# Dual MOSFET, Complementary N and P Channel, 40 V, 40 V, 9.6 A, 9.6 A, 0.017 ohm

![Product image](https://novapart.co/image/farnell:4573819/)

**URL**: https://novapart.co/products/ISA170230C04LMDSXTMA1/dual-mosfet-complementary-n-and-p-channel-40-v-96
**SKU**: ISA170230C04LMDSXTMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Dual MOSFETs
**Price**: €0.3300
**Stock**: 1000+
**Lead Time**: 120 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 8Pins |
| Channel Type | Complementary N and P Channel |
| Product Range | OptiMOS 3 Series |
| Qualification | - |
| Transistor Case Style | SOIC |
| Operating Temperature Max | 150°C |
| Power Dissipation N Channel | 2.5W |
| Power Dissipation P Channel | 2.5W |
| Drain Source Voltage Vds N Channel | 40V |
| Drain Source Voltage Vds P Channel | 40V |
| Continuous Drain Current Id N Channel | 9.6A |
| Continuous Drain Current Id P Channel | 9.6A |
| Drain Source On State Resistance N Channel | 0.017ohm |
| Drain Source On State Resistance P Channel | 0.023ohm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4573819/)

**Public ISA170230C04LMDS Final datasheet** 

## **MOSFET** 

PG‑DSO‑8 

## OptiMOS™ 3 Power‑Transistors, 40 V 

## **Features** 

- Complementary N‑ and P‑channel 

- Very low on‑resistance R 

- 

   - DS(on) 

- Superior thermal resistance 

- 

- 100% avalanche tested 

- 

- Pb‑free lead plating; RoHS compliant 

- 

8 7 6 5 1 2 oy 3 4 

- Halogen‑free according to IEC61249‑2‑21 

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Source 1 Drain 1<br>Pin 1 Pin 8<br>Gate 1 *1 Drain 1<br>Pin 2 Pin 7<br>Source 2 Drain 2<br>Pin 3 Pin 6<br>Gate 2 *1 Drain 2<br>Pin 4 Pin 5<br>**----- End of picture text -----**<br>


## **Product validation** 

Qualified according to JEDEC Standard 

**Table 1        Key Performance Parameters** 

|Parameter|Value|Unit|
|---|---|---|
|V<br>DS (n‑channel)|40|V|
|R<br>DS(on),max (n‑channel)|17|mΩ|
|I<br>D (n‑channel)|9.6|A|
|V<br>DS (p‑channel)|‑40|V|
|R<br>DS(on),max (p‑channel)|23|mΩ|
|I<br>D (p‑channel)|‑8.8|A|



_*1: Internal body diode_ 

I ‑8.8 A D (p‑channel) Js Type/Ordering Code Package Marking Related Links ISA170230C04LMDS PG‑DSO‑8 1723C04L ‑ oF 

Datasheet https://www.infineon.com 

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## **Table of Contents** 

**Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1 Maximum ratings  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3 Thermal characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5 Electrical characteristics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  6 Electrical characteristics diagrams  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9 Package Outlines  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17 Revision History  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18 Trademarks  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18 Disclaimer  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18** 

Datasheet https://www.infineon.com 

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## **1   Maximum ratings** 

at TA=25 °C, unless otherwise specified 

**Table 2      Maximum ratings (n‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>9.6  VGS=10 V, TC=25 °C<br>6.1  VGS=10 V, TC=100 °C<br>Continuous drain current  [1)] ID ‑ ‑ 5.2  A VGS=4.5 V, TC=100 °C<br>7.2 VGS=10 V,TA=25 °C,RthJA=90 °C/W 2)<br>Pulsed drain current  [3)] ID,pulse ‑ ‑ 38 A TA=25 °C<br>Avalanche energy, single pulse  [4)] EAS ‑ ‑ 36 mJ ID=9.6 A, RGS=25 Ω<br>Gate source voltage VGS ‑20 ‑ 20 V ‑<br>2.5  TC=25 °C<br>Power dissipation Ptot ‑ ‑ 1.4 W TA=25 °C, RthJA=90 °C/W 2)<br>Operating and storage temperature T , Tj stg ‑55 ‑ 150 °C ‑<br>**----- End of picture text -----**<br>


1)    Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature as specified. For other case temperatures please refer to Diagram 2 for n‑channel and the Diagram 17 for p‑channel. De‑rating will be required based on the actual environmental conditions. 

