# Power MOSFET, N Channel, 55 V, 27 A, 0.035 ohm, TO-220AB, Through Hole

![Product image](https://novapart.co/image/farnell:8651396/)

**URL**: https://novapart.co/products/IRLZ34NPBF/power-mosfet-n-channel-55-v-27-a-0035-ohm-to-220ab
**SKU**: IRLZ34NPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.4350
**Stock**: 1000+
**Lead Time**: 190 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:27A; Drain Source Voltage Vds:55V; On Resistance Rds(on):0.035ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:2V; Power Dis

## Specifications

| Parameter | Value |
|---|---|
| Msl | - |
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | - |
| Qualification | - |
| Power Dissipation | 56W |
| Transistor Mounting | Through Hole |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-220AB |
| Drain Source Voltage Vds | 55V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 27A |
| Drain Source On State Resistance | 0.035ohm |
| Gate Source Threshold Voltage Max | 2V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:8651396/)

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D<br>Voss = 55V<br>Rpg(on) = 0.035 Ω<br>G DS(on)<br>Ip = 30A<br>S<br>TO-220AB<br>**----- End of picture text -----**<br>


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Ric θ<br>Ros θ<br>Rs<br>**----- End of picture text -----**<br>


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∆ | — | — [0.035 V/°C| VR e ferences = 10V,toIp25°C,= 16AIp®= 1mA<br>Ω<br>Static Drain-to-Source On-Resistance |Soc— | — [0.060 V ea s  == 4.0V,5.0V, Ip Ip == 1 64 A ©<br>Gate Threshold Voltage | 1.0 | -—-| 20 | V_ | Vos= Ves, Ip = 250HA<br>Forward Transconductance | 11 [—-|—]|S$ | Vos=25V, Ip =16A<br>Drain-to-Source, -to- [TTT aA [Mos= 58V, Ves= OV<br>Leakage Current | — | —| 250 | HM Vos = 44V, Vas = OV, T) = 150°C<br>less Gate-to-Source Forward Leakage ge | —~ | [—|] na Ves [Ves = 16V<br>___| Total Gate-to-Source Gate ChargeReverse Leakage |Sree—- | —|-100 | Vos = = -16V<br>|Qgs__ | Gate-to-Source Charge | —- | —-| 5.2 |] nc | Vos=44v<br>|Qga_ | Gate-to-Drain ("Miller") Charge | —- | —-| 14 | Ves = 5.0V, See Fig. 6 and 13 ©<br>fe [RiseTimeTurn-On Delay Time SSSe| 100 —] ,,, | v= 188<br>Turn-Off Delay Time | — | 21 | —| Re =6.5 Ω,  Ves = 5.0V<br>Fall Time Pf Ω,<br>28 fj Ro=18 See Fig. 10.0 D<br>.<br>Internal Drain Inductance | —| as |— | aH 6mmBetween(0.25in.)lead,<br>G<br>Ls Internal Source Inductance 75 from package .<br>and center of die contact S<br>input Capacitance Se<br>Output Capacitance | -—— |220]-—— ] pF | Vos=25V<br>Reverse Transfer Capacitance — — f = 1.0MHz, See Fig. 5<br>Source-Drain Ratings and Characteristics<br>Is Continuous Source Current MOSFET symbol D<br>(Body Body Diode) 30 A showing g the<br>Ism Pulsed Source Current 410 integral reverse G<br>(Body Diode) © p-n junction diode. S<br>Vsp Diode Forward Voltage |—-|-—-|1.3 | V_ | T= 25°C, Is = 16A, Ves = OV ®<br>tr Reverse Recovery Time | —| 76 | 110] ns | Ty = 25°C, Ir = 16A<br>Qn Reverse RecoveryCharge | ——|190]290 | nc | di/dt = 100A/us ®<br>ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by Ls+Lp)<br>Notes:<br>Repetitive rating; pulse width limited by 6) ISD ≤ 16A, di/dt ≤ 270A/Us, Vpp ≤ Vierypss:<br>max. junction temperature. ( See fig. 11 ) Ty ≤ 175°C<br>Vpp = 25V, starting Ty = 25°C, L = 610HH @ Pulse width ≤  300ys; duty cycle  ≤ 2%.<br>Ω<br>**----- End of picture text -----**<br>


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1000<br> TOP           15V<br>                   12V<br>                   10V<br>                   8.0V | |<br>                   6.0V<br>                   4.0V<br>100                    3.0V BOTTOM   2.5V TEL<br>mere ee<br>10 geet |<br>ZF Me en |<br>1 2.5V<br>Bt e l<br>a<br> 20µs PULSE WIDTH<br>Py  T   = 25°CJ<br>0.1<br>0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>I   , Drain-to-Source Current (A)D<br>**----- End of picture text -----**<br>


