<br>−Junction−to−Ambient (Note 2)|R�JC<br>R�JA|1.0<br>50|°C/W|



2. When mounted using minimum recommended pad size on FR−4 board. 

## **ELECTRICAL CHARACTERISTICS** (Per Leg) 

|**ELECTRICAL CHARACTERISTICS** (Per Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3), Per Leg<br>(IF= 15 Amps, TC= +25°C)<br>(IF= 15 Amps, TC= +150°C)<br>(IF= 30 Amps, TC= +25°C)<br>(IF= 30 Amps, TC= +150°C)|VF|0.54<br>0.47<br>0.67<br>0.66|V|
|Maximum Instantaneous Reverse Current (Note 3), Per Leg<br>(Rated dc Voltage, TC= +25°C)<br>(Reverse Voltage = 10 V, TC= +150°C)<br>(Rated dc Voltage, TC= +150°C)|IR|0.6<br>46<br>145|mA|



3. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBRB3030CT|D2PAK|50 Units / Rail|
|MBRB3030CTG|D2PAK<br>(Pb−Free)|50 Units / Rail|
|MBRB3030CTT4|D2PAK|800 Units / Tape & Reel|
|MBRB3030CTT4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**http://onsemi.com** 

**2** 

# **MBRB3030CT** 

## **ELECTRICAL CHARACTERISTICS** 

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100 100<br>10 ÎÎÎÎ TJ = 150 ° C 10 ÎÎÎ TJ = 150 ° C<br>25 ° C 25 ° C<br>ÎÎ ÎÎ<br>1 1<br>ÎÎÎ 100 ° C ÎÎ 100 ° C<br>0.1 ÎÎÎ 0.1 ÎÎ<br>0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>VF, INSTANTANEOUS VOLTAGE (VOLTS) VF, INSTANTANEOUS VOLTAGE (V)<br>Figure 1. Maximum Forward Voltage, Per Leg Figure 2. Typical Forward Voltage, Per Leg<br>1.0 ÎÎÎ 1.0<br>0.1 ÎÎÎ TJ = 150 ° C 0.1 ÎÎÎÎ T J  = 150 ° C<br>ÎÎÎÎ<br>0.01 ÎÎÎ 0.01<br>100 ° C 100 ° C<br>0.001 ÎÎÎ 0.001 ÎÎ<br>10 [−4] 25 ° C 10 [−4]<br>ÎÎÎ ÎÎÎ<br>10 [−5] 10 [−5] ÎÎÎ 25 ° C<br>10 [−6] 10 [−6]<br>0 5 10 15 20 25 30 0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Figure 3. Maximum Reverse Current, Per Leg Figure 4. Typical Reverse Current, Per Leg<br>TJ = 25 ° C<br>5000<br>3000<br>MAXIMUM<br>TYPICAL<br>1000<br>800<br>600<br>1 10<br>VR, REVERSE VOLTAGE (V)<br>, INSTANTANEOUS FORWARD CURRENT (A)IF IF, INSTANTANEOUS FORWARD CURRENT (A)<br>IR, REVERSE CURRENT (A) IR, REVERSE CURRENT (A)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Capacitance** 