2)    Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air. One transistor active. 

- 3)    See Diagrams 3 and 18 for more detailed information 

- 4)    See Diagrams 13 and 28 for more detailed information 

**Table 3      Maximum ratings (p‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>‑8.8  VGS=‑10 V, TC=25 °C<br>‑5.6  VGS=‑10 V, TC=100 °C<br>Continuous drain current  [5)] ID ‑ ‑ ‑4.9  A VGS=‑4.5 V, TC=100 °C<br>‑6.6 VGS=‑10 V,TA=25 °C,RthJA=90 °C/W 6)<br>Pulsed drain current  [7)] ID,pulse ‑ ‑ ‑35 A TA=25 °C<br>Avalanche energy, single pulse  [8)] EAS ‑ ‑ 36 mJ ID=‑8.8 A, RGS=25 Ω<br>Gate source voltage VGS ‑20 ‑ 20 V ‑<br>2.5  TC=25 °C<br>Power dissipation Ptot ‑ ‑ 1.4 W TA=25 °C, RthJA=90 °C/W 6)<br>Operating and storage temperature T , Tj stg ‑55 ‑ 150 °C ‑<br>**----- End of picture text -----**<br>


5)    Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature as specified. For other case temperatures please refer to Diagram 2 for n‑channel and the Diagram 17 for p‑channel. De‑rating will be required based on the actual environmental conditions. 

6)    Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air. One transistor active. 

Datasheet https://www.infineon.com 

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- 7)    See Diagrams 3 and 18 for more detailed information 

- 8)    See Diagrams 13 and 28 for more detailed information 

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## **2   Thermal characteristics** 

**Table 4      Thermal characteristics** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Thermal resistance, junction ‑ solder point RthJC ‑ ‑ 50 °C/W ‑<br>Thermal resistance, junction ‑<br>ambient, RthJA ‑ ‑ 150 °C/W ‑<br>minimal footprint, steady state<br>Thermal resistance, junction ‑<br>ambient, RthJA ‑ ‑ 90 °C/W ‑<br>6 cm² cooling area, steady state  [9)]<br>**----- End of picture text -----**<br>


9)    Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air. One transistor active. 

Datasheet https://www.infineon.com 

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## **3   Electrical characteristics** 

at =25 °C, unless otherwise specifiedTj 

**Table 5      Static characteristics (n‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Drain‑source breakdown voltage V(BR)DSS 40 ‑ ‑ V VGS=0 V, =1 mAID<br>Gate threshold voltage VGS(th) 1.1 ‑ 2.7 V VDS=VGS, =1000 μAID<br>Zero gate voltage drain current IDSS ‑ 0.1 10 1 100 μA VVDSDS=40 V, =40 V, VVGSGS=0 V, =25 °C =0 V, =125 °CTTjj<br>Gate‑source leakage current IGSS ‑ 10 100 nA VGS=20 V, VDS=0 V<br>Drain‑source on‑state resistance R ‑ 13  17  VGS=10 V, =9.6 A ID<br>DS(on)<br>18 23.6 [mΩ] VGS=4.5 V, =8.5 AID<br>Gate resistance RG ‑ 1.1 ‑ Ω ‑<br>Transconductance  [10)] gfs 12 25 ‑ S |VDS|≥2|ID|RDS(on)max, =9.6 AID<br>**----- End of picture text -----**<br>


- 10)    Defined by design. Not subject to production test. 

