# MEMS Accelerometer, ± 2g, ± 4g, ± 8g, ± 16g, X, Y, Z, I2C, MIPI I3C, SPI, LGA, 12 Pins

![Product image](https://novapart.co/image/farnell:3764228/)

**URL**: https://novapart.co/products/LIS2DU12TR/mems-accelerometer-2g-4g-8g-16g-x-y-z-i2c-mipi-i3c
**SKU**: LIS2DU12TR
**Manufacturer**: STMICROELECTRONICS
**Category**: Semiconductors - ICs || IC Sensors || MEMS Accelerometers
**Price**: €1.2200
**Stock**: 1000+
**Lead Time**: 127 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 12Pins |
| Sensing Axis | X, Y, Z |
| Product Range | - |
| Qualification | - |
| Sensitivity Typ | - |
| Output Interface | I2C, MIPI I3C, SPI |
| Sensor Case Style | LGA |
| Mems Sensor Output | Digital |
| Supply Voltage Max | 3.6V |
| Supply Voltage Min | 1.62V |
| Sensor Case / Package | LGA |
| Operating Temperature Max | 85°C |
| Operating Temperature Min | -40°C |
| Sensing Range - Accelerometer | ± 2g, ± 4g, ± 8g, ± 16g |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3764228/)

**LIS2DU12** 

Data brief 

MEMS digital output motion sensor: advanced ultra-low-power 3-axis accelerometer 

## **Features** 

- Supply voltage range from 1.62 to 3.6 V with independent IO supply 

- Ultra-low power consumption 

   - 

      - Normal mode with anti-alias filter: 5.9 µA 

   - Ultra-low-power mode: 0.45 µA 

   - One-shot mode: 0.2 µA 

   - Power-down: 0.02 µA 

- Low noise down to 160 µg/√Hz 

- ±2 _g_ /±4 _g_ /±8 _g_ /±16 _g_ full scales 

- ODR from 1.6 Hz to 800 Hz 

- Embedded temperature sensor 

- Embedded FIFO: up to 512 samples of accelerometer and temperature data in high resolution or up to 768 samples of acceleration data at low resolution 

- High-speed I²C/SPI/MIPI I3C[SM] digital output interface 

- Embedded digital functions (free-fall, wake-up, single/double-tap recognition, activity/inactivity, 6D/4D orientation) 

- Self-test 

- Small package: 2.0 x 2.0 x 0.74 (max) mm LGA 12-lead 

- 10000 _g_ high shock survivability 

- ECOPACK, RoHS and “Green” compliant 

|**Product status link**<br>~~_~~|**Product status link**<br>~~_~~|
|---|---|
|LIS2DU12||
|**Product summary**<br>~~Jo~~||
|**Order code**<br>LIS2DU12TR||
|**Temp. range [°C]**<br>-40 to +85||
|**Package**<br>LGA-12||
|**Packing**<br>Tape and reel||
|**Product resources**<br>~~——~~||
|TN0018(Design and soldering)||



## **Applications** 

- Motion detection for wearables 

- Gesture recognition and gaming 

- Motion-activated functions and user interfaces 

- Display orientation 

- Tap/double-tap recognition 

- Free-fall detection 

- Smart power saving for handheld devices 

- Hearing aids and portable healthcare devices 

- Wireless sensor nodes 

- Motion-enabled metering devices 

## **Description** 

The LIS2DU12 is an ultra-low-power three-axis linear accelerometer embedding advanced digital functions. 

The LIS2DU12 has user-selectable full scales of ±2 _g_ /±4 _g_ /±8 _g_ /±16 _g_ and is capable of measuring accelerations with output data rates from 1.6 Hz to 800 Hz. 

The LIS2DU12 has an integrated 128-level FIFO buffer allowing to store a wide range of data, reducing system power consumption. 

The embedded self-test capability allows the user to check that the sensor works in the final application. 

**DB4522** - **Rev 1** - **June 2021** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**LIS2DU12** 

The LIS2DU12 has a dedicated internal engine to process motion and acceleration detection including free-fall, wake-up, single/double-tap recognition, activity/inactivity, and 6D/4D orientation. 

The LIS2DU12 is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40°C to + 85 °C. 

