# MOSFET Relay, SPST-NO (1 Form A), SPST-NC (1 Form B), AC / DC, 60 V, 1 A, SMD-8, Surface Mount

![Product image](https://novapart.co/image/farnell:3995957/)

**URL**: https://novapart.co/products/LBA710STR/mosfet-relay-spst-no-1-form-a-nc-b-ac-dc-60-v-smd
**SKU**: LBA710STR
**Manufacturer**: LITTELFUSE
**Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays
**Price**: €3.5200
**Stock**: 10+
**Lead Time**: 190 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Load Type | AC / DC |
| Contact Form | SPST-NO (1 Form A), SPST-NC (1 Form B) |
| Load Current | 1A |
| Product Range | OptoMOS Series |
| Relay Mounting | Surface Mount |
| Relay Terminals | Gull Wing |
| Load Voltage Max | 60V |
| Isolation Voltage | 3.75kV |
| I/O Capacitance Typ | 3pF |
| On State Resistance Max | 0.6ohm |
| Mosfet Relay Package Style | SMD-8 |
| Off State Leakage Current Max | 1µA |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:3995957/)

**LBA710 60V, 1A Dual Single-Pole Relays: 1-Form-A (NO) & 1-Form-B (NC)** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|BlockingVoltage|60|V|
|Load Current|1|Arms/ ADC|
|On-Resistance(max)|0.6||
|LED Current to Operate|2|mA|



## **Features** 

- Low On-Resistance (0.6  ) 

- Low Control Current (2mA) 

- 3750Vrms Input/Output Isolation 

- 100% Solid State 

- Low Drive Power Requirements 

## **Description** 

LBA710 is a 60V, 1A, 0.6  dual Solid State Relay integrating independent single-pole normally open (1-Form-A) and single-pole normally closed (1-Form-B) relays into a single package. It features a superior combination of low on-resistance and 1A load current handling capability. 

## **Approvals** 

   - UL Recognized Component: File # E76270 

   - CSA Certified Component: Certificate # 1175739 

   - TUV EN 62368-1: Certificate # B 082667 0008 

- No EMI/RFI Generation 

- Surface Mount Version 

- Small 8-Pin Package 

- Tape & Reel available 

- Flammability Rating UL 94 V-0 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|LBA710|8-Pin DIP(50/Tube)|
|LBA710S|8-Pin Surface Mount(50/Tube)|
|LBA710STR|8-Pin Surface Mount(1000/Reel)|



## **Applications** 

- Security 

## **Pin Configuration** 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

- Medical Equipment-Patient/Equipment Isolation 

- Industrial Controls 

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**----- Start of picture text -----**<br>
1 8<br>+ Control<br>Normally Closed<br>2 7 Form-B<br>– Control<br>3 6<br>+ Control<br>Normally Open<br>4 5 Form-A<br>[<br>– Control<br>**----- End of picture text -----**<br>


**Switching Characteristics of Normally Open Devices** 

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**----- Start of picture text -----**<br>
Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**Switching Characteristics of Normally Closed Devices** 

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**----- Start of picture text -----**<br>
Form-B<br>IF<br>ILOAD<br>90%<br>10%<br>toff ton<br>**----- End of picture text -----**<br>


**1** 

DS-LBA710-R05 

**www.ixysic.com** 

**LBA710** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak(10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|ESD Rating, Human BodyModel|8|kV|
|Operational Temperature, Ambient|-40 to  +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

