# Schottky Rectifier, 45 V, 15 A, Dual Common Cathode, TO-263 (D2PAK), 3 Pins, 840 mV

![Product image](https://novapart.co/image/farnell:1431082/)

**URL**: https://novapart.co/products/MBRB1545CTG/schottky-rectifier-45-v-15-a-dual-common-cathode
**SKU**: MBRB1545CTG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €1.2300
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3Pins |
| Product Range | MBRB1 |
| Diode Mounting | Surface Mount |
| Diode Case Style | TO-263 (D2PAK) |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 840mV |
| Forward Surge Current | 150A |
| Average Forward Current | 15A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 45V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1431082/)

## MBRB1545CTG, SBRB1545CTG 

## SWITCHMODE Power Rectifier 

## **D[2] PAK Surface Mount Power Package** 

The D[2] PAK Power Rectifier employs the Schottky Barrier principle with a platinum barrier metal. These state-of-the-art devices have the following features: 

## **Features** 

- Center−Tap Configuration 

## **http://onsemi.com** 

**SCHOTTKY BARRIER RECTIFIER 15 AMPERES 45 VOLTS** 

- Guardring for Stress Protection 

- Low Forward Voltage 

- 175°C Operating Junction Temperature 

- Epoxy Meets UL 94, V−0 @ 0.125 in 

- Short Heatsink Tab Manufactured − Not Sheared 

- Similar in Size to the Industry Standard TO220 Package 

- SBRB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

**D[2] PAK CASE 418B STYLE 3** 

1 4 3 

## **Mechanical Characteristics** 

**MARKING DIAGRAM** 

- Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 

- Weight: 1.7 grams (approximately) 

• Finish: All External Surfaces Corrosion Resistant and Terminal B1545 = Device Code AY    WW A = Assembly Location Leads are Readily Solderable B1545G Y = Year • Lead and Mounting Surface Temperature for Soldering Purposes: AKA WW = Work Week 260°C Max. for 10 Seconds G = Pb−Free Package • Device Meets MSL1 Requirements ~~:~~ AKA = Diode Polarity • ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) **ORDERING INFORMATION Device Package Shipping**[†] MBRB1545CTG D[2] PAK 50 Units/Rail (Pb−Free) SBRB1545CTG D[2] PAK 50 Units/Rail (Pb−Free) MBRB1545CTT4G D[2] PAK 800/Tape & Reel (Pb−Free) SBRB1545CTT4G D[2] PAK 800/Tape & Reel (Pb−Free) ~~=e~~ †For information on tape and reel specifications, including part orientation and tape sizes, please *For additional information on our Pb−Free strategy and soldering details, please refer to our Tape and Reel Packaging Specifications download the ON Semiconductor Soldering and Mounting Techniques Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRB1545CT/D** 

**1** 

© Semiconductor Components Industries, LLC, 2012 **November, 2012 − Rev. 13** 

**MBRB1545CTG, SBRB1545CTG** 

## **MAXIMUM RATINGS** (Per Leg) 

|**MAXIMUM RATINGS**(Per Leg)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|45|V|
|Average Rectified Forward Current<br>(Rated VR, TC= 167°C) Total Device|IF(AV)|7.5<br>15|A|
|Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz, TC= 166°C)|IFRM|15|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|150|A|
|Peak Repetitive Reverse Surge Current (2.0�s, 1.0 kHz)|IRRM|1.0|A|
|Storage Temperature Range|Tstg|−65 to +175|°C|
|Operating Junction Temperature (Note 1)|TJ|−65 to +175|°C|
|Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** (Per Leg) 

|**THERMAL CHARACTERISTICS**(Per Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance<br>Junction to Case<br>Junction to Ambient (Note 2)|R�JC<br>R�JA|2.0<br>50|°C/W|



