# MOSFET Relay, SPST-NO (1 Form A), SPST-NC (1 Form B), AC / DC, 350 V, 120 mA, SMD-8 ![Product image](https://novapart.co/image/farnell:3995946/) **URL**: https://novapart.co/products/LBA110S/mosfet-relay-spst-no-1-form-a-nc-b-ac-dc-350-v-120 **SKU**: LBA110S **Manufacturer**: LITTELFUSE **Category**: Switches & Relays || Relays || Solid State Relays & Contactors || MOSFET Solid State Relays **Price**: €3.5900 **Stock**: 50+ **Lead Time**: 197 days (indicative) ## Specifications | Parameter | Value | |---|---| | Svhc | To Be Advised | | Load Type | AC / DC | | Contact Form | SPST-NO (1 Form A), SPST-NC (1 Form B) | | Load Current | 120mA | | Product Range | OptoMOS Series | | Relay Mounting | Surface Mount | | Relay Terminals | Gull Wing | | Load Voltage Max | 350V | | Isolation Voltage | 3.75kV | | I/O Capacitance Typ | 3pF | | On State Resistance Max | 35ohm | | Mosfet Relay Package Style | SMD-8 | | Off State Leakage Current Max | 1µA | ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:3995946/) **LBA110 350V, 120mA Dual Single-Pole Relays: 1-Form-A (NO) & 1-Form-B (NC)** INTEGRATED CIRCUITS DIVISION |**Parameter**|**Ratings**|**Units**| |---|---|---| |Blocking Voltage|350|VP| |Load Current|120|mArms/ mADC| |On-Resistance (max)|35|| ## **Features** - 3750Vrms Input/Output Isolation - 100% Solid State ## **Description** LBA110 comprises two independent 350V, 120mA, 35  solid state relays: one single-pole, normally open (1-Form-A) relay and one single-pole, normally closed (1-Form-B) relay. LBA110 is designed to provide an ideal solution where a complementary Form-A/Form-B relay pair is required. - Low Drive Power Requirements - FCC Compatible - VDE Compatible - No EMI/RFI Generation - Flammability Rating UL 94 V-0 ## **Approvals** - UL Recognized Component: File # E76270 - CSA Certified Component: Certificate # 1175739 - TUV EN 62368-1: Certificate # B 082667 0008 ## **Applications** - Telecommunications - Telecom Switching - Tip/Ring Circuits - Modem Switching (Laptop, Notebook, Pocket Size) - Hook Switch - Dial Pulsing - Ground Start - Ringing Injection ## **Ordering Information** |**Part #**|**Description**| |---|---| |LBA110|8-Pin DIP (50/Tube)| |LBA110S|8-Pin Surface Mount (50/Tube)| |LBA110STR|8-Pin Surface Mount (1,000/Reel)| |LBA110P|8-Pin Flat Pack (50/Tube)| |LBA110PTR|8-Pin Flat Pack (1,000/Reel)| - Instrumentation - Multiplexers - Data Acquisition - Electronic Switching ## **Pin Configuration** - I/O Subsystems - Meters (Watt-Hour, Water, Gas) - Medical Equipment-Patient/Equipment Isolation - Security - Industrial Controls **==> picture [81 x 53] intentionally omitted <==** **----- Start of picture text -----**
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
**----- End of picture text -----**
**==> picture [124 x 52] intentionally omitted <==** **----- Start of picture text -----**
1 8
2 7 Normally Closed Pole
3 6
Normally Open Pole