**Table 6      Static characteristics (p‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Drain‑source breakdown voltage V(BR)DSS ‑40 ‑ ‑ V VGS=0 V, =‑1 mAID<br>Gate threshold voltage VGS(th) ‑1.1 ‑ ‑2.7 V VDS=VGS, =‑1000 μAID<br>Zero gate voltage drain current IDSS ‑ ‑0.1  ‑1  VDS=‑40 V, VGS=0 V, =25 °C Tj<br>‑10 ‑100 [μA] VDS=‑40 V, VGS=0 V, =125 °CTj<br>Gate‑source leakage current IGSS ‑ ‑10 ‑100 nA VGS=‑20 V, VDS=0 V<br>Drain‑source on‑state resistance R ‑ 18  23  VGS=‑10 V, =‑8.8 A ID<br>DS(on)<br>23 29.5 [mΩ] VGS=‑4.5 V, =‑6.9 AID<br>Gate resistance RG ‑ 3 ‑ Ω ‑<br>Transconductance  [11)] gfs 12 24 ‑ S |VDS|≥2|ID|RDS(on)max, =‑8.8 AID<br>**----- End of picture text -----**<br>


- 11)    Defined by design. Not subject to production test. 

**Table 7      Dynamic characteristics (n‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Input capacitance  [12)] Ciss ‑ 880 1100 pF VGS=0 V, VDS=20 V, =1 MHzf<br>Output capacitance  [12)] Coss ‑ 220 290 pF VGS=0 V, VDS=20 V, =1 MHzf<br>Reverse transfer capacitance  [12)] Crss ‑ 15 26 pF VGS=0 V, VDS=20 V, =1 MHzf<br>Turn‑on delay time td(on) ‑ 6.7 ‑ ns VRDD=20 V, =1.6 ΩVGS=4.5 V, =9.6 A, ID<br>G,ext<br>**----- End of picture text -----**<br>


Datasheet https://www.infineon.com 

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**Table 7      Dynamic characteristics (n‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Rise time tr ‑ 5.0 ‑ ns VRDD=20 V, =1.6 ΩVGS=4.5 V, =9.6 A, ID<br>G,ext<br>Turn‑off delay time td(off) ‑ 4.6 ‑ ns VRDD=20 V, =1.6 ΩVGS=4.5 V, =9.6 A, ID<br>G,ext<br>Fall time tf ‑ 4.0 ‑ ns VRDD=20 V, =1.6 ΩVGS=4.5 V, =9.6 A, ID<br>G,ext<br>Gate to source charge Qgs ‑ 2.7 ‑ nC VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Gate charge at threshold Qg(th) ‑ 1.5 ‑ nC VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Gate to drain charge Qgd ‑ 1.6 ‑ nC VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Switching charge Qsw ‑ 2.8 ‑ nC VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Gate charge total  [12)] Qg ‑ 6.0 9.0 nC VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Gate plateau voltage Vplateau ‑ 3.1 ‑ V VDD=20 V, =9.6 A, ID VGS=0 to 4.5 V<br>Gate charge total Qg ‑ 13 19.5 nC VDD=20 V, =9.6 A, ID VGS=0 to 10 V<br>Output charge Qoss ‑ 7.8 ‑ nC VDS=20 V, VGS=0 V<br>**----- End of picture text -----**<br>


- 12)    Defined by design. Not subject to production test. 

