# Schottky Rectifier, 100 V, 40 A, Dual Common Cathode, TO-220, 3 Pins, 900 mV

![Product image](https://novapart.co/image/farnell:1431070/)

**URL**: https://novapart.co/products/MBR41H100CTG/schottky-rectifier-100-v-40-a-dual-common-cathode
**SKU**: MBR41H100CTG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.9740
**Stock**: 200+
**Lead Time**: 106 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):40A; Diode Configuration:Dual Common Cathode; Diode Case Style:TO-220; No. of Pins:3Pins; Forward Voltage VF Max:900mV;

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Product Range | MBR41 |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | TO-220 |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 900mV |
| Forward Surge Current | 350A |
| Average Forward Current | 40A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1431070/)

## Switch-mode Power Rectifier 100 V, 40 A 

## MBR41H100CT, NRVBB41H100CT Series 

**www.onsemi.com** 

## **Features and Benefits** 

• Low Forward Voltage: 0.67 V @ 125°C 1 2, 4 • Low Power Loss/High Efficiency 3 • High Surge Capacity • 175°C Operating Junction Temperature 4 **MARKING DIAGRAMS** • 40 A Total (20 A Per Diode Leg) • Guard−Ring for Stress Protection • NRVBB Prefix for Automotive and Other Applications Requiring **TO−220** ~~os~~ **CASE 221A** Unique Site and Control Change Requirements; AEC−Q101 AYWW **STYLE 6** Qualified and PPAP Capable B41H100x • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 1 AKA 2 Compliant 3 • MBR41H100CTH and MBRB41H100CT−1H are Halide−Free **D[2] PAK−3 CASE 418B Applications** AYWW **STYLE 3** • Power Supply − Output Rectification B41H100G 4 AKA • Power Management • Instrumentation 1 3 an ~~n~~ **Mechanical Characteristics:** 4 • Case: Epoxy, Molded • Epoxy Meets UL 94 V−0 @ 0.125 in **I[2] PAK (TO−262)CASE 418D** B41H100xAYWW • Weight (Approximately): 1.9 Grams (TO−220) **STYLE 3** AKA 1.7 Grams (D[2] PAK−3) 1.5 Grams (TO−262) • Finish: All External Surfaces Corrosion Resistant and Terminal . 1 2 Leads are Readily Solderable 3 • Lead Temperature for Soldering Purposes: AY = Assembly Location= Year 260°C Max. for 10 Seconds WW = Work Week x = G or H G = Pb−Free Package H = Halide−Free Package AKA = Polarity Designator 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. 

Publication Order Number: **MBR41H100CT/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **October, 2020 − Rev. 10** 

## **MBR41H100CT, NRVBB41H100CT Series** 

## **MAXIMUM RATINGS** (Per Diode Leg) 

|**MAXIMUM RATINGS**(Per Diode Leg)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|100|V|
|Average Rectified Forward Current<br>(Rated VR) TC= 150°C|IF(AV)|20|A|
|Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz) TC= 145°C|IFRM|40|A|
|Nonrepetitive Peak Surge Current<br>(Surge applied at rated load conditions halfwave, single phase, 60 Hz)|IFSM|350|A|
|Operating Junction Temperature (Note 1)|TJ|+175|°C|
|Storage Temperature|Tstg|�65 to +175|°C|
|Voltage Rate of Change (Rated VR)|dv/dt|10,000|V/�s|
|Controlled Avalanche Energy (see test conditions in Figures 10 and 11)|WAVAL|400|mJ|
|ESD Ratings:<br>Machine Model = C<br>Human Body Model = 3B||> 400<br>> 8000|V|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** (Per Diode Leg) 

|**THERMAL CHARACTERISTICS**(Per Diode Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Thermal Resistance<br>Junction−to−Case<br>Junction−to−Ambient|R�JC<br>R�JA|2.0<br>70|°C/W|