4 5
[
**----- End of picture text -----**
## **Switching Characteristics of Switching Characteristics of Normally Open Devices Normally Closed Devices** **==> picture [212 x 60] intentionally omitted <==** **----- Start of picture text -----**
Form-A Form-B
IF IF
ILOAD
90% 90%
10% 10%
ILOAD
ton toff toff ton
**----- End of picture text -----**
**1** DS-LBA110-R11 **www.ixysic.com** **LBA110** INTEGRATED CIRCUITS DIVISION ## **Absolute Maximum Ratings @ 25ºC** |**Parameter**|**Ratings**|**Units**| |---|---|---| |Blocking Voltage|350|VP| |Reverse Input Voltage|5|V| |Input Control Current
Peak (10ms)|50|mA| ||1|A| |Input Power Dissipation1|150|mW| |Total Power Dissipation2|800|mW| |Isolation Voltage, Input to Output|3750|Vrms| |Operational Temperature, Ambient|-40 to +85|°C| |Storage Temperature|-40 to +125|°C| _Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ _Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC ## **Electrical Characteristics @ 25ºC** |**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**| |---|---|---|---|---|---|---| |**Output Characteristics**||||||| |Blocking Voltage
~~es~~|IL=1A
~~es~~|VDRM
~~es~~|350
~~es~~|-
~~es~~|-
~~es~~|VP
~~es~~| |Load Current
Continuous1
Peak
~~es~~|-
~~es~~|IL
~~es~~|-
~~es~~|-
~~es~~|120
~~es~~|mArms/ mADC
~~es~~| ||t = 10ms
~~es~~|ILPK
~~es~~|-
~~es~~|-
~~es~~|±350
~~es~~|mAP
~~es~~| |On-resistance
~~es~~|IL=120mA
~~es~~|RON
~~es~~|-
~~es~~|25
~~es~~|35
~~es~~|
~~es~~| |Off-State Leakage Current
~~es~~|VL=350VP
~~es~~|ILEAK
~~es~~|-
~~es~~|-
~~es~~|1
~~es~~|A
~~es~~| |Switching Speeds
Turn-On
Turn-Off
~~es~~|IF=5mA, VL=10V
~~es~~|ton
~~es~~|-
~~es~~|-
~~es~~|3
~~es~~|ms
~~es~~| |||toff
~~es~~|-
~~es~~|-
~~es~~|3
~~es~~|| |Output Capacitance|VL=50V, f=1MHz|COUT|-|25|-|pF| |**Input Characteristics**||||||| |Input Control Current to Activate|IL=120mA|IF|-|-|2|mA| |Input Control Current to Deactivate|-|IF|0.4|0.7|-|mA| |Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V| |Reverse Input Current|VR=5V|IR|-|-|10|A| |**Common Characteristics**||||||| |Input to Output Capacitance|VIO=0V, f=1MHz|CIO|-|3|-|pF| 1 If both poles operate the load current must be derated so as not to exceed the package power dissipation value. R11 **www.ixysic.com** **2** aaa INTEGRATED CIRCUITS DIVISION **LBA110** ~~ee~~ ## **Form-A/Form-B PERFORMANCE DATA*** **==> picture [325 x 125] intentionally omitted <==** **----- Start of picture text -----**
Typical LED Forward Voltage Drop Typical LED Forward Voltage Drop
(N=50, IF=5mA) vs. Temperature
30 1.8
25 ET leet 1d 1.7 Ss
1.6
20 oe 1.5 ne IIFF=10mA=5mA
15 1.4 I F =2mA
eo 1.3 Ss
10
1.2
5
1.1
0 _ hUdllhlUd)kl 1.0 J UN Onl See ndOe
1.364 1.366 1.368 1.370 1.372 -50 -25 0 25 50 75 100
LED Forward Voltage Drop (V) Temperature (ºC)
Device Count (N)
LED Forward Voltage Drop (V)
**----- End of picture text -----**
## **Form-A PERFORMANCE DATA*** **==> picture [488 x 282] intentionally omitted <==** **----- Start of picture text -----**
Form-A Form-A Form-A
Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC)
25 25 35
30
20 20 FL LLLIL.L, FDEP LLLL
25
15 15 Sere, 20 EE
10 10 a= "see 15 2
10
5 5
0 0 Z/hhshhhh6eA 2/s66s6s6§£U::?” 50 '|ani:
0.45 0.75 1.05 1.35 1.65 0.12 0.20 0.28 0.36 0.44 0.52 0.60 19.5 20.5 21.5 22.5 23.5 24.5 25.5
Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )
Form-A Form-A Form-A
Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution
(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50)
25 25 35
20 20 FL LLLIL.L, 30 eeee
25
15 15 Coe EE = 20 O
10 10 os 15 RG
10
5 5 23 || ee =o
0 0 A Z6k66§ss6§5Fs || ree oe 50 +lhitee
0.65 0.91 1.17 1.43 1.69 1.95 0.39 0.65 0.91 1.17 1.43 1.69 1.95 400 420 440 460 480 500 520
LED Current (mA) LED Current (mA) Blocking Voltage (VP)
Device Count (N) Device Count (N) Device Count (N)
Device Count (N) Device Count (N) Device Count (N)
**----- End of picture text -----**
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R11 **3** al INTEGRATED CIRCUITS DIVISION **LBA110** ~~P|~~ ## **Form-A PERFORMANCE DATA*** **==> picture [498 x 587] intentionally omitted <==** **----- Start of picture text -----**
Form-A Form-A Form-A
Typical Turn-On Time Typical Turn-Off Time Typical IF for Switch Operation
vs. LED Forward Current vs. LED Forward Current vs. Temperature
(IL=120mADC) (IL=120mADC) (IL=120mADC)
1.0 0.220 2.5
0.9 0.215
0.8 0.210 2.0
0.7 PERSE 0.205 EEE Co
0.6 AEC S 0.200 Pere 1.5 Ft | dE
0.5 Sm LAL
0.195
0.4 2 A p t{tt{| Peet tettt{ tt 1.0 Ft |Ef7
0.190
0.3
0.2 0.185 0.5
0.1 SoS 0.180 eA ee
0 EERE EEE 0 Cie EE 0 F LT LET
0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100
LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)
Form-A Form-A Form-A
Typical IF for Switch Dropout Typical Turn-On Time Typical Turn-Off Time
vs. Temperature vs. Temperature vs. Temperature
2.5 (IL=120mADC) 1.4 (IL=120mADC) 0.40 (IF=5mA, IL=120mADC)
1.2 F | | | tl lhT 0.35 ee
2.0 1.0 ee ae IF=5mA 0.30 PNT
1.5 0.8 == IF=10mA 0.25 fT yt tt
0.20
1.0 0.6 eT IF=20mA 0.15 ee
0.4 +7 ees
0.10
0.5
0.2 F | | | +s]| | 0.05 Fo TTI~
0 0 ee __| eee | ee ee 0 Eo]nee | hv|l hE hUvdPS
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)
Form-A Form-A Form-A
Typical On-Resistance vs. Temperature Typical Load Current vs. Load Voltage Maximum Load Current
(IF=5mA, IL=120mADC) (IF=5mA) vs. Temperature
60 150 180
160
50 Ft tT tl | dtly 100 FLT ET | WetTy eT TT
140
ft] y EE esi
40 50 120
100
3020 Fe. |T | | hE]|TA -500 PLETE?5082458TAT 8060 ASSTooSS IIIFFF=20mA=10mA=5mA
er ee 40 eee
10 -100
res] | | | lf FLY! | | | 20 Pf
0 FET EL -150 F AL LL 0 eepti.ee
-40 -20 0 20 40 60 80 100 -4 -3 -2 -1 0 1 2 3 4 -40 -20 0 20 40 60 80 100 120
Temperature (ºC) Load Voltage (V) Temperature (ºC)
Form-A Form-A
Typical Blocking Voltage Typical Leakage vs. Temperature
vs. Temperature Measured Across Pins 5&6 Energy Rating Curve
