# MOSFET Relay, SPST-NO (1 Form A), AC / DC, 60 V, 1 A, SMD-6, Surface Mount

![Product image](https://novapart.co/image/farnell:3995919/)

**URL**: https://novapart.co/products/LCA710STR/mosfet-relay-spst-no-1-form-a-ac-dc-60-v-smd-6
**SKU**: LCA710STR
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €2.9300
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A) |
| Load Current | 1A |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 3.75kV |
| I/O Capacitance Typ | 3pF |
| On State Resistance Max | 0.5ohm |
| Mosfet Relay Package Style | SMD-6 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995919/)

> I OLXYS NTEGRATED CIRCUITS DIVISION 

**LCA710 60V, 1A Single-Pole Normally Open Relay** 

**Parameter Rating Units** Blocking Voltage 60 VP Load Current 1 Arms / ADC ~~=—=~~ On-Resistance (max) 0.5  

## **Description** 

The LCA710 is a 60V, 1A, 0.5  , normally open (1-Form-A) solid state relay featuring low on-resistance and high current handling capability. It uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. 

## **Features** 

- Low On-Resistance: 0.5  

- High Current Handling Capability: 1A 

- 3750Vrms Input/Output Isolation 

Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 

- Low Drive Power Requirements 

- Greater Reliability than Electromechanical Relays 

- No EMI/RFI Generation 

- Small 6-Pin Packages 

- Flammability Rating UL 94 V-0 

- Surface Mount and Tape & Reel Versions Available 

## **Applications** 

- Instrumentation 

- Multiplexers 

The LCA710 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it can offer faster, bounce-free switching in a more compact surface mount or thru-hole package. 

## **Approvals** 

   - UL Recognized Component: File E76270 

   - CSA Certified Component: Certificate 1175739 

   - TUV EN 62368-1: Certificate # B 082667 0008 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Security 

- Industrial Controls 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|LCA710|6-Pin DIP(50/Tube)|
|LCA710R|6-Pin Lo-Profile Surface Mount(50/Tube)|
|LCA710RTR|6-Pin Lo-Profile Surface Mount(1000/Reel)|
|LCA710S|6-Pin Surface Mount(50/Tube)|
|LCA710STR|6-Pin Surface Mount(1000/Reel)|



## **Pin Configuration** 

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**----- Start of picture text -----**<br>
AC/DC Configuration<br>1  6<br>+ Control  Load<br>2  5<br>– Control  Do Not Use<br>3  4<br>Do Not Use  Load<br>**----- End of picture text -----**<br>


**==> picture [131 x 50] intentionally omitted <==**

**----- Start of picture text -----**<br>
DC Only Configuration<br>1  6<br>+ Control  + Load<br>2  5<br>– Control  – Load<br>3  4<br>Do Not Use<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally Open Devices** 

**==> picture [101 x 66] intentionally omitted <==**

**----- Start of picture text -----**<br>
Form-A<br>IF JL<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-LCA710-R11 

**www.ixysic.com** 

**LCA710** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak(10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|Operational Temperature, Ambient|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate output power linearly 6.67 mW / ºC 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Blocking Voltage<br>~~a=~~|IL=1A<br>~~a=~~|VDRM<br>~~a=~~|60<br>~~a=~~|-<br>~~a=~~|-<br>~~a=~~|VP<br>~~a=~~|
|Load Current<br>Continuous, AC/DC Configuration<br>Continuous, DC Configuration<br>Peak<br>~~a=~~<br>~~i~~|-<br>~~a=~~|IL<br>~~a=~~|-<br>~~a=~~|-<br>~~a=~~|1<br>~~a=~~|Arms/ ADC<br>~~a=~~|
||||||1.8<br>~~a=~~|ADC<br>~~a=~~|
||t<10ms<br>~~a=~~<br>~~eee~~|ILPK<br>~~a=~~<br>~~eee~~|-<br>~~a=~~<br>~~eee~~|-<br>~~a=~~<br>~~eee~~|±5<br>~~a=~~<br>~~eee~~|AP<br>~~a=~~<br>~~eee~~|
|On-Resistance1<br>AC/DC Configuration<br>DC Configuration<br>~~a=~~<br>~~i~~|IL=1A<br>~~a=~~<br>~~eee~~|RON<br>~~a=~~<br>~~eee~~<br>~~ee~~|-<br>~~a=~~<br>~~eee~~|0.3<br>~~a=~~<br>~~eee~~|0.5<br>~~a=~~<br>~~eee~~|<br>~~a=~~<br>~~eee~~|
||IL=1.8A<br>~~eee~~<br>~~ee~~||-<br>~~eee~~|0.1<br>~~eee~~|0.15<br>~~eee~~||
|Off-State Leakage Current<br>~~i~~<br>~~es~~|VL=60VP<br>~~eee~~<br>~~es~~<br>~~ee~~|ILEAK<br>~~eee~~<br>~~es~~<br>~~ee~~|-<br>~~eee~~<br>~~es~~|-<br>~~eee~~<br>~~es~~|1<br>~~eee~~<br>~~es~~|A<br>~~eee~~<br>~~es~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~es~~|IF=10mA, VL=10V<br>~~es~~<br>~~ee~~|ton<br>~~es~~<br>~~ee~~|-<br>~~es~~|-<br>~~es~~|2.5<br>~~es~~|ms<br>~~es~~|
|||toff<br>~~es~~<br>~~ee~~|-<br>~~es~~|-<br>~~es~~|0.25<br>~~es~~||
|Output Capacitance<br>~~es~~|IF=0mA, VL=0V, f=1MHz<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|-<br>~~es~~|105<br>~~es~~|-<br>~~es~~|pF<br>~~es~~|
|**Input Characteristics**<br>~~es~~<br>~~ee~~|||||||
|Input Control Current to Activate|IL=1A|IF|-|-|10|mA|
|Input Control Current to Deactivate|-|IF|0.4|0.7|-|mA|
|Input Voltage Drop|IF=10mA|VF|0.9|1.42|1.56|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics**|||||||
|Input to Output Capacitance|VIO=0V, f=1MHz|CIO|-|3|-|pF|