## **ELECTRICAL CHARACTERISTICS** (Per Diode Leg) 

|**ELECTRICAL CHARACTERISTICS**(Per Diode Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 2)<br>(IF= 20 A, TC= 25°C)<br>(IF= 20 A, TC= 125°C)<br>(IF= 40 A, TC= 25°C)<br>(IF= 40 A, TC= 125°C)|vF|0.80<br>0.67<br>0.90<br>0.76|V|
|Maximum Instantaneous Reverse Current (Note 2)<br>(Rated DC Voltage, TC= 125°C)<br>(Rated DC Voltage, TC= 25°C)|iR|10<br>0.01|mA|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

**www.onsemi.com** 

**2** 

**MBR41H100CT, NRVBB41H100CT Series** 

**==> picture [493 x 650] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000 1000<br>100 100 TJ = 150 ° C<br>TJ = 150 ° C TJ = 125 ° C<br>10 TJ = 125 ° C 10<br>TJ = 25 ° C TJ = 25 ° C<br>1 1<br>0.1 0.1<br>0 0.2 0.4 0.6 0.8 1.0 1.2 0 0.2 0.4 0.6 0.8 1.0 1.2<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>1.0E−01 1.0E−01<br>TJ = 150 ° C<br>1.0E−02 TJ = 150 ° C 1.0E−02<br>1.0E−03 1.0E−03 TJ = 125 ° C<br>TJ = 125 ° C<br>1.0E−04 1.0E−04<br>1.0E−05 1.0E−05<br>TJ = 25 ° C<br>1.0E−06 TJ = 25 ° C 1.0E−06<br>1.0E−07 1.0E−07<br>1.0E−08 1.0E−08<br>0 20 40 60 80 100 0 20 40 60 80 100<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>35 50<br>45<br>30<br>dc<br>40<br>25 35<br>SQUARE<br>30<br>20 SQUARE WAVE<br>25<br>DC<br>15<br>20<br>10 15<br>10<br>5<br>5<br>0 0<br>100 110 120 130 140 150 160 170 180 0 5 10 15 20 25 30 35 40 45 50<br>TC, CASE TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>, INSTANTANEOUS FORWARD CURRENT (AMPS)IF , INSTANTANEOUS FORWARD CURRENT (AMPS)IF<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>(WATTS)<br>, AVERAGE POWER DISSIPATION<br>FO<br>P<br>, AVERAGE FORWARD CURRENT (AMPS)<br>IF<br>**----- End of picture text -----**<br>


**Figure 5. Current Derating** 

**Figure 6. Forward Power Dissipation** 

**www.onsemi.com** 

**3** 

**MBR41H100CT, NRVBB41H100CT Series** 

**==> picture [243 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000<br>TJ = 25 ° C<br>1000<br>100<br>10<br>0 20 40 60 80 100<br>VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 7. Capacitance** 

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**----- Start of picture text -----**<br>
100<br>D = 0.5<br>0.2<br>10 0.1<br>0.05<br>1<br>0.01<br>0.1<br>P(pk)<br>t1<br>0.01 SINGLE PULSE t2<br>DUTY CYCLE, D = t1/t2<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>Figure 8. Thermal Response Junction−to−Ambient<br>10<br>D = 0.5<br>1<br>0.2<br>0.1<br>0.05<br>0.1<br>0.01<br>P(pk)<br>0.01 t 1<br>SINGLE PULSE<br>t2<br>DUTY CYCLE, D = t 1 /t 2<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>R(t), TRANSIENT THERMAL RESISTANCE<br>R(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 9. Thermal Response Junction−to−Case** 

**www.onsemi.com** 

**4** 

**MBR41H100CT, NRVBB41H100CT Series** 

**==> picture [218 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
+VDD<br>IL 10 mH COIL<br>VD<br>MERCURY ID<br>SWITCH<br>DUT<br>S1<br>**----- End of picture text -----**<br>


**Figure 10. Test Circuit** 

The unclamped inductive switching circuit shown in Figure 10 was used to demonstrate the controlled avalanche capability of this device. A mercury switch was used instead of an electronic switch to simulate a noisy environment when the switch was being opened. 

