# Power Inductor (SMD), 22 µH, 550 mA, Unshielded, 400 mA, LQW32FT_0H Series
**URL**: https://novapart.co/products/LQW32FT220M0HL/power-inductor-smd-22-h-550-ma-unshielded-400
**SKU**: LQW32FT220M0HL
**Manufacturer**: MURATA
**Category**: Passive Components || Inductors || Power Inductors || SMD Power Inductors
**Price**: €0.4030
**Stock**: 10+
**Lead Time**: 78 days (indicative)
## Description
Inductance:22µH; RMS Current (Irms):550mA; Inductor Construction:Unshielded; Saturation Current (Isat):400mA; Product Range:LQW32FT_0H Series; Power Inductor Case:3.2mm x 2.5mm x 2.3
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (04-Feb-2026) |
| Inductance | 22µH |
| Product Range | LQW32FT_0H Series |
| Product Width | 2.5mm |
| Product Height | 2.3mm |
| Product Length | 3.2mm |
| Dc Resistance Max | 0.62ohm |
| Rms Current (Irms) | 550mA |
| Power Inductor Case | 3.2mm x 2.5mm x 2.3mm |
| Inductance Tolerance | ± 20% |
| Inductor Construction | Unshielded |
| Saturation Current (Isat) | 400mA |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2913687/)
## SpecNo.JELF243A-9147A-01 Reference Only P.1/8
## **CHIP COIL (CHIP INDUCTORS) LQW32FT** □□□□ **0HL Murata Standard Reference Specification** 【 **AEC-Q200** 】
## **1. Scope**
This reference specification applies to Chip coil (Chip Inductors) LQW32FT_0H series for Automotive Electronics based on AEC-Q200.
## **2. Part Numbering**
(ex) LQ W 32 F T 470 M 0 H L Product ID Structure Dimension Applications Category Inductance Tolerance Features Category Packaging (L×W) and H:Automotive L:Taping Characteristics ∗ B:Bulk
- ∗ Bulk packing also available. (A product is put in the plastic bag under the taping conditions.)
## **3. Rating**
・ Operating Temperature Range -40 to +125°C
- ・ Storage Temperature Range. -40 to +125°C
|Customer
Part Number|MURATA
Part Number|Inductance|Inductance|DC
Resistance
(Ω)max.|Self
Resonant
Frequency
(MHz min.)|Rated Current(mA)|Rated Current(mA)|Rated Current(mA)|ESD Rank|
|---|---|---|---|---|---|---|---|---|---|
|||(μH)
(@1MHz)|Tolerance
(%)|||∗1
Based on
Inductance
change|∗2
Based on
Temperature rise|||
||||||||Ambient
temperature|||
||||||||85℃|125℃||
||LQW32FT100M0HL|10|M：±20|0.40|100|500|700|140
（|5B
（12kV(AD) < 16kV(AD)）|
||LQW32FT220M0HL|22|M：±20|0.62|50|400|550|110
（|5B
（12kV(AD) < 16kV(AD)）|
||LQW32FT470M0HL|47|M：±20|0.9|30|300|500|100
（|5B
（12kV(AD) < 16kV(AD)）|
- ∗ 1：When applied Rated current to the Products,Inductance will be within ±30% of nominal Inductance value.
- ∗ 2：Keep the temperature(ambient temperature plus self-generation of heat) under 125°C.
- When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max.
As for the rated current marked with *2, rated current is derated as following figure depending on the operating temperature.