**DB4522** - **Rev 1** 

**page 2/13** 

**LIS2DU12 Block diagram and pin description** 

## **1 Block diagram and pin description** 

## **1.1 Block diagram** 

**Figure 1. Block diagram** 

**==> picture [377 x 194] intentionally omitted <==**

**----- Start of picture text -----**<br>
CHARGE<br>AMPLIFIER<br>X+<br>X AAF<br>X-<br>Y+ I C2 CSSCL/SPC<br>a Y- Y AAF CONVERTERA/D CONTROL LOGIC SPI SDA/SDO/SDI<br>MIPI I3C [SM] SDO/SA0<br>Z+<br>Z- Z AAF<br>TEMPERATURE SENSOR<br>SELF TEST  REFERENCE TRIMMINGCIRCUITS CLOCK 128 LevelFIFO  INTERRUPT GEN.CONTROL LOGIC& INT1INT2<br>**----- End of picture text -----**<br>


**DB4522** - **Rev 1** 

**page 3/13** 

**LIS2DU12 Pin description** 

## **1.2 Pin description** 

**Figure 2. Pin connections** 

||||
|---|---|---|
|1<br>9<br>8<br>7<br>2<br>3<br>4<br>6<br>5<br>11<br>12<br>10<br>GND<br>RES<br>SCL/SPC<br>CS<br>SDO/SA0<br>SDA/SDI/SDO<br>NC<br>INT2<br>INT1<br>(TOPVIEW)<br>DIRECTION OF THE<br>DETECTABLE<br>ACCELERATIONS<br>Y<br>1<br>X<br>Z<br>Vdd<br>(BOTTOM VIEW)<br>GND<br>Vdd_IO<br>**Table 1.Pin description**|||
|**Pin#**|**Name**|**Function**|
|1|SCL<br>SPC|I²C/MIPI I3CSMserial clock (SCL)<br>SPI serial port clock (SPC)|
|2(1)|CS|SPI/I²C/MIPI I3CSMmode selection<br>(1: SPI idle mode / I²C/MIPI I3CSMenabled;<br>0: SPI enabled / I²C/MIPI I3CSMdisabled)|
|3(1)|SDO<br>SA0|SPI serial data output (SDO)<br>I²C less significant bit of the device address (SA0)|
|4|SDA<br>SDI<br>SDO|I²C/MIPI I3CSMserial data (SDA)<br>SPI serial data input (SDI)<br>3-wire interface serial data output (SDO)|
|5|NC|Internally not connected. Can be tied to Vdd, Vdd_IO, or GND.|
|6|GND|0 V supply|
|7|RES|Connect to GND|
|8|GND|0 V supply|
|9|Vdd|Power supply|
|10|Vdd_IO|Power supply for I/O pins|
|11(2)|INT2|Interrupt pin 2. Clock input when selected in single data conversion on demand.|
|12(2)|INT1|Interrupt pin 1|



_1. CS and SDO/SA0 pins are internally pulled up. The pull-up of the CS pin can be disconnected by setting bit 2 of register IF_PU_CTRL (0Ch) to ‘1’. The pull-up of the SDO pin can be disconnected by setting bit 7 of register IF_PU_CTRL (0Ch) to ‘1’._ 

_2. The INT1 and INT2 pins are internally pulled down. The internal pull-down of the INT1 pin can be disconnected by setting the PD_DIS_INT1 bit in IF_CTRL (0Eh) to ‘1’. The internal pull-down of the INT2 pin can be disconnected by setting the PD_DIS_INT2 bit in MD2_CFG (20h) to ‘1’._ 

**DB4522** - **Rev 1** 

**page 4/13** 

**LIS2DU12 Mechanical and electrical specifications** 

## **2 Mechanical and electrical specifications** 

## **2.1 Mechanical characteristics** 

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted. 

The product is factory calibrated at 1.8 V. The operational power supply range is from 1.62 V to 3.6 V. 

**Table 2. Mechanical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.(1)**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|FS|Measurement range|||±2||_g_|
|||||±4|||
|||||±8|||
|||||±16|||
|So|Sensitivity|@ FS ±2_g_||0.976||m_g_/digit|
|||@ FS ±4_g_||1.952|||
|||@ FS ±8_g_||3.904|||
|||@ FS ±16_g_||7.808|||
|An|Noise density - normal mode|@ FS ±8_g_<br>ODR = 800 Hz, BW = ODR/2||280||µ_g_/√Hz|
|TyOff|Zero-_g_level offset accuracy(2)|||±30||m_g_|
|TCO|Zero-_g_offset change vs. temperature|||±1||m_g_/°C|
|TCS|Sensitivity change vs. temperature|||±0.035||%/°C|
|ST|Self-test positive difference|X-axis||320||m_g_|
|||Y-axis||320|||
|||Z-axis||420|||



_1. Typical specifications are not guaranteed._ 

_2. Values after factory calibration test and trimming._ 

**DB4522** - **Rev 1** 

**page 5/13** 

**LIS2DU12 Electrical characteristics** 

## **2.2 Electrical characteristics** 

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted. 

The product is factory calibrated at 1.8 V. The operational power supply range is from 1.62 V to 3.6 V. 

