# Schottky Rectifier, General Purpose, 40 V, 3 A, Single, DO-201AD, 2 Pins, 600 mV

![Product image](https://novapart.co/image/farnell:1459059/)

**URL**: https://novapart.co/products/MBR340G../schottky-rectifier-general-purpose-40-v-3-a-single
**SKU**: MBR340G..
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.1430
**Stock**: 10+

## Description

Repetitive Reverse Voltage Vrrm Max:40V; Forward Current If(AV):3A; Diode Configuration:Single; Diode Case Style:DO-201AD; No. of Pins:2Pins; Forward Voltage VF Max:600mV; Forward Surge C

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 2Pins |
| Product Range | MBR34 |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | DO-201AD |
| Diode Configuration | Single |
| Forward Voltage Max | 600mV |
| Forward Surge Current | 80A |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1459059/)

## MBR340 

## **Preferred Device** 

## Axial Lead Rectifier 

This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low−voltage, high−frequency inverters, free wheeling diodes, and polarity protection diodes. 

## **Features** 

- Extremely Low VF 

- Low Power Loss/High Efficiency 

## **http://onsemi.com** 

## **SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES, 40 VOLTS** 

- Highly Stable Oxide Passivated Junction 

- Low Stored Charge, Majority Carrier Conduction 

|Low Stored Charge, Majority Carrier Conduction<br>• Pb−Free Packages are Available*<br>**Mechanical Characteristics:**<br>• Case: Epoxy, Molded<br>• Weight: 1.1 Gram (Approximately)<br>• Finish: All External Surfaces Corrosion Resistant and Terminal<br>Leads are Readily Solderable<br>• Lead Temperature for Soldering Purposes:<br>260°C Max. for 10 Seconds<br>• Polarity: Cathode indicated by Polarity Band<br>**MAXIMUM RATINGS**<br>**Rating**<br>**Symbol**<br>**Max**<br>**Unit**<br>Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>VRRM<br>VRWM<br>VR<br>40<br>V<br>Average Rectified Forward Current TA= 65°C<br>(R JA= 28°C/W, P.C. Board Mounting)<br>IO<br>3.0<br>A<br>Non−Repetitive Peak Surge Current (Note 1)<br>(Surge Applied at Rated Load Conditions<br>Halfwave, Single Phase, 60 Hz, TL= 75°C)<br>IFSM<br>80<br>A<br>Operating and Storage Junction Temperature<br>Range (Reverse Voltage Applied) (Note 2)<br>TJ, Tstg<br>−65 to<br>+175<br>°C|Low Stored Charge, Majority Carrier Conduction<br>• Pb−Free Packages are Available*<br>**Mechanical Characteristics:**<br>• Case: Epoxy, Molded<br>• Weight: 1.1 Gram (Approximately)<br>• Finish: All External Surfaces Corrosion Resistant and Terminal<br>Leads are Readily Solderable<br>• Lead Temperature for Soldering Purposes:<br>260°C Max. for 10 Seconds<br>• Polarity: Cathode indicated by Polarity Band<br>**MAXIMUM RATINGS**<br>**Rating**<br>**Symbol**<br>**Max**<br>**Unit**<br>Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage<br>VRRM<br>VRWM<br>VR<br>40<br>V<br>Average Rectified Forward Current TA= 65°C<br>(R JA= 28°C/W, P.C. Board Mounting)<br>IO<br>3.0<br>A<br>Non−Repetitive Peak Surge Current (Note 1)<br>(Surge Applied at Rated Load Conditions<br>Halfwave, Single Phase, 60 Hz, TL= 75°C)<br>IFSM<br>80<br>A<br>Operating and Storage Junction Temperature<br>Range (Reverse Voltage Applied) (Note 2)<br>TJ, Tstg<br>−65 to<br>+175<br>°C||**AXIAL LEAD**<br>**CASE 267−05**<br>**(DO−201AD)**<br>**STYLE 1**<br>**MARKING DIAGRAM**<br>A<br>MBR<br>340<br>YYWW<br>A<br>= Assembly Location<br>YY<br>= Year<br>WW<br>= Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>f<br>~~=~~|**AXIAL LEAD**<br>**CASE 267−05**<br>**(DO−201AD)**<br>**STYLE 1**<br>**MARKING DIAGRAM**<br>A<br>MBR<br>340<br>YYWW<br>A<br>= Assembly Location<br>YY<br>= Year<br>WW<br>= Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>f<br>~~=~~|**AXIAL LEAD**<br>**CASE 267−05**<br>**(DO−201AD)**<br>**STYLE 1**<br>**MARKING DIAGRAM**<br>A<br>MBR<br>340<br>YYWW<br>A<br>= Assembly Location<br>YY<br>= Year<br>WW<br>= Work Week<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>f<br>~~=~~|
|---|---|---|---|---|---|
|**THERMAL CHARACTERISTICS**<br>**Rating**<br>**Symbol**<br>**Max**<br>**Unit**<br>Thermal Resistance, Junction−to−Ambient<br>(see Note 5, Mounting Method 3)<br>R JA<br>28<br>°C/W<br>Stresses exceeding Maximum Ratings may damage the device. Maximum<br>Ratings are stress ratings only. Functional operation above the Recommended<br>Operating Conditions is not implied. Extended exposure to stresses above the<br>Recommended Operating Conditions may affect device reliability.<br>1. Lead Temperature reference is cathode lead 1/32 in from case.<br>2. The heat generated must be less than the thermal conductivity from|||**Device**<br>**Package**<br>**Shipping**†<br>**ORDERING INFORMATION**<br>MBR340<br>Axial Lead<br>500 Units / Bag<br>MBR340RL<br>Axial Lead<br>1500/Tape & Reel<br>MBR340RLG<br>Axial Lead<br>(Pb−Free)<br>1500/Tape & Reel<br>MBR340G<br>Axial Lead<br>(Pb−Free)<br>500 Units / Bag<br>~~_~~|||
|Junction−to−Ambient: dPD/dTJ< 1/R JA.|||†For information on tape and reel specifications,|||
||||including part orientation and tape sizes, please|including part orientation and tape sizes, please||
||||refer to our Tape and Reel Packaging Specifications|||
||||Brochure, BRD8011/D.|||



