# Power MOSFET, N Channel, 25 V, 81 A, 4200 µohm, TO-252AA, Surface Mount

![Product image](https://novapart.co/image/farnell:2726023/)

**URL**: https://novapart.co/products/IRLR8256TRPBF/power-mosfet-n-channel-25-v-81-a-4200-ohm-to-252aa
**SKU**: IRLR8256TRPBF
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || FETs || Single MOSFETs
**Price**: €0.6220
**Stock**: 50+
**Lead Time**: 2 days (indicative)

## Description

Transistor Polarity:N Channel; Continuous Drain Current Id:81A; Drain Source Voltage Vds:25V; On Resistance Rds(on):0.0042ohm; Rds(on) Test Voltage Vgs:10V; Threshold Voltage Vgs:1.8V; P

## Specifications

| Parameter | Value |
|---|---|
| Msl | MSL 1 - Unlimited |
| Svhc | No SVHC (08-Jul-2021) |
| No. Of Pins | 3Pins |
| Channel Type | N Channel |
| Product Range | HEXFET |
| Qualification | - |
| Power Dissipation | 63W |
| Transistor Mounting | Surface Mount |
| Rds(On) Test Voltage | 10V |
| Transistor Case Style | TO-252AA |
| Drain Source Voltage Vds | 25V |
| Operating Temperature Max | 175°C |
| Continuous Drain Current Id | 81A |
| Drain Source On State Resistance | 4200µohm |
| Gate Source Threshold Voltage Max | 1.8V |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2726023/)

## PD - 96208A IRLR8256PbF IRLU8256PbF 

## **Applications** 

HEXFET ® Power MOSFET e High Frequency Synchronous Buck ~~a~~ Converters for Computer Processor Power **VDSS RDS(on) max Qg** ~~e~~ High Frequency Isolated DC-DC **25V 5.7m 10nC** Converters with Synchronous Rectification for Telecom and Industrial Use 

**Benefits** e Very Low RDS(on) at 4.5V VGS 

Ultra-Low Gate Impedance 

e Fully Characterized Avalanche Voltage and Current D-Pak I-Pak e Lead-Free IRLR8256PbF IRLU8256PbF RoHS compliant 

|||D-Pak|I-Pak|
|---|---|---|---|
|e|IRLR8256PbF<br>IRLU8256PbF<br>e|||
|||||
|**G**||**D**|**S**|
|Gate||Drain|Source|



## **Absolute Maximum Ratings** 

||**Parameter**|**Max.**|**Units**|
|---|---|---|---|
|VDS|Drain-to-Source Voltage|25|V|
|VGS|Gate-to-Source Voltage|± 20||
|ID @ TC= 25°C|Continuous Drain Current, VGS@ 10V<br>~~pO~~|81<br>~~pO~~|A<br>|
|ID@ TC= 100°C|Continuous Drain Current, VGS@ 10V<br>~~a~~|57<br>~~a~~||
|IDM<br>~~a~~|Pulsed Drain Current<br>~~pT~~<br>~~a~~|325<br>~~pT~~<br>||
|PD@TC= 25°C<br>~~a~~|Maximum Power Dissipation<br>~~aco~~|63<br>~~co~~|W<br>~~co~~|
|PD @TC= 100°C<br>~~a~~|Maximum Power Dissipation<br>~~aco~~|31<br>~~co~~||
|~~pa~~|Linear Derating Factor<br>~~co~~<br>~~eG~~<br>~~pa~~|0.42<br>~~co~~<br>~~eG~~|W/°C<br>~~co~~<br>~~eG~~|
|TJ<br>TSTG<br>~~pa~~|Operating Junction and<br>Storage Temperature Range<br>~~eG~~<br>~~pa~~|-55  to + 175<br>~~eG~~|°C<br>~~eG~~|
|~~pa~~|Soldering Temperature, for 10 seconds<br>~~pa~~|300 (1.6mm from case)||