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1000 aerene a ee ae ae ee ea oe<br>100<br>T  = 25°CJ<br>T  = 175°CJ<br>P|aa A<br>Wa Eee<br>10<br>5 / Senseo ee eeeeee<br>ee ee<br>1<br>[a<br>seeeeeeaeeeeeee<br>0.1 EETPEEE  V     = 25V 20usope DS  purspurs e w ioore tH<br>2 3 4 5 6 7 8 9 10<br>V     , Gate-to-Source Voltage (V)GS<br>D<br>I   , Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000<br> TOP           15V<br>                   12V<br>                   10V<br>                   8.0V 0 | |<br>                   6.0V<br>                   4.0V<br>100                    3.0V BOTTOM   2.5V Amat<br>Te<br>10 ME"a<br>2.5V<br>( L o<br>1<br>772d |<br>a<br> 20µs PULSE WIDTH<br>PT  T   = 175°CJ<br>0.1<br>0.1 1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>Fig 2. Typical Output Characteristics<br>3.0<br>2.5 A AA<br>LO LOO<br>2.0<br>EUR EREN UH OHUREREED?40<br>4<br>1.5<br>1.0 ANA AHAADS >= 00 00 HL<br>Ee za<br>0.5 ACE EEE:<br>TE<br>0.0 PEE Ev = tow<br>-60 -40 -20 0 20 40 60 80 100 120 140 160 180<br>T   , Junction Temperature (°C)J<br>I   , Drain-to-Source Current (A)D<br>(Normalized)<br>DS(on)<br>R           ,  Drain-to-Source On Resistance<br>**----- End of picture text -----**<br>


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1400<br>V      = 0V,         f = 1MHzGS<br>C      = C     + C     ,   C     SHORTEDiss         gs         gd         ds<br>1200 C      = Crss         gd<br>yO s C      = C     + Coss        ds         gd<br>1000 Faa<br>800<br>Se eee ell<br>ss<br>600<br>Se<br>400<br>P| TAN<br>ss<br>SL<br>200<br>SS Sl<br>eePSee ll<br>0<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>C, Capacitance (pF)<br>**----- End of picture text -----**<br>


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1000<br>Pit tty tt tt yy<br>100<br>T  = 175°CJ<br>re 7, ee<br>T  = 25°CJ<br>10 PF ti LT YyYw Tt<br>HIAA | | |<br>ae eee ee<br>or<br>1 iePPE A ew<br>0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0<br>V     , Source-to-Drain Voltage (V)SD<br>I     , Reverse Drain Current (A)SD<br>**----- End of picture text -----**<br>


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15<br>I    = 16AD<br>12 TL<br>ae<br>9<br>va<br>6<br>|  EA<br>a4<br>3<br>pet | | | |<br>TTT Te<br> FOR TEST CIRCUIT<br>7] fit tt     SEE FIGURE 13 a<br>0<br>0 4 8 12 16 20 24 28 32<br>Q   , Total Gate Charge (nC)G<br>Fig 6. Typical Gate Charge Vs.<br>Gate-to-Source Voltage<br>1000<br> OPERATION IN THIS AREA LIMITED<br>                       BY RDS(on)<br>ee eaee<br>100<br>10µs<br>pe SS T<br>100µs<br>10 PPS,p S Taal<br>a<br>1ms<br>PR th<br>10ms<br>1 BBE  Single Pulse OOf A<br>1 10 100<br>V     , Drain-to-Source Voltage (V)DS<br>GS<br>V     , Gate-to-Source Voltage (V)<br>I   , Drain Current (A)D<br>**----- End of picture text -----**<br>


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40 SRRRRE Rp<br>[yt] [tT] “@ ((epper<br>30 Petey [TT] Eee ves<br><I Re L -<br>PPS EEE EET :<br>20 PEL PNA ELE Ban ≤ 1<br>≤ 0.1 %<br>PETE paEAN Pulsecae Width us<br>10 PL TL Ey ELaN EINE Fig 10a. Switching Time Test Circuit<br>VDS<br>BERR RRREEERN<br>90%<br>Pitt A [—"<br>0<br>25 50 75 100 125 150 175<br>T   , Case TemperatureC (  C)°<br>TT 10% \ OV<br>/ \<br>VGS IorKo“oe<br>Fig 9. Maximum Drain Current Vs. td(on) tr td(off) tf<br>I   , Drain Current (A)D<br>**----- End of picture text -----**<br>


