# Power Inductor (SMD), 10 µH, 100 mA, Shielded, LQM21F, 0805 [2012 Metric]
**URL**: https://novapart.co/products/LQM21FN100M70L/power-inductor-smd-10-h-100-ma-shielded-lqm21f
**SKU**: LQM21FN100M70L
**Manufacturer**: MURATA
**Category**: Passive Components || Inductors || Power Inductors || SMD Power Inductors
**Price**: €0.0590
**Stock**: 10+
## Specifications
| Parameter | Value |
|---|---|
| Inductance | 10µH |
| Product Range | LQM21F |
| Product Width | 1.25mm |
| Product Height | 1.25mm |
| Product Length | 2mm |
| Dc Resistance Max | 0.78ohm |
| Rms Current (Irms) | 100mA |
| Power Inductor Case | 2mm x 1.25mm x 1.25mm |
| Inductance Tolerance | ± 20% |
| Inductor Construction | Shielded |
| Inductor Case / Package | 0805 [2012 Metric] |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2840128/)
Reference Only
Spec No. JELF243B-0017H-01 P.1/9
## **CHIP COIL (CHIP INDUCTORS) LQM21FN** □□□□ **80L REFERENCE SPECIFICATION**
## **1. Scope**
This reference specification applies to LQM21FN_80L series, Chip coil (Chip Inductors).
## **2. Part Numbering**
(ex) LQ M 21 F N 4R7 M 8 0 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L × W) and L: Taping Characteristics *B: BULK
- *B: Bulk packing also available
**3. Rating**
- Operating Temperature Range –55°C to + 125°C
- Storage Temperature Range –55°C to + 125°C
|Customer
Part Number|MURATA
Part Number|Inductance|Inductance|DC
Resistance
(Ω)|Self
Resonant
Frequency
(MHz min.)|Rated
Current
(mA)|
|---|---|---|---|---|---|---|
|||(H)|Tolerance||||
||LQM21FN4R7M80L|4.7|±20%|0.18±30%|25|120|
||LQM21FN100M80L|10||0.30±30%|15|100|
## **4. Appearance and Dimensions**
0.5±0.3 Ferrite Electrode 1.25±0.2 2.0±0.2 ■ Unit Mass (Typical value) 0.016g 1.25±0.2 (in mm) **5. Testing Conditions** 《 Unless otherwise specified 》 《 In case of doubt 》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01 P.2/9
## **6. Electrical Performance**
|No.|Item|Specification|TestMethod|
|---|---|---|---|
|6.1|Inductance|Inductance shall meet item 3.|Measuring Equipment:
KEYSIGHT4294A or equivalent(1mA)
MeasuringFrequency: 1MHz|
|6.2|DC Resistance|DC Resistance shall meet item 3.|Measuring Equipment: Digital multi meter
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
Digital multi meter
(TR6846 or equivalent)
terminal2
terminal1
SW
a
b|
|6.3|Self Resonant
Frequency (S.R.F)|S.R.F shall meet item 3.|Measuring Equipment:
KEYSIGHT4291A or equivalent|
|6.4|Rated Current|Self temperature rise shall be limited
to 25°C max.
Inductance Change: within ±50%|The rated current is applied.|
## **7. Mechanical Performance**
|No.|Item|Specification|Test Method|Test Method|Test Method|Test Method|Test Method|Test Method||
|---|---|---|---|---|---|---|---|---|---|
|7.1|Shear Test|Chip coil shall not be damaged after
tested as follows.|Applied Direction
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to
Chip Coil
Substrate|||Coil|||PCB
F|
|||||||||||
|||||||||||
|||||||||||
|||||||||||
|7.2|Bending Test||Substrate: Glass-epoxy substrate
(100mm×40mm×1.0mm)
(in mm)
Speed of Applying Force: 1mm/s
Deflection: 2mm
Hold Duration: 30s
45
R340
F
Deflection
45
Product
Pressure jig|||||||
|7.3|Vibration||Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude:1.5mm
Testing Time:
A period of 2h in each of 3 mutually
perpendicular directions.|||||||
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01 P.3/9
||||||
|---|---|---|---|---|
||No.|Item|Specification|Test Method|
||7.4|Solderability|The wetting area of the electrode
shall be at least 90% covered with
new solder coating.|Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s|
||7.5|Resistance to
Soldering Heat|Appearance: No damage
Inductance Change: within ±20%|Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.|
## **8. Environmental Performance**
It shall be soldered on the substrate.
