# Fast / Ultrafast Diode, Qspeed, 600 V, 16 A, Dual Common Cathode, 2.94 V, 21.5 ns, 60 A

![Product image](https://novapart.co/image/farnell:2771806/)

**URL**: https://novapart.co/products/LXA16T600C/fast-ultrafast-diode-qspeed-600-v-16-a-dual-common
**SKU**: LXA16T600C
**Manufacturer**: POWER INTEGRATIONS
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || Fast & Ultrafast Recovery Rectifier Diodes
**Price**: €0.6870
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| No. Of Pins | 3 Pin |
| Product Range | Qspeed X Series |
| Diode Case Style | TO-220AB |
| Diode Configuration | Dual Common Cathode |
| Forward Voltage Max | 2.94V |
| Forward Surge Current | 60A |
| Reverse Recovery Time | 21.5ns |
| Average Forward Current | 16A |
| Operating Temperature Max | 150°C |
| Repetitive Peak Reverse Voltage | 600V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2771806/)

**LXA16T600C Qspeed[™]** Family 

## **600 V, 16 A X-Series Common-Cathode Diode** 

## **Product Summary** 

|IF(AVG) per diode|8|A|
|---|---|---|
|VRRM|600|V|
|QRR(Typat 125 °C)|82|nC|
|IRRM (Typat 125 °C)|3.5|A|
|Softness tb/ta(Typat 125 °C)|0.55||



## **General Description** 

This device has the lowest QRR of any 600 V Silicon diode.  Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. 

## **Applications** 

## **Pin Assignment** 

- Power Factor Correction (PFC) Boost Diode 

- Motor drive circuits 

- DC-AC inverters 

## **Features** 

- Low QRR, Low IRRM, Low tRR 

- High dIF/dt capable (1000 A/µs) 

- Soft recovery 

## **TO-220AB A1 K A2** o ~~t~~ 

## RoHS Compliant 

Package uses Lead-free plating and Green mold compound. 

## **Benefits** 

- Increases efficiency 

- Eliminates need for snubber circuits 

- Reduces EMI filter component size & count 

- Enables extremely fast switching 

Halogen free per IEC 61249-2-21. 

## **Absolute Maximum Ratings** 

Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. 

|**Symbol**<br>~~ee~~|**Parameter**<br>~~ee~~|**Conditions**<br>~~ee~~|**Rating**<br>~~ee~~|**Units**|
|---|---|---|---|---|
|VRRM<br>~~ee~~|Peak repetitive reverse voltage<br>~~ee~~|~~ee~~|600<br>~~ee~~|V|
|IF(AVG)<br>~~ee~~|Average forward current<br>~~ee~~|Per Diode,TJ= 150 °C,TC=  122°C<br>~~ee~~|8<br>~~ee~~|A|
|||Per Device,TJ= 150 °C,TC=  122°C|16|A|
|IFSM|Non-repetitivepeak surge current|60 Hz,½ cycle|60|A|
|IFSM|Non-repetitivepeak surge current|½ cycle of t = 28μs Sinusoid,TC= 25 °C|350|A|
|TJ|Maximumjunction temperature||150|°C|
|TSTG|Storage temperature||–55 to 150|°C|
||Lead solderingtemperature|Leads at 1.6mm from case,10 sec|300|°C|
|PD|Power dissipation|TC= 25 °C|83|W|



## **Thermal Resistance** 

|**Symbol**|**Resistance from:**|**Conditions**|**Rating**|**Units**|
|---|---|---|---|---|
|RJA|Junction to ambient|TO-220AB|62|°C/W|
|RJC|Junction to case|Per Diode|1.5|°C/W|
|||Per Device|0.8|°C/W|



