# Schottky Rectifier, 40 V, 1 A, Single, SOD-123FL, 2 Pins, 560 mV

![Product image](https://novapart.co/image/farnell:2844729RL/)

**URL**: https://novapart.co/products/MBR140ESFT1G/schottky-rectifier-40-v-1-a-single-sod-123fl-2
**SKU**: MBR140ESFT1G
**Manufacturer**: ONSEMI
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Schottky Diodes || Schottky Rectifier Diodes
**Price**: €0.0920
**Stock**: 1000+
**Lead Time**: 128 days (indicative)

## Description

Repetitive Reverse Voltage Vrrm Max:40V; Forward Current If(AV):1A; Diode Configuration:Single; Diode Case Style:SOD-123FL; No. of Pins:2Pins; Forward Voltage VF Max:560mV; Forward

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Product Range | - |
| Qualification | AEC-Q101 |
| Diode Mounting | Surface Mount |
| Diode Case Style | SOD-123FL |
| Diode Configuration | Single |
| Forward Voltage Max | 560mV |
| Forward Surge Current | 30A |
| Average Forward Current | 1A |
| Operating Temperature Max | 175°C |
| Repetitive Peak Reverse Voltage | 40V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2844729RL/)

## MBR140ESF, NRVB140ESF 

## Surface Mount Schottky Power Rectifier **Plastic SOD−123 Package** 

This device uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. 

## **Features** 

- Guardring for Stress Protection 

- Low Reverse Leakage 

- 175°C Operating Junction Temperature 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Package Designed for Optimal Automated Board Assembly 

- ESD Rating: 

   - ♦ Human Body Model = 3B 

   - ♦ Machine Model = M4 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

## **Mechanical Characteristics** 

- Device Marking: E4F 

- Polarity Designator: Cathode Band 

- Weight: 11.7 mg (approximately) 

- Case: Epoxy, Molded 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

## **http://onsemi.com** 

**SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES 40 VOLTS** 

**==> picture [146 x 140] intentionally omitted <==**

**----- Start of picture text -----**<br>
SOD−123FL<br>CASE 498<br>MARKING DIAGRAM<br>E4FM<br>E4F sa = Specific Device Code<br>M = Date Code<br>= Pb−Free Package)<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBR140ESFT1G|SOD−123FL<br>(Pb−Free)|3,000 /<br>Tape & Reel **|
|MBR140ESFT3G|SOD−123FL<br>(Pb−Free)|10,000 /<br>Tape & Reel ***|
|NRVB140ESFT1G|SOD−123FL<br>(Pb−Free)|3,000 /<br>Tape & Reel **|
|NRVB140ESFT3G|SOD−123FL<br>(Pb−Free)|10,000 /<br>Tape & Reel ***|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

- ** 8 mm Tape, 7” Reel 

- *** 8 mm Tape, 13” Reel 

Publication Order Number: **MBR140ESF/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **February, 2014 − Rev. 3** 

**MBR140ESF, NRVB140ESF** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|40|V|
|Average Rectified Forward Current|IO|1.0|A|
|Peak Repetitive Forward Current|IFRM|2.0|A|
|Non−Repetitive Peak Surge Current<br>(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)|IFSM|30|A|
|Storage Temperature|Tstg|−55 to 175|°C|
|Operating Junction Temperature|TJ|−55 to 175|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 1)<br>Thermal Resistance, Junction−to−Lead (Note 2)<br>Thermal Resistance, Junction−to−Ambient (Note 1)<br>Thermal Resistance, Junction−to−Ambient (Note 2)|Rtjl<br>Rtjl<br>Rtja<br>Rtja|26<br>21<br>325<br>82|°C/W|



1. Mounted with minimum recommended pad size, PC Board FR4. 

2. Mounted with 1 in. copper pad (Cu area 700 mm[2] ). 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(IF= 1.0 A)|VF|**TJ = 25**°**C**|V|
|||0.56||
|Maximum Instantaneous Reverse Current (Note 3)<br>(VR= 40 V)|IR|**TJ = 25**°**C**|�A|
|||30||



3. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2%. 

**http://onsemi.com** 

**2** 

**MBR140ESF, NRVB140ESF** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10.0 10.0<br>TA = 150 ° C<br>1.0 1.0<br>TA = 150 ° C TA = 125 ° C TA = 125 ° C<br>TA = 85 ° C TA = 85 ° C<br>TA = 25 ° C TA = 25 ° C<br>0.10 0.10<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.0<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−01<br>TA = 150 ° C TA = 150 ° C<br>1.E−03<br>TA = 125 ° C 1.E−02 TA = 125 ° C<br>1.E−04<br>1.E−03<br>TA = 85 ° C TA = 85 ° C<br>1.E−05 1.E−04<br>TA = 25 ° C<br>1.E−06 TA = 25 ° C 1.E−05<br>1.E−07 1.E−06<br>0 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 40<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>2.00<br>TJ = 25 ° C 1.80 R � JA  = 82 ° C/W<br>1.60 dc<br>1.40<br>100 1.20 SQUARE WAVE<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>10 0.00<br>1 10 0 20 40 60 80 100 120 140<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>Figure 5. Typical Junction Capacitance Figure 6. Current Derating, Case<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>, INSTANTANEOUS REVERSE CURRENT (mA) , INSTANTANEOUS REVERSE CURRENT (mA)<br>IR IR<br>CURRENT (A)<br>, AVERAGE FORWARD<br>IF(AV)<br>C, JUNCTION CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**3** 

