# Schottky Rectifier, 40 V, 1 A, Single, SOD-123FL, 2 Pins, 560 mV

![Product image](https://novapart.co/image/farnell:3606369/)

**URL**: https://novapart.co/products/MBR140ESFT3G/schottky-rectifier-40-v-1-a-single-sod-123fl-2
**SKU**: MBR140ESFT3G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0640
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2018) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | - |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-123FL |
| Diode Configuration | Single |
| Forward Voltage Max | 560mV |
| Forward Surge Current | 30A |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3606369/)

**DATA SHEET www.onsemi.com** 

## Surface Mount Schottky Power Rectifier **Plastic SOD−123 Package** 

## MBR140ESF, NRVB140ESF 

This device uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. 

## **Features** 

- Guardring for Stress Protection 

## **SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES 40 VOLTS** 

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**----- Start of picture text -----**<br>
SOD−123FL<br>CASE 498<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

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**----- Start of picture text -----**<br>
E4FM �<br>�<br>E4F = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package)<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

- Low Reverse Leakage 

- 175°C Operating Junction Temperature 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Package Designed for Optimal Automated Board Assembly 

- ESD Rating: 

   - ♦ Human Body Model = 3B 

   - ♦ Machine Model = M4 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

## **Mechanical Characteristics** 

- Device Marking: E4F 

- Polarity Designator: Cathode Band 

- Weight: 11.7 mg (approximately) 

- Case: Epoxy, Molded 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBR140ESFT1G|SOD−123FL<br>(Pb−Free)|3,000 /<br>Tape & Reel **|
|MBR140ESFT3G|SOD−123FL<br>(Pb−Free)|10,000 /<br>Tape & Reel ***|
|NRVB140ESFT1G|SOD−123FL<br>(Pb−Free)|3,000 /<br>Tape & Reel **|
|NRVB140ESFT3G|SOD−123FL<br>(Pb−Free)|10,000 /<br>Tape & Reel ***|



   - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

   - ** 8 mm Tape, 7” Reel 

   - *** 8 mm Tape, 13” Reel 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBR140ESF/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **October, 2021 − Rev. 4** 

**MBR140ESF, NRVB140ESF** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|40|V|
|Average Rectified Forward Current|IO|1.0|A|
|Peak Repetitive Forward Current|IFRM|2.0|A|
|Non−Repetitive Peak Surge Current<br>(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)|IFSM|30|A|
|Storage Temperature|Tstg|−55 to 175|°C|
|Operating Junction Temperature|TJ|−55 to 175|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 1)<br>Thermal Resistance, Junction−to−Lead (Note 2)<br>Thermal Resistance, Junction−to−Ambient (Note 1)<br>Thermal Resistance, Junction−to−Ambient (Note 2)|Rtjl<br>Rtjl<br>Rtja<br>Rtja|26<br>21<br>325<br>82|°C/W|



1. Mounted with minimum recommended pad size, PC Board FR4. 

2. Mounted with 1 in. copper pad (Cu area 700 mm[2] ). 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(IF= 1.0 A)|VF|**TJ = 25**°**C**|V|
|||0.56||
|Maximum Instantaneous Reverse Current (Note 3)<br>(VR= 40 V)|IR|**TJ = 25**°**C**|�A|
|||30||



3. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2%. 

**www.onsemi.com** 

**2** 

**MBR140ESF, NRVB140ESF** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10.0 10.0<br>TA = 150 ° C<br>1.0 1.0<br>TA = 150 ° C TA = 125 ° C TA = 125 ° C<br>TA = 85 ° C TA = 85 ° C<br>TA = 25 ° C TA = 25 ° C<br>0.10 0.10<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.0<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−01<br>TA = 150 ° C TA = 150 ° C<br>1.E−03<br>TA = 125 ° C 1.E−02 TA = 125 ° C<br>1.E−04<br>1.E−03<br>TA = 85 ° C TA = 85 ° C<br>1.E−05 1.E−04<br>TA = 25 ° C<br>1.E−06 TA = 25 ° C 1.E−05<br>1.E−07 1.E−06<br>0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>2.00<br>TJ = 25 ° C 1.80 R � JA  = 82 ° C/W<br>1.60 dc<br>1.40<br>100 1.20 SQUARE WAVE<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>10 0.00<br>1 10 0 20 40 60 80 100 120 140<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>Figure 5. Typical Junction Capacitance Figure 6. Current Derating, Case<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)<br>IR IR<br>CURRENT (A)<br>, AVERAGE FORWARD<br>IF(AV)<br>C, JUNCTION CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**www.onsemi.com** 

**3** 

**MBR140ESF, NRVB140ESF** 

## **TYPICAL CHARACTERISTICS** 

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10<br>9 TA = 150 ° C<br>8 I PK /I AV  = 20<br>7<br>6<br>5<br>SQUARE<br>4 WAVE IPK/IAV = 10<br>3<br>2 IPK/IAV = 5<br>1<br>dc<br>0<br>0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>ER DISSIPATION (W)<br>, AVERAGE FORWARD POW-<br>F(AV)<br>P<br>**----- End of picture text -----**<br>


**Figure 7. Forward Power Dissipation** 

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1000<br>D = 0.5<br>100 0.2<br>0.1<br>0.05<br>10 P(pk)<br>0.01<br>t1<br>t 2<br>1 DUTY CYCLE, D = t1/t2<br>SINGLE PULSE<br>Test Type > Min Pad < Die Size 38x38 @ 75% mils � JA = 321.8  ° C/W<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 8. Thermal Response** 

**www.onsemi.com** 

**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SOD−123−2 1.65x2.70x0.90** CASE 498 ISSUE E 

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DATE 22 AUG 2023<br>**----- End of picture text -----**<br>


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GENERIC<br>MARKING DIAGRAM*<br>XXXM<br>XXX = Specific Device Code<br>M = Date Code<br>. = Pb−Free Package<br>**----- End of picture text -----**<br>


(Note: Microdot may be in either location) 

*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. 

## **DOCUMENT NUMBER: 98AON11184D DESCRIPTION: SOD−123−2 1.65x2.70x0.90** 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

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www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **ADDITIONAL INFORMATION** 

**TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales 

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