## **Thermal Resistance** 

||**Parameter**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|
|RθJC|Junction-to-Case<br>~~a~~|–––<br>~~a~~|2.4<br>~~a~~|°C/W|
|RθJA|Junction-to-Ambient (PCB Mount)<br>~~a~~|–––<br>~~a~~|50<br>~~a~~||
|RθJA|Junction-to-Ambient<br>~~a~~|–––<br>~~a~~|110<br>~~a~~||



> Notes ® hrough © are on page 11 www.irf.com 

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**Static @ TJ = 25°C (unless otherwise specified)** 

||**Parameter**|**Min.**<br>~~Is~~|**Typ.**|**Max. **<br>~~GO~~|**Units**<br>~~GO~~|**Conditions**<br>~~(On~~|
|---|---|---|---|---|---|---|
|BVDSS|Drain-to-Source Breakdown Voltage<br>~~es~~|25<br>~~es~~<br>~~Is~~<br>~~rs I~~|–––<br>~~es~~<br>~~I~~|–––<br>~~es~~<br>~~GO~~<br>~~GO~~|V<br>~~es~~<br>~~GO~~<br>~~GO~~|VGS= 0V, ID= 250μA<br>~~es~~<br>~~(On~~|
|ΔΒVDSS/ΔTJ|Breakdown Voltage Temp. Coefficient<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~Is~~<br>~~es~~<br>~~rs I~~|18<br>~~es~~<br>~~es~~<br>~~I~~|–––<br>~~es~~<br>~~GO~~<br>~~es~~<br>~~GO~~|mV/°C<br>~~es~~<br>~~GO ~~<br>~~es~~<br>~~GO~~|Reference to 25°C, ID= 1mA<br>~~es~~<br> ~~(On~~<br>~~es~~|
|RDS(on)|Static Drain-to-Source On-Resistance<br>~~a~~|–––<br>~~rs I~~<br>~~a~~<br>~~a~~|4.2<br>~~I~~<br>~~a~~<br>~~ee~~|5.7<br>~~GO~~<br>~~a~~|mΩ<br>~~GO~~<br>~~a~~|VGS= 10V, ID= 25A<br>~~a~~<br>~~@~~|
|||–––<br>~~a~~<br>~~a~~|6.7<br>~~a~~<br>~~ee~~|8.5<br>~~a~~||VGS= 4.5V, ID= 20A<br>~~a~~<br>~~@~~|
|VGS(th)|Gate Threshold Voltage<br>~~a~~<br>~~es~~|1.35<br>~~a~~<br>~~a~~<br>~~es~~|1.8<br>~~a~~<br>~~ee~~<br>~~es~~|2.35<br>~~a~~<br>~~es~~|V<br>~~a~~<br>~~es~~|VDS= VGS, ID= 25μA<br>~~a~~<br>~~@~~<br>~~ee~~|
|ΔVGS(th)/ΔTJ|Gate Threshold Voltage Coefficient<br>~~es~~|–––<br>~~es~~|-7.2<br>~~es~~|–––<br>~~es~~|mV/°C<br>~~es~~||
|IDSS|Drain-to-Source Leakage Current<br>~~a~~|–––<br>~~a~~|–––<br>~~a~~|1.0<br>~~a~~|μA<br>~~a~~|VDS= 20V, VGS= 0V<br>~~a~~|
|||–––<br>~~a~~<br>~~ee~~|–––<br>~~a~~<br>~~ee~~|150<br>~~a~~<br>~~ee~~||VDS= 20V, VGS= 0V, TJ= 125°C<br>~~a~~|
|IGSS|Gate-to-Source Forward Leakage<br>~~es~~|–––<br>~~es~~|–––<br>~~es~~|100<br>~~es~~|nA<br>~~/ _——~~<br>~~G (~~|VGS= 20V<br>~~_——~~|
||Gate-to-Source Reverse Leakage<br>~~es~~|–––<br>~~es~~<br>~~rs~~|–––<br>~~es~~<br>~~I~~|-100<br>~~es~~<br>~~G~~||VGS= -20V<br>~~_——~~<br>~~(~~|