**Table 8      Dynamic characteristics (p‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Input capacitance  [13)] Ciss ‑ 1900 2500 pF VGS=0 V, VDS=‑20 V, =1 MHzf<br>Output capacitance  [13)] Coss ‑ 750 980 pF VGS=0 V, VDS=‑20 V, =1 MHzf<br>Reverse transfer capacitance  [13)] Crss ‑ 38 67 pF VGS=0 V, VDS=‑20 V, =1 MHzf<br>Turn‑on delay time td(on) ‑ 15 ‑ ns VRDD=‑20 V, =1.6 ΩVGS=‑4.5 V, =‑8.8 A, ID<br>G,ext<br>Rise time tr ‑ 8.9 ‑ ns VRDD=‑20 V, =1.6 ΩVGS=‑4.5 V, =‑8.8 A, ID<br>G,ext<br>Turn‑off delay time td(off) ‑ 15 ‑ ns VRDD=‑20 V, =1.6 ΩVGS=‑4.5 V, =‑8.8 A, ID<br>G,ext<br>Fall time tf ‑ 7.4 ‑ ns VRDD=‑20 V, =1.6 ΩVGS=‑4.5 V, =‑8.8 A, ID<br>G,ext<br>Gate to source charge Qgs ‑ ‑5.9 ‑ nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>Gate charge at threshold Qg(th) ‑ ‑3.3 ‑ nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>Gate to drain charge Qgd ‑ ‑3.5 ‑ nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>Switching charge Qsw ‑ ‑6.1 ‑ nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>Gate charge total  [13)] Qg ‑ ‑12.6 ‑19 nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>**----- End of picture text -----**<br>


Datasheet https://www.infineon.com 

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**Table 8      Dynamic characteristics (p‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Gate plateau voltage Vplateau ‑ ‑3.1 ‑ V VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑4.5 V<br>Gate charge total  [13)] Qg ‑ ‑25 ‑38 nC VDD=‑20 V, =‑8.8 A, ID VGS=0 to ‑10 V<br>Output charge Qoss ‑ ‑22 ‑ nC VDS=‑20 V, VGS=0 V<br>**----- End of picture text -----**<br>


- 13)    Defined by design. Not subject to production test. 

**Table 9      Reverse diode (n‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Diode continuous forward current IS ‑ ‑ 3.1 A TC=25 °C<br>Diode pulse current IS,pulse ‑ ‑ 38 A TA=25 °C<br>Diode forward voltage VSD ‑ 0.86 1 V VGS=0 V, =9.6 A, =25 °CIF Tj<br>Reverse recovery time trr ‑ 13 ‑ ns VR=20 V, =9.6 A, dIF iF/dt=100 A/μs<br>Reverse recovery charge Qrr ‑ 4.3 ‑ nC VR=20 V, =9.6 A, dIF iF/dt=100 A/μs<br>**----- End of picture text -----**<br>


**Table 10      Reverse diode (p‑channel)** 

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Values<br>Parameter Symbol Unit Note/ Test Condition<br>Min. Typ. Max.<br>Diode continuous forward current IS ‑ ‑ ‑3.4 A TC=25 °C<br>Diode pulse current IS,pulse ‑ ‑ ‑35 A TA=25 °C<br>Diode forward voltage VSD ‑ ‑0.86 ‑1 V VGS=0 V, =‑8.8 A, =25 °CIF Tj<br>Reverse recovery time trr ‑ 22 ‑ ns VR=‑20 V, =‑8.8 A, dIF iF/dt=‑100 A/μs<br>Reverse recovery charge Qrr ‑ 11 ‑ nC VR=‑20 V, =‑8.8 A, dIF iF/dt=‑100 A/μs<br>**----- End of picture text -----**<br>


Datasheet https://www.infineon.com 

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## **4   Electrical characteristics diagrams** 

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Diagram 1: Power dissipation (n‑channel) Diagram 2: Drain current (n‑channel)<br>3.00 10<br>2.75<br>9<br>2.50<br>8<br>2.25<br>7<br>2.00<br>6<br>1.75<br>1.50 5<br>1.25<br>4<br>1.00<br>3<br>0.75<br>2<br>0.50<br>1<br>0.25<br>0.00 0<br>0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175<br>TC [°C] TC [°C]<br>Ptot=f(TC) ID=f(TC); VGS≥10 V<br>[W] [A]<br>Ptot ID<br>**----- End of picture text -----**<br>


Diagram 3: Safe operating area (n‑channel) 