480 0.016 1.0
0.014 0.9
470 0.8
0.012
460 Se 0.7 \]
0.010 0.6
450 Ft | waPea 0.008 eEESpfe| ee| ft ye 0.5 2STINT301/0005CET
440 ia ) 0.0060.004 eSe eeT 0.40.3 S0039010080000SU00 A00
430 SES 0.2 00
0.002 0.1
420 ARETE 0 FoeEtd e 0 330000000
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10μs 100μs 1ms 10ms 100ms 1s 10s 100s
Temperature (ºC) Temperature (ºC) Time
Turn-On Time (ms) Turn-Off Time (ms) LED Current (mA)
LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)
On-Resistance () Load Current (mA) Load Current (mA)
)P
Leakage (µA)
Blocking Voltage (V Load Current (A)
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*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 **www.ixysic.com** **4** all INTEGRATED CIRCUITS DIVISION **LBA110** ~~eee~~ ## **Form-B PERFORMANCE DATA*** **==> picture [497 x 578] intentionally omitted <==** **----- Start of picture text -----**
Form-B Form-B Form-B
Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance Distribution
(N=50, IF=5mA, IL=120mADC) (N=50, IF=5mA, IL=120mADC) (N=50, IF=0mA, IL=120mADC)
25 25 25
20 8 e 20 e ee e e 20 ee ee
15105 e2m m | i | e | a 1510 e 5 eee! | |)lhd elhee 15105 eeee|l|)lee| ee
0 Inn | 0 | =6oO ERE L)hlUlUC<(“ 0 (< [air]
0.25 0.35 0.45 0.55 0.65 0.75 0.24 0.40 0.56 0.72 0.88 1.04 25.5 26.5 27.5 28.5 29.5 30.5 31.5
Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ( )
Form-B Form-B Form-B
Typical IF for Switch Operation Typical IF for Switch Dropout Typical Blocking Voltage Distribution
(N=50, IL=120mADC) (N=50, IL=120mADC) (N=50)
25 25 30
20 FETT Er ) hC 20 UEEEE EET C ELE 25 TT
20
15 15
PEPPER Geer 15 ECO
10 10
20" "See=e 10 See
5 cr ae 5 6)~§)hCUlUL_LrLCe|hlULhlC( 5 a" LH 8
0 iit 0 iti 0 ésee D
0.7 0.9 1.1 1.3 1.5 1.7 1.9 0.7 0.9 1.1 1.3 1.5 1.7 1.9 365 375 385 395 405 415 425
LED Current (mA) LED Current (mA) Blocking Voltage (VP)
Form-B Form-B Form-B
Typical Turn-On Time Typical Turn-Off Time Typical IF for Switch Operation
vs. LED Forward Current vs. LED Forward Current vs. Temperature
0.42 (IL=120mADC) 0.7 (IL=120mADC) 3.0 (IL=120mADC)
0.41 ET | | | TT [Te]] 0.6 2.5
0.40 ees 0.5 A
2.0
0.39
0.4
0.38 severe REE 1.5 ee
0.3
0.37 SAC CACC CEE A
0.2 Ne 1.0
0.36
0.35 SHA 0.1 eee— C e 0.5 COETe
0.34 SN 0 S O vd Fl nF 0 F ET Tt
0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50 -40 -20 0 20 40 60 80 100
LED Forward Current (mA) LED Forward Current (mA) Temperature (ºC)
Form-B Form-B Form-B
Typical IF for Switch Dropout Typical Turn-On Time Typical Turn-Off Time
vs. Temperature vs. Temperature vs. Temperature
3.0 (IL=120mADC) 0.7 (IF=5mA, IL=120mADC) 1.2 (IL=120mADC)
2.5 F | | dT dT dT df 0.6 NS 1.0 r | | | hc T dT Ce IF=5mA
0.5
2.0 0.8
1.5 SOOT 0.4 ERE 0.6 ee IF=10mA
Serra 0.3 ERS Oe
1.0 Toppa 0.2 CBSO 0.4 IF=20mA
0.5 t+ | | | | 0.1 ee 0.2 +
0 F t tT Tt 0 FLL LT 0 Herre | |
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC) Temperature (ºC)
