# Schottky Rectifier, 100 V, 3 A, Single, DO-201AD, 2 Pins, 790 mV

![Product image](https://novapart.co/image/farnell:2440978/)

**URL**: https://novapart.co/products/MBR3100RLG/schottky-rectifier-100-v-3-a-single-do-201ad-2
**SKU**: MBR3100RLG
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.2460
**Stock**: 10+
**Lead Time**: 78 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):3A; Diode Configuration:Single; Diode Case Style:DO-201AD; No. of Pins:2Pins; Forward Voltage VF Max:790mV; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | MBR31 |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | DO-201AD |
| Diode Configuration | Single |
| Forward Voltage Max | 790mV |
| Forward Surge Current | 150A |
| Average Forward Current | 3A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 100V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2440978/)

**Preferred Device** 

## MBR3100 

## Axial Lead Rectifier 

This device employs the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low−voltage, high−frequency inverters, free wheeling diodes, and polarity protection diodes. 

## **Features** 

- Low Reverse Current 

- Low Stored Charge, Majority Carrier Conduction 

## **http://onsemi.com** 

## **SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES, 100 VOLTS** 

- Low Power Loss/High Efficiency 

- Highly Stable Oxide Passivated Junction 

- Guard−ring for Stress Protection 

- Low Forward Voltage 

- 175°C Operating Junction Temperature 

- High Surge Capacity 

- Pb−Free Packages are Available* 

## **Mechanical Characteristics:** 

**==> picture [53 x 37] intentionally omitted <==**

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AXIAL LEAD<br>CASE 267−05<br>(DO−201AD)<br>STYLE 1<br>**----- End of picture text -----**<br>


- Case: Epoxy, Molded 

- Weight: 1.1 Gram (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

**MARKING DIAGRAM** • Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds A • Polarity: Cathode indicated by Polarity Band MBR 3100 YYWW **MAXIMUM RATINGS Rating Symbol Max Unit** ~~SIL~~ Peak Repetitive Reverse Voltage VRRM 100 V A = Assembly Location Working Peak Reverse Voltage VRWM YY = Year DC Blocking Voltage VR WW = Work Week Average Rectified Forward Current T(R JA = 28 ° C/W, Refer to P.C. Board Mounting,A = 100 ° C IO 3.0 A (Note: Microdot may be in either location)= Pb−Free Package Note 3) **ORDERING INFORMATION** Non−Repetitive Peak Surge Current IFSM 150 A (Surge Applied at Rated Load Conditions **Device Package Shipping**[†] Halfwave, Single Phase, 60 Hz) Operating and Storage Junction Temperature TJ, Tstg −65 to ° C MBR3100 Axial Lead 500 Units / Bag Range (Note 1) (Reverse Voltage Applied) +175 MBR3100G Axial Lead 500 Units / Bag (Pb−Free) Voltage Rate of Change (Rated VR) dv/dt 10 V/ns MBR3100RL Axial Lead 1500/Tape & Reel Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended MBR3100RLG Axial Lead 1500/Tape & Reel Operating Conditions is not implied. Extended exposure to stresses above the (Pb−Free) Recommended Operating Conditions may affect device reliability. ~~—— =~~ 1. The heat generated must be less than the thermal conductivity from †For information on tape and reel specifications, Junction−to−Ambient: dPD/dTJ < 1/R JA. including part orientation and tape sizes, please 

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**Preferred** devices are recommended choices for future use and best overall value. 

Publication Order Number: **MBR3100/D** 

**1** 

© Semiconductor Components Industries, LLC, 2006 **June, 2006 − Rev. 6** 

**MBR3100** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Thermal Resistance, Junction−to−Ambient (see Note 3, Mounting Method 3)|R�JA|28|°C/W|
|**ELECTRICAL CHARACTERISTICS**(TL= 25°C unless otherwise noted)||||
|**Characteristic**|**Symbol**|**Max**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 2)<br>(iF= 3.0 Amps, TL= 25°C)<br>(iF= 3.0 Amps, TL= 100°C)|vF|0.79<br>0.69|V|
|Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 2)<br>TL= 25°C<br>TL= 100°C|iR|0.6<br>20|mA|