**MBR140ESF, NRVB140ESF** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10<br>9 TA = 150 ° C<br>8 I PK /I AV  = 20<br>7<br>6<br>5<br>SQUARE<br>4 WAVE IPK/IAV = 10<br>3<br>2 IPK/IAV = 5<br>1<br>dc<br>0<br>0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>ER DISSIPATION (W)<br>, AVERAGE FORWARD POW-<br>F(AV)<br>P<br>**----- End of picture text -----**<br>


**Figure 7. Forward Power Dissipation** 

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**----- Start of picture text -----**<br>
1000<br>D = 0.5<br>100 0.2<br>0.1<br>0.05<br>10 P(pk)<br>0.01<br>t1<br>t 2<br>1 DUTY CYCLE, D = t1/t2<br>SINGLE PULSE<br>Test Type > Min Pad < Die Size 38x38 @ 75% mils � JA = 321.8  ° C/W<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 8. Thermal Response** 

**http://onsemi.com** 

**4** 

**MBR140ESF, NRVB140ESF** 

## **PACKAGE DIMENSIONS** 

**SOD−123FL** CASE 498 ISSUE D 

**==> picture [212 x 244] intentionally omitted <==**

**----- Start of picture text -----**<br>
E<br>——-<br>D<br>1 2<br>A1<br>POLARITY INDICATOR<br>me OPTIONAL AS NEEDED e ee A<br>TOP VIEW END VIEW<br>a HE — | t c<br>SIDE VIEW<br>2X L<br>2X b<br>2X<br>me BOTTOM VIEW<br>**----- End of picture text -----**<br>


|**DIM**<br>~~ESS See~~|**MILLIMETERS**<br>~~ESS See~~|**MILLIMETERS**<br>~~ESS See~~|**MILLIMETERS**<br>~~ESS See~~|**INCHES**<br>~~ESS See~~|**INCHES**<br>~~ESS See~~|**INCHES**<br>~~ESS See~~|
|---|---|---|---|---|---|---|
||**MIN**<br>~~ESS See~~|**NOM**<br>~~ESS See~~|**MAX**<br>~~ESS See~~|**MIN**<br>~~ESS See~~|**NOM**<br>~~ESS See~~|**MAX**|
|**A**<br>**A1**<br>~~ESS See~~|0.90<br>0.00<br>~~ESS See~~|**NOM**<br>0.95<br>0.05<br>~~ESS See~~|0.98<br>0.10<br>~~ESS See~~|0.035<br>0.000<br>~~ESS See~~|0.037<br>0.002<br>**NOM**<br>~~ESS See~~|0.039<br>0.004|
|**A1**<br>~~ESS See~~|0.00<br>~~ESS See~~|0.05<br>~~ESS See~~|0.10<br>~~ESS See~~|0.000<br>~~ESS See~~|0.002<br>~~ESS See~~|0.004|
|**b**<br>~~ESS See~~|0.70<br>~~ESS See~~|0.90<br>~~ESS See~~|1.10<br>~~ESS See~~|0.028<br>~~ESS See~~|0.035<br>~~ESS See~~|0.043|
|**c**|0.10|0.15|0.20|0.004|0.006|0.008|
|**D**|1.50|1.65|1.80|0.059|0.065|0.071|
|**E**|2.50|2.70|2.90|0.098|0.106|0.114|
|**L**|0.55|0.75|0.95|0.022|0.030|0.037|
|**HE**|3.40|3.60|3.80<br>——|0.134<br>——|0.142<br>——|0.150<br>——|
||0°|−|8°<br>——|0°<br>——|−<br>——|8°<br>——|



## **RECOMMENDED** 

## **SOLDERING FOOTPRINT*** 

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4.20<br>**----- End of picture text -----**<br>


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2X<br>ÉÉÉÉ ÉÉÉÉ1.25<br>ÉÉÉÉ ÉÉÉÉ<br>2X 1.22 ÉÉÉÉ ÉÉÉÉ<br>T ÉÉÉÉ E E ÉÉÉÉ<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**MBR140ESF/D** 

**http://onsemi.com 5** 



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- [Supplier page](https://es.farnell.com/on-semiconductor/mbr140esft1g/schottky-rect-aec-q101-40v-sod/dp/2844729RL)
---

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