Device Count (N) Device Count (N) Device Count (N)
Device Count (N) Device Count (N) Device Count (N)
Turn-On Time (ms) Turn-Off Time (ms) LED Current (mA)
LED Current (mA) Turn-On Time (ms) Turn-Off Time (ms)
**----- End of picture text -----**
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. **www.ixysic.com** R11 **5** ## aol INTEGRATED CIRCUITS DIVISION **LBA110** ~~eee~~ eee errr eee ~~eee~~ **Form-B PERFORMANCE DATA*** **==> picture [498 x 281] intentionally omitted <==** **----- Start of picture text -----**
Form-B Form-B Form-B
Typical On-Resistance vs. Temperature Typical Load Current vs. Load Voltage Maximum Load Current vs. Temperature
(IF=0mA, IL=120mADC) (IF=0mA) (IF=0mA)
60 150 180
160
50 F | | tT dt Tt 100 Ft oT dT | hE hE VP 140 aiiF PTTft | ft ft
cf Ty TT
40 | | | | [ | | 50 FT TE EE YY 120 Ss
100
30 0
[pp eer) PPT 80 EPS
20 etry. | | | | -50 FL Ped 60 a
40
10 -100
PPP) ea 20 e
0 FEE ET -150 P A IL EE 0 Se
-40 -20 0 20 40 60 80 100 -4 -3 -2 -1 0 1 2 3 4 -40 -20 0 20 40 60 80 100 120
Temperature (ºC) Load Voltage (V) Temperature (ºC)
Form-B
Form-B Typical Leakage vs. Temperature
Typical Blocking Voltage Measured Across Pins 5&6
vs. Temperature (IF=5mA) Energy Rating Curve
415 0.016 1.0
410 ee 0.014 ee 0.9 S000000000
0.8
405 0.012
0.7
400 SoS 0.010 SA 0.6 A
395 EF | | UT rm 0.008 tr | | | |]Z | | 0.5 2000/00ECIMIN TIE08AAELC ECCT
390 SESS 0.006 SSE 0.40.3
385 0.004
0.2
380 44 a 0.002 oe 0.1 2010/00200000000:A 0
375 elt | | tld 0 f t | tT | | tt 0 2 010/00 000 A
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 10μs 100μs 1ms 10ms 100ms 1s 10s 100s
Temperature (ºC) Temperature (ºC) Time
On-Resistance () Load Current (mA) Load Current (mA)
)P
Leakage (µA)
Blocking Voltage (V Load Current (A)
**----- End of picture text -----**
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 **www.ixysic.com** **6** **LBA110** INTEGRATED CIRCUITS DIVISION ## **Manufacturing Information** ## **Moisture Sensitivity** All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of % the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . **Device Moisture Sensitivity Level (MSL) Classifi cation** LBA110S / LBA110P MSL 1 ~~—————EE~~ ## **ESD Sensitivity** This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . ## **Soldering Profile** Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. **Device Classifi cation Temperature (Tc) Dwell Time (tP) Max Refl ow Cycles** LBA110S 250ºC 30 Seconds 3 LBA110P 260ºC 30 seconds 3 ~~er~~ For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. |**Device**
~~—EE—————————~~|**Maximum Pin Temperature**
~~—EE—————————~~|**Maximum Body Temperature**
~~—EE—————————~~|**Maximum Dwell Time**
~~—EE—————————~~|**Wave Cycles**
~~—EE—————————~~| |---|---|---|---|---| |LBA110
~~—EE—————————~~|260ºC
~~—EE—————————~~|250ºC
~~—EE—————————~~|10 seconds*
~~—EE—————————~~|1