|No.|Item|Specification|Test Method|
|---|---|---|---|
|8.1|Heat
Resistance|Appearance: No damage
Inductance Change: within ±20%
|Temperature: 125°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.|
|8.2|Humidity||Temperature: 70°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.|
|8.3|Temperature
Cycle||1 cycle:
1 step: -55°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: 125°C±2°C / 30 min to 3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 24 h±2 h.|
## **9. Specification of Packaging**
## **9.1 Appearance and Dimensions of paper tape / plastic tape**
**==> picture [338 x 155] intentionally omitted <==**
**----- Start of picture text -----**
2.0±0.05 1.45±0.05
4.0±0.1 4.0±0.1 φ1.5± 00.1 0.2±0.1
Direction of feed
1.45±0.05 (in mm)
・Dimension of the Cavity is measured at the bottom side.
1.75 ±0.1
3.5 ±0.05
2.25 ±0.1 8.0 ±0.3
**----- End of picture text -----**
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01 P.4/9
## **9.2 Specification of Taping**
- (1) Packing quantity (standard quantity)
- 3,000 pcs / reel
- (2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
- (3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
- (4) Spliced point
Plastic tape and Cover tape has no spliced point.
- (5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.
## **9.3 Pull Strength**
**==> picture [425 x 100] intentionally omitted <==**
**----- Start of picture text -----**
Plastic tape
10N min.
Cover tape
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm / min 165 to 180 degree F Cover tape
0.2N to 0.7N
Peeling off force
(minimum value is typical)
Plastic tape
**----- End of picture text -----**
## **9.4 Peeling off force of cover tape**
## **9.5 Dimensions of Leader-tape,Trailer and Reel**
There shall be leader-tape ( cover tape ) and trailer-tape (empty tape) as follows.
**==> picture [338 x 121] intentionally omitted <==**
**----- Start of picture text -----**
Trailer Leader
2.0±0.5 160 min.
Label 190 min. 210 min.
Empty tape Cover tape
13.0±0.2
60± 10
9± 10 21.0±0.8 Direction of feed
13±1.4
180± 03 (in mm)
**----- End of picture text -----**
## **9.6 Marking for reel**
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity etc ･･･
- 1) □□ OOOO (1) (2) (3)
- (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D Third, Fourth digit : Day
(3) Serial No. 2) ROHS – Y (△) (1) (2)
- (1) RoHS regulation conformity parts.
- (2) MURATA classification number
## **9.7 Marking for Outside package (corrugated paper box)**
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2) ,Quantity, etc ･･･
MURATA MFG.CO., LTD
**==> picture [473 x 142] intentionally omitted <==**
**----- Start of picture text -----**
Reference Only
ee Spec No. JELF243B-0017H-01 P.5/9 PO
9.8. Specification of Outer Case
Outer Case Dimensions
Standard Reel Quantity
Label (mm) in Outer Case (Reel)
W D H
H
186 186 93 5
—_ D —————
W Above Outer Case size is typical. It depends on a quantity of an order
**----- End of picture text -----**
## **10.** ！ **Caution**
## **Limitation of Applications**
Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
- (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
- (2) Aerospace equipment (7) Traffic signal equipment
- (3) Undersea equipment (8) Disaster prevention / crime prevention equipment
- (4) Power plant control equipment (9) Data-processing equipment
- (5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
## **11. Notice**
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
## **11.1 Land pattern designing**
|**11.1 Land pattern designing**|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**11.1 Land pattern designing**||Chip|||Coil||||LandSolder||Resist||||
|c||||||||||||a||1.2|
|||||||||||||b|3.0 to 4.0||
|||||||||||||c||1.0|
||||||a||||||||||
||||||b|||||||||(in mm)|
## **11.2 Flux, Solder**
- Use rosin-based flux.
- Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux.
- Use Sn-3.0Ag-0.5Cu solder.
- Standard thickness of solder paste: 100m to 150m.