|gfs|Forward Transconductance<br>~~es~~<br>~~es~~|81<br>~~es~~<br>~~es~~<br>~~rs~~<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~I~~<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~G~~|S<br>~~/ _——~~<br>~~es~~<br>~~G (~~|VDS= 13V, ID= 20A<br>~~_——~~<br>~~es~~<br>~~(~~|
|Qg|Total Gate Charge<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~rs ~~<br>~~es~~<br>~~es~~|10<br>~~es~~<br> ~~I~~<br>~~es~~<br>~~es~~|15<br>~~es~~<br>~~G~~<br>~~es~~|nC<br>~~es~~<br>~~G (~~<br>~~GO~~|See Fig. 16<br>VGS= 4.5V<br>ID= 20A<br>VDS= 13V<br>~~es~~<br>~~(~~<br>~~(On~~|
|Qgs1|Pre-Vth Gate-to-Source Charge<br>~~es~~|–––<br>~~es ~~<br>~~es~~<br>~~es~~|2.3<br> ~~es~~<br>~~es~~|–––<br>~~es~~|||
|Qgs2|Post-Vth Gate-to-Source Charge<br>~~es~~|–––<br>~~es~~<br>~~es~~|1.6<br>~~es~~|–––<br>~~es~~|||
|Qgd|Gate-to-Drain Charge<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~es~~|3.6<br>~~es~~|–––<br>~~es~~|||
|Qgodr|Gate Charge Overdrive<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~es~~|2.6<br>~~es~~|–––<br>~~es~~|||
|Qsw|Switch Charge(Qgs2+ Qgd)<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~es~~<br>~~Is~~|5.1<br>~~es~~|–––<br>~~es~~<br>~~GO~~|||
|Qoss|Output Charge<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~Is~~<br>~~rs~~|9.0<br>~~es~~<br>~~I~~|–––<br>~~es~~<br>~~GO~~<br>~~GO~~|nC<br>~~es~~<br>~~GO~~<br>~~GO~~|VDS= 16V, VGS= 0V<br>~~es~~<br>~~(On~~<br>®|
|RG|Gate Resistance<br>~~es~~<br>~~es~~<br>~~es~~|–––<br>~~es~~<br>~~Is~~<br>~~es~~<br>~~rs~~|2.5<br>~~es~~<br>~~es~~<br>~~I~~|3.9<br>~~es~~<br>~~GO~~<br>~~es~~<br>~~GO~~|Ω<br>~~es~~<br>~~GO ~~<br>~~es~~<br>~~GO~~|~~es~~<br> ~~(On~~<br>~~es~~<br>®|
|td(on)|Turn-On DelayTime<br>~~es~~|–––<br>~~rs~~<br>~~es~~|9.7<br>~~I~~|–––<br>~~GO~~|ns<br>~~GO~~|VDD= 13V, VGS= 4.5V<br>RG= 1.8Ω<br>ID= 20A<br>See Fig. 14<br>®|
|tr|Rise Time<br>~~es~~<br>~~es~~|–––<br>~~rs ~~<br>~~es~~<br>~~es~~|46<br> ~~I~~<br>~~es~~|–––<br>~~GO~~<br>~~es~~|||
|td(off)|Turn-Off DelayTime<br>~~es~~|–––<br>~~es~~<br>~~es~~|12<br>~~es~~|–––<br>~~es~~|||
|tf|Fall Time<br>~~es~~|–––<br>~~es~~<br>~~es~~|8.5<br>~~es~~|–––<br>~~es~~|||
|Ciss|InputCapacitance<br>~~es~~|–––<br>~~es~~<br>~~es~~|1470<br>~~es~~|–––<br>~~es~~|pF|VGS= 0V<br>VDS= 13V<br>ƒ= 1.0MHz|
|Coss|Output Capacitance<br>~~es~~|–––<br>~~es~~<br>~~es~~<br>~~es~~|453<br>~~es~~|–––<br>~~es~~|||
|Crss|Reverse Transfer Capacitance<br>~~es~~|–––<br>~~es~~<br>~~es~~|185<br>~~es~~|–––<br>~~es~~|||



