# Power Inductor (SMD), 10 µH, 50 mA, Shielded, LQM18FN_00 Series, 0603 [1608 Metric]
**URL**: https://novapart.co/products/LQM18FN100M00D/power-inductor-smd-10-h-50-ma-shielded-lqm18fn_00
**SKU**: LQM18FN100M00D
**Manufacturer**: MURATA
**Category**: Passive Components || Inductors || Power Inductors || SMD Power Inductors
**Price**: €0.0950
**Stock**: 10+
## Description
Inductance:10µH; RMS Current (Irms):50mA; Inductor Construction:Shielded; Saturation Current (Isat):-; Product Range:LQM18F Series; Power Inductor Case:1.6mm x 0.8mm x 0.8mm; DC R
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (17-Dec-2015) |
| Inductance | 10µH |
| Product Range | LQM18FN_00 Series |
| Product Width | 0.8mm |
| Product Height | 0.8mm |
| Product Length | 1.6mm |
| Dc Resistance Max | 1.17ohm |
| Rms Current (Irms) | 50mA |
| Inductance Tolerance | ± 20% |
| Inductor Construction | Shielded |
| Inductor Case / Package | 0603 [1608 Metric] |
| Saturation Current (Isat) | - |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2840127RL/)
Spec No. JELF243B-0012J-01 Reference Only P.1/8
## **CHIP COIL (CHIP INDUCTORS) LQM18FN** □□□□ **00D Reference Specification**
## **1. Scope**
This reference specification applies to LQM18FN_00 series, Chip coil (Chip Inductors).
## **2. Part Numbering**
(ex) LQ M 18 F N 1R0 M 0 0 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D: Taping Characteristics *B: BULK *Bulk packing (B) also available **3. Rating**
- ・Operating Temperature Range –55°C to + 125°C
- ・Storage Temperature Range –55°C to + 125°C
|Customer
Part Number|MURATA
Part Number|Inductance|Inductance|DC
Resistance
(Ω)|Self
Resonant
Frequency
(MHz min.)|Rated
Current
(mA)|
|---|---|---|---|---|---|---|
|||(μH)|Tolerance||||
||LQM18FN1R0M00D|1.0|±20%|0.20±30%|120|150|
||LQM18FN2R2M00D|2.2||0.40±30%|80|120|
||LQM18FN4R7M00D|4.7||0.60±30%|50|80|
||LQM18FN100M00D|10||0.90±30%|30|50|
## **4. Appearance and Dimensions**
**==> picture [423 x 109] intentionally omitted <==**
**----- Start of picture text -----**
0.3±0.2 Ferrite Electrode
0.8±0.1 ■ Unit Mass (Typical value)
0.005g
1.6±0.1 0.8±0.1 (in mm)
**----- End of picture text -----**
## **5. Testing Conditions**
《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa
MURATA MFG.CO., LTD
Spec No. JELF243B-0012J-01 Reference Only P.2/8
## **6. Electrical Performance**
|No.|Item|Specification|Test Method|
|---|---|---|---|
|6.1|Inductance|Inductance shall meet item 3.|Measuring Equipment:
Agilent 4291A or equivalent(1mA)
MeasuringFrequency: 1MHz|
|6.2|DC Resistance|DC Resistance shall meet item 3.|Measuring Equipment: Digital multi meter
DC resistance shall be measured after
putting chip coil between the terminal 2
under the condition of opening between
a and b.
Every measurement the terminal 1 shall
be shorted between a and b when
changing chip coil.
Digital multi meter
(TR6846 or equivalent)
terminal2
terminal1
SW
a
b|
|6.3|Self Resonant
Frequency (S.R.F)|S.R.F shall meet item 3.|Measuring Equipment:
Agilent 4291A or equivalent(1mA)|
|6.4|Rated Current|Self temperature rise shall be limited
to 25°C max.