## **11.3 Flow soldering / Reflow soldering conditions**
- Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
- Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
- Standard soldering profile and the limit soldering profile is as follows.
- The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality.
MURATA MFG.CO., LTD
Spec No. JELF243B-0017H-01 P.6/9
## Reference Only
## Soldering profile (1) Flow soldering profile
**==> picture [300 x 191] intentionally omitted <==**
**----- Start of picture text -----**
Temp.
( ℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min. Time. ( s)
Standard Profile Limit Profile
Pre-heating 150℃, 60s min.
Heating 250℃, 4s～6s 265℃±3℃, 5s
Cycle of flow 2 times 2 times
**----- End of picture text -----**
## (2) Reflow soldering profile
**==> picture [257 x 131] intentionally omitted <==**
**----- Start of picture text -----**
Temp. 260℃
( ℃)
245℃±3℃
230℃
220℃
Limit Profile
180
150
30s～60s Standard Profile
60s max.
90s±30s Time. ( s)
**----- End of picture text -----**
||StandardProfile|LimitProfile|
|---|---|---|
|Pre-heating|150°C～180°C, 90s±30s||
|Heating|above 220°C,30s～60s|above 230°C,60s max.|
|Peaktemperature|245°C±3°C|260°C,10s|
|Cycle of reflow|2times|2times|
## **11.4 Reworking with soldering iron.**
The following conditions must be strictly followed when using a soldering iron.
|Pre-heating|150°C,1 min|
|---|---|
|Tiptemperature|350°C max.|
|Solderingiron output|80W max.|
|Tipdiameter|φ3mm max.|
|Solderingtime|3(+1,-0)s|
|Time|2 times|
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock.
MURATA MFG.CO., LTD
Reference Only
Spec No. JELF243B-0017H-01 P.7/9
## **11.5 Solder Volume**
- Solder shall be used not to be exceeded the upper limits as shown below.
- Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.
**==> picture [303 x 48] intentionally omitted <==**
**----- Start of picture text -----**
Upper Limit
Recommendable
1/3T ≦ t ≦ T
t
T ： thickness of product
**----- End of picture text -----**
## **11.6 Product** ’ **s location**
The following shall be considered when designing and laying out P.C.B.'s.
- (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
- ［ Products direction ］
**==> picture [366 x 51] intentionally omitted <==**
**----- Start of picture text -----**
a
b Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
〈 Poor example 〉 〈 Good example 〉
**----- End of picture text -----**
- (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.
|Contents of Measures|Stress Level|
|---|---|
|(1) Turn the mounting direction of the component parallel to the board separation surface.|A > D*1|
|(2) Add slits in the board separation part.|A > B|
|(3) Keep the mounting position of the component away from the board separation surface.|A > C|
**==> picture [148 x 106] intentionally omitted <==**
**----- Start of picture text -----**
C
Perforation
B
D
A
Slit
**----- End of picture text -----**
- *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
- If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
- (3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
**==> picture [161 x 82] intentionally omitted <==**
**----- Start of picture text -----**
Recommended
Screw Hole
**----- End of picture text -----**
MURATA MFG.CO., LTD
~~Td~~ Reference Only Spec No. JELF243B-0017H-01 P.8/9
## **11.7 Cleaning Conditions**
Products shall be cleaned on the following conditions.
- (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
- (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
- (3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us.
## **11.8 Resin coating**
The inductance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
## **11.9 Caution for use**
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
## **11.10 Magnetic Saturation**
When the excessive current over rated current is applied the inductance value may change due to magnetism.
## **11.11 Handling of a substrate**
- After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
## **11.12 Storage and Handing Requirements**
## (1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
- (2) Storage conditions
- Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
- Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
- Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
- Products should be stored under the airtight packaged condition.
MURATA MFG.CO., LTD
## Reference Only
Spec No. JELF243B-0017H-01 P.9/9
## (3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
## **12** ． **! Note**
- (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product.
- (2) You are requested not to use our product deviating from the reference specifications.
- (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
## Links
- [View this product on Novapart](https://novapart.co/products/LQM21FN100M70L/power-inductor-smd-10-h-100-ma-shielded-lqm21f)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/murata/lqm21fn100m70l/power-inductor-10uh-0-1a-0805/dp/2840128)
---
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