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1000 1000<br>VGS VGS<br>TOP           10V TOP           10V<br>4.5V 4.5V<br>3.7V 3.7V<br>enamel 3.5V fesensill anil 3.5V<br>100 3.3V 3.3V<br>3.0V 3.0V<br>a eee 2.7V 100 SS arieaanii 2.7V<br>BOTTOM 2.5V BOTTOM 2.5V<br>10<br>ee |LL<br>10<br>Po Pye<br>1 reer | | | Yr<br>2.5V<br>SHa 2.5V mn LT TT Orit ) ≤ 60μs PULSE WIDTH<br>0.1 Ba ≤ 60μs PULSE WIDTH ee   Tj = 25°C 1 Cl Tj = 175°C<br>0.1 1 10 100 0.1 1 10 100<br>VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)<br>Fig 1.   Typical Output Characteristics Fig 2.   Typical Output Characteristics<br>1000 2.0<br>ID = 25AD = 25A= 25A<br>a ee eee ee = ee V GS  = 10V<br>100<br>=e FEEL<br>1.5<br>+ T = 175°C f+ + F x<br>J<br>10<br>iff ttt] LIA<br>1.0<br>1 en 2 eee TJ = 25 ° eee C eee eee eee > J<br>Spossss Lei<br>ee Ae ee ee ee eee Ae<br>ee Ee ee eee VDS = 15V ;<br>aie ≤ 60μs PULSE WIDTH<br>0.1 0.5<br>oe ee ee<br>1 2 3 4 5 6 7 8 -60 -40 -20 0 20 40 60 80 100120140160180120140160180140160180160180180<br>TJ , Junction Temperature (°C)<br>VGS, Gate-to-Source Voltage (V)<br>ID, Drain-to-Source Current (A)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>ID, Drain-to-Source Current (A)<br>ID, Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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2.0<br>ID = 25AD = 25A= 25A<br>V GS  = 10V<br>FEEL<br>1.5<br>F x<br>LIA<br>1.0<br>> J<br>Lei<br>Ae<br>0.5<br>ee<br>-60 -40 -20 0 20 40 60 80 100120140160180120140160180140160180160180180<br>TJ , Junction Temperature (°C)<br>RDS(on) , Drain-to-Source On Resistance                        (Normalized)<br>**----- End of picture text -----**<br>


**Fig 3.** Typical Transfer Characteristics 

**Fig 4.** Normalized On-Resistance vs. Temperature 

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10000 5.0<br>VCGS  iss   = C = 0V,       f = 1 MHZgs + Cgd,  C ds SHORTED ID= 20A<br>C rss    = C gd  4.0 VDS= 20V<br>—] Coss   = Cds + Cgd ME VDS= 13V<br>re) Ciss 3.0 LL<br>1000<br>ATT Coss 2.0 TTT<br>Po LTH !<br>a<br>ee ee ee VTE<br>1.0<br>C rss<br>100 0.0<br>Ltrs rt =  VTE<br>1 10 100 0 1 2 3 4 5 6 7 8 9 10 11 12 13<br>VDS, Drain-to-Source Voltage (V)  QG,  Total Gate Charge (nC)<br>Fig 5.   Typical Capacitance vs. Fig 6.   Typical Gate Charge vs.<br>Drain-to-Source Voltage Gate-to-Source Voltage<br>1000<br>1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)(on)<br>100<br>| 7A APRNPRNRNN 100μsec<br>—— TJ = 175°C 100 ASOSetteSO 1msec re Il<br>10<br>pf f | | | SetteSO<br>10msec<br>T = 25°C<br>J  10<br>i [ee] ee ee MUNea siieces imeiea siieces imei siieces imei imei<br>1<br>———  mecec Tc = 25 ° C eiiiii<br>ee V GS  = 0V Tj = 175°C°CC eeoes failoes fail fail<br>PPP Single Pulse ee<br>0.1 a<br>1<br>0.0 0.5 1.0 1.5 2.0 2.5<br>0 1 10<br>VSD, Source-to-Drain Voltage (V)<br>VGS, Gate-to-Source Voltage (V)<br>C, Capacitance (pF)<br>ISD, Reverse Drain Current (A)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