When S1 is closed at t0 the current in the inductor IL ramps up linearly; and energy is stored in the coil. At t1 the switch is opened and the voltage across the diode under test begins to rise rapidly, due to di/dt effects, when this induced voltage reaches the breakdown voltage of the diode, it is clamped at BVDUT and the diode begins to conduct the full load current which now starts to decay linearly through the diode, and goes to zero at t2. 

By solving the loop equation at the point in time when S1 is opened; and calculating the energy that is transferred to the diode it can be shown that the total energy transferred is equal to the energy stored in the inductor plus a finite amount of energy from the VDD power supply while the diode is in breakdown (from t1 to t2) minus any losses due to finite component resistances. Assuming the component resistive 

**==> picture [217 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
BVDUT<br>IL ID<br>VDD<br>t0 t1 t2 t<br>**----- End of picture text -----**<br>


**Figure 11. Current−Voltage Waveforms** 

elements are small Equation (1) approximates the total energy transferred to the diode. It can be seen from this equation that if the VDD voltage is low compared to the breakdown voltage of the device, the amount of energy contributed by the supply during breakdown is small and the total energy can be assumed to be nearly equal to the energy stored in the coil during the time when S1 was closed, Equation (2). 

## **EQUATION (1):** 

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## **EQUATION (2):** 

**==> picture [79 x 19] intentionally omitted <==**

**www.onsemi.com** 

**5** 

**MBR41H100CT, NRVBB41H100CT Series** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBR41H100CTG|TO−220<br>(Pb−Free)|50 Units / Rail|
|MBR41H100CTH|TO−220<br>(Halide−Free)|50 Units / Rail|
|MBRB41H100CT−1G|I2PAK<br>(Pb−Free)|50 Units / Rail|
|MBRB41H100CT−1H<br>(In Development)|I2PAK<br>(Halide−Free)|50 Units / Rail|
|MBRB41H100CTT4G|D2PAK 3<br>(Pb−Free)|800 Units / Tape & Reel|
|NRVBB41H100CTT4G*|D2PAK 3<br>(Pb−Free)|800 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

*NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. 

**www.onsemi.com** 

**6** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**TO−220** CASE 221A ISSUE AK 

DATE 13 JAN 2022 

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SCALE 1:1<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
STYLE 1: STYLE 2: STYLE 3: STYLE 4:<br>PIN 1. BASE PIN 1. BASE PIN 1. CATHODE PIN 1. MAIN TERMINAL 1<br>2. COLLECTOR 2. EMITTER 2. ANODE 2. MAIN TERMINAL 2<br>3. EMITTER 3. COLLECTOR 3. GATE 3. GATE<br>4. COLLECTOR 4. EMITTER 4. ANODE 4. MAIN TERMINAL 2<br>STYLE 5: STYLE 6: STYLE 7: STYLE 8:<br>PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE PIN 1. CATHODE<br>2. DRAIN 2. CATHODE 2. ANODE 2. ANODE<br>3. SOURCE 3. ANODE 3. CATHODE 3. EXTERNAL TRIP/DELAY<br>4. DRAIN 4. CATHODE 4. ANODE 4. ANODE<br>STYLE 9: STYLE 10: STYLE 11: STYLE 12:<br>PIN 1. GATE PIN 1. GATE PIN 1. DRAIN PIN 1. MAIN TERMINAL 1<br>2. COLLECTOR 2. SOURCE 2. SOURCE 2. MAIN TERMINAL 2<br>3. EMITTER 3. DRAIN 3. GATE 3. GATE<br>4. COLLECTOR 4. SOURCE 4. SOURCE 4. NOT CONNECTED<br>**----- End of picture text -----**<br>


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Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42148B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: TO−220 PAGE 1 OF 1<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