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 10<br>a OS<br>a GO OO<br>FE a<br>D = 0.50<br> 1 p d ESeeean<br>a 0.20 ee<br>0.10<br>r e<br>0.05 en PDM<br>0.1 0.02 SINGLE PULSE<br>Ce 0.01 e  Tf (THERMAL RESPONSE) t1<br>na e<br>ce t2<br>po Notes:<br>1. Duty factor D = t   / t1 2<br>2. Peak TJ = P DM x  Z thJC + TC<br>0.01<br>0.00001 0.0001 0.001 0.01 0.1<br>t  , Rectangular Pulse Duration (sec)1<br>thJC<br>(Z        )<br>Thermal Response<br>**----- End of picture text -----**<br>


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L<br>VDS<br>D.U.T.<br>RG +<br>lw - VDD<br>—_ IAS<br>o e tp 0.01Ω<br>wwe<br>**----- End of picture text -----**<br>


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V(BR)DSS<br>t<br>p<br>VDD<br>VDS / / \ J/<br>yf<br>IAS<br>12b. Unclamped Inductive<br>QG<br>A QGS QGD<br>VG toe<br>Charge<br>**----- End of picture text -----**<br>


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250<br>                    I D<br>GER aee TOP            6.6A<br>                   11A<br>200 Nae BNE EEE BOTTOM    16A<br>150<br>PNT<br>NERU<br>100 WN<br>PNINOIN EP dd |<br>50 PE NAN<br>pSA<br> V      = 25V pS DD<br>0<br>25 50 75 100 125 150 175<br>Starting T  , Junction Temperature (°C)J<br>AS<br>E     ,   Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


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Current Regulator<br>Same Type as D.U.T.<br>50KΩ<br>12V .2µF<br>.3µF<br>+<br>D.U.T. -VDS<br>VGS<br>(ss<br>3mA<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


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D.U.T + Circuit Layout Considerations<br>™    •  Low Stray Inductance<br>@  •   Ground Plane<br> •   Low Leakage Inductance<br>| - Current Transformer<br>+<br>- - +<br>(0<br>®<br>Rg •   dv/dt controlled by Rg +<br>•   Driver same type as D.U.T. -<br>•<br>•   D.U.T. - Device Under Test<br>(1) Isp controlled by Duty Factor "D"<br>® Driver Gate Drive<br>P.W.<br>Period D =<br>P.W. | Period _t<br>VGS=10V<br>t<br>@ D.U.T. ISD Waveform<br>Reverse<br>Recovery Body Diode Forward<br>Current ii Current di/dt /<br>©) D.U.T. VDS Waveform<br>Diode Recovery<br>dv/dt<br>VDD<br>ma<br>Re-Applied<br>Voltage Body Diode  a Forward Drop<br>® Inductor Curent ee ee<br>Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


## Dimensions are shown in millimeters (inches) 

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10.54 (.415) 3.78 (.149) - B -<br>2.87 (.113) 10.29 (.405) 3.54 (.139) 4.69 (.185)<br>2.62 (.103) - A - 4.20 (.165) 1.32 (.052)<br>1.22 (.048)<br>6.47 (.255)<br>_ 4 6.10 (.240) g<br>aeey FO 7<br>15.24 (.600)<br>14.84 (.584) LEAD ASSIGNMENTS<br>1.15 (.045) LEAD ASSIGNMENTS<br>     MIN HEXFET       1 - GATE  IGBTs, CoPACK<br>1     2    3 1- GATE       2 - DRAIN 1- GATE<br>2- DRAIN       3 - SOURCE 2- COLLECTOR<br>| ar_ 3- SOURCE4- DRAIN       4 - DRAIN 3- EMITTER4- COLLECTOR<br>14.09 (.555)<br>13.47 (.530) 4.06 (.160)<br>3.55 (.140)<br>3X [0.93 (.037)] 0.69 (.027) 3X [0.55 (.022)] 0.46 (.018)<br>3X mii [1.40 (.055)] 1.15 (.045) 0.36  (.014)        M    B   A   M = 2.92 (.115)<br>2.64 (.104)<br>a, 2.54 (.100) || T<br>2X<br>NOTES:<br>**----- End of picture text -----**<br>


- 1  DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.             3  OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 

- 2  CONTROLLING DIMENSION : INCH                                                       4  HEATSINK & LEAD MEASUREMENTS DO NOT INCLUDE BURRS. 

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E XAMPLE: T HIS  IS  AN IRF1010<br>LOT  CODE 1789<br>AS S EMBLED ON WW 19, 1997 INT ERNAT IONAL PART  NUMBER<br>IN T HE AS S E MBLY LINE "C" RE CT IFIER<br>LOGO<br>Note: position indicates "Lead-Free"  "P" in assembly line DAT E CODE<br>YEAR  7 =  1997<br>AS SE MBLY<br>LOT  CODE WEEK 19<br>LINE C<br>**----- End of picture text -----**<br>


Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 

TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information **.** 11/03 

Note:  For the most current drawings please refer to the IR website at: http://www.irf.com/package/ 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



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