# Power MOSFET, N Channel, 55 V, 47 A, 0.022 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8651418/)

**URL**: https://novapart.co/products/IRLZ44NPBF/power-mosfet-n-channel-55-v-47-a-0022-ohm-to-220ab
**SKU**: IRLZ44NPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.5200
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:41A; Drain Source Voltage Vds:55V; On Resistance Rds(on):0.022ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Powe

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET Series |
| Qualification | - |
| Power Dissipation | 110W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 55V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 47A |
| Drain Source On State Resistance | 0.022ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8651418/)

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D<br>Voss = SSV<br>G Rpgvon) = 0.022 Ω<br>Ip =47A<br>S<br>eS<br>TO-220AB<br>**----- End of picture text -----**<br>


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Vieajoss __| Drain-to-Souree Breakdown Votage [55 [——[—— | V_| Ves=OV, lp = 250uA<br>∆<br>| — | — [0.022] Ves = 10V, Ip = 25A ©<br>Ω<br>| — | —|0.035| Ves = 4.0V, Ip = 21A ®<br>Vottage———+|<br>Vesti)Ue | Transconductance———~([|_21_|——|—- Gate Threshold 4.0 [=| 2.0 [ V_| Vos= Ves, lo  = 250uA<br>____| Forward | S| Vps=25V, Ip = 25A<br>| P=<br>Ipss [= 728 Tn [Nos 55V, Vas = OV<br>Drain-to-Source Leakage Current r — [—| 250 | H Vos = 44V, Vas = OV, T) = 150°C<br>eos fate Fond teaage | — [| 100 |, [Vesey<br>Q,__| [  Gate-to-Source Reverse Leakage [ —— |[—-|-100| " | Vas =-16V<br>Qys___| Total Gate Charge | [| 48 | «| = 28<br>Qgr Gate-to-Source Charge =| —- | | 8.6 | ac | Vos = 4av<br>tuo, | Gate-to-Drain (‘Miler’) Charge | —- |——| 25 |__| Vos = 5.0V, See  Fig. 6  and 13 ©<br>t | Tumm-On DelayTime | | 11 || | Von = 28V<br>ton RiseTime SS*d | 84 J gg | to = 258 Ω,<br>ti |—SSSSS~wS~CSTum-Off DelayTime S| —— | 26 || ™| Ro=34 Ω,  Veg =5.0V<br>fFalTime . || R14 Between lead, See Fig. 100 D<br>G<br>Ls Internal Source Inductance 75 .<br>Cis [Input Capacitance «| == [1700 — ‘| and Vos center = OV of die contact S<br>Coss | Output Capacitance ‘| —- | 400[ | pF | Vos=25v<br>Cres |__| f= 1.0MbHz, See Fig. 5<br>Source-Drain Ratings and Characteristics<br>D<br>(Body Diode) A showing the<br>G<br>(Body Diode) © p-n junction diode. S<br>Veo__| Diode Forward Votage «| =| =| 13 | V | Ty= 25°C, ls= 268, Ves=0V 0<br>ts [Reverse Recovery Time (| —| 80] 120| ns | T)=25°C, Ir =25A<br>RecoveryCharge<br>tonQi, | Reverse ‘| ——| Intrinsic 210] turn-on 320 | time  nC is negligible | diet = 100Aius (turn-on is  © dominated by Lg+Lp)<br>Notes:<br>© Repetitive rating; pulse width limited by @ ISD ≤ 25A, di/dt ≤ 270A/us, Vpp ≤ V«er)pss:<br>max. junction temperature. ( See fig. 11 ) Ty ≤ 175°C<br>@ Vpp = 25V, starting Ty = 25°C, L = 470uH @ Pulse width ≤  300us; duty cycle  ≤ 2%.<br>Ω<br>**----- End of picture text -----**<br>


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1000<br> TOP           15V<br>                   12V<br>                   10V a a<br>                   8.0V a<br>                   6.0V<br>                   4.0V<br>                   3.0V<br> BOTTOM   2.5V HT<br>100 eee” aviiimellll<br>aan eee<br>ER) . ae eee<br>a | ee<br>ey<br>2A ee |<br>10 7a<br>Of py<br>C27 SEeeee<br>a>Yoanette 2.5V 00nnn |<br> 20µs PULSE WIDTH<br>e GaiaH  T   = 25°CJ<br>1<br>0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>I   , Drain-to-Source Current (A)D<br>**----- End of picture text -----**<br>


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1000<br> TOP           15V<br>                   12V<br>                   10V LS a<br>                   8.0V 0 a<br>                   6.0V<br>                   4.0V<br>                   3.0V<br> BOTTOM   2.5V ee eeeeor<br>100 een alll<br>Pe<br>Se 2 ee<br>en<br>A<br>en” Z|<br>10 |ey’ — rrZa 2.5V<br>| _ GF PAL | fy [ey]<br>|MO7YA Ay<br> 20µs PULSE WIDTH<br>Ait@nimnai  T   = 175°CJ<br>1<br>0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>I   , Drain-to-Source Current (A)D<br>**----- End of picture text -----**<br>