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1000<br>OPERATION IN THIS AREA<br>LIMITED BY R DS(on)(on)<br>7A APRNPRNRNN 100μsec<br>100<br>ASOSetteSO 1msec re Il<br>10msec<br>10<br>MUNea siieces imeiea siieces imei siieces imei imei<br> mecec Tc = 25 ° C eiiiii<br>Tj = 175°C°CC eeoes failoes fail fail<br>Single Pulse ee<br>a<br>1<br>0 1 10 100<br>VDS, Drain-to-Source Voltage (V)<br>ID,  Drain-to-Source Current (A)<br>**----- End of picture text -----**<br>


**Fig 7.** Typical Source-Drain Diode Forward Voltage 

**Fig 8.** Maximum Safe Operating Area 

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90 2.5<br>Limited By Package<br>80 a ee TTTTITII.<br>70 m7 tt 2.0 PLY<br>60 | PET<br>Vw | Lt TT SCP<br>50 C7 SY<br>1.5<br>Toy CHA<br>40 ID = 25μA<br>ee Pt NEE<br>30<br>a 1.0 {itt<br>20<br>100 TSrt TN 0.5 P TTLELELLIN-t | IN|<br>25 50 75 100 125 150 175 -75 -50 -25 0 25 50 75 100 125 150 175<br> TC , Case Temperature (°C) TJ , Temperature ( °C )<br>ID,  Drain Current (A)<br>VGS(th), Gate threshold Voltage (V)<br>**----- End of picture text -----**<br>


**Fig 9.** Maximum Drain Current vs. Case Temperature 

**Fig 10.** Threshold Voltage vs. Temperature 

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10<br>1 D = 0.50<br>0.20<br>0.10<br>ee<br>0.1 0.020.05 R1R1 R2R2 R3R3 R4R 4 Ri (0.04252   0.000007°C/W)     τ i (sec)<br>0.01 Feet τ J τ J τ 1 τ 1 τ 2 τ 2 τ 3 τ 3 τ 4 τ 4 τ C τ 0.57953   0.000109 1.17480   0.001003 ees<br>0.01 Ci= Ci τ i / Rii / Ri 0.60472   0.005976<br>SINGLE PULSE Notes:<br>( THERMAL RESPONSE ) 1. Duty Factor D = t1/t2<br>a 2. Peak Tj = P dm x Zthjc + Tc ll<br>0.001<br>1E-006 1E-005 0.0001 0.001 0.01 0.1<br>t1 , Rectangular Pulse Duration (sec)<br>Thermal Response ( Z thJC ) °C/W<br>**----- End of picture text -----**<br>


**Fig 11.** Maximum Effective Transient Thermal Impedance, Junction-to-Case 

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15V<br>VDS L DRIVER<br>RG D.U.T +<br>- [V][DD]<br>IAS<br>ai 2V0VGS<br>tp 0.01 Ω<br>**----- End of picture text -----**<br>


**Fig 12a.** Unclamped Inductive Test Circuit 

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V(BR)DSS<br>-— tp ><br>/<br>/ \<br>/ \<br>IAS<br>**----- End of picture text -----**<br>