November 2013 

www.powerint.com 

|**Symbol**<br>~~gees~~|**Parameter**<br>~~gees~~|**Conditions**<br>~~gees~~|**Conditions**<br>~~gees~~|**Min**<br>~~gees~~|**Typ**<br>~~gees~~|**Max**<br>~~gees~~|**Units**<br>~~gees~~|
|---|---|---|---|---|---|---|---|
|**DC Characteristicsper diode**<br>~~gees~~||||||||
|IR<br>~~gees~~|Reverse current per diode<br>~~gees~~|VR= 600 V, TJ= 25 °C<br>~~gees~~||-<br>~~gees~~|-<br>~~gees~~|250<br>~~gees~~|A<br>~~gees~~|
|||VR= 600 V,TJ= 125 °C<br>~~gees~~||-<br>~~gees~~|0.85<br>~~gees~~|-<br>~~gees~~|mA<br>~~gees~~|
|VF<br>~~gees~~|Forward voltage per diode<br>~~gees~~|IF= 8 A,TJ= 25 °C<br>~~gees~~||-<br>~~gees~~|2.35<br>~~gees~~|2.94<br>~~gees~~|V<br>~~gees~~|
|||IF= 8 A,TJ= 150 °C<br>~~gees~~||-<br>~~gees~~|2.1<br>~~gees~~|-<br>~~gees~~|V<br>~~gees~~|
|CJ<br>~~gees~~|Junction capacitance per<br>diode<br>~~gees~~|VR= 10 V, 1 MHz<br>~~gees~~||-<br>~~gees~~|40<br>~~gees~~|-<br>~~gees~~|pF<br>~~gees~~|
|**Dynamic Characteristicsper diode**||||||||
|tRR|Reverse recovery time,<br>per diode|dIF/dt =200 A/s<br>VR=400, IF=8 A|TJ=25 °C|-|21.5|-|ns|
||||TJ=125 °C|-|33|-|ns|
|QRR|Reverse recovery charge,<br>per diode|dIF/dt =200 A/s<br>VR=400, IF=8 A|TJ=25 °C|-|31|48|nC|
||||TJ=125 °C|-|82|-|nC|
|IRRM|Maximum reverse<br>recovery current, per<br>diode|dIF/dt =200 A/s<br>VR=400, IF=8 A|TJ=25 °C|-|2.2|2.8|A|
||||TJ=125 °C|-|3.5|-|A|
|S<br>~~oT~~|Softness per diode=<br>a<br>b<br>t<br>t<br>~~oT~~|dIF/dt =200 A/s<br>VR=400, IF=8 A<br>~~oT~~|TJ=25 °C<br>~~oT~~|-<br>~~oT~~|0.74|-||
||||TJ=125 °C<br>~~oT~~|-<br>~~oT~~|0.55|-||



**==> picture [453 x 137] intentionally omitted <==**

**----- Start of picture text -----**<br>
VR<br>D1<br>L1 DUT<br>IF  tRR  15V<br>dIF/dt Pulse generator + Rg<br>ta  tb  Q1<br>0<br>0.2xIRRM<br>IRRM<br>**----- End of picture text -----**<br>


**Figure 1.  Reverse Recovery Definitions** 

**Figure 2.  Reverse Recovery Test Circuit** 

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**LXA16T600C** 

## **Electrical Specifications at TJ= 25**  **C (unless otherwise specified)** 

**==> picture [441 x 497] intentionally omitted <==**

**----- Start of picture text -----**<br>
24 160<br>22 A A ee<br>140<br>20<br>18 Tj=125C 120<br>16 s a a OO<br>100<br>14 OA | | | | jt} tt<br>12 80<br>10 A Tj=25C<br>60<br>8<br>6 S ESS || 40 ERRRECEEE<br>4<br>20<br>2 >SS S || REESE| Sw || | |<br>0 et 0 Po<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 180<br>VF (V) VR (V)<br>Figure 3.   Typical IF vs VF Figure 4.  Typical Cj vs VR<br>dI/dt=1000A/us<br>160 40 dI/dt=200A/us<br>140 35<br>dI/dt=500A/us<br>120 30<br>dI/dt=500A/us<br>100 25<br>80 20<br>dI/dt=200A/us<br>60 15<br>dI/dt=1000A/us<br>40 [am | | tl 10 [TY |LTT<br>20 7] | | cE 5 P77] |TTT<br>0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14<br>IF (A) IF (A)<br>Figure 5.   Typical QRR vs IF at TJ = 125 °C  Figure 6.   Typical tRR vs IF at Tj = 125 °C<br>25 100<br>90<br>| ee ee ee<br>20 80<br>70<br>15 60<br>10 > 5040 Po CU<br>30<br>5 NX 20 rr a ee ee<br>10<br>0 0 ee ee ee<br>25 TN 50 75 100 125 150 |)  SSS 25 50 75 100 125 150<br>Case Temperature, TC ( [o] C) Case Temperature, TC ( [o] C)<br>(A)IF  C(pF)j<br> (nC)  (ns)<br>QRR tRR<br> (A)<br>IF(AV) P (W)<br>**----- End of picture text -----**<br>