> 1  Derate linearly 1.33 mW / **º** C 

> 2  Derate output power linearly 6.67 mW / **º** C 

## **Electrical Characteristics @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics: Form-A (Normally Open)**<br>~~ee~~|||||||
|Blocking Voltage<br>~~es~~|IL=1A<br>~~es~~<br>~~ee~~|VDRM<br>~~es~~|60<br>~~es~~|-<br>~~es~~|-<br>~~es~~|VP<br>~~es~~|
|Load Current<br>Continuous<br>Peak<br>~~es~~|IF=2mA<br>~~es~~<br>~~ee~~|IL<br>~~es~~|-<br>~~es~~|-<br>~~es~~|1<br>~~es~~|Arms/ ADC<br>~~es~~|
||IF=2mA, t<10ms<br>~~es~~<br>~~ee~~|ILPK<br>~~es~~|-<br>~~es~~|-<br>~~es~~|±5<br>~~es~~|AP<br>~~es~~|
|On-Resistance<br>~~es~~<br>~~ee~~|IF=2mA, IL=1A<br>~~es~~<br>~~ee~~<br>~~ee~~|RON<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|0.21<br>~~es~~<br>~~ee~~|0.6<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|
|Switching Speeds<br>Turn-On Output (Activate)<br>Turn-Off Output(Deactivate)<br>~~ee~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-<br>~~ee~~|0.7<br>~~ee~~|5<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|0.09<br>~~ee~~|5<br>~~ee~~||
|Off-State Leakage Current<br>~~ee~~|IF=0mA, VL=60V<br>~~ee~~|ILEAK<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|A<br>~~ee~~|
|Output Capacitance|IF=0mA, VL=50V, f=1MHz|COUT|-|44|-|pF|
|**Output Characteristics: Form-B(Normally Closed)**<br>~~ee~~|||||||
|Blocking Voltage<br>~~es~~|IF=2mA, IL=1A<br>~~es~~<br>~~ee~~|VDRM<br>~~es~~|60<br>~~es~~|-<br>~~es~~|-<br>~~es~~|VP<br>~~es~~|
|Load Current<br>Continuous<br>Peak<br>~~es~~|IF=0mA<br>~~es~~<br>~~ee~~|IL<br>~~es~~|-<br>~~es~~|-<br>~~es~~|1<br>~~es~~|Arms/ ADC<br>~~es~~|
||IF=0mA, t<10ms<br>~~es~~<br>~~ee~~|ILPK<br>~~es~~<br>~~oe~~|-<br>~~es~~|-<br>~~es~~|±5<br>~~es~~|AP<br>~~es~~|
|On-Resistance<br>~~es~~<br>~~ee~~|IF=0mA, IL=1A<br>~~es~~<br>~~ee~~<br>~~ee~~|RON<br>~~es~~<br>~~ee~~<br>~~oe~~|-<br>~~es~~<br>~~ee~~|0.39<br>~~es~~<br>~~ee~~|0.6<br>~~es~~<br>~~ee~~|<br>~~es~~<br>~~ee~~|
|Switching Speeds<br>Turn-On Output (Deactivate)<br>Turn-Off Output(Activate)<br>~~ee~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~<br>~~oe~~|-<br>~~ee~~|0.63<br>~~ee~~|5<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~<br>~~oe~~|-<br>~~ee~~|1.5<br>~~ee~~|5<br>~~ee~~||
|Off-State Leakage Current<br>~~ee~~|IF=2mA, VL=60V<br>~~ee~~|ILEAK<br>~~ee~~<br>~~oe~~|-<br>~~ee~~|-<br>~~ee~~|1<br>~~ee~~|A<br>~~ee~~|
|Output Capacitance|IF=2mA, VL=50V, f=1MHz|COUT|-|125|-|pF|
|**Input Characteristics: Form-A and Form-B**|||||||
|Input Control Current to Activate|IL=1A|IF|-|-|2|mA|
|Input Control Current to Deactivate|-|IF|0.1|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics: Form-A and Form-B**|||||||
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|3|-|pF|



*NOTE:  If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dissipation value. 