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400<br>ID<br>PPE<br>350<br>TOP         5.57A<br>                8.50A<br>NESE<br>300<br>NEE BOTTOM    20A<br>250<br>200 ENGR<br>150 QENEEERR<br>100<br>ESSN ETT TTT<br>50<br>aeSNE<br>Pt |  PSS<br>0<br>25 50 75 100 125 150 175<br>Starting TJ , Junction Temperature (°C)<br>EAS , Single Pulse Avalanche Energy (mJ)<br>**----- End of picture text -----**<br>


**Fig 12c.** Maximum Avalanche Energy vs. Drain Current 

**Fig 12b.** Unclamped Inductive Waveforms 

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Current Regulator<br>Same Type as D.U.T.<br>50K Ω<br>12V .2 μ F<br>.3 μ F<br>LLit| +<br>D.U.T. -VDS<br>VGS<br>3mA<br>t T] |<br>= )<br>IG ID<br>Current Sampling Resistors<br>**----- End of picture text -----**<br>


**Fig 13.** Gate Charge Test Circuit 

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 1<br> 0.1 %<br>**----- End of picture text -----**<br>


**Fig 14a.** Switching Time Test Circuit 

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VDS<br>90%<br>10%<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br>


**Fig 14b.** Switching Time Waveforms 

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Driver Gate Drive<br>P.W.<br>D.U.T + { P.W. + Period ——— — D = —— Period<br>) [©)]    • Circuit Layout Considerations | V | t GS=10V<br> •<br>| =] - LowGround StrayPla I n eductance<br>•   Low Leakage Inductance ® D.U.T. ISD Waveform<br>+<br>Reverse<br>Recovery Body Diode Forward<br>oi - [l] Current Transformer - ® + Current r Current di/dt NN<br>® D.U.T. VDS Waveform Diode Recoverydv/dt ‘<br>00 _ VDD<br>ma<br>•   Re-Applied<br>•   Driver same type as D.U.T. + Voltage Body Diode  Forward Drop<br>Re (A •   dvidt controlled by Re Vp p - Inductor Curent<br>•   D.U.T. - Device Under Test SO O<br>Isp controlled by Duty Factor "D" ® Ripple  ≤ 5% ISD<br>**----- End of picture text -----**<br>


**Fig 15.** Peak Diode Recovery dv/dt Test Circuit or N-Channel HEXFET ® Power MOSFETs 

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Id<br>Vds<br>Vgs<br>Vgs(th)<br>\<br>\! I H I<br>\ ! | H |<br>Mo dt r e , < ><br>Qgodr Qgd Qgs2 Qgs1<br>**----- End of picture text -----**<br>


**Fig 16.** Gate Charge Waveform 

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EXAMPLE: THIS IS AN IRFR120<br>PART NUMBER<br>WITH ASSEMBLY INTERNATIONAL<br>LOT CODE 1234 RECTIFIER IRFR120 DATE CODE<br>ASSEMBLED ON WW 16, 2001 LOGO 116A YEAR 1 =  2001<br>IN THE ASSEMBLY LINE "A" 12 34 WEEK 16<br>oa LINE A<br>Note: "P" in assembly line positionindicates "Lead-Free" ASSEMBLYLOT CODE eat<br>"P" in assembly line position indicates<br>"Lead-Free" qualification to the consumer-level<br>PART NUMBER<br>INTERNATIONAL C N<br>OR DATE CODE<br>RECTIFIER IRFR120 P =  DESIGNATES LEAD-FREE<br>LOGO TeaR P1i6a PRODUCT (OPTIONAL)<br>12 34<br>P =  DESIGNATES LEAD-FREE<br>ASSEMBLY PRODUCT QUALIFIED TO THE<br>LOT CODE eal CONSUMER LEVEL (OPTIONAL)<br>YEAR 1 =  2001<br>WEEK 16<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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EXAMPLE: THIS IS AN IRFU120 PART NUMBER<br>INTERNATIONAL<br>WITH ASSEMBLY<br>LOT CODE 5678 RECTIFIER IRFU120 DATE CODE<br>LOGO 119A YEAR 1 =  2001<br>ASSEMBLED ON WW 19, 2001 56 78 WEEK 19<br>IN THE ASSEMBLY LINE "A"<br>LINE A<br>ASSEMBLY<br>LOT CODE<br>Note: "P" in assembly line position<br>indicates Lead-Free"<br>a<br>OR<br>PART NUMBER<br>INTERNATIONAL c S<br>RECTIFIER IRFU120 DATE CODE<br>LOGO TAR P1194 P =  DESIGNATES LEAD-FREE<br>56 78 PRODUCT (OPTIONAL)<br>YEAR 1 =  2001<br>ASSEMBLY<br>LOT CODE WEEK 19<br>A =  ASSEMBLY SITE CODE<br>**----- End of picture text -----**<br>