**Table 3. Electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ(1)**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|Vdd|Supply voltage||1.62|1.8|3.6|V|
|Vdd_IO|I/O pins supply voltage(2)||1.62||Vdd + 0.1|V|
|IddNM|Current consumption in normal mode|FS = ±8_g_<br>ODR = 800 Hz,<br>BW = ODR/2 with anti-alias filter||5.9||µA|
|IddULP|Current consumption in ultra-low-<br>power mode|FS = ±8_g_<br>ODR = 1.6 Hz,<br>BW = ODR/2||0.45||µA|
|Idd_PD|Current consumption in power-down|||20||nA|
|VIH|Digital high-level input voltage||0.7*Vdd_IO|||V|
|VIL|Digital low-level input voltage||||0.3*Vdd_IO|V|
|VOH|Digital high-level output voltage|IOH= 4 mA(3)|Vdd_IO - 0.2 V||||
|VOL|Digital low-level output voltage|IOL= 4 mA(3)|||0.2 V||



_1. Typical specifications are not guaranteed._ 

_2. It is possible to remove Vdd, maintaining Vdd_IO without blocking the communication busses. In this condition the measurement chain is powered off._ 

_3. 4 mA is the maximum driving capability, ie. the maximum DC current that can be sourced/sunk by the digital pin in order to guarantee the correct digital output voltage levels VOH and VOL._ 

## **2.3 Temperature sensor characteristics** 

@ Vdd = 1.8 V, T = 25 °C unless otherwise noted. 

**Table 4. Temperature sensor characteristics** 

|**Symbol**|**Parameter**|**Min.**|**Typ.(1)**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|Top|Operating temperature range|-40||+85|°C|
|Toff|Temperature offset(2)|-15||+15|°C|
|TSDr|Temperature sensor output change vs. temperature||0.045(3)||°C/LSB|
|TODR|Temperature refresh rate||ODR||Hz|



_1. Typical specifications are not guaranteed._ 

_2. The output of the temperature sensor is 0 LSB (typ.) at 25 °C._ 

_3. 12-bit resolution._ 

**DB4522** - **Rev 1** 

**page 6/13** 

**LIS2DU12** 

**Communication interface characteristics** 

## **2.4 Communication interface characteristics** 

## **2.4.1 SPI - serial peripheral interface** 

Subject to general operating conditions for Vdd and Top. 

**Table 5. SPI slave timing values** 

|**Smbol**|**Parameter**|**Value(1)**|**Value(1)**|**Unit**|
|---|---|---|---|---|
|**y**||**Min**|**Max**||
|tc(SPC)|SPI clock cycle|100||ns|
|fc(SPC)|SPI clock frequency||10|MHz|
|tsu(CS)|CS setup time|6||ns|
|th(CS)|CS hold time|40|||
|tsu(SI)|SDI input setup time|12|||
|th(SI)|SDI input hold time|15|||
|tv(SO)|SDO valid output time||50||
|th(SO)|SDO output hold time|9|||
|tdis(SO)|SDO output disable time||50||



_1. 10 MHz clock frequency for SPI with both 4 and 3 wires, based on characterization results, not tested in production._ 

**Figure 3. SPI slave timing diagram** 

**==> picture [385 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
CS<br>tsu(CS) tc(SPC) th(CS)<br>SPC<br>tsu(SI) th(SI)<br>SDI MSB IN  LSB IN<br>tv(SO) th(SO) tdis(SO)<br>SDO MSB OUT  LSB OUT<br>**----- End of picture text -----**<br>


_Note: Measurement points are done at 0.3·Vdd_IO and 0.7·Vdd_IO for both input and output ports._ 

**DB4522** - **Rev 1** 

**page 7/13** 

**LIS2DU12** 

**Communication interface characteristics** 

## **2.4.2 I²C - inter-IC control interface** 

Subject to general operating conditions for Vdd and Top. 

**Table 6. I²C slave timing values** 

|**Smbol**|**Parameter**|**I²C standard mode(1)**|**I²C standard mode(1)**|**I²C fast mode(1)**|**I²C fast mode(1)**|**Unit**|
|---|---|---|---|---|---|---|
|**y**||**Min**|**Max**|**Min**|**Max**||
|f(SCL)|SCL clock frequency|0|100|0|400|kHz|
|tw(SCLL)|SCL clock low time|4.7||1.3||µs|
|tw(SCLH)|SCL clock high time|4.0||0.6|||
|tsu(SDA)|SDA setup time|250||100||ns|
|th(SDA)|SDA data hold time|0.01|3.45|0.01|0.9|µs|
|th(ST)|START condition hold time|4||0.6||µs|
|tsu(SR)|Repeated START condition setup time|4.7||0.6|||
|tsu(SP)|STOP condition setup time|4||0.6|||
|tw(SP:SR)|Bus free time between STOP and START condition|4.7||1.3|||