Diagram 4: Max. transient thermal impedance (n‑ channel) 

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10 [2] 10 [3]<br>single pulse<br>0.01<br>1 µs<br>0.02<br>10 [1] 0.05<br>10 µs 0.1<br>0.2<br>10 [2]<br>0.5<br>10 [0] 100 µs<br>10 1 1 ms 10 [1]<br>10 2 10 ms<br>10 [0]<br>10 3<br>DC<br>10 4 10 1<br>10 1 10 [0] 10 [1] 10 [2] 10 5 10 4 10 3 10 2 10 1 10 [0] 10 [1]<br>VDS [V] tp [s]<br>ID=f(VDS); TC=25 °C; =0; parameter: D tp ZthJC=f(tp); parameter: =D tp/T<br>[A] [K/W]<br>D<br>I<br>thJC<br>Z<br>**----- End of picture text -----**<br>


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Diagram 5: Typ. output characteristics (n‑channel) 

Diagram 6: Typ. drain‑source on resistance (n‑channel) 

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40 40<br>10 V 4.5 V 3.5 V<br>5 V<br>35 4 V<br>35<br>30<br>30<br>25<br>25<br>20<br>3.5 V 4 V<br>20<br>4.5 V<br>15<br>5 V<br>15<br>10<br>10 V<br>3 V 10<br>5<br>0 5<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 2 4 6 8 10 12 14 16 18 20<br>VDS [V] ID [A]<br>ID=f(VDS), =25 °C; parameter: Tj VGS RDS(on)=f(ID), =25 °C; parameter: Tj VGS<br>Diagram 7: Typ. transfer characteristics (n‑channel) Diagram 8: Typ. drain‑source on resistance (n‑channel)<br>40 40<br>35<br>30<br>30<br>25<br>20<br>15<br>150 °C<br>20<br>10<br>150 °C<br>5 25 °C<br>25 °C<br>0 10<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 14 16<br>VGS [V] VGS [V]<br>ID=f(VGS), |VDS|>2|ID|RDS(on)max; parameter: Tj RDS(on)=f(VGS), =9.6 A; parameter: ID Tj<br>]<br>[m<br>[A]<br>D<br>I<br>DS(on)<br>R<br>]<br>[m<br>[A]<br>D<br>I<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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Diagram 9: Normalized drain‑source on resistance (n‑ channel) 

Diagram 10: Typ. gate threshold voltage (n‑channel) 

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1.8 2.4<br>1.6<br>1.4 2.0<br>1.2<br>1.0 1.6<br>0.8<br>0.6 1.2<br>75 50 25 0 25 50 75 100 125 150 175 75 50 25 0 25 50 75 100 125 150 175<br>Tj [°C] Tj [°C]<br>RDS(on)=f(Tj), =9.6 A, ID VGS=10 V VGS(th=f(Tj), VGS=VDS; parameter: =1000μAID<br>°C)<br>25<br>to<br>[V]<br>GS(th)<br>V<br>(normalized<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


Diagram 11: Typ. capacitances (n‑channel) 

Diagram 12: Forward characteristics of reverse diode (n‑ ch.) 

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10 [4] 10 [2]<br>25 °C<br>150 °C<br>10 [3]<br>Ciss<br>10 [1]<br>10 [2]<br>Coss<br>10 [0]<br>10 [1]<br>Crss<br>10 [0] 10 1<br>0 5 10 15 20 25 30 35 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>VDS [V] VSD [V]<br>C=f(VDS); VGS=0 V; =1 MHzf IF=f(VSD); parameter: Tj<br>[pF] [A]<br>F<br>C I<br>**----- End of picture text -----**<br>


