# Schottky Rectifier, 10 V, 2 A, Single, DO-214AC (SMA), 2 Pins, 500 mV

![Product image](https://novapart.co/image/farnell:1431077/)

**URL**: https://novapart.co/products/MBRA210ET3G/schottky-rectifier-10-v-2-a-single-do-214ac-sma
**SKU**: MBRA210ET3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.3000
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 2Pins |
| Product Range | MBRA2 |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | DO-214AC (SMA) |
| Diode Configuration | Single |
| Forward Voltage Max | 500mV |
| Forward Surge Current | 150A |
| Average Forward Current | 2A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 10V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1431077/)

## MBRA210ET3 

## Surface Mount Schottky Power Rectifier **SMA Power Surface Mount Package** 

This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Typical applications are AC/DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. 

## **Features** 

- Low IR, Extends Battery Life 

- 1st in the Market Place with a 10 VR Schottky Rectifier 

- Compact Package with J−Bend Leads Ideal for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Guardring for Over−Voltage Protection 

## **http://onsemi.com** 

**SCHOTTKY BARRIER RECTIFIER 2 AMPERES 10 VOLTS** ~~S~~ **SMA CASE 403D PLASTIC** 

- Optimized for Low Leakage Current 

- Pb−Free Package is Available 

## **MARKING DIAGRAM** 

## **Mechanical Characteristics** 

- Case: Molded Epoxy 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 70 mg (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Polarity: Polarity Band Indicates Cathode Lead 

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B2E1<br>AYWW<br>B2E1 = Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>= Pb−Free Package<br>**----- End of picture text -----**<br>


- ESD Ratings: 

Machine Model = C Human Body Model = 3B 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MBRA210ET3 SMA 5000/Tape & Reel MBRA210ET3G SMA 5000/Tape & Reel (Pb−Free) ~~——~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MBRA210ET3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2008 **August, 2008 − Rev. 6** 

**MBRA210ET3** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|10|V|
|Average Rectified Forward Current<br>(At Rated VR, TC= 125°C)|IO|2.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|100|A|
|Storage/Operating Case Temperature|Tstg, TC|−65 to +150|°C|
|Operating Junction Temperature|TJ|−65 to +150|°C|
|Voltage Rate of Change<br>(Rated VR, TJ= 25°C)|dv/dt|10,000|V/�s|



Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min Pad**|**1 Inch** **Pad**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 1)<br>Thermal Resistance, Junction−to−Ambient (Note 1)|R�JL<br>R�JA|22<br>150|15<br>81|°C/W|
|**ELECTRICAL CHARACTERISTICS**|||||
|Maximum Instantaneous Forward Voltage (Note 2)<br>(IF= 0.1 A)<br>(IF= 1.0 A)<br>(IF= 2.0 A)|VF|**TJ = 25**°**C**|**TJ = 100**°**C**|V|
|||0.405<br>0.480<br>0.500|0.275<br>0.355<br>0.385||
|Maximum Instantaneous Reverse Current<br>(VR= 5.0 V)<br>(VR= 10 V)|IR|**TJ = 25**°**C**|**TJ = 100**°**C**|�A|
|||15<br>50|200<br>500||



1. Mounted on a 3 ″ square FR4 PC Board with min. pads or 1 ″ square copper heat spreader. 

2. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2%. 

**http://onsemi.com** 

**2** 

**MBRA210ET3** 

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100 100<br>10 10<br>100 ° C<br>1 1<br>0.1 125 ° C 75 ° C 25 ° C −40 ° C 0.1 125 ° C 100 ° C 25 ° C<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD<br>VOLTAGE (VOLTS)<br>CURRENT (AMPS)<br>, INSTANTANEOUS FORWARDIF , MAXIMUM INSTANTANEOUSIF FORWARD CURRENT (AMPS)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 2. Maximum Forward Voltage** 

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1.00E−03<br>125 ° C<br>1.00E−04 100 ° C<br>75 ° C<br>1.00E−05<br>1.00E−06<br>25 ° C<br>1.00E−07<br>0 2 4 6 8 10<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current<br>3.5 1.4<br>dc<br>3.0 1.2<br>dc<br>2.5 1.0<br>2.0 SQUARE WAVE 0.8<br>SQUARE WAVE<br>1.5 0.6<br>1.0 0.4<br>0.5 0.2<br>0 0<br>110 120 130 140 150 160 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>TL, LEAD TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>Figure 4. Current Derating − Junction to Lead Figure 5. Forward Power Dissipation<br>, REVERSE CURRENT (AMPS)<br>IR<br>CURRENT (AMPS)<br>, AVERAGE FORWARD<br>IF<br>, AVERAGE POWER DISSIPATION (WATTS)<br>FO<br>P<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**3** 

**MBRA210ET3** 

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10,000<br>1000<br>100<br>0 2 4 6 8 10<br>VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 6. Typical Capacitance** 

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100<br>D = 0.5<br>0.2<br>0.1<br>10<br>0.05<br>0.02<br>0.01<br>1<br>SINGLE PULSE<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, TIME (S)<br>Figure 7. Thermal Response, Junction to Ambient (min pad)<br>100<br>D = 0.5<br>0.2<br>10 0.1<br>0.05<br>0.02<br>1 0.01<br>SINGLE PULSE<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, TIME (S)<br>C/W)<br>°<br>, TRANSIENT THERMAL RESISTANCE (<br>(t)<br>R<br>C/W)<br>°<br>, TRANSIENT THERMAL RESISTANCE (<br>(t)<br>R<br>**----- End of picture text -----**<br>


**Figure 8. Thermal Response, Junction to Ambient (1 inch pad)** 

**http://onsemi.com** 

**4** 

**MBRA210ET3** 

## **PACKAGE DIMENSIONS** 

**SMA** CASE 403D−02 ISSUE D 

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HE<br>E<br>=<br>b D<br>ime POLARITY INDICATOR<br>OPTIONAL AS NEEDED bay<br>**----- End of picture text -----**<br>


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(SEE STYLES)<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 1.92 2.17 2.27 0.076 0.085 0.089<br>A1 0.05 0.10 0.15 0.002 0.004 0.006<br>b 1.27 1.45 1.63 0.050 0.057 0.064<br>c 0.15 0.28 0.41 0.006 0.011 0.016<br>D 2.29 2.60 2.92 0.090 0.103 0.115<br>== E 4.06 SSSe 4.32 4.57 0.160 0.170 E 0.180<br>H E 4.83 5.21 5.59 0.190 0.205 0.220<br>L 0.76 1.14 1.52 0.030 0.045 0.060<br>**----- End of picture text -----**<br>


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= L<br>**----- End of picture text -----**<br>


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A<br>A1<br>c<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

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**----- Start of picture text -----**<br>
4.0<br>0.157<br>2.0<br>0.0787<br>+<br>oe<br>2.0<br>an<br>0.0787<br>SCALE 8:1 mm<br>(—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com 

**N. American Technical Support** : 800−282−9855 Toll Free 

**ON Semiconductor Website** : **www.onsemi.com** 

USA/Canada 

**Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5773−3850 Sales Representative 

**http://onsemi.com** 

**MBRA210ET3/D** 

**5** 



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