## **4. Testing Conditions**
- 《Unless otherwise specified》
- Temperature : Ordinary Temperature / 15°C to 35°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH)
《In case of doubt》 Temperature : 20°C±2°C Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa
MURATA MFG.CO.,LTD
> SpecNo.JELF243A-9147A-01 Reference Only P.2/8
## **5. Appearance and Dimensions**
**==> picture [108 x 20] intentionally omitted <==**
**----- Start of picture text -----**
■ Unit Mass (Typical value)
0.073g
**----- End of picture text -----**
## **6.Electrical Performance**
|No.|Item|Specification|Test Method|
|---|---|---|---|
|6.1|Inductance|Inductance shall meet item 3.|Measuring Equipment：KEYSIGHT E4294A or equivalent
Measuring Frequency： 1MHz|
|6.2|DC Resistance|DC Resistance shall meet item 3.|Measuring Equipment：Digital multi meter|
|6.3|Self Resonant
Frequency
(S.R.F)|S.R.F shall meet item 3.|Measuring Equipment：KEYSIGHT E4294A or equivalent|
## **7. Q200 Requirement**
## **7.1.Performance (based on Table 5 for Magnetics(Inductors / Transformer) AEC-Q200 Rev.D issued June 1. 2010**
AEC-Q200
|**AEC-Q200 Rev.D issuedC-Q200 Rev.D issued-Q200 Rev.D issuedQ200 Rev.D issued200 Rev.D issued00 Rev.D issued Rev.D issuedev.D issuedv.D issuedssued June 1. 2010ne 1. 2010e 1. 2010 1. 2010010100**|**AEC-Q200 Rev.D issuedC-Q200 Rev.D issued-Q200 Rev.D issuedQ200 Rev.D issued200 Rev.D issued00 Rev.D issued Rev.D issuedev.D issuedv.D issuedssued June 1. 2010ne 1. 2010e 1. 2010 1. 2010010100**|**AEC-Q200 Rev.D issuedC-Q200 Rev.D issued-Q200 Rev.D issuedQ200 Rev.D issued200 Rev.D issued00 Rev.D issued Rev.D issuedev.D issuedv.D issuedssued June 1. 2010ne 1. 2010e 1. 2010 1. 2010010100**||
|---|---|---|---|
|AEC-Q200|||Murata Specification / Deviation
~~a~~|
|No
~~a~~|No
Stress
~~a~~|Test Method
~~a~~||
|3 High
~~a~~|3 High
Temperature
Exposure
~~a~~|1000hours at 125 deg C
Set for 24hours at room temperature,
then measured.
~~a~~|Meet Table A after testing.
Table A
Appearance
No damage
Inductance change
(at 1MHz)
Within ±10%
~~a=~~|
|4 Temperature
~~a~~|4 Temperature
Cycling
~~a~~|1000cycles
-40 deg C to +125 deg C
Set for 24hours at room temperature,
then measured.
~~a~~|Meet Table A after testing.
~~a~~|
|7 Biased Humidity
~~a~~|7 Biased Humidity
~~a~~|1000hours at 85 deg C, 85%R.H
~~a~~|Meet Table B after testing.
Table B
Appearance
No damage
Inductance change
(at 1MHz)
Within ±20%
~~a~~
~~=~~|
|8 Operational Life
~~ee~~|8 Operational Life
~~ee~~|Apply Rated Current (at 125 deg C)
125 deg C 1000hours
Set for 24hours at room temperature,
then measured
~~ee~~|Meet Table B after testing.
~~ee~~|
|9 External Visual
~~ee~~|9 External Visual
~~ee~~|Visual inspection
~~ee~~|No abnormalities
~~ee~~|
MURATA MFG.CO.,LTD
## Reference Only
## SpecNo.JELF243A-9147A-01 P.3/8
|SpecNo.JELF243A-9147A-01-9147A-019147A-01-0101
Reference|SpecNo.JELF243A-9147A-01-9147A-019147A-01-0101
Reference|SpecNo.JELF243A-9147A-01-9147A-019147A-01-0101
Reference|P.3/8
Reference Only|
|---|---|---|---|
|AEC-Q200|||Murata Specification / Deviation|
|No|No
Stress|Test Method||
|10 Physical|10 Physical
Dimension|Meet ITEM 5
(Style and Dimensions)|No defects|
|12 Resistance|12 Resistance
to Solvents|Per
MIL-STD-202
Method 215|Not Applicable|
|13 Mechanical Shock|13 Mechanical Shock|Per MIL-STD-202
Method 213
Condition C：100g’s(0.98N), 6ms,
Half sine, 12.3ft/s|Meet Table A after testing.|
|14 Vibration|14 Vibration|5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.|Meet Table A after testing.|
|15 Resistance|15 Resistance
to Soldering Heat|No-heating
Solder temperature 260C+/-5 deg C
Immersion time 10s|Pre-heating：150 to 180C / 90±30s
Meet Table A after testing.|
|17 ESD|17 ESD|Per AEC-Q200-002|ESD Rank：Refer to Item 3. Rating.
