# Schottky Rectifier, 45 V, 20 A, Single Triple Anode Dual Cathode, DFN, 5 Pins, 610 mV ![Product image](https://novapart.co/image/farnell:3606373/) **URL**: https://novapart.co/products/MBR2045MFST1G/schottky-rectifier-45-v-20-a-single-triple-anode **SKU**: MBR2045MFST1G **Manufacturer**: ONSEMI **Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes **Price**: €0.3750 **Stock**: 10+ **Lead Time**: 78 days (indicative) ## Specifications | Parameter | Value | |---|---| | Svhc | No SVHC (25-Jun-2025) | | No. Of Pins | 5Pins | | Product Range | - | | Qualification | - | | Diode Mounting | Surface Mount | | Diode Case Style | DFN | | Diode Configuration | Single Triple Anode Dual Cathode | | Forward Voltage Max | 610mV | | Forward Surge Current | 400A | | Average Forward Current | 20A | | Operating Temperature Max | 150°C | | Repetitive Peak Reverse Voltage | 45V | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:3606373/) **Share Feedback DATA SHEET** Your Opinion Matters **www.onsemi.com** ## Switch Mode Power Rectifiers ## MBR2045MFS, NRVB2045MFS These state−of−the−art devices have the following features: ## **SCHOTTKY BARRIER RECTIFIERS 20 AMPERES 45 VOLTS** 1,2,3 5,6 ## **Features** - Low Power Loss / High Efficiency - New Package Provides Capability of Inspection and Probe After Board Mounting - Guardring for Stress Protection - Low Forward Voltage Drop - 150°C Operating Junction Temperature - Wettable Flacks Option Available - NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* - These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant **==> picture [181 x 140] intentionally omitted <==** **----- Start of picture text -----**
MARKING
DIAGRAM
1 A C
A B2045
SO−8 FLAT LEAD
CASE 488AA A AYWZZ
STYLE 2 Not Used C
B2045 = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
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## **Mechanical Characteristics:** - Case: Epoxy, Molded - Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. - Lead Finish: 100% Matte Sn (Tin) - Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds - Device Meets MSL 1 Requirements ## **Applications** - Output Rectification in Compact Portable Consumer Applications - Freewheeling Diode used with Inductive Loads ## **ORDERING INFORMATION** |**Device**|**Package**|**Shipping**†| |---|---|---| |MBR2045MFST1G|SO−8 FL
(Pb−Free)|1500 /
Tape & Reel| |NRVB2045MFST1G*|SO−8 FL
(Pb−Free)|1500 /
Tape & Reel| **DISCONTINUED** (Note 1) MBR2045MFST3G SO−8 FL 5000 / (Pb−Free) Tape & Reel NRVB2045MFST3G* SO−8 FL 5000 / (Pb−Free) Tape & Reel ~~ET~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1. **DISCONTINUED:** These devices are not recommended for new design. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. Publication Order Number: **MBR2045MFS/D** **1** © Semiconductor Components Industries, LLC, 2014 **June, 2024 − Rev. 3** **MBR2045MFS, NRVB2045MFS** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage|VRRM
VRWM
VR|45|V| |Average Rectified Forward Current
(Rated VR, TC= 130°C)|IF(AV)|20|A| |Peak Repetitive Forward Current,
(Rated VR, Square Wave, 20 kHz, TC= 135°C)|IFRM|40|A| |Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|400|A| |Storage Temperature Range|Tstg|−65 to +175|°C| |Operating Junction Temperature|TJ|−55 to +150|°C| |Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive)|EAS|150|mJ| |ESD Rating (Human Body Model)||3B|| |ESD Rating (Machine Model)||M4|| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RJA ## **THERMAL CHARACTERISTICS** |**Characteristic**
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm21 oz. copper bond pad, on a FR4 board)
Thermal Resistance, Junction−to−Ambient, Steady State
(Assumes 600 mm2, 2−oz, 2 layer on a FR4 board)
**ELECTRICAL CHARACTERISTICS**
Instantaneous Forward Voltage (Note 1)
~~———~~|**Symbol**
RθJC
RθJA
vF|**Typ**
**Max**
**Unit**
−
1.6
°C/W
−
45
°C/W
V
~~oe~~|**Typ**
**Max**
**Unit**
−
1.6
°C/W
−
45
°C/W
V
~~oe~~|**Typ**
**Max**
**Unit**
−
1.6
°C/W
−
45
°C/W
V
~~oe~~|**Typ**
**Max**
**Unit**
−
1.6
°C/W
−
45
°C/W
V
~~oe~~| |---|---|---|---|---|---| |(iF= 15 A, TJ= 125°C)||0.35|0.41||| |(iF= 15 A, TJ= 25°C)||0.44|0.49||| |(iF= 30 A, TJ= 125°C)||0.46|0.58||| |(iF= 30 A, TJ= 25°C)||0.51|0.61||| |Instantaneous Reverse Current (Note 1)|iR|||mA|| |(Rated dc Voltage, TJ= 125°C)||200|300||| |(Rated dc Voltage, TJ= 25°C)||0.3|0.6||| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. **www.onsemi.com** **Share Feedback** Your Opinion Matters **2** **MBR2045MFS, NRVB2045MFS** ## **TYPICAL CHARACTERISTICS** **==> picture [492 x 617] intentionally omitted <==** **----- Start of picture text -----**