- Pb−Free Packages are Available* 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded 

- Weight: 1.1 Gram (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Polarity: Cathode indicated by Polarity Band 

## **MAXIMUM RATINGS** 

## **THERMAL CHARACTERISTICS** 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. Lead Temperature reference is cathode lead 1/32 in from case. 

2. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R JA. 

- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**Preferred** devices are recommended choices for future use and best overall value. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2006 **June, 2006 − Rev. 7** 

**MBR340/D** 

**MBR340** 

## **ELECTRICAL CHARACTERISTICS** (TL = 25 ° C unless otherwise noted) (Note 3) 

|**ELECTRICAL CHARACTERISTICS**(TL= 25°C unless otherwise noted) (Note 3)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 4)<br>(iF= 1.0 Amp)<br>(iF= 3.0 Amp)<br>(iF= 9.4 Amp)|vF|0.500<br>0.600<br>0.850|V|
|Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 4)<br>TL= 25°C<br>TL= 100°C|iR|0.60<br>20|mA|



3. Lead Temperature reference is cathode lead 1/32in from case. 

4. Pulse Test: Pulse Width = 300 � s, Duty Cycle = 2.0%. 

**==> picture [492 x 400] intentionally omitted <==**

**----- Start of picture text -----**<br>
20 100<br>40<br>20 150°C<br>10<br>10 4.0<br>2.0<br>7.0 1.0 100°C 1000<br>0.4<br>5.0 0.2 75°C<br>0.1 100<br>3.0 0.04<br>0.02<br>2.0 TJ = 150°C 25°C 0.0040.01 25°C 10<br>100°C 0.002<br>0.001 10<br>1.0<br>0 10 20 30 40<br>0.7 VR REVERSE VOLTAGE (VOLTS)<br>Figure 2. Typical Reverse Current*<br>0.5<br>*The curves shown are typical for the highest voltage device in the<br>voltage grouping. Typical reverse current for lower voltage selec-<br>tions can be estimated from these same curves if VR is sufficiently<br>0.3 below rated VR.<br>0.2 10<br>0.1 8.0<br>0.07<br>6.0<br>0.05<br>4.0<br>0.03<br>0.02 SQUARE<br>2.0 dc<br>WAVE<br>0.01 0<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 20 40 60 80 100 120 140 160 180 200<br>vF, INSTANTANEOUS VOLTAGE (VOLTS) TA, AMBIENT TEMPERATURE (C°)<br>I   , REVERSE CURRENT (mA)R<br>i   , INSTANTANEOUS FORWARD CURRENT (AMPS)F<br>I           , AVERAGE FORWARD CURRENT (AMPS)F (AV)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 3. Current Derating (Mounting Method #3 per Note 5)** 