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Diagram 13: Avalanche characteristics (n‑channel) Diagram 14: Typ. gate charge (n‑channel)<br>10 [2] 10<br>8 V<br>20 V<br>9 32 V<br>8<br>7<br>10 [1]<br>6<br>25 °C<br>5<br>100 °C 4<br>10 [0]<br>3<br>125 °C 2<br>1<br>10 1 0<br>10 [0] 10 [1] 10 [2] 10 [3] 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14<br>tAV [µs] Qgate [nC]<br>IAS=f(tAV); RGS=25 Ω; parameter: Tj,start VGS=f(Qgate), =9.6 A pulsed, =25 °C; parameter: ID Tj VDD<br>Diagram 15: Drain‑source breakdown voltage (n‑<br>Diagram 16: Power dissipation (p‑channel)<br>channel)<br>43 3.00<br>2.75<br>2.50<br>42<br>2.25<br>2.00<br>41<br>1.75<br>1.50<br>1.25<br>40<br>1.00<br>0.75<br>39<br>0.50<br>0.25<br>38 0.00<br>75 50 25 0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175<br>Tj [°C] TC [°C]<br>VBR(DSS)=f(Tj); =1 mAID Ptot=f(TC)<br>[A] [V]<br>AV GS<br>I V<br>[V]<br>[W]<br>tot<br>BR(DSS) P<br>V<br>**----- End of picture text -----**<br>


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Diagram 17: Drain current (p‑channel) Diagram 18: Safe operating area (p‑channel)<br>10 10 [2]<br>1 µs<br>9<br>10 µs<br>10 [1]<br>8<br>7 100 µs<br>10 [0]<br>6<br>5 10 1 1 ms<br>4<br>10 2 10 ms<br>3<br>2<br>10 3<br>1<br>DC<br>0 10 4<br>0 25 50 75 100 125 150 175 10 1 10 [0] 10 [1] 10 [2]<br>TC [°C] VDS [V]<br>ID=f(TC); |VGS|≥10 V ID=f(VDS); TC=25 °C; =0; parameter: D tp<br>[A] [A]<br>ID ID<br>**----- End of picture text -----**<br>


Diagram 19: Max. transient thermal impedance (p‑ channel) 

Diagram 20: Typ. output characteristics (p‑channel) 

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10 [3] 40<br>single pulse 10 V 5 V<br>0.01 4.5 V<br>0.02 35<br>0.05<br>0.1<br>0.2 4 V<br>10 [2] 30<br>0.5<br>25<br>10 [1] 20<br>3.5 V<br>15<br>10 [0] 10<br>3 V<br>5<br>10 1 0<br>10 5 10 4 10 3 10 2 10 1 10 [0] 10 [1] 0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>tp [s] VDS [V]<br>ZthJC=f(tp); parameter: =D tp/T ID=f(VDS), =25 °C; parameter: Tj VGS<br>[A]<br>[K/W]<br>D<br>thJC I<br>Z<br>**----- End of picture text -----**<br>


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Diagram 21: Typ. drain‑source on resistance (p‑channel) Diagram 22: Typ. transfer characteristics (p‑channel) 

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60 40<br>35<br>50<br>30<br>3.5 V<br>25<br>40<br>20<br>4 V<br>30<br>15<br>4.5 V<br>10<br>5 V<br>20<br>5<br>10 V<br>150 °C<br>25 °C<br>10 0<br>0 2 4 6 8 10 12 14 16 18 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0<br>ID [A] VGS [V]<br>RDS(on)=f(ID), =25 °C; parameter: Tj VGS ID=f(VGS), |VDS|>2|ID|RDS(on)max; parameter: Tj<br>Diagram 23: Typ. drain‑source on resistance (p‑channel) [Diagram 24: Normalized drain‑source on resistance (p‑]<br>ch.)<br>60 1.6<br>50 1.4<br>40 1.2<br>30 1.0<br>150 °C<br>20 0.8<br>25 °C<br>10 0.6<br>0 2 4 6 8 10 12 14 16 75 50 25 0 25 50 75 100 125 150 175<br>VGS [V] Tj [°C]<br>RDS(on)=f(VGS), =‑8.8 A; parameter: ID Tj RDS(on)=f(Tj), =‑8.8 A, ID VGS=‑10 V<br>]<br>[m [A]<br>D<br>I<br>DS(on)<br>R<br>°C)<br>25<br>] to<br>[m<br>DS(on)<br>R<br>(normalized<br>DS(on)<br>R<br>**----- End of picture text -----**<br>