2. Pulse Test: Pulse Width = 300 � s, Duty Cycle = 2.0%. 

**==> picture [236 x 467] intentionally omitted <==**

**----- Start of picture text -----**<br>
50<br>30<br>20<br>TJ = 150°C<br>10<br>100°C<br>5<br>3 25°C<br>2<br>1<br>0.5<br>0.3<br>0.2<br>0.1<br>0.05<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3<br>vF, INSTANTANEOUS VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage<br>8<br>7<br>6<br>5<br>dc<br>4<br>SQUARE<br>WAVE<br>3<br>2<br>1<br>0<br>20 40 60 80 100 120 140 160 180<br>TA, AMBIENT TEMPERATURE (°C)<br>Figure 3. Current Derating<br>(Mounting Method #3 per Note 3)<br>i   , INSTANTANEOUS FORWARD CURRENT (AMPS)F<br>I           , AVERAGE FORWARD CURRENT (AMPS)F (AV)<br>**----- End of picture text -----**<br>


**==> picture [244 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>0.5<br>0.2 TJ = 150°C<br>0.1<br>125°C<br>0.05<br>0.02<br>100°C<br>0.01<br>0.005<br>0.002<br>0.001<br>0.0005<br>25°C<br>0.0002<br>0.0001<br>0 10 20 30 40 50 60 70 80 90 100<br>VR REVERSE VOLTAGE (VOLTS)<br>I   , REVERSE CURRENT (mA)R<br>**----- End of picture text -----**<br>


**Figure 2. Typical Reverse Current*** 

*The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR. 

**==> picture [238 x 191] intentionally omitted <==**

**----- Start of picture text -----**<br>
4<br>3.5<br>3<br>2.5 SQUARE<br>WAVE<br>2 dc<br>1.5<br>1<br>0.5<br>0 1.0 2.0 3.0 4.0 5.0<br>IF (AV), AVERAGE FORWARD CURRENT (AMPS)<br>Figure 4. Power Dissipation<br>P         , AVERAGE POWER DISSIPATION (WATTS)F (AV)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**2** 

**MBR3100** 

**==> picture [233 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
400<br>300<br>200<br>100 TJ = 25°C<br>f = 1 MHz<br>80<br>50<br>40<br>0 20 40 60 80<br>VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Capacitance** 

## **NOTE 3 — MOUNTING DATA** 

Data shown for thermal resistance junction−to−ambient (R�JA) for the mountings shown is to be used as typical guideline values for preliminary engineering, or in case the tie point temperature cannot be measured. 

**TYPICAL VALUES FOR R** � **JA IN STILL AIR** 

|**C**|**US O** �**JA  S**|**US O** �**JA  S**|**US O** �**JA  S**|**US O** �**JA  S**||
|---|---|---|---|---|---|
|**Mounting**<br>**Method**|**Lead Length, L (in)**<br>**1/8**<br>**1/4**<br>**1/2**<br>**3/4**||||**R**�**JA**|
||**1/8**|**1/4**|**1/2**|||
|1|50|51|53|55|°C/W|
|2|58|59|61|63|°C/W|
|3|28||||°C/W|



## **Mounting Method 2** 

## **Mounting Method 1** 

**==> picture [201 x 74] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vector Push−In<br>Terminals T−28<br>ÉÉÉÉÉÉÉÉÉÉÉÉÉ L L<br>**----- End of picture text -----**<br>


P.C. Board where available copper surface is small. **L L** 

**==> picture [495 x 270] intentionally omitted <==**

**----- Start of picture text -----**<br>
L L<br>ÉÉÉÉÉÉÉÉÉÉÉÉÉ L L<br>ÉÉÉÉÉÉÉÉÉÉÉ<br>Mounting Method 3<br>P.C. Board with<br>2−1/2 ″  X 2−1/2 ″<br>copper surface.<br>ÉÉ L = 1/2’’<br>ÉÉ<br>ÉÉ<br>ÉÉ<br>ÉÉ<br>ÉÉ Board Ground Plane<br>ÉÉ<br>http://onsemi.com<br>3<br>**----- End of picture text -----**<br>


**MBR3100** 

## **PACKAGE DIMENSIONS** 

**AXIAL LEAD** CASE 267−05 ISSUE G 

**==> picture [19 x 5] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTES:<br>**----- End of picture text -----**<br>


**==> picture [360 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
1. DIMENSIONS AND TOLERANCING PER ANSI<br>K A 2. Y14.5M, 1982.CONTROLLING DIMENSION: INCH.<br>D 3. 267−04 OBSOLETE, NEW STANDARD 267−05.<br>1 2<br>INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.287 0.374 7.30 9.50<br>B re  4 B 0.189 0.209 4.80 5.30<br>K D 0.047 0.051 1.20 1.30<br>| EEE K 1.000 −−− 25.40 −−−<br>STYLE 1:<br>PIN 1. CATHODE (POLARITY BAND)<br>2. ANODE<br>**----- End of picture text -----**<br>


**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

## **LITERATURE FULFILLMENT** : 

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**http://onsemi.com** 

**MBR3100/D** 

**4** 



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