1 Measurement taken within one second of on-time. 

R11 

**www.ixysic.com** 

**2** 

nail INTEGRATED CIRCUITS DIVISION **LCA710** ~~ee~~ 

## **PERFORMANCE DATA*** 

**==> picture [144 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time<br>(N=50, IF=10mA, IL=1ADC)F=10mA, IL=1ADC)=10mA, IL=1ADC)L=1ADC)=1ADC)DC))<br>25<br>20 FL TtL Tt Tt<br>15<br>10<br>; | lo<br>5 wiltilt<br>0 m iiil tl<br>0.24 0.27 0.30 0.33 0.36 0.39<br>Turn-On Time (ms)<br>Device Count (N)<br>**----- End of picture text -----**<br>


**==> picture [146 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-Off Time<br>(N=50, IF=10mA, IL=1ADC)F=10mA, IL=1ADC)=10mA, IL=1ADC)L=1ADC)=1ADC)DC))<br>25<br>20 FLL ll |<br>15<br>10<br>7 fae<br>5 |<br>0 mili<br>0.078 0.083 0.088 0.093 0.098 0.103<br>Turn-Off Time (ms)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=10mA) (N=50, IF=10mA, IL=1ADC)F=10mA, IL=1ADC)=10mA, IL=1ADC)L=1ADC)=1ADC)DC)) (N=50, IF=10mA, IL=1ADC)F=10mA, IL=1ADC)=10mA, IL=1ADC)L=1ADC)=1ADC)DC))<br>30 25 25<br>25 pT et 20 FL TtL Tt Tt 20 FLL ll |<br>20<br>15 15<br>15<br>10 10<br>10 iif ; | lo 7 fae<br>5 S|. Iai 5 wiltilt 5 |<br>0 _ outlUdll 0 m iiil tl 0 mili<br>1.416 1.418 1.420 1.422 1.424 0.24 0.27 0.30 0.33 0.36 0.39 0.078 0.083 0.088 0.093 0.098 0.103<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution<br>(N=50, IL=1ADC) (N=50, IL=1ADC) (N=50, IF=10mA, IL=1ADC)<br>25 25 35<br>30<br>20 FT TE TT 20 F fet | ff pt f fT ft yt<br>25<br>15 Tel ele) 15 Poorer) 20 hE<br>10 10 15<br>10<br>5 5<br>0 mmiiil =e lt 0 |milaia il & 50 = in | =<br>0.90 0.95 1.00 1.05 1.10 1.15 0.90 0.95 1.00 1.05 1.10 1.15 0.215 0.197 0.199 0.201 0.203 0.205<br>LED Current (mA) LED Current (mA) On-Resistance ( )<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


**Typical Blocking Voltage Distribution (N=50)** 

**==> picture [142 x 108] intentionally omitted <==**

**----- Start of picture text -----**<br>
35<br>30<br>25 Ee oT | UT<br>2015105 reremaeeelleieieie<br>0 [ | hii<br>72 74 76 78 80 82<br>Blocking Voltage (VP)<br>Device Count (N)<br>**----- End of picture text -----**<br>