**Figure 7.  DC Current Derating Curve** 

**Figure 8.  Power Derating Curve** 

## 3 ~~|~~ 

Rev 1.1 11/13                                                                                                                                                                                                                                   www.powerint.com 

RE POWwEr 

**LXA16T600C** 

**==> picture [245 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
55<br>Duty=10%<br>50 | [oOo]<br>a NT Duty=30%<br>45<br>40 PoE aCOUNee ee Duty=50%<br>35 PSO DC<br>30 Po ON ONT<br>25 Po RNR<br>20 ee NN<br>a ee ee a ee ee<br>15<br>a he eeee<br>10<br>5 ee ee <a Oe<br>0 ee ee eees NN<br>25 50 75 100 125 150<br>TC(°C)<br>(PEAK) (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 9.   IF(Peak) vs TC, f=70 kHz** 

**==> picture [86 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
LXA16T600C<br>**----- End of picture text -----**<br>


**==> picture [442 x 283] intentionally omitted <==**

**----- Start of picture text -----**<br>
1<br>D= 0.5<br>D = 0.3<br>D= 0.1<br>0.1<br>D= 0.05<br>D= 0.02<br>D= 0.01<br>0.01<br>D= 0.005<br>D= 0.002 a<br>1. Duty factor D = ty /t2<br>Single Pulse 2. Peak Ty=P DM X Zthuc + Te<br>0.001<br>1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>t1(sec)<br>Zth(j-c)/Rth(j-c)<br>**----- End of picture text -----**<br>


**Figure 10.  Normalized Maximum Transient Thermal Impedance** 

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**LXA16T600C** 

**==> picture [479 x 331] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensional Outline Drawings<br>TO-220AB<br>A<br>E A1<br>Millimeters<br>Q Dim  MIN  MAX<br>øP A  4.32  4.70<br>A1  1.11  1.38<br>D i A2  2.59  2.79<br>b  0.77  1.00<br>D1 b2  1.23  1.36<br>C  0.34  0.47<br>D  14.71  15.75<br>D1  9.05  9.25<br>b2 L1 E  9.96  10.36<br>e  2.44  2.64<br>e1  4.98  5.18<br>L  12.70  14.22<br>L<br>L1  –  3.90<br>b c ØP  3.71  3.96<br>Q 2.54  2.90<br>e A2<br>l e1 in i a===<br>Mechanical Mounting<br>Maximum Torque / Pressure specification<br>Method<br>Screw through hole in package tab  1 Newton Meter (nm) or 8.8 inch-pounds (lb-in)<br>SS Clamp against package body 12.3 kilogram-force per square centimeter (kgf/cm [2] ) or 175 lbf/in [2]<br>**----- End of picture text -----**<br>


**Soldering time and temperature:** This product has been designed for use with hightemperature, lead-free solder.  The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds.  See Application Note AN-303, for more details. 

## **Ordering Information** 

**Part Number Package Packing** LXA16T600C TO-220AB 50 units/tube ~~ee ee ee~~ 

## **The information contained in this document is subject to change without notice.** 

Rev 1.1 11/13                                                                                                                                                                                                                                   www.powerint.com 

5 

## **LXA16T600C** 

|**Revision**|**Notes**|**Date**|
|---|---|---|
|1.0|Released by Qspeed|06/10|
|1.1|Converted to Power Integrations Document|01/11|
|1.1|Stop Point of tRRerror corrected due to typo in Figure 1|11/13|



6 

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Rev 1.1 11/13 

S| **LXA16T600C** 

## **For the latest updates, visit our website: www.powerint.com** 

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. 

## **PATENT INFORMATION** 

The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations.  A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. 

The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2013 Power Integrations, Inc. 

## **Power Integrations Worldwide Sales Support Locations** 

## **WORLD HEADQUARTERS** 

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## **APPLICATIONS HOTLINE** 

World Wide  +1-408-4149660 

## **APPLICATIONS FAX** 

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## 7 ~~|~~ 

Rev 1.1 11/13                                                                                                                                                                                                                                   www.powerint.com 

RE POWwEr 



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