R05 

**www.ixysic.com** 

**2** 

ell INTEGRATED CIRCUITS DIVISION **LBA710** ~~ee~~ 

**LBA710** 

## **Form-A PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Form-A Form-A Form-A<br>Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA) (N=50, IF=5mA)<br>30 25 20<br>25 a ae 20 15 Ta<br>20 | TT<br>15<br>15 10<br>10<br>10<br>5<br>5 5<br>; | |<br>0 is 0 0 m— iii<br>1.364 1.366 1.368 1.370 1.372 0.57 0.61 0.65 0.69 0.73 0.77 0.81 0.077 0.082 0.087 0.092 0.097 0.102<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Form-A Form-A<br>Typical On-Resistance Distribution Typical Blocking Voltage Distribution<br>(N=50, IF=2mA, IL=1A) (N=50)<br>2520 - ce0 28 20<br>15 -oo0 o 15<br>10<br>10 CO<br>50 T==oi) 50<br>0.206 0.207 0.208 0.209 || 0.210 0.211 0.212 65.5 66.0 66.5 67.0 67.5 68.0 68.5<br>On-Resistance ( ) Blocking Voltage (VP)<br>Form-A Form-A<br>Typical Turn-On Typical Turn-Off<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.8 vs. Temperature 1200 (IL=100mA, TA=25ºC) 77.8 (IL=100mA, TA=25ºC)<br>1.7 E | | | [ J 1000 77.7<br>1.6 EN | of of 77.6<br>1.5 IIFF=10mA=5mA 800 77.5<br>1.4 I F =2mA 600 77.4<br>1.3 ASS 5 * *<br>400<br>77.3<br>1.2<br>po | 6] hd] re<br>1.1 p | | | | [ 200 77.2<br>1.0 B= ool [Lh] = 0 Rec 77.1 fo<br>-50 -25 0 25 50 75 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Form-A Form-A Form-A<br>Typical IF for Switch Operation Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>0.95 (IL=500mA) 2500 (IL=100mA) 90 (IL=100mA)<br>0.90 T TA 2000 e ae IF=2mA 85 RS<br>80<br>0.85 1500 75 IF=2mA<br>CECEPVE) - EeerrtT) +  Psp 70<br>0.80 SEPA) 1000 EC) IF=5mA 65 ESSE IF=5mA<br>60<br>0.75 500<br>Tit ArT Ty «Leer 55 Pes<br>0.70 — rtitlit! 0 t LLitltitll|) 50 beers<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Voltage Drop (V)<br>s) s)<br>LED Current (mA) Turn-On Time ( Turn-Off Time (<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R05 

**3** 

eT INTEGRATED CIRCUITS DIVISION **LBA710** ~~a~~ 

**LBA710** 

## **Form-A PERFORMANCE DATA (continued)*** 

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**----- Start of picture text -----**<br>
Form-A Form-A<br>Typical On-Resistance Typical Load Current Maximum Load Current<br>vs. Temperature vs. Load Voltage vs. Temperature<br>0.26 (IF=2mA, IL=500mA) 0.3 (IF=2mA) 1.1 (IF=2mA)<br>0.24 ee ae 0.2 1.0 Ee | [| | | ht h[ Cd<br>eo 0.22 fF | | | | YI | 0.9 2<br>0.1<br>0.20 re | | | LA 0.8 7a rNe<br>0.0<br>0.18 r | | | ew] 0.7 ET | hd| UTN UT<br>-0.1<br>0.16 r | | ew | 0.6 72a<br>0.14 | [amt | | -0.2 0.5 2<br>0.12 rT | ET dE Tt -0.3 0.4 7a<br>-40 -20 0 20 40 60 80 100 -1.0 -0.5 0.0 0.5 1.0 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Voltage (V) Temperature (ºC)<br>Form-A Form-A<br>Form-A Typical Leakage vs. Temperature Output Capacitance<br>Typical Blocking Voltage Measured Across Pins 5&6 vs. Load Voltage<br>70 vs. Temperature 20 (VL=60V) 120 (IF=0mA, f=1MHz)<br>69<br>100<br>68 ++) | er] 15 PATA LAE<br>67 80<br>66 ea 10 AMSAT<br>65 a ae 60 a aN<br>64 pet 5 40 ETA Ps<br>63 de LI SAU<br>62 TEE 0 20 E AT ELLIE<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0.1 1 10 100<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Form-A<br>Energy Rating Curve<br>65 S T ATE ETM TIM TA ET<br>4<br>ATTN TT<br>3<br>SU NAN a a<br>2<br>SITTIN TT<br>1 SATETUTIM TIAA TT<br>0 TT AT ECT TET<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>)<br>Current (A)<br>On-Resistance ( Load Current (A)<br>)Blocking Voltage (VP Leakage Current (nA)<br>Output Capacitence (pF)<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R05 