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3.0 PMA LTTE EL<br>2.5 PTPPT<br>2.0 PTE<br>HERE OOD OE RE a<br>1.5 PEPE re<br>HERRSLA<br>1.0 ca<br>LT<br>0.5 aEOC<br>a<br>0.0 PT<br>PDT Eto<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T   , Junction Temperature (°C)J<br>(Normalized)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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1000 === == SS SS<br>ee ee<br>es OeOO<br>pf<br>T  = 25°CJ<br>100 fae ——_ase<br>a T  = 175°CJ<br>a rr ee<br>Pp Af<br>10 Yeceeee<br>4 ee ee ee ee ee<br>i7A cee ee a<br>72 ne ee ee ee ee<br> V     = 25VDS<br>1 TT)PL TY1 seccous eursepurse moresora A<br>2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2800<br>V      = 0V,         f = 1MHzGS<br>|_| | C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds<br>2400 C      = Crss         gd<br>s C      = oss        ds         gdC     + C<br>2000 Pe So<br>aee<br>1600<br>ee ll<br>ss<br>1200 Sot<br>800 eel<br>ss<br>SS<br>400<br>0 llleeEE<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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1000<br>fans eee<br>ee<br>100 Pf tLe<br>|__| 44 _,___<br>T  = 175°CJ<br>— —— a<br>4<br>T  = 25°CJ<br>10 AA ff P. ow<br>0.4 0.8 1.2 1.6 2.0 2.4<br>V     , Source-to-Drain Voltage (V)SD<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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15<br>I    = 25AD<br>ian Pt<br>12<br>po fpf<br>PTT<br>9 Py la<br>Hf<br>AT<br>6<br>J-<br>3<br>oy<br>TT TT<br> FOR TEST CIRCUIT<br>    SEE FIGURE 13<br>0 7] fit tf STTTTT,<br>0 10 20 30 40 50 60 70<br>Q   , Total Gate Charge (nC)G<br>GS<br>V     , Gate-to-Source Voltage (V)<br>**----- End of picture text -----**<br>


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1000<br> OPERATION IN THIS AREA LIMITED<br>                       BY RDS(on)<br>eenennn:<br>|<br>100 10µs<br>Pa t<br>100µs<br>PS N y<br>AL<br>10 e e<br>1ms<br>el ee U<br>10ms<br>pas  Single Pulse OU e ll<br>1<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>I   , Drain Current (A)D<br>**----- End of picture text -----**<br>


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50 Nite t ttt tty Vos in<br>40 PSA ves Toys<br>PT LN EEE EEE Ro | an -<br>30 Pi TL | ANEE TE »<br>PETE ET EIN ET }} 5.0v ≤ 1<br>≤ 0.1 %<br>2010 SEey EREREERNEEte P TEND Fig 10a. ouyeacerSwitching Time Test Circuit<br>VDS<br>FLEETE ET T y 90%<br>0<br>25 SE 50 75 RRE 100 125 150 175 |<br>T   , Case TemperatureC (  C)°<br>|<br>10%<br>VGS<br>Fig 9. Maximum Drain Current Vs. ; vl . an<br>Case Temperature td(on) tr td(off) tf<br>Fig 10b. Switching Time Waveforms<br> 10<br>PE<br>Pf fe]<br> 1 Seee<br>D = 0.50 ee<br>a a A OO<br>0.20 eer Se os ee ee ee ee<br>0.10<br>PDM<br>0.1 B 0.05 r<br>t1<br>0.02 SINGLE PULSE<br>ee o 0.01 eer (THERMAL RESPONSE) eee eeee eeeeee ee 1. Duty factor D =Notes: t   / t1 2 t2<br>PE 2. Peak T J = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1<br>t  , Rectangular Pulse Duration (sec)1<br>I   , Drain Current (A)D<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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L<br>VDS<br>D.U.T.<br>RG +<br>cw. - VDD<br>IAS<br>Hsev J tp t 0.01Ω<br>snoe|<br>**----- End of picture text -----**<br>


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V(BR)DSS<br>t<br>p<br>VDD<br>/ /<br>VDS / VL<br>yf<br>IAS<br>**----- End of picture text -----**<br>


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500<br>                    ID<br>GaRaeeee TOP            10A<br>                   17A<br>400 BOTTOM    25A<br>NeBNEEEEEE<br>300 KIXPK | tt<br>200 XEN<br>NAGA<br>100<br>Beh NONe Eee<br>PSST<br> V      = 25V po DD SS<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature (°C)J<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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Current Regulator<br>Oo Same Type as D.U.T. 7<br>|<br>50KΩ<br>QG —_ 12V .2µF .3µF<br>° 1 mc<br>a Z +<br>A QGS QGD D.U.T. -VDS<br>VGS<br>VG<br>3mA<br>va & |<br>Or.<br>IG ID<br>Charge Current Sampling Resistors<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Rg •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ii Current di/dt /<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  __ Forward Drop _<br>® Inductor Curent ee ee<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


## Dimensions are shown in millimeters (inches) 

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10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>| an CI = 1.22 (.048)<br>6.47 (.255)<br>4 6.10 (.240)<br><a<br>15.24 (.600)<br>14.84 (.584)<br>LEAD ASSIGNMENTS<br>1.15 (.045)     MIN HEXFETLEAD ASSIGNMENTS       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>| dar_ 3- SOURCE4- DRAIN       4 - DRAIN 3- EMITTER4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [0.93 (.037)] 0.69 (.027) 3X [0.55 (.022)] 0.46 (.018)<br>3X We [1.40 (.055)] 1.15 (.045) 0.36  (.014)        M    B   A   M 2.92 (.115)<br>2.64 (.104)<br>a, 2.54 (.100) || T<br>2X<br>NOTES:<br>**----- End of picture text -----**<br>


- 1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 

- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

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E XAMPLE: T HIS  IS  AN IRF1010<br>LOT  CODE 1789<br>AS S EMBLED ON WW 19, 1997 INT ERNAT IONAL PART  NUMBER<br>IN T HE AS S E MBLY LINE "C" RE CT IFIER<br>LOGO<br>Note: position indicates "Lead-Free"  "P" in assembly line DAT E CODE<br>YEAR  7 =  1997<br>AS SE MBLY<br>LOT  CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 11/03 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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---

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