DATE 16 OCT 2007 

**I[2] PAK (TO−262)** CASE 418D−01 ISSUE D 

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C<br>E<br>SCALE 1:1 −B− V<br>NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>4 Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>INCHES MILLIMETERS<br>A DIM MIN MAX MIN MAX<br>W A 0.335 0.380 8.51 9.65<br>in 1 2 3 b e === B 0.380 0.406 9.65 10.31<br>C 0.160 0.185 4.06 4.70<br>D 0.026 0.035 0.66 0.89<br>F E 0.045 0.055 1.14 1.40<br>F 0.122 REF 3.10 REF<br>−T− G 0.100 BSC 2.54 BSC<br>SEATING H 0.094 0.110 2.39 2.79<br>PLANE K J 0.013 0.025 0.33 0.64<br>S K 0.500 0.562 12.70 14.27<br>S 0.390 REF 9.90 REF<br>V 0.045 0.070 1.14 1.78<br>W 0.522 0.551 13.25 14.00<br>G Ll : J =====<br>D 3 PL H<br>al<br>0.13 (0.005) M T B M<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. GATE<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. COLLECTOR<br>3. EMITTER 3. SOURCE 3. ANODE 3. EMITTER<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. COLLECTOR<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB16716C** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: I[2] PAK (TO−262) PAGE 1 OF 1** ~~——~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **D[2] PAK 3** 

CASE 418B−04 

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ISSUE L<br>SCALE 1:1 NOTES:<br>C 1. DIMENSIONING AND TOLERANCING<br>PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.<br>W<br>4 INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.340 0.380 8.64 9.65<br>B 0.380 0.405 9.65 10.29<br>A C 0.160 0.190 4.06 4.83<br>S D 0.020 0.035 0.51 0.89<br>1 2 3 E 0.045 0.055 1.14 1.40<br>F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>−T− H 0.080 0.110 2.03 2.79<br>K J 0.018 0.025 0.46 0.64<br>SEATINGPLANE G J W KL 0.0900.052 0.0720.110 2.291.32 2.791.83<br>M 0.280 0.320 7.11 8.13<br>ae H N 0.197 REF 5.00 REF<br>D 3 PL P 0.079 REF 2.00 REF<br>R 0.039 REF 0.99 REF<br>0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88<br>V 0.045 0.055 1.14 1.40<br>VARIABLE<br>CONFIGURATION<br>ZONE N P<br>R<br>U<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. GATE PIN 1. CATHODE PIN 1. NO CONNECT<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. COLLECTOR 2. ANODE 2. CATHODE<br>3. EMITTER 3. SOURCE 3. ANODE 3. EMITTER 3. CATHODE 3. ANODE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. COLLECTOR 4. ANODE 4. CATHODE<br>**----- End of picture text -----**<br>


DATE 17 FEB 2015 

## **MARKING INFORMATION AND FOOTPRINT ON PAGE 2** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42761B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: D[2] PAK 3 PAGE 1 OF 2** ~~|eee1~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**==> picture [182 x 232] intentionally omitted <==**

**----- Start of picture text -----**<br>
D [2] PAK 3<br>CASE 418B−04<br>ISSUE L<br>GENERIC<br>MARKING DIAGRAM*<br>xx AYWW<br>xxxxxxxxG<br>xxxxxxxxx xxxxxxxxG<br>AYWW<br>AWLYWWG  AKA<br>oe<br>IC Standard Rectifier<br>xx = Specific Device Code<br>A = Assembly Location<br>WL = Wafer Lot<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>AKA = Polarity Indicator<br>**----- End of picture text -----**<br>


DATE 17 FEB 2015 

- *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. 

## **SOLDERING FOOTPRINT*** 

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**----- Start of picture text -----**<br>
10.49<br>8.38<br>16.155 T L 7<br>2X<br>3.504<br>2X<br>UE<br>1.016<br>5.080<br>aro<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42761B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: D[2] PAK 3 PAGE 2 OF 2** ~~—~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support: Europe, Middle East and Africa Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 **onsemi Website:** www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative 

◊ 

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> specialises in exactly the cases where availability is the real problem: stock
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> alternatives. They guarantee delivery even during supply chain disruptions and
> typically respond to quote requests within one business day.
> [Request a quote](https://novapart.co/quote/) — it's free and there's no
> minimum order.