~~—EE—————————~~| *Total cumulative duration of all waves. ## **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. **www.ixysic.com** R11 **7** **LBA110** INTEGRATED CIRCUITS DIVISION ## **MECHANICAL DIMENSIONS** ## **LBA110** **==> picture [391 x 567] intentionally omitted <==** **----- Start of picture text -----**
9.652 ± 0.381 7.620 ± 0.254 PCB Hole Pattern
2.540 ± 0.127 (0.380 ± 0.015) (0.300 ± 0.010)
(0.100 ± 0.005) 8-0.762 DIA. 2.540 ± 0.127
— (8-0.030 DIA.) (0.100 ± 0.005)
9.144 ± 0.508
6.350 ± 0.127 (0.360 ± 0.020)
(0.250 ± 0.005)
7
Pin 1 3.302 ± 0.051
0.457 ± 0.076 (0.130 ± 0.002)
(0.018 ± 0.003) 7.239 TYP. 7.620 ± 0.127
(0.285) (0.300 ± 0.005)
7.620 ± 0.127
i s 4.064 TYP(0.160) 0.254 ± 0.0127 . ait (0.300 ± 0.005)
(0.010 ± 0.0005)
Dimensions
mm
0.813 ± 0.102 (inches)
(0.032 ± 0.004)
iim i, 4
9.652 ± 0.381 PCB Land Pattern
(0.100 ± 0.005)2.540 ± 0.127 (0.380 ± 0.015) 3.302 ± 0.051 (0.025 ± 0.005)0.635 ± 0.127 2.54
(0.130 ± 0.002) (0.10)
6.350 ± 0.127 9.525 ± 0.254
(0.250 ± 0.005) (0.375 ± 0.010) 1.65 8.90
7.620 ± 0.254 (0.0649) (0.3503)
Pin 1 (0.300 ± 0.010)
0.457 ± 0.076 0.254 ± 0.0127
ed (0.018 ± 0.003) if (0.010 ± 0.0005) +00 0.65 0 -
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
0.813 ± 0.102 mm
pe (0.032 ± 0.004) — (inches)
2.286 MAX. PCB Land Pattern
(0.090 MAX.)
2.540 ± 0.127 0 MIN / 0.102 MAX
(0.100 ± 0.005) (0 MIN / 0.004 MAX) 2.54
(0.10)
(0.250 ± 0.005)6.350 ± 0.127 (0.370 ± 0.005)9.398 ± 0.127 (0.300 ± 0.010)7.620 ± 0.254 (0.025 ± 0.005)0.635 ± 0.127
8.70
h Pin 1 e ! 0.203 ± 0.013 T t (0.0610)1.55 sat h, (0.3425)
_ | 9.652 ± 0.381 (0.008 ± 0.0005) a t : |
(0.380 ± 0.015)
0.65
2.159 ± 0.025 (0.0255)
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003) Dimensions
0.864 ± 0.120 mm
(0.034 ± 0.004) (inches)
**----- End of picture text -----**
## **LBA110S** ## **LBA110P** R11 **www.ixysic.com** **8** **LBA110** INTEGRATED CIRCUITS DIVISION ## **MECHANICAL DIMENSIONS** ## **LBA110STR Tape & Reel** **==> picture [390 x 169] intentionally omitted <==** **----- Start of picture text -----**
2.0
(0.08)
4.0
(0.16)
330.2 DIA.
(13.00 DIA.)
7.5
(0.30)
Top Cover
Tape Thickness Bo=10.30
0.102 MAX. (0.406)
(0.004 MAX.) 16.0±0.3
(0.63±0.012)
Ao=10.30 P1=12.00
K0 =4.90 (0.406) (0.472)
(0.193)
Dimensions
K1 =4.20 User Direction of Feed mm
(0.165) (inches)
Embossed Carrier
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment 3. Controlling dimension: mm
**----- End of picture text -----**
## **LBA110PTR Tape & Reel** **==> picture [399 x 156] intentionally omitted <==** **----- Start of picture text -----**
2.00 4.00
330.2 DIA. (0.079) (0.157)
(13.00 DIA.)
7.50
Top Cover (0.295)
Tape Thickness0.102 MAX. Bo = 10.30 W = 16.00(0.63)
(0.004 MAX.) (0.406)
Ao = 10.30 P1 = 12.00
K0 = 2.70 (0.406) (0.472)
(0.106)
Dimensions
Embossed Carrier K1 (0.079)= 2.00 User Direction of Feed mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
3. Controlling dimension: mm
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