Inductance Change: within ±50%|The rated current is applied.|
## **7. Mechanical Performance**
|No.|Item|Specification|Test Method|Test Method|Test Method|Test Method|Test Method|Test Method||
|---|---|---|---|---|---|---|---|---|---|
|7.1|Shear Test|Chip coil shall not be damaged after
tested as follows.|Applied Direction
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
F
Chip Coil
Substrate|||Coil||||
|||||||||||
|||||||||||
|||||||||||
|||||||||||
|7.2|Bending Test||Substrate: Glass-epoxy substrate
(100mm×40mm×1.6mm)
(in mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30s
45
R340
F
Deflection
45
Product
Pressure jig|||||||
|7.3|Vibration||Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude: 1.5mm
Testing Time:
A period of 2h in each of 3 mutually
perpendicular directions.|||||||
MURATA MFG.CO., LTD
## Spec No. JELF243B-0012J-01 Reference Only P.3/8
|No.|Item|Specification|Test Method|
|---|---|---|---|
|7.4|Solderability|The wetting area of the electrode
shall be at least 90% covered with
new solder coating.|Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s|
|7.5|Resistance to
Soldering Heat|Appearance: No damage
Inductance Change: within ±20%|Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.|
## **8. Environmental Performance**
It shall be soldered on the substrate.
|No.|Item|Specification|Test Method|
|---|---|---|---|
|8.1|Heat Resistance|Appearance: No damage
Inductance Change: within ±20%|Temperature: 125°C±2°C
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.|
|8.2|Humidity||Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 48h±2h.|
|8.3|Temperature
Cycle|Appearance: No damage
Inductance Change: within ±30%|1 cycle:
1 step: -55°C±2°C / 30 min±3 min
2 step: Ordinary temp. / 10 min to 15 min
3 step: +125°C±2°C / 30 min±3 min
4 step: Ordinary temp. / 10 min to15 min
Total of 10 cycles
Then measured after exposure in the room
condition for 48h±2h.|
## **9. Specification of Packaging**
## **9.1 Appearance and Dimensions of paper tape** (8mm-wide)
**==> picture [325 x 144] intentionally omitted <==**
**----- Start of picture text -----**
2.0±0.05
4.0±0.1 4.0±0.1 φ1.5± 0.10
Direction of feed
1.05±0.1 1.1max
(in mm)
1.75±0.1
3.5±0.05
8.0±0.3
1.85±0.1
**----- End of picture text -----**
MURATA MFG.CO., LTD
## Spec No. JELF243B-0012J-01 Reference Only P.4/8
## **9.2 Specification of Taping**
- (1) Packing quantity (standard quantity) 4,000 pcs. / reel
- (2) Packing Method
- Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
- (3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
- (4) Spliced point
Base tape and Top tape has no spliced point.
- (5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept.
## **9.3 Pull Strength**
Top tape 5N min. Bottom tape
## **9.4 Peeling off force of top tape**
|**ling off force of top tape**||
|---|---|
||300mm/ min
0.1 to 0.6N
(minimum value is typical)
F
165 to 180 degree
Top tape
Bottom tape
Base tape|
|Speed of Peelingoff|300mm/ min|
|Peeling off force|0.1 to 0.6N
(minimum value is typical)|
## **9.5 Dimensions of Leader-tape, Trailer and Reel**
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
**==> picture [362 x 137] intentionally omitted <==**
**----- Start of picture text -----**
Trailer
160 min. Leader
2.0±0.5
Label
190 min. 210 min.
Empty tape Top tape
13.0±0.2
60 +1 - 0
Direction of feed
21.0±0.8
9.0 +1-0
13.0±1.4
180 +0-3 (in mm)
**----- End of picture text -----**
## **9.6 Marking for reel**
Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity etc ･･･
- 1) □□ OOOO (1) (2) (3)
- (1) Factory Code (2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D Third, Fourth digit : Day
- (3) Serial No.
- 2) ROHS – Y (△) (1) (2)
- (1) RoHS regulation conformity parts.
- (2) MURATA classification number
## **9.7 Marking for Outside package (corrugated paper box)**
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2), Quantity, etc ･･･
MURATA MFG.CO., LTD
Spec No. JELF243B-0012J-01 Reference Only P.5/8
## **9.8. Specification of Outer Case**
|||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||Label|Outer Case Dimensions
(mm)
W
D
H|||Standard Reel Quantity
in Outer Case (Reel)|
|H||||||||186
186||93|5|
||||||D|||||||
|||W||||Above Outer Case size is typical.||||It depends on a quantity of an order.||
## **10.** ！ **Caution**
## **Limitation of Applications**
Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
- (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
- (2) Aerospace equipment (7) Traffic signal equipment
- (3) Undersea equipment (8) Disaster prevention / crime prevention equipment
- (4) Power plant control equipment (9) Data-processing equipment
- (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above
## **11. Notice**
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
## **11.1 Land pattern designing**
||Chip|Chip|Chip|Chip|Chip|Coil|Coil|LandSolder Resist|LandSolder Resist|LandSolder Resist|LandSolder Resist||||c
0.7
(in mm)|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||c||||||||||o|Soldering|a|b|c|
|||||||||||||Flow|0.7|2.2 to 2.6|0.7|
|||||||||||||||||
|||||||a||||||Refｌow||1.8 to 2.0||
|||||||||||||||||
|||||||||||||||||
|||||||b||||||||||
## **11.2 Flux, Solder**
・Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux.