## **Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

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TR TRR TRL<br>a<br>16.3 ( .641 ) 16.3 ( .641 )<br>15.7 ( .619 ) 15.7 ( .619 )<br>12.1 ( .476 ) FEED DIRECTION 8.1 ( .318 ) FEED DIRECTION<br>11.9 ( .469 ) 7.9 ( .312 )<br>**----- End of picture text -----**<br>


NOTES : 

1.  CONTROLLING DIMENSION : MILLIMETER. 

2.  ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 

3.  OUTLINE CONFORMS TO EIA-481 & EIA-541. 

**==> picture [254 x 93] intentionally omitted <==**

**----- Start of picture text -----**<br>
  13 INCH<br>16 mm<br>**----- End of picture text -----**<br>


NOTES : 

1. OUTLINE CONFORMS TO EIA-481. 

## **Note: For the most current drawing please refer to IR website at http://www.irf.com/package/** 

www.irf.com 

10 

|**Orderable part number**|**Package Type**|**Standard Pack**|**Standard Pack**|**Note**|
|---|---|---|---|---|
|||**Form**|**Quantity**||
|IRLR8256PBF|D-PAK|Tube/Bulk|75||
|IRLR8256TRPBF|D-PAK|Tape and Reel|2000||
|IRLR8256PBF|I-PAK|Tube/Bulk|75||



## **Qualification Information[†]** 

|**Qualification Information[†]**|||
|---|---|---|
|Qualification level|Industrial††||
||(per JEDEC JESD47F†††guidelines)||
||Comments: This family of products has passed JEDEC’s<br>Industrial qualification. IR’s Consumer qualification level is<br>granted by extension of the higher Industrial level.||
|Moisture Sensitivity Level|granted by extension of the higher Industrial level.<br>D-PAK|MSL1<br>granted by extension of the higher Industrial level.|
|||(per JEDEC J-STD-020D†††)|
||I-PAK|Not applicable|
|RoHS Compliant|Yes||



† Qualification standards can be found at International Rectifier’s web site http://www.irf.com/product-info/reliability †† Higher qualification ratings may be available should the user have such requirements. Please contact your International Rectifier sales representative for further information: http://www.irf.com/whoto-call/salesrep/ ††† Applicable version of JEDEC standard at the time of product release. 

Repetitive rating;  pulse width limited by max. junction temperature. 

Starting TJ = 25°C, L = 0.43mH, RG = 25 Ω , IAS = 20A. 

Pulse width ≤ 400μs; duty cycle ≤ 2%. 

Calculated continuous current based on maximum allowable junction temperature. 

Package limitation current is 50A. 

© When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. 

θ 

Data and specifications subject to change without notice. 

**IR WORLD HEADQUARTERS:** 101N.Sepulveda blvd, El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-790 Visit us at www.irf.com for sales contact information.08/2011 

www.irf.com 

11 

## **IMPORTANT NOTICE** 

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . 

With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 

For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( **www.infineon.com** ). 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. 



## Links

- [View this product on Novapart](https://novapart.co/products/IRLR8256TRPBF/power-mosfet-n-channel-25-v-81-a-4200-ohm-to-252aa)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/infineon/irlr8256trpbf/mosfet-n-ch-25v-81a-to-252aa/dp/2726023)
---

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