**Typical Turn-On Time vs. LED Forward Current (IL=1ADC)L=1ADC)=1ADC)DC))** 

**==> picture [493 x 134] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>vs. Temperature (IL=1ADC)L=1ADC)=1ADC)DC)) (IL=1ADC)<br>1.8 2.0 0.09<br>1.7 ee ee eee 1.8 EF | | tT ft tT et 0.08 Fo| [[Deere]<br>1.6 0.07<br>1.6<br>1.5 IIFF=10mA=5mA 1.41.2 0.060.05<br>1.4 ~Ses I F =2mA 1.0 Veena 0.04 POOP Peer<br>1.3 ESSSS 0.80.6 AfESSEpoe tt dT | 0.03 [A<br>1.2 0.4 0.02<br>1.1 REESE 0.2 AEEEERRER 0.01 AEE<br>1.0 S unn vel 00 ve 0 REE eee 0 PEREE E E E<br>-50 -25 0 25 50 75 100 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Temperature (ºC) Forward Current (mA) LED Forward Current (mA)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R11 

**3** 

all INTEGRATED CIRCUITS DIVISION **LCA710** ~~a~~ 

## **PERFORMANCE DATA*** 

**==> picture [528 x 429] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time Typical IF for Switch Operation<br>vs. Temperature vs. Temperature vs. Temperature<br>(IL=1ADC) (IL=1ADC) (IL=1ADC)<br>1.4 0.14 1.01<br>1.00<br>1.2 F| | | | | x] 0.12 Fe | [| | | [ ff pt f ~ Tt<br>1.0 Z IF=5mA 0.10 0.990.98 Seee<br>0.8 r+ | | Perl | | 0.08 ee ee IF=10mA 0.97 2 eee<br>0.96<br>0.60.4 |Pf[| | |--T || IF=10mA 0.060.04 Fr | _| | | [| IF=5mA 0.950.94 Ea2 ee<br>0.93<br>0.2 ee 0.02 ee 0.92<br>0 eee eee 0 F e oT ot tt Tt 0.91 en ee ee<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature ( º C) Temperature ( º C) Temperature ( º C)<br>Typical On-Resistance Typical Load Current<br>vs. Temperature vs. Load Voltage Maximum Load Current<br>(IF=10mA, IL=1ADC) (IF=10mA) vs. Temperature<br>0.45 1000 1400<br>0.40 800 1200<br>“ 0.350.30 SSeS : 600400 eSSSe ee ee a 1000 r+Oe| | | | | | |<br>0.25 200 800<br>0<br>0.20 SSS4 -200 eSSSe 600 eee<br>0.15 -400 400<br>0.10 cc-tpy-} |_| | -600 a 7 Ft | ET TT<br>0.05 7. -800 Fr I7, | fT 200<br>0 P F t.f.t.f.ft.t_ -1000 S une Oe SS Se Se 0 t et Et ET<br>-40 -20 0 20 40 60 80 100 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 120<br>Temperature ( º C) Load Voltage (V) Temperature ( º C)<br>Typical Blocking Voltage Typical Leakage vs. Temperature<br>vs. Temperature Measured Across Pins 4&6 Energy Rating Curve<br>81.0 0.019 8<br>80.0 ee a 0.018 FELILLL SY 7 2301/0000000<br>79.0 ee a 0.017 FP TEI 6 2301/0000<br>78.0 a 0.016 5 21110000<br>77.0 ne 4 000 0<br>0.015 a ae 20010001<br>76.0 3<br>CATT 0050 OY<br>75.0 2 ae 0.014 ae4 2 2012000/001 0 SU NY<br>74.0 Foe 0.013 1 0 A A<br>73.0 7A TTee Tt 0.012 FEEL—T | | |LEL| |SE| 0 22 3011301000 011) 0000  0<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Temperature ( º C) Temperature ( º C) Time<br>IF=10mA<br>IF=5mA<br>Turn-On Time (ms) Turn-Off Time (ms) LED Current (mA)<br>)<br>On-Resistance ( Load Current (mA) Load Current (mA)<br>)P<br>A)<br>Leakage (<br>Blocking Voltage (V Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R11 

**www.ixysic.com** 

**4** 

**LCA710** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~a~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~a~~|
|---|---|
|LCA710R / LCA710S<br>~~a~~|MSL 1<br>~~a~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. 

|**Device**<br>~~FT~~|**Classifi cation Temperature (Tc)**<br>~~FT~~|**Dwell Time (tP)**<br>~~FT~~|**Max Refl ow Cycles**<br>~~FT~~|
|---|---|---|---|
|LCA710R / LCA710S<br>~~FT~~|250ºC<br>~~FT~~|30 seconds<br>~~FT~~|3<br>~~FT~~|



For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. 

|**Device**<br>~~——————~~|**Maximum Pin Temperature**<br>~~——————~~|**Maximum Body Temperature**<br>~~——————~~|**Maximum Dwell Time**<br>~~——————~~|**Wave Cycles**<br>~~——————~~|
|---|---|---|---|---|
|LCA710<br>~~——————~~|260ºC<br>~~——————~~|250ºC<br>~~——————~~|10 seconds*<br>~~——————~~|1<br>~~——————~~|



*Total cumulative duration of all waves. 

## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R11 

**5** 

**LCA710** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **LCA710** 

(0.330±0.015)8.382±0.381 2.54±0.127 (0.285 TYP)7.239 TYP **PCB Hole Pattern** (0.100±0.005) L ~~at~~ 6 - 0.800 DIA. (6 - 0.031 DIA.) 2.540±0.127 9.144±0.508 (0.100±0.005) 6.350±0.127 (0.250±0.005) (0.360±0.020) 7.620±0.127 1.524 TYP (0.300±0.005) Pin 1 1.651±0.254(0.060 TYP) (0.300±0.010)7.620±0.254 0.254±0.0127 ~~an~~ ‘| (0.065±0.010) vl (0.010±0.0005) | nLob 5.080±0.127 ~~ie_4~~ (0.200±0.005) Controlling dimension: inches 3.302±0.051 4.064 TYP (0.130±0.002) ~~a~~ (0.160 TYP) Dimensions 0.457±0.076 mm (0.018±0.003) (inches) 8.382 ± 0.381 **PCB Land Pattern** (0.330 ± 0.015) 2.54 ± 0.127 0.635 ± 0.127 (0.100 ± 0.005) (0.025 ± 0.005) 2.54 (0.10) 9.525 ± 0.254 6.350 ± 0.127 7.620 ± 0.254 (0.375 ± 0.010) (0.250 ± 0.005) (0.300 ± 0.010) 1.70 8.90 (0.061) (0.3503) r ~~adar a 06~~ 04 1.523 ± 0.051 0.254 ± 0.0127 Pin 1 (0.060 ± 0.002) (0.010 ± 0.0005) 1.65 1.651 ± 0.254 ~~‘.~~ (0.065 ± 0.010) s ~~e~~ (0.0649) ~~W~~ e ~~ot~~ Dimensions 3.302 ± 0.051 0.178 ± 0.076 mm (0.130 ± 0.002) (0.007 ± 0.003) (inches) 0.635±0.127 **PCB Land Pattern** 8.382±0.381 (0.025±0.005) (0.330±0.015) 2.54±0.127 (0.100±0.005) 2.54 (0.10) ~~dar 4 +~~ 9.524±0.508 6.350±0.127 (0.375±0.020) (0.250±0.005) 8.90 1.65 (0.3503) Pin 1 (0.018±0.003)0.457±0.076 (0.300±0.010)7.620±0.254 (0.010±0.0005)0.254±0.0127 (0.0649) U ~~l~~ t ~~o~~ o ~~ot~~ 1.651±0.254 ~~=~~ (0.065±0.010) ~~fl~~ 00y ~~0~~ 0.65 3.302±0.051 (0.130±0.002) (0.0255) 4.445±0.254 a — (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) Dimensions 1.651±0.254 mm ~~i~~ : (0.065±0.010) (inches) 

## **LCA710R** 

## **LCA710S** 

R11 

**www.ixysic.com** 

**6** 

**LCA710** 

INTEGRATED CIRCUITS DIVISION 

## **LCA710RTR & LCA710STR Tape & Reel** 

**==> picture [437 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
330.2 Dia P1 = 12.00<br>(13.00 Dia) (0.472)<br>Top Cover W=16.00<br>Tape Thickness (0.63)<br>0.102 Max<br>(0.004 Max) B0 = 10.10<br>(0.398)<br>K0 = 4.90 A0(0.398) = 10.10<br>       (0.19)<br>K1 = 3.80 [Soe] Dimensions<br>       (0.15) User Direction of Feed mm<br>EmbossedCarrier (inches)<br>an [:] NOTES: [}] f a E as —F<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-LCA710-R11 ©Copyright 2021, Littelfuse, Inc. OptoMOS[®] is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 11/3/2021 

**7** 



## Links

- [View this product on Novapart](https://novapart.co/products/LCA710STR/mosfet-relay-spst-no-1-form-a-ac-dc-60-v-smd-6)
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- [Supplier page](https://es.farnell.com/littelfuse/lca710str/mosfet-relay-spst-no-1a-60v-smd/dp/3995919)
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