**www.ixysic.com** 

**4** 

call INTEGRATED CIRCUITS DIVISION **LBA710** ~~a~~ 

**LBA710** 

## **Form-B PERFORMANCE DATA*** 

**==> picture [498 x 579] intentionally omitted <==**

**----- Start of picture text -----**<br>
Form-B Form-B Form-B<br>Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA) (N=50, IF=5mA)<br>30 25 20<br>25 FL [gst 20 Ft tT ll |<br>15<br>20<br>oe 15 |<br>15 10<br>—_ae |hee 10 |<br>10<br>5 rSS| [Zi 5 | | 5<br>0 iii 0 Litt 0<br>1.364 1.366 1.368 1.370 1.372 0.54 0.57 0.60 0.63 0.66 0.69 0.72 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Form-B Form-B<br>Typical On-Resistance Distribution Typical Blocking Voltage Distribution<br>(N=50, IF=0mA, IL=1A) (N=50, IF=2mA)<br>20 25<br>15 | |ime 20<br>15<br>10 20 |) C UEEEE<br>| oe 10 Seen ie<br>5 a0<br>5<br>0 ||| || 0 S=ee| e=o<br>0.381 0.384 0.387 0.390 0.393 0.396 0.399 69 71 73 75 77 79 81<br>On-Resistance ( ) Blocking Voltage (VP)<br>Form-B Form-B<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>1.8 vs. Temperature 0.640 (IL=100mA) 8 (IL=100mA)<br>1.7 0.638 7<br>0.636<br>1.61.5 EeeOSA ee ee IIFF=10mA=5mA 0.6340.632 eeee a ee 65 Hteee| fT<br>1.4 I F =2mA 0.630 4<br>1.3 0.628 3<br>0.626<br>1.2 2<br>0.624<br>1.1 2 0.622 -—f ff 1 vt<br>1.0 0.620 0<br>-50 -25 0 25 50 75 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Form-B Form-B Form-B<br>Typical IF for Switch Operation Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>0.32 (IL=100mA) 0.9 (IF=5mA, IL=100mA) 2.6 (IF=5mA, IL=100mA)<br>2.4<br>0.28 Ft | | | Jf 0.8 ee<br>2.2<br>0.24 nen 0.7 2.0 SSE EA<br>0.20 CET 0.6 1.8 FSS<br>1.6<br>0.16 0.5<br>SZ 40000 1.4 FERS<br>0.12 4g Renee 0.4 1.2 TTL<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage Drop (V)<br>LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

R05 

**5** 

call INTEGRATED CIRCUITS DIVISION **LBA710** ~~a~~ 

**LBA710** 

## **Form-B PERFORMANCE DATA (continued)*** 

**==> picture [498 x 438] intentionally omitted <==**

**----- Start of picture text -----**<br>
Form-B Form-B Form-B<br>Typical On-Resistance Typical Load Current Maximum Load Current<br>vs. Temperature vs. Load Voltage vs. Temperature<br>0.48 (IF=0mA, IL=500mA) 1.0 (IF=0mA) 1.11.0 e (IF=0mA) e<br>0.44<br>0.5<br>: 0.9 FELINE LE<br>0.40 0.8 HEELN LL,<br>0.36 0.0 0.7 TINT<br>-0.5 0.6 TOLLE NRE,<br>0.32<br>0.28 -1.0 0.50.4 TOLLEEEL<br>-40 -20 0 20 40 60 80 100 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Voltage (V) Temperature (ºC)<br>Form-B Form-B Form-B<br>Typical Blocking Voltage Typical Leakage vs. Temperature Output Capacitance<br>vs. Temperature Measured Across Pins 7&8 vs. Load Voltage<br>81 (IF=2mA) 0.10 (IF=2mA, VL=60V) 450 (IF=2mA, f=1MHz)<br>80 es 400 ONC OMICoOo<br>0.08<br>79<br>350<br>78 tier .  p 0.06 e 0 0) SU<br>300<br>77<br>76 EEEREEE LL 0.04  ECHHEH 250 HSIN|<br>200<br>75<br>0.02<br>74 SESEEa | | | [ | EO 150 StNU<br>73 ZT EL 0.00 F ET dT LL 100 COCo Cs<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 0.1 1 10 100<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Form-B<br>Energy Rating Curve<br>6<br>5<br>a ana<br>4<br>SO A TTT TT<br>3 au<br>2<br>SL EN<br>1 a<br>0 FTI TIMI a EATTI a ET<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>)<br>Current (A)<br>On-Resistance ( Load Current (A)<br>)P A)<br>Blocking Voltage (V Leakage Current (<br>Output Capacitance (pF)<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R05 

**www.ixysic.com** 

**6** 

**LBA710** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~a~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~a~~|
|---|---|
|LBA710S<br>~~a~~|MSL 1<br>~~a~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. 