# **http://onsemi.com 3** 

**MBRB3030CT** 

## **TYPICAL CHARACTERISTICS** 

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30 R�JC = 1 ° C/W R�JA = 25 ° C/W<br>DC SQUARE WAVE 15<br>IPK = 5.0 (CAPACITIVE DC<br>20 π  (RESISTIVE LOAD) IAV LOAD) SQUARE WAVE<br>10 π  (RESISTIVE LOAD) IPK = 5.0 (CAPACITIVE<br>IAV LOAD)<br>10 10<br>5 10<br>20<br>20<br>0 0<br>120 125 130 135 140 145 150 155 0 50 100 150<br>TC, CASE TEMPERATURE ( ° C) TA, AMBIENT TEMPERATURE ( ° C)<br>Figure 6. Current Derating, Infinite Heatsink Figure 7. Current Derating<br>10<br>R�JA = 50 ° C/W TJ = 150 ° C<br>8 DC π  (RESISTIVE LOAD) 15 π  (RESISTIVE LOAD)<br>IPK = 5.0 (CAPACITIVE<br>SQUARE WAVE IAV<br>LOAD) DC<br>6<br>IPK = 5.0 (CAPACITIVE 10<br>IAV LOAD) 10<br>4<br>20<br>SQUARE WAVE<br>10<br>5<br>2<br>20<br>0 0<br>0 50 100 150 0 5 10 15 20 25<br>TA, AMBIENT TEMPERATURE ( ° C) IF(AV), AVERAGE FORWARD CURRENT (A)<br>Figure 8. Current Derating, Free Air Figure 9. Forward Power Dissipation<br>1.0<br>SINGLE PULSE<br>0.1 Ppk Ppk DUTY CYCLE, D = tp/t1<br>tp PEAK POWER, Ppk, is peak of an<br>TIME equivalent square power pulse.<br>t1<br>�TJL = Ppk •  R�JL [D + (1 − D)  •  r(t1 + tp) + r(tp) − r(t1)]<br>where<br>�TJL = the increase in junction temperature above the lead temperature<br>r(t) = normalized value of transient thermal resistance at time, t, for example,<br>r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.<br>0.01<br>0.1 1.0 10 100 1000<br>t, TIME (ms)<br>IF(AV), AVERAGE FORWARD CURRENT (A) IF(AV), AVERAGE FORWARD CURRENT (A)<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>PF(AV), AVERAGE FORWARD POWER DISSIPATION (W)<br>RESISTANCE (NORMALIZED)<br>R(t), EFFECTIVE TRANSIENT THERMAL<br>**----- End of picture text -----**<br>


**Figure 10. Thermal Response** 

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. 

**http://onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**D[2] PAK 3** CASE 418B−04 ISSUE L 

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DATE 17 FEB 2015 

**SCALE 1:1** 

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NOTES:<br>C 1. DIMENSIONING AND TOLERANCING<br>PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.<br>W<br>4 INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.340 0.380 8.64 9.65<br>B 0.380 0.405 9.65 10.29<br>A C 0.160 0.190 4.06 4.83<br>S D 0.020 0.035 0.51 0.89<br>1 2 3 E 0.045 0.055 1.14 1.40<br>F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>−T− H 0.080 0.110 2.03 2.79<br>K J 0.018 0.025 0.46 0.64<br>SEATINGPLANE G J W KL 0.0900.052 0.0720.110 2.291.32 2.791.83<br>M 0.280 0.320 7.11 8.13<br>H N 0.197 REF 5.00 REF<br>D 3 PL P 0.079 REF 2.00 REF<br>R 0.039 REF 0.99 REF<br>0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88<br>V 0.045 0.055 1.14 1.40<br>VARIABLE<br>CONFIGURATION<br>ZONE N P<br>R<br>U<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. GATE PIN 1. CATHODE PIN 1. NO CONNECT<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. COLLECTOR 2. ANODE 2. CATHODE<br>3. EMITTER 3. SOURCE 3. ANODE 3. EMITTER 3. CATHODE 3. ANODE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. COLLECTOR 4. ANODE 4. CATHODE<br>**----- End of picture text -----**<br>


## **MARKING INFORMATION AND FOOTPRINT ON PAGE 2** 

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Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42761B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION:  D [2] PAK 3 PAGE 1 OF 2<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

DATE 17 FEB 2015 

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D [2] PAK 3<br>CASE 418B−04<br>ISSUE L<br>**----- End of picture text -----**<br>


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GENERIC<br>MARKING DIAGRAM*<br>xx AYWW<br>xxxxxxxxG<br>xxxxxxxxx xxxxxxxxG<br>AYWW<br>AWLYWWG  AKA<br>IC Standard Rectifier<br>xx = Specific Device Code<br>A = Assembly Location<br>WL = Wafer Lot<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>AKA = Polarity Indicator<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

## **SOLDERING FOOTPRINT*** 

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10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42761B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: D[2] PAK 3 PAGE 2 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

**www.onsemi.com** 

~~**2**~~ 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

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 



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