2. When mounted using minimum recommended pad size on FR−4 board. 

## **ELECTRICAL CHARACTERISTICS** (Per Leg) 

|**ELECTRICAL CHARACTERISTICS**(Per Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(iF= 7.5 Amps, TJ= 125°C)<br>(iF= 15 Amps, TJ= 125°C)<br>(iF= 15 Amps, TJ= 25°C)|VF|0.57<br>0.72<br>0.84|V|
|Maximum Instantaneous Reverse Current (Note 3)<br>(Rated dc Voltage, TJ= 125°C)<br>(Rated dc Voltage, TJ= 25°C)|iR|15<br>0.1|mA|



3. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

**http://onsemi.com** 

**2** 

**MBRB1545CTG, SBRB1545CTG** 

**==> picture [489 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>30<br>20 10<br>10 125°C<br>1<br>3 85°C<br>2<br>0.1<br>1<br>0.5 125°C 85°C 25°C 0.01 25°C<br>0.001<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 10 20 30 40 50<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>, REVERSE LEAKAGE CURRENT (mA)<br>IR<br>iF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage, Per Leg** 

**Figure 2. Typical Reverse Current, Per Leg** 

**==> picture [485 x 192] intentionally omitted <==**

**----- Start of picture text -----**<br>
14<br>16<br>TJ = 125°C IPK = DC<br>14 I AV 12<br>�<br>IPK<br>12 IPK = 10 IAV = 5 10<br>10 IPK I AV SQUARE<br>= 20 8<br>IAV<br>8<br>DC 6<br>6<br>4<br>SQUARE<br>4<br>WAVE<br>2<br>2<br>0 0<br>0 2 4 6 8 10 12 14 16 155 160 165 170 175<br>IF(AV), AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE ( ° C)<br>, AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD POWER DISSIPATION (WATTS)PF(AV) IF(AV)<br>**----- End of picture text -----**<br>


**Figure 3. Typical Forward Power Dissipation** 

**Figure 4. Current Derating, Case, Per Leg** 

**http://onsemi.com** 

**3** 

**MBRB1545CTG, SBRB1545CTG** 

## **PACKAGE DIMENSIONS** 

**D[2] PAK** CASE 418B−04 ISSUE K 

**==> picture [466 x 525] intentionally omitted <==**

**----- Start of picture text -----**<br>
−B− C NOTES:<br>1. DIMENSIONING AND TOLERANCING<br>4 E PER ANSI Y14.5M, 1982.<br>V 2.3. 418B−01 THRU 418B−03 OBSOLETE,CONTROLLING DIMENSION: INCH.<br>W NEW STANDARD 418B−04.<br>INCHES MILLIMETERS<br>S DIM MIN MAX MIN MAX<br>1 2 3<br>A 0.340 0.380 8.64 9.65<br>A B 0.380 0.405 9.65 10.29<br>C 0.160 0.190 4.06 4.83<br>−T− D 0.020 0.035 0.51 0.89<br>SEATING E 0.045 0.055 1.14 1.40<br>PLANE G F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>K H 0.080 0.110 2.03 2.79<br>D 3 PL J W KJ 0.0180.090 0.0250.110 2.290.46 2.790.64<br>0.13 (0.005) M T B M L 0.052 0.072 1.32 1.83<br>H M 0.280 0.320 7.11 8.13<br>N 0.197 REF 5.00 REF<br>VARIABLE P 0.079 REF 2.00 REF<br>CONFIGURATION R 0.039 REF 0.99 REF<br>ZONE N P S 0.575 0.625 14.60 15.88<br>R V 0.045 0.055 1.14 1.40<br>U<br>STYLE 3:<br>L L L PIN 1. ANODE<br>2. CATHODE<br>3. ANODE<br>M M M 4. CATHODE<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>SOLDERING FOOTPRINT*<br>10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**http://onsemi.com** 

**4** 

**MBRB1545CTG, SBRB1545CTG** 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com 

**N. American Technical Support** : 800−282−9855 Toll Free USA/Canada 

**ON Semiconductor Website** : **www.onsemi.com** 

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**http://onsemi.com** 

**MBRB1545CT/D** 

**5** 



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