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Diagram 25: Typ. gate threshold voltage (p‑channel) 

Diagram 26: Typ. capacitances (p‑channel) 

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2.2 10 [4]<br>Ciss<br>2.0<br>10 [3]<br>Coss<br>1.8<br>1.6 10 [2]<br>1.4 Crss<br>10 [1]<br>1.2<br>1.0 10 [0]<br>75 50 25 0 25 50 75 100 125 150 175 0 5 10 15 20 25 30 35 40<br>Tj [°C] VDS [V]<br>VGS(th=f(Tj), VGS=VDS; parameter: =1000μAID C=f(VDS); VGS=0 V; =1 MHzf<br>[V]<br>[pF]<br>GS(th) C<br>V<br>**----- End of picture text -----**<br>


Diagram 27: Forward characteristics of reverse diode (p‑ ch.) 

Diagram 28: Avalanche characteristics (p‑channel) 

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10 [2] 10 [2]<br>25 °C<br>150 °C<br>10 [1] 10 [1]<br>25 °C<br>100 °C<br>10 [0] 10 [0]<br>125 °C<br>10 1 10 1<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 10 [0] 10 [1] 10 [2] 10 [3]<br>VSD [V] tAV [µs]<br>IF=f(VSD); parameter: Tj IAS=f(tAV); RGS=25 Ω; parameter: Tj,start<br>[A]<br>[A]<br>IF IAV<br>**----- End of picture text -----**<br>


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Diagram 29: Typ. gate charge (p‑channel) 

Diagram 30: Drain‑source breakdown voltage (p‑ channel) 

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10 42<br>8 V<br>er ba<br>20 V<br>9 32 V<br>8 Mr<br>Vj<br>7<br>Mf<br>V4 41<br>6 bie<br>5 Vi<br>Ve<br>4<br>40<br>3<br>2<br>1<br>0 od 39<br>0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 75 50 25 0 25 50 75 100 125 150 175<br>Qgate [nC] Tj [°C]<br>rs VGS=f(Qgate), =‑8.8 A pulsed, =25 °C; parameter: ID Tj VDD VBR(DSS)=f(Tj); =‑1 mAID<br>[V]<br>[V]<br>GS<br>V BR(DSS)<br>V<br>**----- End of picture text -----**<br>


## Gate charge waveforms ee 

‑ ee 

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## **5   Package Outlines** 

|PACKAGE - GROUP<br>NUMBER:|PACKAGE - GROUP<br>NUMBER:|**PG-DSO-8-U02**|**PG-DSO-8-U02**|
|---|---|---|---|
|**DIMENSIONS**||MIN.<br>MAX.<br>**MILLIMETERS**||
|**A**||0.18|0.25|
|**A1**||1.35|1.75|
|**b**||0.38|0.51|
|**c**||0.254||
|**D**||4.80|5.00|
|**E**||5.80|6.20|
|**E1**||3.80|4.00|
|**e**||1.27||
|**L**||0.48|0.91|
|**O**||4°||
|**N**||8||



**Figure 1** Outline PG‑DSO‑8, dimensions in mm 

Datasheet https://www.infineon.com 

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## **Revision History** 

ISA170230C04LMDS 

## **Revision 2024‑10‑02, Rev. 2.0** 

Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2024‑10‑02 Release of final datasheet 

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Published by Infineon Technologies AG 81726 München, Germany © 2024 Infineon Technologies AG All Rights Reserved. 

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## Information 

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## Warnings 

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. 

The Infineon Technologies component described in this Data Sheet may be used in life‑support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life‑support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 

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---

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