Meet Table A after testing|
|18 Solderbility|18 Solderbility|Per J-STD-002|Method b：Not Applicable
95% of the terminations is to be soldered.
(Except exposed wire)|
|19 Electrical|19 Electrical
Characterization|Measured：Inductance|No defects|
|20 Flammability|20 Flammability|Per UL-94|Not Applicable|
|21 Board Flex|21 Board Flex|Epoxy-PCB(1.6mm)
Deflection 2mm(min)
Holding time 60s|Meet Table C after testing.
Table C
Appearance
No damage
DC resistance change
Within ±10%|
|22 Terminal Strength|22 Terminal Strength|Per AEC-Q200-006
A force of 17.7N for 60s|No defect|
## **8. Specification of Packaging**
## **8.1 Appearance and Dimensions of plastic tape** (12mm-wide, 4mm pitch)
Dimension of the Cavity is measured at the bottom side.
MURATA MFG.CO.,LTD
## SpecNo.JELF243A-9147A-01 Reference Only P.4/8
## **8.2 Specification of Taping**
- (1) Packing quantity (standard quantity)
- 1,500 pcs. / reel
- (2) Packing Method
Products shall be packed in the cavity of the plastic tape and sealed by Cover tape.
- (3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
- (4) Spliced point
Plastic tape and Cover tape has no spliced point.
- (5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept.
## **8.3 Pull Strength**
|**ull Strength**||
|---|---|
|Plastic tape|5N min.|
|Cover tape|10N min.|
## **8.4 Peeling off force of cover tape**
||165 to 180 degree
F
Cover tape
Plastic tape
300mm/min
0.2N to 0.7N
(minimum valueistypical)|
|---|---|
|Speed of Peeling off|300mm/min
|
|Peeling off force|0.2N to 0.7N
(minimum valueistypical)|
|||
## **8.5 Dimensions of Leader-tape,Trailer and Reel**
There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.
**==> picture [382 x 121] intentionally omitted <==**
**----- Start of picture text -----**
Trailer Leader
2.0±0.5 160 min.
190 min. 210 min.
Label
Empty TapeCover tape
φ 60±10 φ 13.0±0.2
φ 21.0±0.8
13± 10 Direction of feed
17±1.4
0
φ 180± 3 (in mm)
**----- End of picture text -----**
## **8.6 Marking for reel**
Customer part number, MURATA part number, Inspection number( ∗ 1), RoHS marking( ∗ 2), Quantity etc ･･･
∗ 1) □□ OOOO ×××
(1) (2) (3)
(1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day
(3) Serial No.
∗ 2) « Expression of RoHS marking » ROHS – Y (△) (1) (2)
- (1) RoHS regulation conformity
- (2) MURATA classification number
## **8.7 Marking for Outside package (corrugated paper box)**
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking ( ∗ 2) , Quantity, etc ･･･
## **8.8. Specification of Outer Case**
|||||||||Outer Case Dimensions (mm)|Standard Reel Quantity||
|---|---|---|---|---|---|---|---|---|---|---|
|||||||Label||W
D
H|in Outer Case (Reel)||
|H||||||||186
186
93|4||
||||||D||∗Above Outer Case size is typical. It depends on a quantity
of an order.||||
|||W|||||||||
MURATA MFG.CO.,LTD
## SpecNo.JELF243A-9147A-01 Reference Only P.5/8
## **9. Caution** A
## **9.1 Limitation of Applications**
Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
- (1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
- (2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above
## **9.2 Caution(Rating)**
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and short / open circuit of the product or falling off the product may be occurred.
## **9.3 Fail-safe**
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused by the abnormal function or the failure of our product.
## **10. Notice**
Products can only be soldered with reflow. This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
## **10.1 Land pattern designing**
Recommended land patterns for reflow soldering are as follows： These have been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process.