- ・Use Sn-3.0Ag-0.5Cu solder.
- ・Standard thickness of solder paste: 100μm to 150μm.
## **11.3 Flow soldering / Reflow soldering conditions**
- ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
- Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
- ・Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality.
MURATA MFG.CO., LTD
Spec No. JELF243B-0012J-01 Reference Only P.6/8
Soldering profile
- (1) Flow soldering profile
**==> picture [300 x 178] intentionally omitted <==**
**----- Start of picture text -----**
Temp.
( ℃)
265℃±3℃
250℃
Limit Profile
150
Heating Time
Standard Profile
60s min. Time. ( s)
Standard Profile Limit Profile
Pre-heating 150℃, 60s min.
Heating 250℃, 4s～6s 265℃±3℃, 5s
Cycle of flow 2 times 2 times
**----- End of picture text -----**
## (2) Reflow soldering profile
**==> picture [306 x 189] intentionally omitted <==**
**----- Start of picture text -----**
Temp. 260℃
( ℃)
245℃±3℃
230℃
220℃
Limit Profile
180
150
30s～60s Standard Profile
60s max.
90s±30s Time. ( s)
Standard Profile Limit Profile
Pre-heating 150°C～180°C, 90s±30s
Heating above 220°C, 30s～60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
**----- End of picture text -----**
## **11.4 Reworking with soldering iron**
The following conditions must be strictly followed when using a soldering iron.
|Pre-heating|150°C,1 min|
|---|---|
|Tiptemperature|350°C max.|
|Solderingiron output|80W max.|
|Tipdiameter|φ3mm max.|
|Solderingtime|3(+1,-0)s|
|Time|2 times|
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock.
## **11.5 Solder Volume**
- ・Solder shall be used not to be exceeded the upper limits as shown below.
- ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.
**==> picture [298 x 40] intentionally omitted <==**
**----- Start of picture text -----**
Upper Limit
Recommendable 1/3T≦t≦T
t T： thickness of product
**----- End of picture text -----**
MURATA MFG.CO., LTD
Spec No. JELF243B-0012J-01 Reference Only P.7/8
## **11.6 Product’s location**
The following shall be considered when designing and laying out P.C.B.'s.
- (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
- ［Products direction］
**==> picture [169 x 51] intentionally omitted <==**
**----- Start of picture text -----**
a
b
〈 Poor example 〉 〈 Good example 〉
**----- End of picture text -----**
Products shall be located in the sideways direction (Length: a‹b) to the mechanical stress.
- (2) Products location on P.C.B. separation
**==> picture [140 x 59] intentionally omitted <==**
**----- Start of picture text -----**
C
Seam B
D
b A
Slit Length:a‹b
a
**----- End of picture text -----**
Products (A, B, C, D) shall be located carefully so that products are not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order of ACB D.
## **11.7 Cleaning Conditions**
Products shall be cleaned on the following conditions.
- (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA)
- (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
- (3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
- (4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
- (5) Other cleaning Please contact us.
## **11.8 Resin coating**
Inductance value may be changed due to the large cure-stress of the resin when products are coated with resin. In this case, take care when you select resin to prevent the deterioration of the product quality.
## **11.9 Caution for use**
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.)
## **11.10 Magnetic Saturation**
When the excessive current over rated current is applied, the inductance value may change due to magnetism.
MURATA MFG.CO., LTD
## ~~ee~~ Spec No. JELF243B-0012J-01 Reference Only P.8/8
## **11.11 Handling of a substrate**
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
## **11.12 Storage and Handing Requirements**
- (1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
## (2) Storage conditions
- ・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
- ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
- ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
- ・Products should be stored under the airtight packaged condition.
## (3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
## **12** ． A **! Note**
- (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product.
- (2) You are requested not to use our product deviating from the reference specifications.
- (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.
MURATA MFG.CO., LTD
## Links
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- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/murata/lqm18fn100m00d/power-inductor-10uh-0-05a-0603/dp/2840127RL)
---
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