|**Device**<br>~~———————e~~|**Classifi cation Temperature (Tc)**<br>~~———————e~~|**Dwell Time (tP)**<br>~~———————e~~|**Max Refl ow Cycles**<br>~~———————e~~|
|---|---|---|---|
|LBA710S<br>~~———————e~~|250ºC<br>~~———————e~~|30 seconds<br>~~———————e~~|3<br>~~———————e~~|



For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. 

|**Device**<br>~~——————~~|**Maximum Pin Temperature**<br>~~——————~~|**Maximum Body Temperature**<br>~~——————~~|**Maximum Dwell Time**<br>~~——————~~|**Wave Cycles**<br>~~——————~~|
|---|---|---|---|---|
|LBA710<br>~~——————~~|260ºC<br>~~——————~~|250ºC<br>~~——————~~|10 seconds*<br>~~——————~~|1<br>~~——————~~|



*Total cumulative duration of all waves. 

## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

R05 

**7** 

**LBA710** 

INTEGRATED CIRCUITS DIVISION 

## **Mechanical Dimensions** 

## **LBA710** 

9.652 ± 0.381 7.620 ± 0.254 **PCB Hole Pattern** 2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010) (0.100 ± 0.005) 8-0.762 DIA. 2.540 ± 0.127 ~~f~~ A ~~]~~ (8-0.030 DIA.) (0.100 ± 0.005) 9.144 ± 0.508 6.350 ± 0.127 (0.360 ± 0.020) (0.250 ± 0.005) 7 | ~~yt~~ Pin 1 3.302 ± 0.051 0.457 ± 0.076 (0.130 ± 0.002) (0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127 (0.285) (0.300 ± 0.005) 7.620 ± 0.127 ~~So~~ 4.064 TYP ~~A~~ 0.254 ± 0.0127 ~~ij]~~ (0.300 ± 0.005) (0.160) (0.010 ± 0.0005) Dimensions mm ~~i~~ 0.813 ± 0.102 ~~i~~ - (inches) ~~I~~ (0.032 ± 0.004) 

## **LBA710S** 

> 9.652 ± 0.381 **PCB Land Pattern** (0.100 ± 0.005)2.540 ± 0.127 (0.380 ± 0.015) 3.302 ± 0.051 (0.025 ± 0.005)0.635 ± 0.127 2.54 (0.130 ± 0.002) (0.10) 6.350 ± 0.127 9.525 ± 0.254 (0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90 (0.0649) (0.3503) 7.620 ± 0.254 Pin 1 (0.300 ± 0.010) 0.457 ± 0.076 0.254 ± 0.0127 ~~ho~~ (0.018 ± 0.003) (0.010 ± 0.0005) ~~e~~ 0.65 ~~e~~ (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions 0.813 ± 0.102 mm ~~or~~ - (0.032 ± 0.004) (inches) 

R05 

**www.ixysic.com** 

**8** 

**LBA710** 

INTEGRATED CIRCUITS DIVISION 

## **LBA710STR Tape & Reel** 

**==> picture [439 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.0<br>(0.08)<br>4.0<br>(0.16)<br>330.2 DIA.<br>(13.00 DIA.)<br>7.5<br>(0.30)<br>Top Cover<br>Tape Thickness Bo=10.30<br>0.102 MAX. (0.406)<br>(0.004 MAX.) 16.0±0.3<br>(0.63±0.012)<br>|<br>Ao=10.30 P1=12.00<br>K0 =4.90 (0.406) (0.472)<br>(0.193)<br>Dimensions<br>K1 =4.20 User Direction of Feed mm<br>(0.165) (inches)<br>Embossed Carrier<br>NOTES:<br>1. Dimensions carry tolerances of EIA Standard 481-2<br>2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>Embossment<br>**----- End of picture text -----**<br>


3. Controlling dimension:  mm 

## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-LBA710-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS[®] is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

**9** 

10/27/2021 



## Links

- [View this product on Novapart](https://novapart.co/products/LBA710STR/mosfet-relay-spst-no-1-form-a-nc-b-ac-dc-60-v-smd)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/littelfuse/lba710str/mosfet-relay-spst-no-nc-1a-60v/dp/3995957)
---

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