Metal mask aperture pattern
MURATA MFG.CO.,LTD
## SpecNo.JELF243A-9147A-01 Reference Only P.6/8
## **10.2 Flux, Solder**
- ・Use rosin-based flux.
Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine.
- Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux.
- ・Use Sn-3.0Ag-0.5Cu solder.
- ・Standard thickness of solder paste : 150μm.
- ・Please pay attention to solder paste's penetrating in order to avoid short circuit between the lines.
## **10.3 Reflow soldering conditions**
- ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 150°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
- ・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.
- ・Reflow soldering profile
**==> picture [313 x 159] intentionally omitted <==**
**----- Start of picture text -----**
Temp. 260℃
( ℃)
245℃±3℃
230℃
220℃
Limit Profile
180
150
30s ～60 s Standard Profile
60s max.
90s±30s Time. ( s)
**----- End of picture text -----**
||Standard Profile|Limit Profile|
|---|---|---|
|Pre-heating|150°C～180°C、90s±30s||
|Heating|above 220°C､30s～60s|above 230°C､60s max.|
|Peak temperature|245°C±3°C|260°C,10s|
|Cycle of reflow|2 times|2 times|
## **10.4 Reworking with soldering iron**
The following conditions must be strictly followed when using a soldering iron.
|following conditions must|be strictly followe|
|---|---|
|Pre-heating|150°C,1 min|
|Tip temperature|350°C max.|
|Soldering iron output|80W max.|
|Tip diameter|φ3mm max.|
|Soldering time|3 (+1,-0)s|
|Time|2 times|
- Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock.
MURATA MFG.CO.,LTD
## SpecNo.JELF243A-9147A-01 ~~Oo~~ Reference Only P.7/8
## **10.5 Solder Volume**
- ・Solder shall be used not to be exceeded the upper limits as shown below.
- ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T≦t≦T
T：thickness of electrode
## **10.6 Product’s location**
The following shall be considered when designing and laying out P.C.B.'s.
- (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
- ［Products direction］
> a Products shall be located in the sideways ~~-~~ b direction (Lengthstress. ：a＜b) to the mechanical 〈 Poor example 〉 〈 Good example 〉
- (2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.
**==> picture [404 x 216] intentionally omitted <==**
**----- Start of picture text -----**
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to A > D ∗ 1
the board separation surface.
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from A > C
the board separation surface.
C
Seam B ∗ 1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
b A D the PCB, therefore A > D is invalid.
Slit
Length:a < b
a
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
Screw Hole Recommended
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
**----- End of picture text -----**
- (3) Mounting Components Near Screw Holes
## **10.7 Cleaning Conditions**
Products shall be cleaned on the following conditions.
- (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
- (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.
Power：20 W / l max. Frequency：28kHz to 40kHz Time：5 min max.
- (3) Cleaner
1. Alcohol type cleaner
- Isopropyl alcohol (IPA)
2. Aqueous agent
- PINE ALPHA ST-100S
- (4) There shall be no residual flux and residual cleaner after cleaning.
- In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
- (5) Other cleaning Please contact us.
MURATA MFG.CO.,LTD
## SpecNo.JELF243A-9147A-01 ~~Pp~~ Reference Only P.8/8
## **10.8 Resin coating**
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.
## **10.9 Caution for use**
- ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire.
- ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
## **10.10 Notice of product handling at mounting**
In some mounting machines,when picking up components support pin pushes up the components from the bottom of plastic tape. In this case, please remove the support pin. The support pin may damage the components and break wire.
## **10.11 Handling of a substrate**
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
## **10.12 Storage and Handing Requirements**
- (1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
- (2) Storage conditions
- ・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity
- ・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
- ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products.
- ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
- ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
## **11. Note**
- (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product.
- (2) You are requested not to use our product deviating from the reference specifications.
- (3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO.,LTD
## Links
- [View this product on Novapart](https://novapart.co/products/LQW32FT220M0HL/power-inductor-smd-22-h-550-ma-unshielded-400)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/murata/lqw32ft220m0hl/inductor-unshielded-22uh-aec-q200/dp/2913687)
---
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