_1. Data based on standard I²C protocol requirement, not tested in production._ 

## **Figure 4. I²C slave timing diagram** 

**==> picture [391 x 150] intentionally omitted <==**

**----- Start of picture text -----**<br>
REPEATED<br>START<br>START<br>tsu(SR)<br>SDA tw(SP:SR) START<br>tsu(SDA) th(SDA)<br>tsu(SP) STOP<br>SCL<br>th(ST) tw(SCLL) tw(SCLH)<br>**----- End of picture text -----**<br>


_Note: Measurement points are done at 0.3·Vdd_IO and 0.7·Vdd_IO for both ports._ 

**DB4522** - **Rev 1** 

**page 8/13** 

**LIS2DU12 Absolute maximum ratings** 

## **2.5 Absolute maximum ratings** 

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 

**Table 7. Absolute maximum ratings** 

|**Symbol**<br>~~a~~|**Ratings**<br>~~a~~|**Maximum value**<br>~~a~~<br>~~ee~~|**Unit**<br>~~a~~|
|---|---|---|---|
|Vdd|Supply voltage|-0.3 to 4.3<br>~~ee~~|V|
|Vdd_IO|I/O pins supply voltage|-0.3 to 4.3|V|
|Vin|Input voltage on any control pin<br>(CS, SCL/SPC, SDA/SDI/SDO, SDO/SA0)|-0.3 to Vdd_IO +0.3|V|
|APOW|Acceleration (any axis, powered, Vdd = 1.8 V)|3000_g_for 0.5 ms|_g_|
|||10000_g_for 0.2 ms|_g_|
|AUNP|Acceleration (any axis, unpowered)|3000_g_for 0.5 ms|_g_|
|||10000_g_for 0.2 ms|_g_|
|TOP|Operating temperature range|-40 to +85|°C|
|TSTG|Storage temperature range|-40 to +125|°C|
|ESD|Electrostatic discharge protection|2 (HBM)|kV|



_Note:_ 

_Supply voltage on any pin should never exceed 4.3 V._ 

This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. 

This device is sensitive to electrostatic discharge (ESD), improper handling can cause permanent damage to the part. 

**DB4522** - **Rev 1** 

**page 9/13** 

**LIS2DU12 Package information** 

## **3 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **3.1** 

## **Soldering information** 

The LGA package is compliant with the ECOPACK, RoHS and “Green” standard. 

It is qualified for soldering heat resistance according to JEDEC J-STD-020. 

For the land pattern and soldering recommendations, please consult technical note TN0018 available on www.st.com. 

## **3.2 LGA-12 package information** 

**Figure 5. LGA-12 2.0 x 2.0 x 0.74 mm package outline and mechanical data** 

**==> picture [119 x 108] intentionally omitted <==**

**==> picture [112 x 114] intentionally omitted <==**

Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.15mm unless otherwise specified 

## OUTER DIMENSIONS 

|**ITEM**|**DIMENSION [mm]**<br>**T**|**OLERANCE [mm]**|
|---|---|---|
|]<br>L<br>[<br>h<br>t<br>g<br>n<br>e<br>L|2|1<br>.<br>0<br>±<br>1<br>.<br>0<br>±<br> /|
|]<br>W<br>[<br>h<br>t<br>di<br>W|2||
|]<br>H<br>[ t<br>h<br>gie<br>H|X<br>A<br>M<br>74<br>.<br>0||



**==> picture [43 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
DM00170568<br>**----- End of picture text -----**<br>


**DB4522** - **Rev 1** 

**page 10/13** 

**LIS2DU12** 

## **Revision history** 

**Table 8. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|28-Jun-2021|1|Initial release|



**DB4522** - **Rev 1** 

**page 11/13** 

**LIS2DU12 Contents** 

|**Contents**|**Contents**||
|---|---|---|
|**1**|**Block**|**diagram and pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
||**1.1**|Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
||**1.2**|Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|**2**|**Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5**||
||**2.1**|Mechanical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
||**2.2**|Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
||**2.3**|Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
||**2.4**|Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|||**2.4.1**<br>SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|||**2.4.2**<br>I²C - inter-IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
||**2.5**|Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**3**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10**||
||**3.1**|Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10|
||**3.2**|LGA-12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**|||
|**Contents .**||**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12**|



**DB4522** - **Rev 1** 

**page 12/13** 

**LIS2DU12** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2021 STMicroelectronics – All rights reserved 

**DB4522** - **Rev 1** 

**page 13/13** 



## Links

- [View this product on Novapart](https://novapart.co/products/LIS2DU12TR/mems-accelerometer-2g-4g-8g-16g-x-y-z-i2c-mipi-i3c)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/stmicroelectronics/lis2du12tr/mems-accelerometers-xz-axis-lga/dp/3764228)
---

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