**http://onsemi.com** 

**2** 

**MBR340** 

**==> picture [489 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.5 500<br>SQUARE dc<br>WAVE 400<br>2.0 RESISTIVE LOAD TJ = 25°C<br>IPK � � 300<br>(CAPACITIVE LOAD) IAV<br>1.5 I  [PK] � 5.0 200<br>IAV<br>10<br>1.0<br>20 TJ = 150°C 100<br>90<br>0.5 80<br>70<br>60<br>50<br>0 1.0 2.0 3.0 4.0 5.0 0 10 20 30 40 50<br>IF (AV), AVERAGE FORWARD CURRENT (AMPS) VR REVERSE VOLTAGE (VOLTS)<br>Figure 4. Power Dissipation Figure 5. Typical Capacitance<br>C, CAPACITANCE (pF)<br>P         , AVERAGE POWER DISSIPATION (WATTS)F (AV)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

## **NOTE 5 — MOUNTING DATA** 

Data shown for thermal resistance junction−to−ambient (R�JA) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured. 

## **TYPICAL VALUES FOR R** � **JA IN STILL AIR** 

|**C**|**US O** �**JA  S**|**US O** �**JA  S**|**US O** �**JA  S**|**US O** �**JA  S**||
|---|---|---|---|---|---|
|**Mounting**<br>**Method**|**Lead Length, L (in)**||||**R**�**JA**|
||**1/8**|**1/4**|**1/2**|**3/4**||
|1|50|51|53|55|°C/W|
|2|58|59|61|63|°C/W|
|3|28||||°C/W|



## **Mounting Method 1** 

## **Mounting Method 2** 

**==> picture [495 x 295] intentionally omitted <==**

**----- Start of picture text -----**<br>
P.C. Board where available Vector Push−In<br>copper surface is small. Terminals T−28<br>L L<br>ÉÉÉÉÉÉÉÉÉÉÉÉÉ L L<br>ÉÉÉÉÉÉÉÉÉÉÉ<br>ÉÉÉÉÉÉÉÉÉÉÉ<br>Mounting Method 3<br>P.C. Board with<br>2−1/2 ″  X 2−1/2 ″<br>copper surface.<br>ÉÉ L = 1/2’’<br>ÉÉ<br>ÉÉ<br>ÉÉ<br>ÉÉ<br>ÉÉ Board Ground Plane<br>ÉÉ<br>http://onsemi.com<br>**----- End of picture text -----**<br>


**3** 

**MBR340** 

## **PACKAGE DIMENSIONS** 

**AXIAL LEAD** CASE 267−05 ISSUE G 

**==> picture [19 x 5] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTES:<br>**----- End of picture text -----**<br>


**==> picture [360 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
1. DIMENSIONS AND TOLERANCING PER ANSI<br>K A 2. Y14.5M, 1982.CONTROLLING DIMENSION: INCH.<br>D 3. 267−04 OBSOLETE, NEW STANDARD 267−05.<br>1 2<br>INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.287 0.374 7.30 9.50<br>B re  4 B 0.189 0.209 4.80 5.30<br>K D 0.047 0.051 1.20 1.30<br>| EEE K 1.000 −−− 25.40 −−−<br>STYLE 1:<br>PIN 1. CATHODE (POLARITY BAND)<br>2. ANODE<br>**----- End of picture text -----**<br>


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## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com 

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**MBR340/D** 

**http://onsemi.com** 

**4** 



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