100.00 100.00
a ee eee eee eee ee e Es ee ee ee ee 0 eee ee |
a A a
10.00 n TA = 150 ° C y 10.00 TA = 150 ° C
47 eee 274
125 ° C
1.00 HF 1.00 ro OI 125 ° C OT rd
iff, f f | | | |_ | if fift |f| | |
25 ° C 25 ° C −40 ° C
−40 ° C
0.10 So| if eef/fae | | | | 0.10 | A wf | vi fe | | ct lt
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.800.90
VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward
Voltage Voltage
1.E+00 1.E+00
TA = 150 ° C TA = 150 ° C
1.E−01 1.E−01
— a
1.E−02 TA = 125 ° C 1.E−02 TA = 125 ° C
————— =
1.E−03 ———— 1.E−03 ———————————=
1.E−04 TA = 25 ° C 1.E−04 TA = 25 ° C
1.E−05 1.E−05
1.E−06 1.E−06
—$—_— — ==
1.E−07 ——= TA = −40 OS ° C — _ 1.E−07 — —O TA = −40 ° C —
1.E−08 S SS 1.E−08 eS
SSE OS
1.E−09 a 1.E−09 a
1.E−10 1.E−10
0 10 20 30 40 0 5 10 15 20 25 30 35 40 45
VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics
10,000 60
TJ = 25 ° C 55 R JC = 1.6 ° C/W
50 dc
45
1,000 PN 40 ns
35 SQUARE WAVE
TTa 30 ae n ee
a 25 a a ee ee ee e e
100 ee ee ee e e 20 a a A
15
eea 105 eeeeee
10 a ee ee e e 0 ( ee
0 10 20 30 40 0 20 40 60 80 100 120 140 160
VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)
, INSTANTANEOUS FORWARD CURRENT (A) , INSTANTANEOUS FORWARD CURRENT (A)
IF IF
, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)
IR IR
CURRENT (A)
, AVERAGE FORWARD
IF(AV)
C, JUNCTION CAPACITANCE (pF)
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**Figure 5. Typical Junction Capacitance** **Figure 6. Current Derating TO−220AB** **www.onsemi.com** **Share Feedback** Your Opinion Matters **3** **MBR2045MFS, NRVB2045MFS** **==> picture [142 x 9] intentionally omitted <==** **----- Start of picture text -----**
TYPICAL CHARACTERISTICS
**----- End of picture text -----**
**==> picture [246 x 178] intentionally omitted <==** **----- Start of picture text -----**
8
7 I APK /I AV = 20 IAPK/IAV = 10
6 PpaAeA
5
IAPK/IAV = 5
4
pf YY | A
3
2 aay ane
SQUARE WAVE
1 PAL
DC
0
0 1 2 3 4
IF(AV), AVERAGE FORWARD CURRENT (A)
, AVERAGE FORWARD
F(AV) POWER DISSIPATION (W)
P
**----- End of picture text -----**
**Figure 7. Forward Power Dissipation** **==> picture [491 x 170] intentionally omitted <==** **----- Start of picture text -----**
100
Duty Cycle = 50%
20%
10
10% Assumes 25 ° C ambient and soldered to
5%
1 2% a 600 mm [2] − oz copper pad on PCB
1%
0.1
0.01
Single Pulse
0.001
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
PULSE TIME (sec)
C/W)
°
R(t) (
**----- End of picture text -----**
**Figure 8. Thermal Response** > **www.onsemi.comonsemi.com Share Feedback** > **4** , Your Opinion Matters ~~ne~~ **www.onsemi.comonsemi.com** ~~a~~ **4** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [493 x 621] intentionally omitted <==** **----- Start of picture text -----**
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
1 ISSUE N
SCALE 2:1 DATE 25 JUN 2018
2 X NOTES:
1. DIMENSIONING AND TOLERANCING PER
0.20 C ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
D A 3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
2 B 2 X BURRS.
D1 MILLIMETERS
0.20 C
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.00 −−− 0.05
E1 4 X b 0.33 0.41 0.51
� c 0.23 0.28 0.33
E D 5.00 5.15 5.30
2 D1 4.70 4.90 5.10
c D2 3.80 4.00 4.20
A1 E 6.00 6.15 6.30
E1 5.70 5.90 6.10
1 2 3 4 E2 3.45 3.65 3.85
e 1.27 BSC
TOP VIEW G 0.51 0.575 0.71
C K 1.20 1.35 1.50
SEATING L 0.51 0.575 0.71
0.10 C DETAIL A PLANE L1 0.125 REF
M 3.00 3.40 3.80
A � 0 � −−− 12 �
0.10 C GENERIC
SIDE VIEW MARKING DIAGRAM*
DETAIL A
1
8X b XXXXXX
0.10 C A B e/2 AYWZZ
0.05 c
L e
1 4 XXXXXX = Specific Device Code
K A = Assembly Location
Y = Year
RECOMMENDED W = Work Week
E2 SOLDERING FOOTPRINT* ZZ = Lot Traceability
(EXPOSED PAD)PIN 5 L1 M 0.4952X 4.560 *This information is generic. Please refer to
2X device data sheet for actual part marking.
1.530 Pb−Free indicator, “G” or microdot “ � ”,
may or may not be present. Some products
G D2 2X may not follow the Generic Marking.
BOTTOM VIEW 0.475
3.200
4.530
STYLE 1: STYLE 2: 2X 1.330
PIN 1. 2. SOURCESOURCE PIN 1. 2. ANODEANODE 0.905
3. SOURCE 3. ANODE 1
4. GATE 4. NO CONNECT
5. DRAIN 5. CATHODE 0.965
4X
1.000 1.270
4X 0.750 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON14036D Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: DFN5 5x6, 1.27P (SO−8FL) PAGE 1 OF 1
**----- End of picture text -----**
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